JP3827835B2 - Non-contact IC card - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a non-contact IC card for exchanging data without contact with an external reader / writer, and in particular, a non-contact IC that can be easily switched from a usable state to an unusable state and further to a usable state. The present invention relates to a card and a non-contact IC card that can be reliably identified.
[0002]
[Prior art]
Conventionally, an IC card with a terminal is widely used as a prepaid card for a telephone card particularly in France and the like because it has a higher ability to prevent information stored in the card from being falsified than a magnetic card.
[0003]
In an IC card with a terminal for a prepaid card such as this telephone card, it is important to determine whether it is used or not. In addition to buying and selling cash vouchers, the card buyer must be able to confirm that the purchase card is unused.
On the other hand, in Japan, a magnetic recording type 0.25 mm-thick telephone card is used. In this card, the use is started and the approximate remaining frequency is determined by punching holes.
[0004]
However, the thickness of the IC card is generally 0.76 mm, and it is not easy to punch holes, and it is avoided.
Therefore, when the IC card with a terminal as described above is used for a telephone card, it is sold by being wrapped in a film or the like, and when used, the packaging is cut and the card is taken out and used. Therefore, it is determined that at least the card that has been wrapped is not unused, and the packaged IC card represents an unused state.
[0005]
[Problems to be solved by the invention]
However, in recent years, non-contact IC cards that transmit and receive data and the like in a non-contact manner using the outside and electromagnetics have come to be used. A non-contact IC card does not require connection by an electrical contact unlike an IC card with a terminal, and can be used even in a packaged state because it communicates by electromagnetic waves or the like. Therefore, there is a problem that it is not possible to distinguish between used and unused only by being enclosed in the package.
In addition, it is conceivable to use a bag with an electromagnetic shielding effect for this measure, but in addition to cost increase, there is a possibility that it will be put in a bag with a similar appearance after use and sold at a cash voucher shop etc. .
[0006]
Under such circumstances, the applicant of the present application has proposed a non-contact IC card in which a cut piece having a short circuit is provided at one end of the non-contact IC card so that the used and unused states can be switched easily and reliably (Heisei Heisei). (Patent application on September 5, 1997).
However, in the case of the non-contact IC card, since a short circuit is formed at the time of issuing the card, there is a problem that the transmitting / receiving circuit does not function and the card issuance process cannot be performed. Therefore, in the present invention, the circuit functions at the time of the card issuance process, but after the issuance process, when the card is sold or sent to an individual, the short circuit is short-circuited so that the transmission / reception circuit does not function. It is an object of the present invention to provide a non-contact IC card that can remove a short-circuited circuit and restore its function again when in use.
[0007]
[Means for Solving the Problems]
The invention according to claim 1 of the present invention for solving the above-mentioned problems is a non-contact IC card for driving an internal circuit by receiving a signal from an external device through an antenna coil, and both terminals of the antenna coil are connected to an IC chip. When an easy short circuit is formed between the terminals to be performed and the easy short circuit is short-circuited, the non-contact IC card does not function, and the easy short circuit after the short circuit is disconnected In the non-contact IC card, the function of the non-contact IC card is restored.
The invention according to claim 2 which solves the above-mentioned problems is based on a card substrate including an antenna coil that interacts with an electric field, electromagnetic field, or magnetic field from an external device, and a processing circuit that processes a signal generated by the antenna coil. In the non-contact IC card, an easy short circuit is formed between the terminals connecting both terminals of the antenna coil to the IC chip, and the non-contact IC card functions when the short circuit is short-circuited. In the non-contact IC card, the function of the non-contact IC card is restored when the easy short circuit after the short circuit is cut.
[0008]
The invention according to claim 3 that solves the above-mentioned problems is a non-contact IC card that receives a signal from an external device via an antenna coil and drives an internal circuit. Both terminals of the antenna coil are connected to an IC chip. A non-short circuit is formed between the terminals to be formed, and the easy short circuit is formed so as to pass through a cut piece provided to extend to the card base portion. Contact IC card.
The invention according to claim 4 that solves the above-described problems is provided by a card base including an antenna coil that interacts with an electric field, electromagnetic field, or magnetic field from an external device, and a processing circuit that processes a signal generated by the antenna coil. In the non-contact IC card, an easy short circuit is formed between the terminals of the antenna coil connected to the IC chip, and the easy short circuit is provided to extend to the card base. The non-contact IC card is formed so as to pass through the cut piece.
[0009]
The invention according to claim 5 that solves the above-mentioned problems is characterized in that the easy-short circuit is provided with an easily short-circuited connection portion by cream solder, and the invention according to claim 6 is the pressurization in the easy-short circuit. It has the easy-short-circuiting connection part connected by this.
[0010]
The invention of claim 7 which solves the above-mentioned problems is characterized in that the short-circuiting connection portion is in the card body, and the invention of claim 8 of the present invention is that the entire short-circuiting circuit is formed of cream solder. It is characterized by being.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be specifically described below, but the present invention is not limited to the following embodiments.
FIG. 1 is a circuit diagram showing an embodiment of a non-contact IC card according to the present invention.
The non-contact IC card 10 is formed in a form in which an antenna coil 13 is formed on a main body 111 of a card-type thin base material (center sheet), an IC chip 12 is mounted on the antenna coil 13 and laminated with upper and lower cover sheets. Has been. Therefore, no contact terminal with the external device is provided on the surface of the card base, and reading / writing of data with the external device can be realized in a non-contact manner by a so-called wireless method using an electric field, an electromagnetic field or a magnetic field.
[0012]
The non-contact IC card according to the present invention is characterized in that an easy short circuit 14 for connecting both ends of the IC chip 12 is formed at one end of the card main body 111. In other words, the easy short circuit 14 has an easy short connection portion 17 that can be short-circuited by lowering the insulation resistance, although the insulation resistance is initially high, and the circuit of the card body is not short-circuited in the initial state. Although it is in a state, when the short-circuiting connecting portion 17 is once made conductive and connected, the circuit is short-circuited. That is, as long as the short-circuited circuit is connected, current does not flow through the antenna coil 13 having a higher resistance and communication with the outside is not performed. Therefore, communication is possible only after the short-circuited circuit is disconnected. The function will be restored.
The shorted circuit can be cut by various methods. As a preferable mode of circuit cutting, a cut piece 112 is provided at one end of the card base so that a part of the shorted circuit passes through the cut piece. There is a method of cutting the circuit by forming and cutting the cut piece from the folding groove 18. In FIG. 1, the part indicated by the dotted line on the right side shows a state in which the excision piece 112 is excised.
[0013]
FIG. 2 is a block diagram showing an embodiment of a circuit configuration of an IC card including an antenna coil. The antenna system 130 is connected to input portions of a power supply circuit 123, a clock extraction circuit 124, and a demodulator 125, and each output portion is connected to a processing circuit 127. Further, the output portion of the processing circuit is connected to the modulator 126, the output portion of this modulator is connected to the antenna system 130, and the memory 128 is connected to the processing circuit 127.
[0014]
The antenna system 130 is used for both transmission and reception, receives electromagnetic waves and the like from the external reader / writer 132, receives data, receives power supply, and transmits data to the reader / writer. A power supply circuit 123 is connected to the antenna system, and this power supply circuit is connected to a processing circuit 127 in the IC card to supply power. The antenna system is connected to the input of the clock extraction circuit 124 and supplies a clock signal to the processing circuit. The antenna system is connected to the input of the demodulator 125 and outputs a demodulated signal from the reader / writer to the processing circuit. The processing circuit is composed of, for example, a microcomputer, is initialized with a signal from the power supply circuit, uses the clock from the clock extraction circuit 124 as a transmission source, transmission control, reception control, memory access control, various data calculations, etc. Signal processing. Further, the processing circuit performs reception control of received data and writes data to the memory. Further, the data is read from the memory, transmitted to the modulator, and the data is transmitted from the antenna system to the external reader / writer 132.
[0015]
The non-contact IC card used in the present invention is not particularly limited as long as it can perform non-contact transmission / reception with an external reader / writer using an electric field, an electromagnetic field or a magnetic field. For example, in the non-contact IC card, the antenna coil is also used for transmission and reception, but can be provided separately for power supply, data reception, and data transmission. The size of the antenna coil depends on the non-contact IC card system, and may be a shape along the inner periphery of the card base as shown in FIG. There are no particular restrictions on the method for manufacturing the antenna coil, such as a wire wound or a printed board printed with conductive ink. In the above description, power is supplied from the outside in a non-contact manner. However, it is also possible to have a power source in the non-contact IC card itself so as to incorporate a battery or a solar cell. is there.
[0016]
The contactless IC card of the present invention can be used for entrance / exit management, production process management, verification of railway and road pass tickets, etc., or financial settlement, but is particularly suitable for prepaid cards such as telephones. Is something that can be done. A prepaid card is a card having a function of recording a certain value, being mechanically settled each time a product is purchased, borrowed or provided with a service, and the record is updated.
These operations are performed by remote electromagnetic coupling between the electronic device of the IC card and the receiver or the reader.
[0017]
FIG. 3 is a diagram showing an embodiment of a non-contact IC card according to the present invention. In the IC card of the present invention, the card base body 111 and the cut piece 112 are temporarily connected by the folding groove 18 as shown in FIG. The folding groove 18 is a portion in which a part of the card base is connected in a thin layer so that it can be easily cut. The folding groove may be a perforation. An IC chip 12 is mounted on the card base body, and one terminal (bump) 121 of the chip is connected to the antenna coil 13 through the through holes 113 and 114, and the other terminal (bump) 122 is a terminal. 115 is directly connected to the antenna coil. In FIG. 3A, the easy-shortening connection portion 17 for short-circuiting the easy-shortening circuit 14 is provided in the cut piece 112, but the connection portion itself may be in the card body. In any case, it is only necessary to perform the short-circuiting process.
Since the IC chip 12 and the antenna coil 13 are actually provided on the center sheet of the inner layer of the card, they cannot be observed from the surface.
[0018]
FIG. 3B is an enlarged cross-sectional view taken along line AA in FIG. The card base body can have various configurations. In the case of the embodiment shown in FIG. 3, the card substrate is composed of a center sheet 11c having printed wiring and cover sheets 11a and 11b covering the upper and lower surfaces thereof. As shown in FIG. 3, terminals (bumps) 121 and 122 are formed on the surface of the IC chip 12 that contacts the center sheet 11c, and the bumps and the contact terminals of the center sheet 11c are bonded by solder bonding or wire bonding. ing. One terminal 122 of the IC chip is directly connected to the antenna coil 13 as described above, but is connected to the short-circuit circuit 14 through the circuit connected to the antenna coil and the through-hole 115 at the portion of the through-hole 115. Branches to the circuit that performs. The circuit connected to the other terminal 121 is once conducted through the through hole 113 to the opposite surface of the printed circuit board, and then branched at the through hole 114, and one is connected to the antenna coil 13 through the through hole 114. The other is connected to the easy short circuit 14.
[0019]
Although the easy short circuit 14 is provided in the extended part of the center sheet 11c, it may be on the surface side (chip bonding surface side) of the center sheet 11c or on the opposite side. Although it is formed on the back surface in FIG. 3, it can be easily formed on the surface opposite to the IC chip in this way because the number of through holes is small. Furthermore, the short circuit 14 itself may be formed on the cover sheet 11b side as long as the connection with the IC chip is reliably performed.
The easy short circuit 14 of the excision piece 112 is formed with an easy short connection portion 17 made of, for example, cream solder. The cream solder connection portion 17a is formed by, for example, forming a disconnected pattern on the cover sheet 11b, and aligning and laminating the center sheet 11c provided with perforations so that both ends of the disconnected portion are exposed. Can be formed. Alternatively, the cream solder connection portion 17a is, for example, perforated so as to cut the circuit of the center sheet on which the short-circuiting circuit is formed, and then the cream solder is sufficiently filled in the perforation and brought into contact with the cut circuit. It can also be formed.
The fold groove 18 is formed by cutting so that the excised piece can be easily separated, but it is necessary to form the fold groove 18 so as not to cut the easy short circuit 14. This groove may be perforated as described above, but it is also necessary not to cut the easy short circuit. In the embodiment of FIG. 3, the IC chip 12 is inside the antenna coil. In the case of FIG. 1, the IC chip is outside the antenna coil, but there is no functional difference. However, when the IC chip is provided outside the coil as shown in FIG. 1, it is easier to connect to the easy short circuit and the number of through holes can be reduced.
[0020]
FIG. 3C is a perspective view showing a state when the non-contact IC card 10 is used by cutting the cut piece 112. When the card body portion 111 is supported and a force is applied to the cut piece, the cut piece is easily separated from the main body portion. As a result, the short-circuited circuit is disconnected, and the IC card has the original communication function. The cut surface of the easy short circuit 14 is exposed in the cut section of the IC card main body. The excision piece once separated in this way does not return to its original state, and cannot be sold as an unused product by being misrepresented.
[0021]
FIG. 4 is a cross-sectional view showing an embodiment of an easily short-circuited connecting portion. FIG. 4 (A) is an enlarged view of the cross section taken along line BB in FIG. 3 (A). FIG. 4 (A) is the cream solder connection portion 17a before the short-circuiting process, and FIG. 4 (B) is short-circuited during the short-circuiting process. A circuit 15 is shown.
As shown in FIG. 4A, the cream solder is filled in the perforated part 117 so as to connect the circuits 14a and 14b located at both ends of the perforated part 117 formed in the center sheet 11c. In this case, the circuit patterns 14a and 14b in a disconnected state are formed on the cover sheet 11b, while the center sheet 11c is provided with a perforated portion 117 in advance, and both ends of the disconnected pattern are perforated. The method of aligning and laminating as seen from the part facilitates the process.
[0022]
Cream solder is a powdered solder made by mixing a small amount of an organic solvent with a highly viscous flux made of rosin or the like. For example, a eutectic solder having a composition of 63Sn / 37Pb is widely used as the metal powder, but a metal powder containing several percent of bismuth (Bi) is also commercially available. When bismuth is included, it becomes low-melting property, but tends to be brittle and poor adhesion. At room temperature, since the solder powder having a particle size of about 20 to 30 μm is dispersed in the highly viscous flux, the resistance value is 1 KΩ / m or more and is quite high. In general, after the wiring is fixed in this hard viscous state, it is heated by hot air, infrared rays or the like, and soldering is performed at a temperature equal to or higher than the melting temperature of the solder. When the melting point of the Sn—Pb system is the lowest, it is about 183 ° C., but heating at 200 ° C. is required for actual melting. Therefore, the cream solder portion is not affected at a card press temperature of about 140 ° C. After melting and solidifying, the resistance value is substantially 0 (zero).
[0023]
As described above, since the cream solder has a high insulation resistance before the heat treatment, the easy short circuit itself is not in a completely conductive state even if it is in contact with the circuits 14a and 14b. At this time, since the resistance of the antenna circuit is lower, the transmission / reception function of the non-contact type IC card is maintained. Accordingly, in this state, issuing processing such as writing of fixed data or personal data can be performed.
Next, as shown in FIG. 4B, when the heating pin 24 is brought into contact with the cream solder connecting portion 17a from the cover sheet 11a, the cream solder once melts and then returns to room temperature and solidifies again. In this state, the cream solder portion becomes a normal solder connection portion, and the resistance value decreases, and the cream solder portion is connected to the circuits 14a and 14b so that the entire circuit functions as a short circuit. That is, in this state, the resistance of the short-circuited circuit 15 is substantially 0 (zero), and usually the resistance value of the antenna circuit from 2 to 3Ω to 20 to 30Ω increases, so that the antenna circuit has a function of transmitting and receiving. Can't be done. This short-circuiting treatment can also be performed by partially irradiating hot air, infrared rays, or a laser beam regardless of the heating pin.
[0024]
FIG. 5 is a cross-sectional view showing another embodiment of the easily short-circuited connecting portion. 1 shows an embodiment of a circuit connected by pressurization. FIG. 5A shows the pressure connection portion 17b before the short-circuiting process, and FIG. 5B shows the short-circuited circuit 15 at the time of the short-circuiting process.
As shown in FIG. 5A, the pressure connection portion 17b is formed on the upper surface of the center sheet 11c so as to be connected to the circuits 14a and 14b located at both ends of the perforated portion 117 formed on the upper surface of the cover sheet 11b. Yes. In this state, as in FIG. 4, the easy short circuit is in a non-conductive state, so that a predetermined issuing process can be performed.
Next, as shown in FIG. 5B, when the pressure connection portion 17b is pressed from the cover sheet 11a with the pressure contact rod 25, the connection portions 17b formed on the upper surfaces of the circuits 14a and 14b and the center sheet 11c are crimped. The entire circuit functions as a short circuit. That is, in this state, the resistance of the shorted circuit 15 is small and the resistance value of the antenna circuit is high, so that the antenna circuit cannot perform the transmission / reception function. In FIG. 5B, the cover sheet 11b is kept flat, but pressure may be applied to the extent that the cover sheet 11b is recessed or penetrated to ensure contact.
[0025]
FIG. 6 is a cross-sectional view showing still another embodiment of the easy short-circuit connection portion. In the case of FIG. 6, short circuit 14a, 14b is formed in the center sheet | seat 11c like FIG. 6 (A), and the easily short circuit connection part 17a by cream solder is formed in the cover sheet | seat 11b. When such a sheet is laminated as shown in FIG. 6B and the cream solder portion is heated thereafter, the cream solder becomes normal solder and becomes conductive, resulting in a short circuit 15. In the case of this embodiment, it is not necessary to provide a hole in the center sheet 11c.
Furthermore, although not shown in the drawing, the entire easy short circuit can be formed of cream solder as still another embodiment of the easy short connection part. In this case, the cream solder wiring is longer than in the embodiment of FIGS. 4 and 6, so that the electrical resistance value is high and the issuing process can be performed under better conditions. In this case, the cream solder circuit must be provided by screen printing or the like separately from the conductor circuit.
[0026]
FIG. 7 is a perspective view showing an embodiment of the short-circuited connecting portion. In FIG. 7, circuits 14a and 14b are usually made of a metal layer such as aluminum or copper, and are formed by etching or the like. The thickness of the metal layer can be about 10 to 50 μm, and the line width w can be about 10 to 100 μm. The distance s between the circuits 14a and 14b is preferably about 0.5 mm to 5 mm. Further, the cream solder has a size L that covers between the circuits 14a and 14b, and the thickness h is preferably about 1 to 10 μm.
[0027]
Next, an example of a method for manufacturing such a non-contact IC card will be described.
FIG. 8 is a diagram for explaining the manufacturing process of the non-contact IC card of the present invention. First, as shown in FIG. 8A, a necessary antenna coil 13, an easy short circuit 14, a cream solder connecting portion 17a, and a center sheet 11c in which a through hole is formed are prepared, and an IC chip 12 is bonded thereto. (FIG. 8B). The IC chip can be bonded by molten solder bumps or wire bonding. Next, the cover sheets 11a and 11b are laminated and laminated on the upper and lower surfaces of the center sheet 11c to which the IC chip is bonded. In order to facilitate lamination, the adhesive layers 11d and 11e may be provided in advance on the cover sheets 11a and 11b.
[0028]
Lamination is performed by hot pressing the center sheet 11c between the cover sheets 11a and 11b and joining the center sheet and the cover sheet by thermal welding (FIG. 8C). Thereby, the non-contact IC card 10 in which the IC chip 12 is embedded in the card base 11 constituted by the center sheet 11c and the cover sheets 11a and 11b on both sides thereof can be manufactured.
In the above process, since the IC chip that is not modularized is a thin layer of about 50 to 200 μm, the thickness of the chip is absorbed by the cover sheet and hardly affects the appearance. Further, in the case where the cover sheet and the center sheet are bonded by providing the adhesive layers 11d and 11e, it is easier to absorb the influence of the thickness of the IC chip with the adhesive layer.
[0029]
The center sheet 11c on which the printed circuit is formed is manufactured by forming a necessary coil antenna and terminals on a plastic sheet having a conductive aluminum layer formed on both sides by a plating method, and then through holes. It is possible to adopt a known method for forming the surface to make the front and back circuits conductive. The reason why the connection circuit 16 and the short circuit 14 are provided on the surface opposite to the IC chip mounting surface of the center sheet 11c is to avoid contact with the antenna coil, and a large circuit area is not required. There is no need for a large area. This connection circuit can also be formed by application or the like using a dispenser regardless of the etching method.
The short-circuiting connecting portion 17 can employ a method of perforating the center sheet 11c and filling it with cream solder, or a method of forming a circuit as shown in FIG. 6 and bringing it into contact with the cream solder of the cover sheet.
[0030]
Next, the fold groove 18 is formed in the laminated card substrate. For this, a method of forming from the upper and lower surfaces or one surface of the base sheet by a method such as pressing, counterbore, half-cutting with a cutting blade, etc. can be employed (FIG. 8D). The thickness of the sheet remaining in the fold groove 18 can be arbitrarily set, but if it is too thin, the fold groove portion may be unexpectedly broken, and if a considerable thickness remains, it can be easily cut off. There is also a possibility that the end face of the card becomes a saw-toothed jaggedness after cutting. Although depending on the material and thickness of the card substrate, the preferred thickness is empirically in the range of 0.1 to 0.3 mm.
Although the width W (FIG. 3C) of the base material to be cut can be arbitrarily set, it is considered that about 0.5 to 20 mm is appropriate in order to provide a room that can be grasped by a finger.
Usually, the press laminating and counterboring processes are performed in a sheet state in which a plurality of cards are formed on multiple sides. Therefore, after the above processes, the product is punched into a required card size.
[0031]
As the resin constituting the center sheet 11c and the cover sheets 11a and 11b according to the present invention, for example, heat-sealable polyvinyl chloride resin, polyethylene, polypropylene, polystyrene, ABS resin, acrylic resin, polyamide resin, polyimide resin, etc. Can be illustrated. Even if it is a polyester resin, a polycarbonate resin or the like having no heat-fusibility, it can be laminated and laminated together with an adhesive or the like to form a card substrate.
[0032]
【Example】
Next, an embodiment of the contactless IC card of the present invention will be described with reference to FIGS.
In order to form an antenna coil, an easy short circuit, and a connection circuit on both sides of a polyethylene terephthalate film having a thickness of 25 μm to be the center sheet 11c, an aluminum layer having a thickness of 20 μm was formed by an electroless plating → electrolytic plating process. Next, the antenna coil 13 and the connection terminal of the IC chip were formed on the aluminum layer on the IC chip 12 mounting surface side by a photoetching method. The antenna coil was formed by etching so that it was wound four times inside the card body with a line width of 160 μm and a line interval.
Similarly, the necessary connection circuit 16 and easy short circuit 14 were formed on the surface opposite to the IC chip mounting surface. Through holes 113, 114, and 115 for connecting circuits on the front and back surfaces of the center sheet were formed, and plating for imparting conductivity was performed. Next, an IC chip (memory 64 bytes) 12 having a required circuit and solder bumps was bonded to the terminal portion of the center sheet by applying heat pressure with a heater block.
[0033]
The easy short-circuit connection portion 17 was formed as shown in FIGS. That is, it is formed in the center sheet 11c so that the portion s between the portions 14a and 14b in which the circuit (line width w = 0.2 mm) is cut in the cut piece is 1 mm, and the width L of the cream solder is 2 mm on the center sheet 11c. The cover sheet 11b was printed by screen printing so that the thickness h was 6 μm. As the cream solder, “RMA type” manufactured by Senju Metal Industry Co., Ltd., in which powdered solder of 37% Pb and 63% Sn was dispersed in a flux composed of pine resin, adhesive, alcohol and the like.
[0034]
Next, 2 of the cover sheets 11a and 11b formed by applying a polyester adhesive with a layer thickness of 280 μm to the center sheet 11c to which the IC chip is mounted and a polyethylene terephthalate film having a thickness of 100 μm to be the cover sheets 11a and 11b. A sheet is prepared, and is placed on both sides of the center sheet 11c so that the adhesive layer faces the center sheet, and is heated with a press (140 ° C, 25 kg / cm). ² 15 minutes). After pressing, the total thickness of the card substrate was 760 μm. The number of card impositions on the card substrate was 30 in 5 rows and 6 rows. It should be noted that no adhesive was applied to the portion of the cover sheet 11b facing the cream solder printing portion.
[0035]
After laminating, spotting was performed to form the folded grooves 18 from both sides of the card substrate. The counterbore depth was 180 μm from the front surface side and 280 μm from the back surface side, and the wiring of the easy short circuit 14 was sandwiched in the center of the card base so that the base material thickness of 300 μm remained. The width W of the excised piece was 10 mm, and the width x of the fold groove was 0.5 mm.
Then, in order to isolate | separate into each card | curd, it punched out to the shape which the cutting piece connected to the non-contact IC card main-body shape.
[0036]
With respect to the completed non-contact IC card, the short-circuiting circuit is in an insulated state, and fixed data and personal data are written, issued, and made usable. Thereafter, the cream solder connection portion 17a was heated with a heat pin to be in a conductive state. At this time, the resistance value of the shorted circuit was zero, the resistance value of the antenna coil was 10Ω, and the card did not have a communication function with the outside. Next, when the excision piece was removed and the test was performed, it was confirmed that the original function was exhibited.
[0037]
【The invention's effect】
The non-contact IC card of the present invention is provided with an easy short circuit that makes it impossible to communicate with an external device. Short-circuit the department and distribute or sell it to individuals. Therefore, as long as the short-circuited circuit is in a conductive state, the IC card antenna circuit does not function and data stored in the IC card is free from malfunctions due to external electromagnetic fields, such as during transportation until the purchaser starts using it. Can be held completely in the same state as at the time of manufacture.
Moreover, the use of the IC card can be easily performed by cutting the short-circuited circuit.
Further, when a cut piece having an easy short circuit is provided on the card body, it is very clear that the card body is an unused non-contact IC card. Also, once the excision piece is excised, it is difficult to restore the original state. Therefore, the purchaser is spared from fraudulent acts such as selling a used IC card as unused, and an unused contactless IC card can be purchased with certainty.
[Brief description of the drawings]
FIG. 1 is a circuit diagram showing an embodiment of a non-contact IC card according to the present invention.
FIG. 2 is a block diagram showing an embodiment of a circuit configuration of an IC card including an antenna coil.
FIG. 3 is a diagram showing an embodiment of a non-contact IC card according to the present invention.
FIG. 4 is a cross-sectional view showing an embodiment of an easily short-circuited connecting portion.
FIG. 5 is a cross-sectional view showing another embodiment of the easily short-circuited connecting portion.
FIG. 6 is a cross-sectional view showing still another embodiment of the easily short-circuited connecting portion.
FIG. 7 is a perspective view showing an embodiment of an easily short-circuited connecting portion.
FIG. 8 is a diagram illustrating a manufacturing process of a non-contact IC card according to the present invention.
[Explanation of symbols]
10 Non-contact IC card
11 Card base
11a, 11b Cover sheet
11c Center sheet
11d, 11e Adhesive layer
12 IC chip
13 Antenna coil
14 Easy short circuit
15 Short circuit
16 Connection circuit
17 Easy short circuit connection
17a Cream solder connection
17b Pressure connection
18 Folding groove
24 Heating pin
25 Pressure welding rod
111 Body
112 excision
113, 114, 115 Through hole
115, 121, 122 terminals
117 Perforated part
123 Power supply circuit
124 Clock extraction circuit
125 demodulator
126 Modulator
127 Processing circuit
128 memory
130 Antenna system
132 External reader / writer

Claims (8)

In a non-contact IC card that receives a signal from an external device via an antenna coil and drives an internal circuit,
An easy short circuit is formed between the terminals of the antenna coil connected to the IC chip. When the easy short circuit is shorted, the contactless IC card does not function and the short circuit A non-contact IC card, wherein the function of the non-contact IC card is restored when a later short-circuiting circuit is disconnected. In a non-contact IC card consisting of a card substrate containing an antenna coil that interacts with an electric field, an electromagnetic field, or a magnetic field from an external device, and a processing circuit that processes a signal generated by the antenna coil.
An easy short circuit is formed between the terminals of the antenna coil connected to the IC chip. When the easy short circuit is shorted, the contactless IC card does not function and the short circuit A non-contact IC card, wherein the function of the non-contact IC card is restored when a later short-circuiting circuit is disconnected. In a non-contact IC card that receives a signal from an external device via an antenna coil and drives an internal circuit,
An easy short circuit is formed between the terminals of the antenna coil connected to the IC chip, and the easy short circuit passes through a cut piece provided to extend to the card base. A non-contact IC card characterized by being formed. In a non-contact IC card consisting of a card substrate containing an antenna coil that interacts with an electric field, an electromagnetic field, or a magnetic field from an external device, and a processing circuit that processes a signal generated by the antenna coil.
An easy short circuit is formed between the terminals of the antenna coil connected to the IC chip, and the easy short circuit passes through a cut piece provided to extend to the card base. A non-contact IC card characterized by being formed.   5. The non-contact IC card according to claim 1, further comprising an easily short-circuited connection portion made of cream solder in the easily short-circuited circuit.   The non-contact IC card according to any one of claims 1 to 4, further comprising an easily short-circuited connection portion connected by pressurization in the easily short-circuited circuit.   7. The non-contact IC card according to claim 5, wherein the easily short-circuited connecting portion is in the card body.   The non-contact IC card according to any one of claims 1 to 4, wherein the entire short-circuiting circuit is formed of cream solder.

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