JP2002216097A - Ic card and method for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily select adhesive by reinforcing the adhesive force of a card substrate. SOLUTION: A plurality of holes 13a and 13b are formed so as to be dispersed at the part of a substrate 11 where circuit parts 12a and 12b are not arranged so that a component film 10 can be manufactured. Adhesive layers 21 and 22 having fluidity at the time of working are arranged along the surface and back face of the component film 10, and a pair of laminated films 31 and 32 are arranged outside the layers, and a part of the adhesive layers 21 and 22 is allowed to flow in the holes 13 at the time of laminating the whole card, and the flowing adhesive layers 21 and 22 are fused and integrated.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of joining a first substrate having a circuit portion formed thereon and another substrate with a second substrate.
The present invention relates to a C card and a method for manufacturing the C card.

[0002]

2. Description of the Related Art A contactless IC card is an electronic component such as an antenna coil for transmitting and receiving a data signal and electric power to and from an external reader / writer for reading and writing data, an IC chip for performing signal processing, and the like. It is composed of a board for mounting and connecting them.

[0003] The form of the antenna coil is a winding type coil formed by wrapping a covered copper wire or the like, or an etching method in which a metal such as a copper foil is laminated on an insulating material such as a plastic film by patterning by an etching method. There is a coil or a print coil formed by a silk screen printing method using a conductive ink.

[0004] A method of manufacturing a non-contact type IC card is to connect an antenna coil and electronic components such as an IC chip and a capacitor and mount them as a component, and then store the component in an injection-molded plastic case. Or, it is common to laminate a plurality of plastic films to enclose the components.

However, recently, in order to achieve the thickness of 0.76 ± 0.08 mm specified in the ISO standard,
Many methods for laminating a plurality of plastic films to reduce the thickness have been adopted. For example, in a method in which a component in which an electronic component such as an IC chip and a capacitor is connected to an antenna coil and a component is formed on a film, and the component is laminated with a plastic film and encapsulated therein, the card surface is made smooth without irregularities. Therefore, usually, hot melt type adhesive, PVC, P
A method of laminating with a thermoplastic material such as ET-G is used.

FIG. 6 is an exploded perspective view showing a state of a conventional general non-contact IC card before lamination. In FIG. 6, reference numeral 1 denotes a component film on which a circuit for nine cards composed of electronic components is mounted on a substrate 1a. 1
.., 1b are IC chips, and 1c, 1c
.. 1c is an antenna circuit. 2a and 2b are laminated films (laminated films) 3a and 3b for protecting the card surface,
Is an adhesive layer that is adhered and laminated on the front and back surfaces of the above.

[0007]

SUMMARY OF THE INVENTION Such a non-contact IC
In general, the card is used many times a day, and each time the card is seen by the user, it is preferable that the appearance of the card face be clean. Therefore, it is particularly important that the appearance is smooth and smooth. In order to obtain a good product, it is necessary to select a material that simultaneously satisfies the fluidity and adhesive strength of the adhesive, but it is extremely difficult for the following reasons. When a non-contact IC card is manufactured by the above-described method, metal parts such as an IC chip, a capacitor, and an antenna coil on a component film do not have thermoplasticity so that the card surface has no unevenness and a smooth surface. Therefore, it is necessary to flush a thermoplastic material such as a hot-melt type adhesive, PVC, or PET-G into the peripheral portion by the volume of those parts to make the thickness uniform.

FIG. 5 is an enlarged sectional view showing a part of a conventional non-contact IC card. In the conventional non-contact IC card, the portion of the adhesive layer 2a inserted between the IC chip 1b mounted on the substrate 1a and the laminate film 3a has poor fluidity due to heating of the adhesive during the lamination process. Since it is sufficient, it remains without escaping due to diffusion to the peripheral portion, and raises a part of the laminate film 3a to form a partial protrusion on the card surface. In this example, the portion of the circuit 1c of the antenna coil does not need to have any protrusions on the card surface. However, if fluidity is sacrificed in order to secure the bonding strength, even in this portion,
Protrusions may be formed on the card surface.

[0009] The components formed on the film described above are generally achieved by heating and pressing when connecting electronic parts, as represented by soldering, welding, connection by anisotropic conductive film and the like. Is done. They are,
It is widely used because it can be connected in a very short time and can obtain high reliability in connection. In this case, the material on which the components are formed is selected so that stable dimensional accuracy and physical strength can be obtained even under the connection conditions. They are often physically and chemically stable plastic films. Accordingly, the types of adhesives having a sufficient adhesive strength are naturally limited.

[0010] On the other hand, it is necessary to select a film to be laminated that has a suitability as a card in a state where the entire film is formed into a card. For example, physical strength, suitability for processing, safety, etc. are required in addition to color, texture, and material cost. In particular, in processing suitability, the minimum condition is that processing for forming a card shape, for example, bonding, punching, and printing is possible. In the case of laminating such films having different properties into a card, it is necessary to fuse the films by heat or to use an adhesive for bonding the films. However, in the method of fusing the films together, the strength cannot be secured at all unless the materials are substantially the same.

On the other hand, when an adhesive is used, development of a material having a predetermined adhesive strength requires cost and a lot of time, and there are many problems to be solved. For example, it adheres well to the film on which the component is formed, but does not adhere to the film for the overlying card.
In some cases, the opposite is true. Therefore, when the fluidity of the adhesive material required for eliminating and smoothing the surface of the card is required, there arises a problem that the adhesive strength required for the film forming the component cannot be sufficiently obtained.

An object of the present invention is to use a second substrate having a necessary bonding strength with respect to another substrate to be laminated,
An IC in which the structural engagement with the first substrate on which the circuit portion is formed is made dense, and sufficient bonding strength as the entire card is obtained regardless of the physical properties of each substrate used.
The object is to provide a card and a method for manufacturing the card.

[0013]

According to a first aspect of the present invention, there is provided a semiconductor device having a first circuit portion having a circuit portion formed on a surface thereof.
An IC card comprising: a base material, and a first base material and another base material laminated on the first base material, and a second base material having fluidity during processing. An IC card, wherein a large number of bonding auxiliary holes are formed dispersedly on the first base material, and are provided so as to allow the second base material to flow in and be integrated during the processing.

According to a second aspect of the present invention, there is provided an IC according to the first aspect.
In the card, the other base material is disposed on both sides of the first base material, and the second base material has better adhesion to the other base material than the first base material. An IC card characterized in that:

According to a third aspect of the present invention, there is provided the IC according to the first aspect.
The card is characterized in that the joining auxiliary hole has a size that absorbs the second base material for the volume of the circuit portion.

According to a fourth aspect of the present invention, there is provided the first to third aspects.
An IC for manufacturing the IC card according to any one of the above items
In the method for manufacturing a card, a circuit part forming step of forming the circuit part on the first base material, and a step of forming the circuit part on the first base material without forming the circuit part on the first base material Auxiliary bonding hole forming step of dispersing and forming a large number of bonding auxiliary holes for inflowing and integrating, and fluidizing the second base material between the first base material and the other base material A joining step of joining the first base material and the other base material while flowing the second base material into the joining auxiliary hole;
A method for manufacturing an IC card, comprising:

[0017]

Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is an exploded perspective view showing an embodiment of a non-contact IC card according to the present invention before laminating a single card. FIG. 2 is an enlarged view of a part of the component film 10 of FIG. FIG. In an actual card manufacturing process, the card is processed by the same method (9 impositions) as the conventional card shown in FIG.

The IC card according to the present embodiment includes a component film 10, adhesive layers 21, 22, and laminated films 31, 32. The component film 10 has an IC chip 12a and an antenna coil 1 on its surface.
Film on which circuit section such as 2b is formed (first base material)
It is. In this component film 10,
A number of holes 13a, 13a,... 13a, which are features of the present invention, are formed around the mounting place of the circuit section.
Also, a large number of holes 13b, 13b,.
.. 13b is opened.

The adhesive layers 21 and 22 join the component film 10 and the laminated films (other base materials) 31 and 32 laminated thereon, and form a base material such as an adhesive or a fusion film having fluidity during processing. Material (second base material). The laminated films 31 and 32 are films (other base materials) that are laminated on the component film 10 and are disposed on the outermost side to protect the entire card.

The holes 13 (13a, 13a... 13a, 1
13b) are dispersedly formed on the substrate 11 so as to penetrate the front and back surfaces of the substrate 11, and are formed integrally by flowing a part of the adhesive layers 21 and 22 during lamination processing. It is an auxiliary hole for joining that is transformed into a hole. These holes 13 play a role of allowing a part of the adhesive layers 21 and 22 to flow in during processing, and fusing and connecting surfaces that flow and contact with each other. Also, holes 13a, 13a,.
In addition to the above-mentioned role, the circuit portion absorbs an extra amount of adhesive corresponding to the volume of the circuit portion protruding from the surface of the substrate 11 during processing (volume absorbing portion), and is large enough to help smooth the card surface. The pod arrangement is determined.

The shape, size, number, and arrangement of the holes 13 may be such that the desired bonding force and smoothness can be obtained, and that the substrate 11 does not cause any problem for component formation. The means may use a punching blade, a laser beam, or the like, as long as the performance of the substrate 11 is not impaired.

Next, a method of manufacturing this non-contact IC card will be described. First, component film (1st
In the substrate 10, a circuit portion such as an IC chip 12a and an antenna coil 12b is formed on a substrate 11 (circuit portion forming step). At this time, a large number of holes 13a, 13a,... 13a, 13b,
.. 13b are opened (joining auxiliary hole forming step).

Thereafter, the component film 10
Are laminated films 31, 31 by the adhesive layers 21 and 22.
Then, they are laminated and joined so as to be sandwiched between 32 (joining step). At this time, the holes 13a, 13a... 13a, 1
13b penetrates the front and back surfaces of the substrate 11, and a part of the adhesive constituting the adhesive layers 21 and 22 flows in the above-described laminating process.

At this time, the adhesive layers 2 on both sides of the substrate 11
Reference numerals 1 and 22 denote a large number of holes 13 formed in the periphery of a circuit portion such as an IC chip 12a, an antenna coil 12b, and other capacitors that form a circuit on the substrate 11 during lamination processing.
13a and a large number of holes 13b, 13b... 13b dispersed and arranged in other parts, and come into contact with each other. Reinforce. Further, a part of the adhesive layer 21 above these components flows into the large number of holes 13a, 13a,. Surface irregularities are eliminated.

FIG. 3 shows the hole 1 in the substrate 11 by laminating.
It is explanatory drawing (sectional drawing) which shows the situation in which an adhesive flows into 3a and hole 13b. FIG. 4 shows a state in which the substrate 11 is adhered through the process of FIG.
FIG. 6 is an explanatory view (cross-sectional view) showing a state in which the adhesive force to the reinforcing member is reinforced, in comparison with the conventional example of FIG. 5.

As described above, according to the present embodiment, even if the adhesive layer 21 does not adhere to circuit parts such as an IC chip, a capacitor, and an antenna coil, the adhesive strength to the substrate 11 is insufficient. Holes 13a, 13b
The adhesive layers 21 and 22 that have flowed into the holes 13a and 13b are connected by the holes 13a and 13b, so that the necessary adhesive strength can be sufficiently ensured. Therefore, when designing an IC card, there is an effect that it is easy to select an adhesive which has been difficult in the past.

(Other Embodiments) The present invention is not limited to the above-described embodiments, but can be variously modified or changed, and they are within the equivalent range thereof. FIG.
FIG. 9 is an explanatory diagram (plan view) showing an application example of a state of holes arranged around components such as an IC chip on a substrate 11. The component film 10 which is a feature of the present invention includes the substrate 1
The hole penetrating into the front and back of 1 may be not circular but other shapes.
In the case of FIG. 7, rectangular holes 13c, 13c.
c, 13d, 13d ... 13d, 13e, 13e ...
13e, 13f, 13f... 13f is an explanatory view (plan view) showing a part of an example in which 13f is opened.

In the case of FIG. 7, relatively large holes 13c, 13d, etc. are arranged at the nearest position around the IC chip 12c, and holes 13e, 13e,.
・ 13e is arranged. In the case of FIG. 7 as well, the same effect as in FIG. 2 is obtained. In particular, it is suitable when the IC chip 12c is relatively large, and the inflow of the adhesive layer 21 can be made faster.

FIG. 8 is an explanatory view (plan view) showing a part of another modification of the component film substrate. FIG.
Are holes 13g, 13g,..., 13g provided in the substrate 11 in a portion corresponding to the peripheral portion of the card alone.
A part of the adhesive layers 21 and 22 sandwiching the substrate 11 is caused to flow in, and the upper and lower portions thereof are connected to each other to reinforce particularly the peripheral portion of the card.

A single card is obtained by stacking a plurality of cards together according to FIG. 6 and then cutting the combs through the holes 13g, 13g... 13g of the substrate 11 shown in FIG. It is cut off together with a laminated film and an adhesive layer (not shown) from the location of the peripheral edge portion 14 of the card (shown by a two-dot chain line), and the portion shown by the diagonal lines in FIG. Further, the component film 10 is made slightly smaller than the adhesive layers 21 and 22 disposed on the outside and the laminated films 31 and 32 covering the outermost portions, so that the component film 10 is completely May be wrapped in the adhesive layers 21 and 22.

The shape and arrangement of the holes penetrating the front and back surfaces of the substrate are not limited to those shown in FIGS. 2, 7, 8 and the like, but may be various shapes, sizes and arrangements. Any combination is possible as long as it is in accordance with the gist of the present invention. In addition, although the joining auxiliary hole has been described as an example of a through hole, the joining auxiliary hole may be a concave hole having a narrow entrance or the like and joined from one side.

[0032]

As described above, according to the present invention,
Since a large number of auxiliary bonding holes are provided dispersedly in a portion where the circuit portion formed on the first substrate is not arranged, necessary bonding strength to other substrates laminated on the first substrate As long as there is a second base material having a certain strength, the bonding strength to the first base material is reinforced, and the state of the circuit section and the second base material of the first base material are Regardless of the physical properties of the card, there is an effect that a sufficient bonding strength can be obtained as a whole card.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing an embodiment of a non-contact IC card alone according to the present invention.

FIG. 2 is an enlarged plan view showing a part of a component unit.

FIG. 3 is an explanatory view (cross-sectional view) showing a situation where an adhesive is about to flow into a hole of a substrate during lamination processing.

FIG. 4 is an explanatory view (cross-sectional view) showing a situation in which the adhesive force to the substrate has been reinforced through the process of FIG.

FIG. 5 is an enlarged sectional view showing a part of a conventional non-contact IC card.

FIG. 6 shows processing of a plurality of conventional non-contact IC cards.
FIG. 3 is an exploded perspective view showing a state before lamination.

FIG. 7 is an explanatory view (plan view) showing an application example of a state of holes arranged around a component.

FIG. 8 is an explanatory view (plan view) showing a part of a modification of the substrate.

[Explanation of symbols]

1,10 component film 1a, 11 substrate 1b, 12a IC chip 1c, 12b antenna coil 2a, 2b, 21,22 adhesive layer 3a, 3b, 31,32 laminated film 13a, 13b, 13c, 13d, 13e, 13f, 1
3g hole

Claims (4)

[Claims] 1. A first base material having a circuit portion formed on a surface thereof, and the first base material and another base material laminated on the first base material are joined to each other to form a fluid during processing. And a second base material having: a bonding auxiliary hole that is formed in a large number by being dispersed on the first base material, and that flows in and integrates the second base material during the processing. An IC card. 2. The IC card according to claim 1, wherein the other base is disposed on both sides of the first base, and the second base is the first base. An IC card having better adhesiveness to the other substrate than that of the IC card. 3. The IC card according to claim 1, wherein the bonding auxiliary hole has a size that absorbs the second base material by a volume of the circuit portion. . 4. One of claims 1 to 3
The method for manufacturing an IC card according to claim 1, wherein: a circuit portion forming step of forming the circuit portion on the first base; and a portion where the circuit portion is not formed on the first base. A bonding auxiliary hole forming step of dispersing and forming a large number of bonding auxiliary holes for integrating the flow of the second base material during the processing; and forming the second base material with the first base material. Joining the first base material and the other base material while the second base material is fluidized by being sandwiched between the other base materials, and the second base material is caused to flow into the bonding auxiliary holes. A method for manufacturing an IC card, comprising: