JP2003311609A5 - - Google Patents
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- Publication number
- JP2003311609A5 JP2003311609A5 JP2002116721A JP2002116721A JP2003311609A5 JP 2003311609 A5 JP2003311609 A5 JP 2003311609A5 JP 2002116721 A JP2002116721 A JP 2002116721A JP 2002116721 A JP2002116721 A JP 2002116721A JP 2003311609 A5 JP2003311609 A5 JP 2003311609A5
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- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Priority Applications (11)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002116721A JP4353673B2 (ja) | 2002-04-18 | 2002-04-18 | ポリッシング方法 |
| PCT/JP2003/004894 WO2003086706A1 (en) | 2002-04-18 | 2003-04-17 | Polishing method |
| TW092108882A TWI285575B (en) | 2002-04-18 | 2003-04-17 | Polishing method |
| AU2003227414A AU2003227414A1 (en) | 2002-04-18 | 2003-04-17 | Polishing method |
| US10/481,019 US7163895B2 (en) | 2002-04-18 | 2003-04-17 | Polishing method |
| EP03717630A EP1495837B1 (en) | 2002-04-18 | 2003-04-17 | Polishing method |
| DE60314505T DE60314505T2 (de) | 2002-04-18 | 2003-04-17 | Polierverfahren |
| CNB038007592A CN100415447C (zh) | 2002-04-18 | 2003-04-17 | 抛光装置及抛光方法 |
| CNA2008101311553A CN101327573A (zh) | 2002-04-18 | 2003-04-17 | 抛光方法 |
| KR1020037016156A KR100973759B1 (ko) | 2002-04-18 | 2003-04-17 | 폴리싱방법 |
| US11/272,825 US20060079092A1 (en) | 2002-04-18 | 2005-11-15 | Polishing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002116721A JP4353673B2 (ja) | 2002-04-18 | 2002-04-18 | ポリッシング方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003311609A JP2003311609A (ja) | 2003-11-05 |
| JP2003311609A5 true JP2003311609A5 (cg-RX-API-DMAC7.html) | 2005-07-07 |
| JP4353673B2 JP4353673B2 (ja) | 2009-10-28 |
Family
ID=29243464
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002116721A Expired - Lifetime JP4353673B2 (ja) | 2002-04-18 | 2002-04-18 | ポリッシング方法 |
Country Status (9)
| Country | Link |
|---|---|
| US (2) | US7163895B2 (cg-RX-API-DMAC7.html) |
| EP (1) | EP1495837B1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP4353673B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR100973759B1 (cg-RX-API-DMAC7.html) |
| CN (2) | CN101327573A (cg-RX-API-DMAC7.html) |
| AU (1) | AU2003227414A1 (cg-RX-API-DMAC7.html) |
| DE (1) | DE60314505T2 (cg-RX-API-DMAC7.html) |
| TW (1) | TWI285575B (cg-RX-API-DMAC7.html) |
| WO (1) | WO2003086706A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101023429B (zh) * | 2004-07-02 | 2010-09-01 | 斯特拉斯鲍公司 | 用于处理晶片的方法和系统 |
| US8083571B2 (en) * | 2004-11-01 | 2011-12-27 | Ebara Corporation | Polishing apparatus |
| JP5248127B2 (ja) | 2008-01-30 | 2013-07-31 | 株式会社荏原製作所 | 研磨方法及び研磨装置 |
| KR101958874B1 (ko) | 2008-06-04 | 2019-03-15 | 가부시키가이샤 에바라 세이사꾸쇼 | 기판처리장치, 기판처리방법, 기판 파지기구, 및 기판 파지방법 |
| JP5390807B2 (ja) * | 2008-08-21 | 2014-01-15 | 株式会社荏原製作所 | 研磨方法および装置 |
| KR101022277B1 (ko) * | 2009-02-25 | 2011-03-21 | 그린스펙(주) | 실리콘 베어 웨이퍼 연마장치용 캐리어 헤드 |
| US20120264359A1 (en) * | 2011-04-13 | 2012-10-18 | Nanya Technology Corporation | Membrane |
| JP6158637B2 (ja) * | 2012-08-28 | 2017-07-05 | 株式会社荏原製作所 | 弾性膜及び基板保持装置 |
| CN103645613B (zh) * | 2013-12-05 | 2016-06-08 | 上海现代先进超精密制造中心有限公司 | 一种用于光刻机角度镜接边抛光的方法 |
| JP6466785B2 (ja) * | 2015-06-09 | 2019-02-06 | 株式会社ディスコ | 搬送装置 |
| CN106334997A (zh) * | 2016-10-20 | 2017-01-18 | 天津华海清科机电科技有限公司 | 抛光头以及具有其的抛光机 |
| JP7022980B2 (ja) * | 2018-01-05 | 2022-02-21 | 不二越機械工業株式会社 | ウェーハ剥離装置およびウェーハ研磨装置 |
| US12691547B2 (en) * | 2023-09-27 | 2026-07-28 | Applied Materials, Inc. | CMP inner ring in smart head |
| CN117885033B (zh) * | 2023-12-26 | 2026-04-03 | 北京晶亦精微科技股份有限公司 | 一种取放片装置、双面加工的化学机械抛光系统及方法 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4918869A (en) * | 1987-10-28 | 1990-04-24 | Fujikoshi Machinery Corporation | Method for lapping a wafer material and an apparatus therefor |
| JP3550180B2 (ja) | 1994-04-28 | 2004-08-04 | 同和鉱業株式会社 | ウェハの搬送方法および搬送装置 |
| US5762539A (en) * | 1996-02-27 | 1998-06-09 | Ebara Corporation | Apparatus for and method for polishing workpiece |
| US6210255B1 (en) | 1998-09-08 | 2001-04-03 | Applied Materials, Inc. | Carrier head for chemical mechanical polishing a substrate |
| JP2000127026A (ja) | 1998-10-26 | 2000-05-09 | Speedfam-Ipec Co Ltd | ウエハ研磨装置 |
| US6358128B1 (en) * | 1999-03-05 | 2002-03-19 | Ebara Corporation | Polishing apparatus |
| US6722963B1 (en) * | 1999-08-03 | 2004-04-20 | Micron Technology, Inc. | Apparatus for chemical-mechanical planarization of microelectronic substrates with a carrier and membrane |
| US6506105B1 (en) * | 2000-05-12 | 2003-01-14 | Multi-Planar Technologies, Inc. | System and method for pneumatic diaphragm CMP head having separate retaining ring and multi-region wafer pressure control |
| WO2001087541A2 (en) * | 2000-05-12 | 2001-11-22 | Multi-Planar Technologies, Inc. | Pneumatic diaphragm head having an independent retaining ring and multi-region pressure control, and method to use the same |
| US6857945B1 (en) * | 2000-07-25 | 2005-02-22 | Applied Materials, Inc. | Multi-chamber carrier head with a flexible membrane |
| JP2002187060A (ja) * | 2000-10-11 | 2002-07-02 | Ebara Corp | 基板保持装置、ポリッシング装置、及び研磨方法 |
| US6652362B2 (en) * | 2000-11-23 | 2003-11-25 | Samsung Electronics Co., Ltd. | Apparatus for polishing a semiconductor wafer and method therefor |
| CN1260778C (zh) * | 2000-12-04 | 2006-06-21 | 株式会社荏原制作所 | 基片加工方法 |
| US6746318B2 (en) * | 2001-10-11 | 2004-06-08 | Speedfam-Ipec Corporation | Workpiece carrier with adjustable pressure zones and barriers |
-
2002
- 2002-04-18 JP JP2002116721A patent/JP4353673B2/ja not_active Expired - Lifetime
-
2003
- 2003-04-17 EP EP03717630A patent/EP1495837B1/en not_active Expired - Lifetime
- 2003-04-17 US US10/481,019 patent/US7163895B2/en not_active Expired - Lifetime
- 2003-04-17 CN CNA2008101311553A patent/CN101327573A/zh active Pending
- 2003-04-17 WO PCT/JP2003/004894 patent/WO2003086706A1/ja not_active Ceased
- 2003-04-17 TW TW092108882A patent/TWI285575B/zh not_active IP Right Cessation
- 2003-04-17 AU AU2003227414A patent/AU2003227414A1/en not_active Abandoned
- 2003-04-17 KR KR1020037016156A patent/KR100973759B1/ko not_active Expired - Lifetime
- 2003-04-17 CN CNB038007592A patent/CN100415447C/zh not_active Expired - Lifetime
- 2003-04-17 DE DE60314505T patent/DE60314505T2/de not_active Expired - Lifetime
-
2005
- 2005-11-15 US US11/272,825 patent/US20060079092A1/en not_active Abandoned