JP2003309116A5 - - Google Patents

Download PDF

Info

Publication number
JP2003309116A5
JP2003309116A5 JP2002110940A JP2002110940A JP2003309116A5 JP 2003309116 A5 JP2003309116 A5 JP 2003309116A5 JP 2002110940 A JP2002110940 A JP 2002110940A JP 2002110940 A JP2002110940 A JP 2002110940A JP 2003309116 A5 JP2003309116 A5 JP 2003309116A5
Authority
JP
Japan
Prior art keywords
manufacturing
semiconductor device
frequency power
reaction chamber
gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002110940A
Other languages
English (en)
Japanese (ja)
Other versions
JP4018432B2 (ja
JP2003309116A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2002110940A priority Critical patent/JP4018432B2/ja
Priority claimed from JP2002110940A external-priority patent/JP4018432B2/ja
Publication of JP2003309116A publication Critical patent/JP2003309116A/ja
Publication of JP2003309116A5 publication Critical patent/JP2003309116A5/ja
Application granted granted Critical
Publication of JP4018432B2 publication Critical patent/JP4018432B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2002110940A 2002-04-12 2002-04-12 半導体装置の作製方法 Expired - Fee Related JP4018432B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002110940A JP4018432B2 (ja) 2002-04-12 2002-04-12 半導体装置の作製方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002110940A JP4018432B2 (ja) 2002-04-12 2002-04-12 半導体装置の作製方法

Publications (3)

Publication Number Publication Date
JP2003309116A JP2003309116A (ja) 2003-10-31
JP2003309116A5 true JP2003309116A5 (https=) 2005-09-15
JP4018432B2 JP4018432B2 (ja) 2007-12-05

Family

ID=29393921

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002110940A Expired - Fee Related JP4018432B2 (ja) 2002-04-12 2002-04-12 半導体装置の作製方法

Country Status (1)

Country Link
JP (1) JP4018432B2 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6849561B1 (en) * 2003-08-18 2005-02-01 Asm Japan K.K. Method of forming low-k films
JP4728748B2 (ja) * 2005-09-05 2011-07-20 株式会社東芝 半導体製造装置の清浄化方法
JP2007287890A (ja) * 2006-04-14 2007-11-01 Kochi Univ Of Technology 絶縁膜の成膜方法、半導体装置の製法、プラズマcvd装置
US7855153B2 (en) * 2008-02-08 2010-12-21 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
CN102549638B (zh) * 2009-10-09 2015-04-01 株式会社半导体能源研究所 发光显示器件以及包括该发光显示器件的电子设备

Similar Documents

Publication Publication Date Title
JP7341216B2 (ja) 載置台
JP5202050B2 (ja) シャワーヘッド及び基板処理装置
CN109256326B (zh) 等离子体处理装置用部件及其喷镀方法
US9117857B2 (en) Ceiling electrode plate and substrate processing apparatus
JP3590416B2 (ja) 薄膜形成方法および薄膜形成装置
CN109755123A (zh) 等离子体蚀刻方法
JP2020520116A (ja) 基板及びチャンバ部品上への金属ケイ素化合物層の堆積
WO2008147756A4 (en) In-situ photoresist strip during plasma etching of active hard mask
TW201001530A (en) Electrode structure and substrate processing apparatus
US10692726B2 (en) Method for processing workpiece
US10867778B2 (en) Cleaning method and processing apparatus
KR20050058464A (ko) 플라즈마 처리 방법 및 플라즈마 처리 장치
CN108735598A (zh) 蚀刻方法
TW307027B (en) Process for reducing circuit damage during pecvd in single wafer pecvd system
JP2003309116A5 (https=)
JP5179219B2 (ja) 付着物除去方法及び基板処理方法
JP3492289B2 (ja) プラズマcvd装置
JP3286951B2 (ja) プラズマcvd成膜方法と装置
TW200719411A (en) Method of direct deposition of polycrystalline silicon
JP3437926B2 (ja) プラズマcvd装置及び成膜方法並びにクリーニング方法
JP6280408B2 (ja) 処理ガス流量の決定方法
JP2019175975A (ja) ボロン系膜の成膜方法および成膜装置
WO2007125836A1 (ja) Ti膜の成膜方法
JP2016021434A (ja) ステンシルマスク、プラズマ処理装置及びプラズマ処理方法
CN113811401B (zh) 使用等离子体和蒸汽的干式清洁方法