JP2003303813A5 - - Google Patents
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- Publication number
- JP2003303813A5 JP2003303813A5 JP2002109189A JP2002109189A JP2003303813A5 JP 2003303813 A5 JP2003303813 A5 JP 2003303813A5 JP 2002109189 A JP2002109189 A JP 2002109189A JP 2002109189 A JP2002109189 A JP 2002109189A JP 2003303813 A5 JP2003303813 A5 JP 2003303813A5
- Authority
- JP
- Japan
- Prior art keywords
- processing chamber
- vacuum processing
- processing apparatus
- plasma processing
- suppressing charging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 claims 23
- 239000011261 inert gas Substances 0.000 claims 6
- 239000012530 fluid Substances 0.000 claims 3
- 239000011810 insulating material Substances 0.000 claims 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 239000000919 ceramic Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- 229910001873 dinitrogen Inorganic materials 0.000 claims 1
- 229910052731 fluorine Inorganic materials 0.000 claims 1
- 239000011737 fluorine Substances 0.000 claims 1
- 239000003507 refrigerant Substances 0.000 claims 1
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002109189A JP4115155B2 (ja) | 2002-04-11 | 2002-04-11 | プラズマ処理装置の真空処理室内部品の帯電抑制方法 |
| TW092106050A TWI287261B (en) | 2002-04-11 | 2003-03-19 | Method for suppressing charging of component in vacuum processing chamber of plasma processing system and plasma processing system |
| AU2003227236A AU2003227236A1 (en) | 2002-04-11 | 2003-03-27 | Method for suppressing charging of component in vacuum processing chamber of plasma processing system and plasma processing system |
| US10/509,338 US7592261B2 (en) | 2002-04-11 | 2003-03-27 | Method for suppressing charging of component in vacuum processing chamber of plasma processing system and plasma processing system |
| PCT/JP2003/003770 WO2003085715A1 (en) | 2002-04-11 | 2003-03-27 | Method for suppressing charging of component in vacuum processing chamber of plasma processing system and plasma processing system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002109189A JP4115155B2 (ja) | 2002-04-11 | 2002-04-11 | プラズマ処理装置の真空処理室内部品の帯電抑制方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003303813A JP2003303813A (ja) | 2003-10-24 |
| JP2003303813A5 true JP2003303813A5 (OSRAM) | 2005-09-22 |
| JP4115155B2 JP4115155B2 (ja) | 2008-07-09 |
Family
ID=28786567
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002109189A Expired - Fee Related JP4115155B2 (ja) | 2002-04-11 | 2002-04-11 | プラズマ処理装置の真空処理室内部品の帯電抑制方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7592261B2 (OSRAM) |
| JP (1) | JP4115155B2 (OSRAM) |
| AU (1) | AU2003227236A1 (OSRAM) |
| TW (1) | TWI287261B (OSRAM) |
| WO (1) | WO2003085715A1 (OSRAM) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4574174B2 (ja) * | 2004-01-14 | 2010-11-04 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置及び電極 |
| JP4527431B2 (ja) * | 2004-04-08 | 2010-08-18 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| TWD110109S1 (zh) | 2004-04-21 | 2006-04-11 | 東京威力科創股份有限公司 | 半導體製造用靜電夾盤吸附板 |
| JP5103049B2 (ja) * | 2007-04-04 | 2012-12-19 | 株式会社日立ハイテクノロジーズ | ウエハ載置用電極 |
| KR101232901B1 (ko) | 2010-12-08 | 2013-02-13 | 엘아이지에이디피 주식회사 | 플라즈마처리장치 |
| US10069443B2 (en) * | 2011-12-20 | 2018-09-04 | Tokyo Electron Limited | Dechuck control method and plasma processing apparatus |
| US20150228524A1 (en) * | 2014-02-12 | 2015-08-13 | Varian Semiconductor Equipment Associates, Inc. | Plasma resistant electrostatic clamp |
| CN113365747A (zh) * | 2019-01-30 | 2021-09-07 | 应用材料公司 | 用于清洁真空系统的方法、用于真空处理基板的方法以及用于真空处理基板的设备 |
| TWI844352B (zh) * | 2023-05-03 | 2024-06-01 | 劉華煒 | 半導體製程真空腔之靜電吸盤快速排氣結構 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0393637B1 (en) | 1989-04-18 | 1994-02-16 | Tokyo Electron Limited | Plasma processing method |
| KR100260587B1 (ko) * | 1993-06-01 | 2000-08-01 | 히가시 데쓰로 | 정전척 및 그의 제조방법 |
| US6224312B1 (en) * | 1996-11-18 | 2001-05-01 | Applied Materials, Inc. | Optimal trajectory robot motion |
| JP4112659B2 (ja) * | 1997-12-01 | 2008-07-02 | 大陽日酸株式会社 | 希ガスの回収方法及び装置 |
| US6663716B2 (en) | 1998-04-14 | 2003-12-16 | Cvd Systems, Inc. | Film processing system |
| US6081414A (en) * | 1998-05-01 | 2000-06-27 | Applied Materials, Inc. | Apparatus for improved biasing and retaining of a workpiece in a workpiece processing system |
| JP4060941B2 (ja) | 1998-05-26 | 2008-03-12 | 東京エレクトロン株式会社 | プラズマ処理方法 |
| JP3323135B2 (ja) * | 1998-08-31 | 2002-09-09 | 京セラ株式会社 | 静電チャック |
| KR100307628B1 (ko) * | 1999-04-03 | 2001-10-29 | 윤종용 | 반도체 제조설비의 청정방법 및 이를 적용한 반도체 제조 설비 |
| JP4547744B2 (ja) | 1999-11-17 | 2010-09-22 | 東京エレクトロン株式会社 | プリコート膜の形成方法、成膜装置のアイドリング方法、載置台構造及び成膜装置 |
| JP4590031B2 (ja) * | 2000-07-26 | 2010-12-01 | 東京エレクトロン株式会社 | 被処理体の載置機構 |
-
2002
- 2002-04-11 JP JP2002109189A patent/JP4115155B2/ja not_active Expired - Fee Related
-
2003
- 2003-03-19 TW TW092106050A patent/TWI287261B/zh not_active IP Right Cessation
- 2003-03-27 AU AU2003227236A patent/AU2003227236A1/en not_active Abandoned
- 2003-03-27 WO PCT/JP2003/003770 patent/WO2003085715A1/ja not_active Ceased
- 2003-03-27 US US10/509,338 patent/US7592261B2/en not_active Expired - Fee Related
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