JP2003283215A5 - - Google Patents
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- Publication number
- JP2003283215A5 JP2003283215A5 JP2003117109A JP2003117109A JP2003283215A5 JP 2003283215 A5 JP2003283215 A5 JP 2003283215A5 JP 2003117109 A JP2003117109 A JP 2003117109A JP 2003117109 A JP2003117109 A JP 2003117109A JP 2003283215 A5 JP2003283215 A5 JP 2003283215A5
- Authority
- JP
- Japan
- Prior art keywords
- lower yoke
- resin case
- circuit device
- nonreciprocal circuit
- yoke
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 description 37
- 229920005989 resin Polymers 0.000 description 37
- 239000004020 conductor Substances 0.000 description 25
- 239000003990 capacitor Substances 0.000 description 16
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- 239000007769 metal material Substances 0.000 description 10
- 229910045601 alloy Inorganic materials 0.000 description 9
- 239000000956 alloy Substances 0.000 description 9
- 238000001746 injection moulding Methods 0.000 description 7
- 229920006351 engineering plastic Polymers 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 229910000531 Co alloy Inorganic materials 0.000 description 3
- 229910017061 Fe Co Inorganic materials 0.000 description 3
- 229920000106 Liquid crystal polymer Polymers 0.000 description 3
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 3
- 239000004734 Polyphenylene sulfide Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 229920000069 polyphenylene sulfide Polymers 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 230000002441 reversible effect Effects 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000010295 mobile communication Methods 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003117109A JP3871269B2 (ja) | 2003-04-22 | 2003-04-22 | 非可逆回路素子 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003117109A JP3871269B2 (ja) | 2003-04-22 | 2003-04-22 | 非可逆回路素子 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP36134399A Division JP2001177309A (ja) | 1999-12-20 | 1999-12-20 | 非可逆回路素子およびその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003283215A JP2003283215A (ja) | 2003-10-03 |
| JP2003283215A5 true JP2003283215A5 (https=) | 2005-05-12 |
| JP3871269B2 JP3871269B2 (ja) | 2007-01-24 |
Family
ID=29244577
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003117109A Expired - Lifetime JP3871269B2 (ja) | 2003-04-22 | 2003-04-22 | 非可逆回路素子 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3871269B2 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4780311B2 (ja) * | 2006-03-24 | 2011-09-28 | Ｔｄｋ株式会社 | 非可逆回路素子、及び、これを用いた通信機器 |
-
2003
- 2003-04-22 JP JP2003117109A patent/JP3871269B2/ja not_active Expired - Lifetime
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