JP3871269B2 - 非可逆回路素子 - Google Patents
非可逆回路素子 Download PDFInfo
- Publication number
- JP3871269B2 JP3871269B2 JP2003117109A JP2003117109A JP3871269B2 JP 3871269 B2 JP3871269 B2 JP 3871269B2 JP 2003117109 A JP2003117109 A JP 2003117109A JP 2003117109 A JP2003117109 A JP 2003117109A JP 3871269 B2 JP3871269 B2 JP 3871269B2
- Authority
- JP
- Japan
- Prior art keywords
- lower yoke
- external terminal
- circuit device
- assembly
- capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011347 resin Substances 0.000 claims description 33
- 229920005989 resin Polymers 0.000 claims description 33
- 239000004020 conductor Substances 0.000 claims description 24
- 229910052751 metal Inorganic materials 0.000 claims description 22
- 239000002184 metal Substances 0.000 claims description 22
- 239000003990 capacitor Substances 0.000 claims description 21
- 229910045601 alloy Inorganic materials 0.000 claims description 13
- 239000000956 alloy Substances 0.000 claims description 13
- 229920006351 engineering plastic Polymers 0.000 claims description 9
- 238000001746 injection moulding Methods 0.000 claims description 7
- 229910017061 Fe Co Inorganic materials 0.000 claims description 6
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 3
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims description 3
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 3
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 claims description 3
- 230000002441 reversible effect Effects 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 2
- 238000002347 injection Methods 0.000 claims description 2
- 239000007924 injection Substances 0.000 claims description 2
- 238000005096 rolling process Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000010295 mobile communication Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Images
Landscapes
- Non-Reversible Transmitting Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003117109A JP3871269B2 (ja) | 2003-04-22 | 2003-04-22 | 非可逆回路素子 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003117109A JP3871269B2 (ja) | 2003-04-22 | 2003-04-22 | 非可逆回路素子 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP36134399A Division JP2001177309A (ja) | 1999-12-20 | 1999-12-20 | 非可逆回路素子およびその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003283215A JP2003283215A (ja) | 2003-10-03 |
| JP2003283215A5 JP2003283215A5 (https=) | 2005-05-12 |
| JP3871269B2 true JP3871269B2 (ja) | 2007-01-24 |
Family
ID=29244577
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003117109A Expired - Lifetime JP3871269B2 (ja) | 2003-04-22 | 2003-04-22 | 非可逆回路素子 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3871269B2 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4780311B2 (ja) * | 2006-03-24 | 2011-09-28 | Ｔｄｋ株式会社 | 非可逆回路素子、及び、これを用いた通信機器 |
-
2003
- 2003-04-22 JP JP2003117109A patent/JP3871269B2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2003283215A (ja) | 2003-10-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101051703B (zh) | 不可逆电路元件 | |
| TW554565B (en) | Non-reciprocal circuit device and wireless communications equipment comprising same | |
| JP3871269B2 (ja) | 非可逆回路素子 | |
| US8525610B2 (en) | Composite electronic module and method of manufacturing composite electronic module | |
| US6906597B2 (en) | Non-reciprocal circuit device and resin casing used therefor | |
| JP4345254B2 (ja) | 非可逆回路素子及び通信装置 | |
| JP2003283215A5 (https=) | ||
| JP3483191B2 (ja) | 非可逆回路素子 | |
| CN110620284A (zh) | 非可逆电路元件及使用其的通信装置 | |
| JP2001177309A (ja) | 非可逆回路素子およびその製造方法 | |
| US20020089390A1 (en) | Non-reciprocal circuit element, lumped element type isolator, and mobile communication unit | |
| US6535074B2 (en) | Non-reciprocal circuit element, lumped element type isolator, and mobile communication unit | |
| JP2001298305A (ja) | 非可逆回路素子およびその製造方法 | |
| US6724276B2 (en) | Non-reciprocal circuit device and communication apparatus | |
| US6734753B2 (en) | Nonreciprocal circuit element and communication device | |
| JP4110526B2 (ja) | 非可逆回路素子 | |
| JPH10303605A (ja) | アイソレータ | |
| JP4085364B2 (ja) | 非可逆回路素子 | |
| JP2002208804A (ja) | 非可逆回路素子 | |
| JP4423602B2 (ja) | 非可逆回路素子 | |
| JP2000252707A (ja) | 非可逆回路素子 | |
| JP4529330B2 (ja) | 非可逆回路素子及び通信装置 | |
| JP4182632B2 (ja) | 非可逆回路素子及び通信装置 | |
| US7138883B2 (en) | Non-reciprocal circuit element | |
| JP2003204206A (ja) | 非可逆回路素子用樹脂ケース及びこれを用いた非可逆回路素子 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20040628 |
|
| A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20040628 |
|
| A975 | Report on accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A971005 Effective date: 20040715 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20040723 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20040813 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20040910 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20041029 |
|
| A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20041105 |
|
| A912 | Re-examination (zenchi) completed and case transferred to appeal board |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20041126 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20061013 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 3871269 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20091027 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20101027 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20111027 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20111027 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121027 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121027 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20131027 Year of fee payment: 7 |
|
| EXPY | Cancellation because of completion of term |