JP2003273686A - Laminated electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a laminated electronic component with which a high frequency (microwave) communication apparatus can be miniaturized and the capability for eliminating noise out of use frequency bands can be improved. <P>SOLUTION: A band pass filter and a balancer are incorporated within a laminate in which an insulator layer and a conductor pattern are laminated. The band pass filter and the balancer are formed within the laminate to be mutually laterally arranged when seeing the laminate through the laminating direction of the laminate. A coil comprising the band pass filter and a coil comprising the balancer are formed while being separated equally to or longer than 200 μm vertically to the laminating direction of the laminate. The band pass filter and the balancer are connected between an unbalanced terminal and a pair of balanced terminals. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated electronic component mounted on a mobile communication terminal or a high frequency (microwave) communication device such as a wireless LAN.

[0002]

2. Description of the Related Art A receiving circuit 143 and a transmitting circuit 144 are connected to a mobile communication terminal through a switching element 142 connected to an antenna 141 as shown in FIG. 14, and a signal received from the antenna 141 is received by the receiving circuit. There is a switch 143 that alternately switches the switching elements 142 at high speed so as to transmit the transmission signals from the transmission circuit 144 to the antenna 141, respectively. Reception circuit 1 of this mobile communication terminal
In 43, a filter 147 is inserted between the high frequency amplifier 145 and the frequency mixer 146. In recent years, this type of mobile communication terminal has come to be composed of several ICs, passive components of their peripheral circuits, and filters. In addition, this IC has a low drive voltage for use in a mobile communication terminal, which is being reduced in power consumption.
In such a situation, in this type of mobile communication terminal, a balanced input / output type IC is being used in a frequency mixer for the purpose of improving the S / N ratio accompanying the lowering of the driving voltage.

[0003]

However, many of the switching elements 142 and the high frequency amplifiers 145 are still of the unbalanced type. Therefore, the filter 147 of the receiving circuit 143 forms an unbalanced type on a printed circuit board of a mobile communication terminal by using a discrete component as a circuit element forming the filter, or integrates the circuit element forming the filter. The formed unbalanced type is generally mounted on a printed circuit board of a mobile communication terminal. The balanced input / output type IC used in the frequency mixer generally has an input impedance different from the output impedance of the filter, for example, 100Ω or 200Ω. Therefore, in this type of mobile communication terminal, the unbalanced signal output from the filter 147 is converted into a balanced signal, and the filter 147 and the frequency mixer 146 are combined.
15, it is necessary to insert a balun 148 between the filter 147 and the frequency mixer 146 in order to match the impedance of the balun 148 to the printed circuit board of the mobile communication terminal. Space and
A space for forming a wiring pattern for connecting the balun 148 and the filter 147 and a wiring pattern for connecting the balun 148 and the frequency mixer 146 is required, and the shape becomes large.

Further, in this type of mobile communication terminal, the high frequency amplifier 145, the filter 147, the balun 148, and the frequency mixer 146 are sequentially connected through the wiring pattern of the printed circuit board of the mobile communication terminal, so the filter 147 is used.
And the balun 148 to match the impedance between the input / output impedance of the filter 147 and the balun 1
It is necessary to unify the input impedance of 48 to 50Ω. Therefore, the characteristics of the filter are limited by the input / output impedance, and the function as the filter may not be sufficiently exhibited.

It is an object of the present invention to provide a laminated electronic component that contributes to downsizing of high frequency (microwave) communication equipment and can improve noise removal ability outside the used frequency band.

[0006]

A multilayer electronic component of the present invention has a bandpass filter and a balun built in a laminate in which an insulating layer and a conductor pattern are laminated. When the laminated body is seen through from the laminating direction, they are arranged side by side with each other, and are formed in the laminated body so that the distance between the bandpass filter and the balun is 200 μm or more. Connected between balancing terminals. Further, the multilayer electronic component of the present invention includes a bandpass filter in which a first resonator and a second resonator are electromagnetically coupled to each other in a laminate in which an insulating layer and a conductor pattern are laminated, and a first coil. And a second coil are connected to each other, and a third coil whose one end is grounded is electromagnetically coupled to the first coil, and a fourth coil whose one end is grounded is electromagnetically coupled to the second coil. Built-in balun,
The bandpass filter and the balun are arranged side by side when seen through the laminated body in the stacking direction of the laminated body, and are formed in the laminated body such that the distance between the bandpass filter and the balun is 200 μm or more. A balun is connected between the unbalanced terminal and the pair of balanced terminals.

[0007]

BEST MODE FOR CARRYING OUT THE INVENTION In the laminated electronic component of the present invention, a bandpass filter and a balun are integrally formed in a laminated body in which an insulating layer and a conductor pattern are laminated. In the bandpass filter and the balun, the bandpass filter is formed on one side of the laminate and the balun is formed on the other side of the laminate so that they are arranged side by side when seen through the laminate in the stacking direction of the laminate. The coil that constitutes the bandpass filter and the coil that constitutes the balun are 200
It is formed at a distance of μm or more. The thus-formed filter and balun are connected between the unbalanced terminal and the pair of balanced terminals provided in the laminated body. In this case, the bandpass filter and the balun are connected to each other by connecting the conductor pattern forming the filter and the conductor pattern forming the balun formed on the same insulator layer on the same insulator layer. Therefore, in the multilayer electronic component of the present invention, since the bandpass filter and the balun are integrally formed in the multilayer body as described above, the bandpass filter and the balun interfere with each other and the multilayer electronic component of the multilayer electronic component is interfered with each other. It is possible to prevent deterioration of the characteristics, particularly the attenuation characteristics at the frequency of the attenuation pole. Further, the output impedance of the filter can be set without being affected by the output impedance of the balun required according to the input impedance of the IC (for example, 100Ω or 200Ω). In this laminated electronic component, the unbalanced terminals are connected to the unbalanced line, and the pair of balanced terminals are connected to the balanced line.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A laminated electronic component of the present invention will be described below with reference to FIGS. FIG. 1 is a circuit diagram showing a circuit example of a high frequency (microwave) communication device using the laminated electronic component of the present invention, FIG. 2 is a circuit diagram of the laminated electronic component of the present invention, and FIG. 3 is a laminated type of the present invention. It is a disassembled perspective view which shows the 1st Example of an electronic component. In the mobile communication terminal using the laminated electronic component of the present invention, the antenna is connected to the common end of the switching element 12, and the reception circuit 13 and the transmission circuit 14 are connected to the branch ends of the switching element 12, respectively. Then, the laminated electronic component 10 of the present invention is inserted between the output end of the high frequency amplifier 15 of the receiving circuit 13 and the input end of the balanced input / output type IC used in the frequency mixer 16.

The laminated electronic component 10 is provided in the laminated body.
A bandpass filter connected to the unbalanced terminal and a balun connected between the bandpass filter and the pair of balanced terminals are formed. This bandpass filter and balun are composed of a coil L1 and a capacitor C as shown in FIG.
A first resonator in which 1 is connected in parallel and a second resonator in which a coil L2 and a capacitor C2 are connected in parallel are electromagnetically coupled, a coil L3 and a coil L4 are connected, The coil L3 is electromagnetically coupled to the coil L5 having one end grounded, and the coil L4 is electromagnetically coupled to the coil L6 having one end grounded to form a so-called marchand type balun. This bandpass filter is an electromagnetically coupled two resonators. The connection point between the coil L1 and the capacitor C1 is connected to the unbalance terminal 21 via the capacitor C4, and the connection between the coil L2 and the capacitor C2. The point is connected to the balun coil L3 via the capacitor C5. In this balun, the coil L5 is connected to the balancing terminal 22,
6 is connected to the balancing terminal 23. The capacitor C3 of the bandpass filter is a capacitance generated by capacitively coupling two resonators, and the other end of the balun coil L4 is in an electrically floating state. The laminated electronic component 10 is mounted on a printed wiring board of a mobile communication terminal. The unbalanced terminal of the multilayer electronic component 10 is connected to the unbalanced transmission line connected to the output terminal of the high frequency amplifier 15. Further, the pair of balancing terminals of the multilayer electronic component 10 are connected to the balanced transmission line connected to the input end of the IC used in the frequency mixer 16.

Such a bandpass filter and balun are
As shown in FIG. 3, by laminating an insulating layer and a conductor pattern, they are formed in these laminated bodies. The insulator layers 31A to 31L are formed using a material having an insulating property such as a magnetic substance, a non-magnetic substance, and a dielectric substance. A ground conductor pattern 32A is formed on the surface of the insulator layer 31A. The ground conductor pattern 32A is drawn out to the four end faces of the insulator layer 31A. Insulator layers 31B, 31C, 31D,
A coil conductor pattern 33A and a coil conductor pattern 33B are formed on the surface of 31E, respectively. Coil conductor pattern 33A and coil conductor pattern 33B
Are formed side by side in the width direction of the insulator layer on one half surface (left half surface in FIG. 3) of the insulator layer. And the insulator layer 31
The coil conductor patterns 33A of B to 31E are spirally connected to each other through a through hole to form a coil L1.
Coil conductor pattern 33 of insulator layers 31B to 31E
B is spirally connected to the coil L2 through a through hole.
Is formed. The coil L1 and the coil L2 are connected to each other by connecting the coil conductor pattern 33A and the coil conductor pattern 33B on the surface of the insulator layer 31B, and the connection point of the coil conductor pattern 33A and the coil conductor pattern 33B is It is drawn out to the end surface of the insulator layer 31B. The capacitance formed between the coil conductor patterns 33A of the insulating layers 31B to 31E and the insulating layer 31B.
The capacitor C1 is formed in parallel with the coil L1 by the capacitance formed between the coil conductor pattern 33A and the ground conductor pattern 32A. Further, the capacitance formed between the coil conductor patterns 33B of the insulator layers 31B to 31E and the coil conductor pattern 33B of the insulator layer 31B.
The capacitor C2 is formed in parallel with the coil L2 by the capacitance formed between the grounding conductor pattern 32A and the grounding conductor pattern 32A. On the surface of the insulator layer 31F, a conductor pattern 32B for grounding is provided.
Is formed. The ground conductor pattern 32B is drawn out to the three end faces of the insulator layer 31F. Insulator layer 31
On the surface of G, a coil conductor pattern 34 and a coil conductor pattern 35 are formed. Coil conductor pattern 3
4 and the coil conductor pattern 35 are formed on one half surface (right half surface in FIG. 3) of the insulator layer and are connected to each other. On the surface of the insulator layer 31H, the coil conductor pattern 34,
35 and the conductor patterns 38A and 39A for capacitors are formed. The coil conductor pattern 34 and the coil conductor pattern 35 are formed on one half surface of the insulator layer 31H (right half surface in FIG. 3).
Are formed side by side in the width direction of the insulator layer. Further, the capacitance conductor pattern 38A and the capacitance conductor pattern 39A are
The remaining half surface (left half surface in FIG. 3) of the insulator layer 31H is formed side by side in the width direction of the insulator layer. The capacitance conductor pattern 38A is connected to the coil conductor pattern 33A through the through holes of the insulating layers 31F to 31H.
In addition, the capacitor conductive pattern 39A includes the insulator layers 31F to 31F.
Coil conductor pattern 3 through the 31H through hole
3B is connected. Then, this capacitance conductor pattern 3
A capacitor C3 is formed by the capacitance formed between 8A and the conductor pattern 39A for capacitance and the capacitance between the coil L1 and the coil L2. On the surface of the insulator layer 31I, the coil conductor patterns 34 and 35 and the capacitor conductor pattern 38 are formed.
B and 39B are formed. The coil conductor pattern 34 and the coil conductor pattern 35 are formed side by side in the width direction of the insulator layer on one half surface (right half surface in FIG. 3) of the insulator layer 31H. Further, the capacitance conductor pattern 38B and the capacitance conductor pattern 39B are such that the capacitance conductor pattern 38B faces the capacitance conductor pattern 38A on the remaining half surface (the left half surface in FIG. 3) of the insulator layer 31I. Pattern 39
B is formed so as to face the capacitive conductor pattern 39A. Then, the coil conductor patterns 34 of the insulator layers 31G to 31I are spirally connected to each other through the through holes to form the coil L3, and the coil conductor patterns 35 of the insulator layers 31G to 31I are passed through the through holes. The coil L4 is formed in a spiral connection. This coil L3
And the coil L4 are connected to each other by connecting the coil conductor 34 and the coil conductor 35 of the insulator layer 31G. In this coil L3, by connecting the coil conductor pattern 34 of the insulator layer 31I and the capacitor conductor pattern 39B, a capacitor C5 formed by the capacitance between the capacitor conductor pattern 39A and the capacitor conductor pattern 39B is provided. It is connected to the coil L2. In addition, the coil L4 is in a state where one end of the coil conductor pattern 35 of the insulator layer 31I is electrically floated by extending the end away from the end surface of the insulator layer 31I without connecting the end to anywhere. It has become. Further, the capacitor C4 is formed by the capacitance formed between the capacitance conductor pattern 38A and the capacitance conductor pattern 38B. A coil conductor pattern 36 and a coil conductor pattern 37 are formed on the surface of the insulator layer 31J. The coil conductor pattern 36 and the coil conductor pattern 37 are arranged such that the coil conductor pattern 36 faces the coil conductor pattern 34 on one half surface (right half surface in FIG. 3) of the insulator layer 31J. It is formed so as to face the coil conductor pattern 35.
The coil conductor pattern 36 and the coil conductor pattern 37 are connected to each other, and the connection point is extended to the end surface of the insulator layer 31J. A coil conductor pattern 36 and a coil conductor pattern 37 are formed on the surface of the insulator layer 31K. The coil conductor pattern 36 and the coil conductor pattern 37 are formed side by side in the width direction of the insulator layer on one half surface (right half surface in FIG. 3) of the insulator layer 31K. One end of the coil conductor pattern 36 and the coil conductor pattern 37
One end of each of the two is drawn out to the opposite end surface of the insulator layer 31K. The coil conductor pattern 36 and the coil conductor pattern 37 are covered with the insulator layer 31L.
Then, the coil conductor patterns 36 of the insulator layers 31J and 31K are spirally connected to each other through the through holes to form the coil L5, and the coil conductor patterns 37 of the insulator layers 31J and 31K are interposed through the through holes. The coil L6 is formed in a spiral connection. As shown in FIG. 4, an unbalanced terminal 21 and a balanced terminal 2 are attached to the laminated body thus laminated.
2, 23, four ground terminals G and dummy terminals NC are formed. Then, the capacitance conductor pattern 38B is connected to the unbalanced terminal 21 and the ground conductor patterns 32A and 32B.
Is the ground terminal G, the common connection end of the coil conductor pattern 36 and the coil conductor pattern 37 of the insulator layer 31J is the ground terminal G, and the coil conductor pattern 36 of the insulator layer 31K is the balancing terminal 22. , The coil conductor patterns 37 of the insulator layer 31K are connected to the balancing terminals 23, respectively.

As shown in FIG. 5, the laminated electronic component thus formed has a band pass filter and a balun arranged side by side when the laminated body is seen through in the laminating direction of the insulating layers.
A bandpass filter is formed on one side (left half in FIG. 5) and a balun is formed on the other side (right half in FIG. 5) with respect to the center line. In such a multilayer electronic component, the line width of the conductor pattern for the coil of the bandpass filter is 100 μm,
The line width of the balun coil conductor pattern is 75 μm, and the distance W in the direction perpendicular to the laminating direction of the bandpass filter coil conductor pattern and the balun coil conductor pattern is 120 μm. As shown in 1 of FIG. 8, it is possible to obtain the characteristics that the pass band is 2.11 to 2.17 GHz and the attenuation pole is formed around 1.7 GHz. When this laminated electronic component is used, the signal of the W-CDMA band is obtained. The DCS 1800 MHz band can be attenuated. In addition, the size of the multilayer electronic component at this time is 3.2 m in length and width.
mx 1.6 mm, height is 1 mm. In FIG. 6, the horizontal axis represents frequency and the vertical axis represents the amount of attenuation.
The transmission characteristics are shown in and the reflection characteristics are shown in B.

FIG. 7 shows the size of the element (3.2 mm × 1.6 mm in height and width, 1 mm in height) of this laminated electronic component.
In the same condition, change the distance W in the direction perpendicular to the stacking direction of the insulating layers of the bandpass filter coil conductor pattern and balun coil conductor pattern from 50 to 450 μm, and compare the attenuation at 1880 MHz. It was done. In the multilayer electronic component of the present invention, as shown in FIG. 7, as the distance W in the direction perpendicular to the stacking direction of the insulating layers of the coil conductor pattern of the bandpass filter and the balun coil conductor pattern increases. When the attenuation at 1880 MHz becomes large and the distance W between the conductor patterns for the coil of the bandpass filter and the conductor pattern for the coil of the balun in the direction perpendicular to the stacking direction is 200 μm or more, the attenuation of the present invention at 1880 MHz. A tendency was obtained that the amount was better than that of the bandpass filter alone. Therefore, in the multilayer electronic component of the present invention, the spacing W in the direction perpendicular to the stacking direction of the insulating layers of the conductor pattern for the coil of the bandpass filter and the conductor pattern for the coil of the balun is set.
By setting the thickness to 200 μm or more, the interference between the bandpass filter and the balun can be significantly reduced, and
The amount of attenuation at 1880MHz could be improved compared to the one with only the bandpass filter. In FIG. 7, the horizontal axis represents the distance W (μm) in the direction perpendicular to the laminating direction of the insulating layers of the coil conductor pattern of the bandpass filter and the balun coil conductor pattern, and the vertical axis represents the attenuation amount (d
B) is shown.

FIG. 9 is an exploded perspective view showing a second embodiment of the laminated electronic component of the present invention. A ground conductor pattern 92A is formed on the surface of the insulator layer 91A. Coil L in which coil conductor patterns 93 and 94 are formed on one half surface (right half surface) of the surfaces of the insulator layers 91B and 91C, and the coil conductor patterns are connected in series and connected to each other.
3 and the coil L4 are formed. Insulator layers 91D, 91E
Coil conductor pattern 9 on one half (right half) of the surface of
5, 96 are formed, and the coil conductor patterns are connected to form the coil L5 and the coil L6. A conductor pattern for grounding is formed on the surface of the insulator layer 91F. Coil conductor patterns 97A and 97B are formed on one half surface (left half surface) of the surfaces of the insulator layers 91G to 91J,
Connect the coil conductor patterns to the coil L1.
And the coil L2 is formed. The capacitance conductor pattern 98A and the capacitance conductor pattern 99A are formed on one half surface (left half surface) of the surface of the insulator layer 91K.
8A is connected to the coil conductor pattern 97A, and the capacitor conductor pattern 99A is connected to the coil conductor pattern 97B. One half of the surface of the insulator layer 91L (left half)
And the conductor pattern 98B for capacitance and the conductor pattern 99 for capacitance
B is formed, and a capacitor C4 is formed between the capacitance conductor pattern 98A and the capacitance conductor pattern 98B, and a capacitor C5 is formed between the capacitance conductor pattern 99A and the capacitance conductor pattern 99B. Further, the capacitor conductor pattern 99B is connected to the coil conductor pattern 93 of the insulator layer 91C via the external electrode provided on the side surface of the laminate. Such a multilayer electronic component has a bandpass filter coil conductor pattern having a line width of 100 μm and a balun coil conductor pattern having a line width of 75 μm, and has a bandpass filter coil conductor pattern and a balun coil conductor. The spacing W in the direction perpendicular to the stacking direction of the insulating layers of the pattern is 20
When it is set to 0 μm or more, as shown by 2 in FIG. 8, it is possible to obtain the characteristics that the pass band is 2.11 to 2.17 GHz and the attenuation pole is formed near 1.7 GHz. When this laminated electronic component is used, Passes signals in the W-CDMA band, DCS18
The 00MHz band can be attenuated. In addition, the size of the multilayer electronic component at this time is 3.2 mm × 1.6 mm in length and width,
The height became 1 mm.

FIG. 10 shows a third embodiment of the laminated electronic component of the present invention.
FIG. 3 is an exploded perspective view showing the embodiment of FIG. A ground conductor pattern 102A is formed on the surface of the insulator layer 101A. The conductor pattern 102A for ground is the insulator layer 101.
Two points are drawn out on the opposite end faces of A, respectively. On the surface of the insulator layer 101B, a coil conductor pattern 103C is formed on one half surface (left half surface). Insulator layer 10
Coil conductor patterns 103A and 103B are formed on one half surface (left half surface) of the surfaces of 1C to 101G, and the coil conductor patterns are connected to form a coil L1 and a coil L2. Further, on the remaining half surface (right half surface) of the surface of the insulator layer 101F, the ground conductor pattern 102 is formed.
B is formed. The coil conductor pattern 104 is provided on one half surface (right half surface) of the surfaces of the insulating layers 101H to 101J,
105 are formed, and the respective coil conductor patterns are connected to form the coil L3 and the coil L4 connected in series. Further, the conductor pattern for capacitance 108A and the conductor pattern for capacitance 109A are formed on the remaining half surface (left half surface) of the insulator layer 101I, and the conductor pattern for capacitance 10 is formed.
8A is connected to the coil conductor pattern 103A, and the capacitor conductor pattern 109A is connected to the coil conductor pattern 103B. Further, the conductor pattern for capacitance 108B and the conductor pattern for capacitance 109B are formed on the remaining half surface (left half surface) of the insulator layer 101J, and the conductor pattern for capacitance 109B is connected to the conductor pattern for coil 104. A capacitor C4 is formed between the capacitance conductor pattern 108A and the capacitance conductor pattern 108B, and a capacitor C5 is formed between the capacitance conductor pattern 109A and the capacitance conductor pattern 109B. Insulator layers 101K, 10
Coil conductor patterns 105 and 106 are formed on one half surface (right half surface) of the surface of 1L, and the coil conductor patterns are connected to form a coil L5 and a coil L6. In the laminated body thus laminated, four external terminals are formed on opposite side surfaces as shown in FIG. Such a multilayer electronic component has a bandpass filter coil conductor pattern having a line width of 100 μm and a balun coil conductor pattern having a line width of 75 μm, and has a bandpass filter coil conductor pattern and a balun coil conductor. When the distance W in the direction perpendicular to the stacking direction of the insulating layers of the pattern is set to 200 μm or more, the pass band is 2.4 to 2.5 as shown in 3 of FIG.
At GHz, it is possible to obtain the characteristic that an attenuation pole is formed near 1.89 GHz. When this laminated electronic component is used, B
A signal in the Bluetooth band can be passed and the W-CDMA band can be attenuated. At this time, the size of the multilayer electronic component is 3.2 mm x 1.6 mm in height and width and 1 m in height.
It became m.

FIG. 12 shows a fourth embodiment of the laminated electronic component of the present invention.
FIG. 3 is an exploded perspective view showing the embodiment of FIG. A conductor pattern 122A for ground is formed on the surface of the insulator layer 121A. The conductor pattern 122A for ground is the insulator layer 121.
One is drawn out to each of the opposite end faces of A. The coil conductor pattern 123C formed on one half surface (left half surface) of the surface of the insulator layer 121B and the coil conductor patterns 123A and 123B formed on one half surface (left half surface) of the surfaces of the insulator layers 121C to 121G. The coil L1 and the coil L2 are formed. In addition, the insulator layer 121
On the remaining half surface (right half surface) of the surface of F, a conductor pattern 122B for ground is formed. Insulator layers 121H to 12
A coil L3 and a coil L4 connected in series are formed by the coil conductor patterns 124 and 125 formed on one half surface (right half surface) of the surface of 1J. In addition, the conductor patterns for capacitance 128A and 129A formed on the remaining half surface of the insulator layer 121I and the conductor pattern for capacitance 128B formed on the remaining half surface of the insulator layer 121J,
129B forms capacitors C4 and C5. Coil L5 and coil L6 are formed by the coil conductor patterns 126 and 127 formed on one half surfaces of the surfaces of the insulator layers 121K and 121L. In the laminated body thus laminated, three external terminals are formed on opposite side surfaces as shown in FIG. Such a multilayer electronic component has a bandpass filter coil conductor pattern having a line width of 100 μm and a balun coil conductor pattern having a line width of 75 μm, and has a bandpass filter coil conductor pattern and a balun coil conductor. When the distance W in the direction perpendicular to the stacking direction of the insulating layers of the pattern is set to 200 μm or more, the pass band is 2.4 to 2.5 GHz as shown in 4 of FIG.
It is possible to obtain the characteristic that an attenuation pole is formed around 1.92 GHz. When this laminated electronic component is used, Bluetooth is used.
It is possible to pass signals in the oth band and attenuate the W-CDMA band. The size of the laminated electronic component at this time was 3.2 mm × 1.6 mm in height and width and 1 mm in height.

Although the embodiments of the laminated electronic component of the present invention have been described above, the present invention is not limited to these embodiments. For example, although the balun is described as a marchand type in the embodiment, it may be a pure transmission type or a trifilar type. Further, in the bandpass filter and the balun, the coil conductor pattern forming the coil L3 and the capacitance conductor pattern forming the capacitor C5 may be connected via a through hole in the insulator layer. Furthermore, the capacitor C
Although the two capacitor conductor patterns forming part 3 are formed side by side in the embodiment, they may be formed so as to face each other with the insulator layer interposed therebetween. Furthermore, the bandpass filter can have various circuit configurations. Further, in the embodiment, the case where it is inserted between the output end of the high frequency amplifier of the receiving circuit and the input end of the balanced input / output type IC of the frequency mixer has been described, but the balanced input / output type IC of the frequency mixer is described.
Can be inserted between the input end of the VCO and the output end of the VCO, or between the unbalanced line of the transmission circuit and the input end of the balanced input / output type IC. Further, although the case of the mobile communication terminal has been described in the embodiments, the present invention can be applied to a wireless LAN as long as it is inserted between the unbalanced line and the balanced line.

[0017]

As described above, the laminated electronic component of the present invention has the following features: a laminated body in which an insulating layer and a conductor pattern are laminated;
Built-in band-pass filter and balun, the band-pass filter and balun are stacked side by side when the laminated body is seen through from the stacking direction of the laminated body, and the interval between the band-pass filter and the balun is 200 μm or more. Formed in the body, the band-pass filter and balun are connected to the unbalanced terminal and 1
Since it is connected between the pair of balancing terminals, it is possible to achieve the removal of noise outside the used frequency band and the conversion of balanced signals and unbalanced signals with one chip component without degrading the characteristics.
Further, the output impedance of the filter can be set so that the characteristics of the filter are optimized without being affected by the required output impedance of the balun. Therefore, the multilayer electronic component according to the present invention has a high frequency (microwave).
It is possible to contribute to downsizing of communication equipment, and to improve noise removal capability outside the used frequency band as compared with the related art. Further, since the multilayer electronic component of the present invention does not interfere with each other between the bandpass filter and the balun, it is possible to design the bandpass filter and the balun without considering the influence of each other, and it is easy to design. In addition, the design cost can be reduced.

[Brief description of drawings]

FIG. 1 is a circuit diagram showing a circuit example of a high frequency (microwave) communication device using a laminated electronic component of the present invention.

FIG. 2 is a circuit diagram of the multilayer electronic component of the present invention.

FIG. 3 is an exploded perspective view showing a first embodiment of the multilayer electronic component of the present invention.

FIG. 4 is a perspective view of a first embodiment of a multilayer electronic component of the present invention.

FIG. 5 is a top view of the multilayer electronic component of the present invention.

FIG. 6 is a graph showing characteristics of the first example of the multilayer electronic component of the present invention.

FIG. 7 is a graph showing characteristics of the multilayer electronic component of the present invention.

FIG. 8 is a table showing characteristics of the multilayer electronic component of the present invention.

FIG. 9 is an exploded perspective view showing a second embodiment of the multilayer electronic component of the present invention.

FIG. 10 is an exploded perspective view showing a third embodiment of the multilayer electronic component of the present invention.

FIG. 11 is a perspective view of a third embodiment of the multilayer electronic component of the present invention.

FIG. 12 is an exploded perspective view showing a fourth embodiment of the multilayer electronic component of the present invention.

FIG. 13 is a perspective view of a fourth embodiment of the multilayer electronic component of the present invention.

FIG. 14 is a circuit diagram of a high frequency (microwave) communication device.

FIG. 15 is a circuit diagram of another high frequency (microwave) communication device.

[Explanation of symbols]

11 antenna 12 switching elements 13 Receiver circuit 14 Transmitter circuit

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Claims (2)

[Claims] 1. A laminated body in which an insulating layer and a conductor pattern are laminated, wherein a bandpass filter and a balun are built in, and the bandpass filter and the balun are seen through the laminated body from the laminating direction of the laminated body. They are arranged side by side and are formed in a laminated body so that the interval between the bandpass filter and the balun is 200 μm or more, and the bandpass filter and the balun are connected between the unbalanced terminal and the pair of balanced terminals. A laminated electronic component characterized by the following. 2. A bandpass filter in which a first resonator and a second resonator are electromagnetically coupled, a first coil and a second coil are provided in a laminated body in which an insulating layer and a conductor pattern are laminated. A third balun connected to the first coil, one end of which is grounded, is electromagnetically coupled, and a second coil is electromagnetically coupled to a fourth coil whose one end is grounded. The band-pass filter and the balun are arranged side by side when seen through the laminated body from the laminating direction of the laminated body, and are formed in the laminated body so that the distance between the band-pass filter and the balun is 200 μm or more. A multilayer electronic component in which a bandpass filter and the balun are connected between an unbalanced terminal and a pair of balanced terminals.