JP2002353834A - Layered electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a layered electronic component that contributes to downsizing of a high frequency (microwave) communication unit and improves the characteristic of a filter. SOLUTION: An insulation layer and a conductor pattern are layered and a filter and a balun are formed in the layered body. The filter and the balun are connected between an unbalancing terminal and a couple of balancing terminals.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated electronic component mounted on a mobile communication terminal or a high-frequency (microwave) communication device such as a W-LAN.

[0002]

2. Description of the Related Art A receiving circuit 63 and a transmitting circuit 64 are connected to a mobile communication terminal via a switching element 62 connected to an antenna 61 as shown in FIG.
There is a type in which the switching element 62 is alternately switched at a high speed so that the reception signal from the transmission circuit 63 is transmitted to the reception circuit 63 and the transmission signal from the transmission circuit 64 is transmitted to the antenna 61.
In the receiving circuit 63 of the mobile communication terminal, a filter 67 is inserted between the high frequency amplifier 65 and the frequency mixer 66. In recent years, in this type of mobile communication terminal, some I
C, its peripheral components, passive components, and filters. In addition, the driving voltage of this IC is reduced for use in mobile communication terminals that are being reduced in power consumption. Under such circumstances, in this type of mobile communication terminal, the S / S associated with the lowering of the driving voltage is used.
Balanced input / output type ICs are being used in frequency mixers and the like for the purpose of improving the N ratio.

[0003]

However, as the filter 67 of the receiving circuit 63, an unbalanced type is formed on a printed circuit board of a mobile communication terminal by using discrete components as circuit elements constituting the filter. It is common to mount an unbalanced type in which circuit elements constituting a filter are integrally formed on a printed circuit board of a mobile communication terminal. Further, a balanced input / output type IC used for a frequency mixer or the like generally has an input impedance different from the output impedance of a filter, for example, 100Ω or 200Ω. for that reason,
In this type of mobile communication terminal, the unbalanced signal output from the filter 67 is converted into a balanced signal.
In order to match the impedance of the frequency mixer 66 with the filter 67, as shown in FIG.
6, a space for mounting the balun 68 on the printed circuit board of the mobile communication terminal, and wiring for connecting the balun 68 and the filter 67 and the balun 68 and the frequency mixer 66. A space for forming a pattern is required.

In this type of mobile communication terminal, a high frequency amplifier 65, a filter 67, a balun 68, and a frequency mixer 66 are sequentially connected via a wiring pattern of a printed circuit board of the mobile communication terminal. And balun 6
Filter 6 in order to match the impedance between
7 and the input impedance of the balun 68 need to be unified to 50Ω. Therefore, the characteristics of the filter are limited by the input / output impedance, and the function as the filter may not be sufficiently exhibited.

An object of the present invention is to provide a multilayer electronic component which contributes to downsizing of a high-frequency (microwave) communication device and can improve the characteristics of a filter.

[0006]

According to the present invention, there is provided a multilayer electronic component comprising an insulator layer and a conductor pattern laminated thereon, a filter and a balun formed in the laminate, and the filter and the balun are connected to an unbalanced terminal and one. Connect between a pair of balancing terminals. The filter is constituted by a band-pass filter or a low-pass filter.

[0007]

BEST MODE FOR CARRYING OUT THE INVENTION In the laminated electronic component of the present invention, an insulator layer and a conductor pattern are laminated, and a filter and a balun are integrally formed in the laminated body. The filter and the balun are connected between an unbalanced terminal provided on the laminate and a pair of balanced terminals. Therefore, the multilayer electronic component of the present invention provides an input impedance (for example, 100Ω or 20
0Ω), the output impedance of the filter can be set without being affected by the required output impedance of the balun. In this multilayer electronic component, an unbalanced terminal is connected to an unbalanced line, and a pair of balancing terminals is connected to a balanced line.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A laminated electronic component according to the present invention will be described below with reference to FIGS. FIG. 1 is a circuit diagram showing a circuit example of a high-frequency (microwave) communication device using the laminated electronic component of the present invention, FIG. 2 is a circuit diagram of an embodiment of the laminated electronic component of the present invention, and FIG. FIG. 2 is an exploded perspective view showing an embodiment of the multilayer electronic component of FIG. In the mobile communication terminal using the laminated electronic component of the present invention, an antenna is connected to a common end of the switching element 12, and a receiving circuit 13 and a transmitting circuit 14 are connected to branch ends of the switching element 12, respectively. Then, the laminated electronic component 10 of the present invention is inserted between the output terminal of the high-frequency amplifier 15 of the receiving circuit 13 and the input terminal of the balanced input / output type IC used for the frequency mixer 16.

In the laminated electronic component 10, a filter connected to an unbalanced terminal and a balun connected between the filter and a pair of balanced terminals are formed in a laminate of an insulator layer and a conductor pattern. Is done. This laminated electronic component 10
It is mounted on a printed wiring board of a mobile communication terminal. The unbalanced terminal of the multilayer electronic component 10 is connected to an unbalanced transmission line connected to the output terminal of the high-frequency amplifier 15. Further, a pair of balancing terminals of the multilayer electronic component 10 is connected to a balanced transmission line connected to an input terminal of an IC used for the frequency mixer 16.

As shown in FIG. 2, for example, a filter and a balun of the multilayer electronic component 10 are composed of a first resonator having a coil L1 and a capacitor C1 connected in parallel and a second resonator having a coil L2 and a capacitor C2 connected in parallel. A band-pass filter formed by electromagnetically coupling the resonators of
3 is connected to the second line L4, and the third line L5, one end of which is grounded, is electromagnetically coupled to the first line L3.
A so-called marchand type balun formed by electromagnetically coupling a fourth line L6 whose one end is grounded to the line L4. In this bandpass filter, the connection point between the coil L1 and the capacitor C1 is connected to the unbalanced terminal 21 via the capacitor C4, and the connection point between the coil L2 and the capacitor C2 is connected via the capacitor C5 to the first line L3 of the balun. Connected to. In this balun, the third line L5 is connected to the balancing terminal 22, and the fourth line L6 is connected to the balancing terminal 23. The capacitor C3 of the band-pass filter is a capacitance generated by capacitive coupling of two resonators, and the other end of the balun second line L4 is in an electrically floating state.

Such a filter and a balun are formed in a laminated body by laminating an insulator layer and a conductor pattern as shown in FIG. Insulator layers 31A to 31O
Is formed using an insulating magnetic material or an insulating non-magnetic material. An earth conductor pattern 32A is formed on the surface of the insulator layer 31A. This ground pattern 32A
Are drawn out to the opposite end faces of the insulator layer 31A. A line conductor pattern 33 and a line conductor pattern 34 are formed on the surfaces of the insulator layers 31B, 31C, and 31D, respectively. Then, the first line L3 is formed by spirally connecting the line conductor patterns 33 of the insulator layers 31B to 31D via the through holes, and the first line L3 is formed.
The second line L4 is formed by helically connecting the D line conductor patterns 34 via the through holes. This first
The line L3 and the second line L4 are connected to each other by connecting the line conductor pattern 33 and the line conductor pattern 34 on the surface of the insulator layer 31A. In addition, this first
In the line L3 and the second line L4, the end of the line conductor pattern 33 of the insulator layer 31D constituting one end of the first line L3 is drawn out to the end face of the insulator layer 31D, and the second line L4 The end of the conductor pattern 34 for the line of the insulator layer 31D which constitutes the other end of the insulator layer 31D extends at a distance from the end face of the insulator layer 31D. A line conductor pattern 35 and a line conductor pattern 36 are formed on the surface of the insulator layer 31E. In the line conductor pattern 35 and the line conductor pattern 36, the line conductor pattern 35 is opposed to the line conductor pattern 33 via the insulator layer 31E, and the line conductor pattern 36 is arranged via the insulator layer 31E. It is formed so as to face the conductor pattern 34 for use. Insulator layer 31F,
A line conductor pattern 35 and a line conductor pattern 36 are formed on the surface of 31G. Then, the insulator layer 31E
The third line L5 is formed by helically connecting the line conductor patterns 35 through 31G through the through holes, and the line conductor patterns 34 of the insulator layers 31E through 31G are spirally connected through the through holes. The connection forms the fourth line L6. The third line L3 and the fourth line L4 are
The line conductor pattern 35 and the line conductor pattern 36 on the surface of the insulator layer 31E are connected to each other by connecting the line conductor pattern 35 and the line conductor pattern 36.
Are drawn out to the end face of the insulator layer 31E. The end of the line conductor pattern 35 of the insulator layer 31G forming one end of the third line L5 and the line conductor pattern 36 of the insulator layer 31G forming the other end of the fourth line L6.
Is drawn out to the same end face of the insulator layer 31G. A ground conductor pattern 32B is formed on the surface of the insulator layer 31H. This ground pattern 32B is drawn out to the opposite end face of the insulator layer 31H. Insulator layer 31
On the surfaces of I, 31J and 31K, a coil conductor pattern 37 and a coil conductor pattern 38 are formed. Then, the coil conductor patterns 37 of the insulator layers 31I to 31K are spirally connected via through holes to form the coil L.
1 are formed, and the coil conductor patterns 38 of the insulator layers 31I to 31K are spirally connected via through holes to form a coil L2. This coil L1 and coil L
2 are connected to each other by connecting the coil conductor pattern 37 and the coil conductor pattern 38 of the insulator layer 31I, and the connection point between the coil conductor pattern 37 and the coil conductor pattern 38 is formed on the end face of the insulator layer 31I. Drawn out. Further, the capacitance formed between the coil conductor patterns 37 of the insulator layers 31I to 31K, and the coil conductor pattern 37 and the ground conductor pattern 32 of the insulator layer 31I.
A capacitor C1 is formed in parallel with the coil L1 by the capacitance formed between B and B. Also, the insulator layers 31I to 31I
A capacitor C2 is formed in parallel with the coil L2 by the capacitance formed between the K coil conductor patterns 38 and the capacitance formed between the coil conductor patterns 38 and the ground conductor pattern 32B of the insulator layer 31I. A conductor pattern 39 for capacitive coupling is formed on the surface of the insulator layer 31L. The capacitive coupling conductor pattern 39 is formed on the insulator layer 31.
It is formed on the surface of the insulator layer 31L so as to straddle the coil L1 and the coil L2 via L. A capacitor C3 is formed by the capacitance between the capacitive coupling conductor pattern and the coils L1 and L2 and the capacitance between the coil L1 and the coil L2.
A conductor pattern for capacitance 40 and a conductor pattern for capacitance 41 are formed on the surface of the insulator layer 31M. The capacitor conductor pattern 40 is connected to the coil conductor pattern 37 of the insulator layer 31K via through holes in the insulator layers 31M and 31L. In addition, the conductor pattern for capacitance 41 is formed on the insulator layer 31K through the through holes of the insulator layers 31M and 31L.
Are connected to the coil conductor pattern 38. Insulator layer 3
On the 1N surface, a conductor pattern for capacitance 42 and a conductor pattern 43 for capacitance are formed. The capacitance conductor pattern 42 is formed at a position facing the capacitance conductor pattern 40 via the insulator layer 31N, and a capacitor C4 is formed between the capacitance conductor pattern 40 and the capacitance conductor pattern 42. The capacitance conductor pattern 43 is formed at a position facing the capacitance conductor pattern 41 via the insulator layer 31N, and a capacitor C5 is formed between the capacitance conductor pattern 41 and the capacitance conductor pattern 43. The capacitance conductor pattern 42 and the capacitance conductor pattern 43 are drawn out to the same end surface of the insulator layer 31N. Further, the conductor pattern for capacitance 42 and the conductor pattern 43 for capacitance are covered with the insulator layer 31O. The unbalanced terminal 21, the balanced terminals 22, 23, a pair of ground terminals G, and the internal conductor pattern connection terminals NC are formed on the side surfaces of the stacked body thus stacked. Then, the conductor pattern 42 for capacitance is connected to the terminal 21 for unbalance,
The ground conductor patterns 32A and 32B serve as ground terminals G, the capacitance electrodes 43 and the line conductor patterns 33 of the insulator layer 31D serve as internal conductor pattern connection terminals NC, and the line conductor patterns 35 of the insulator layer 31G serve as ground conductors. Balance terminal 22
Then, the line conductor patterns 36 of the insulator layer 31G are connected to the balancing terminals 23, respectively.

FIG. 5 is a circuit diagram showing another circuit example of a high-frequency (microwave) communication device using the multilayer electronic component of the present invention. FIG. 5 shows a part of a circuit of a mobile communication terminal. This mobile communication terminal is composed of an input terminal of a balanced input / output type IC used for a frequency mixer 56 and a VCO 57.
The multilayer electronic component 10 of the present invention is inserted between the output terminals. The multilayer electronic component 10 includes a filter connected to an unbalanced terminal in a laminate of an insulator layer and a conductor pattern;
A balun connected between the filter and a pair of balanced terminals is formed. The multilayer electronic component 10 has an unbalanced terminal connected to an unbalanced transmission line connected to an output terminal of the VCO 57 and a pair of balanced terminals connected to an input of a balanced input / output type IC used for the frequency mixer 56. It is connected to the balanced transmission line connected to the end.

Although the embodiments of the multilayer electronic component of the present invention have been described above, the present invention is not limited to these embodiments. For example, the bandpass filter can have various circuit configurations. Although the balun is described as a marchand type in the embodiment, it may be a pure transmission type or a trifilar type. Further, in the embodiment, the filter and the balun are overlapped in the direction of lamination of the insulator layers. However, the filter and the balun may be arranged in the laminate in a direction perpendicular to the lamination direction. In the embodiment, the filter is configured by a band-pass filter.
The filter may be constituted by a low-pass filter. In this case, a low-pass filter is connected to the unbalanced terminal, and a balun is connected between the low-pass filter and a pair of balanced terminals. Further, in the embodiment, the case of the mobile communication terminal has been described as the high-frequency (microwave) communication device. However, the present invention may be inserted between an unbalanced line and a balanced line.
It can also be applied to ANs.

[0014]

As described above, the multilayer electronic component according to the present invention comprises an insulator layer and a conductor pattern, a filter and a balun formed in the laminate, and an unbalanced terminal between the filter and the balun. And a pair of balancing terminals, the output impedance of the filter can be set so that the characteristics of the filter are optimized without being affected by the required output impedance of the balun. Therefore, the multilayer electronic component of the present invention can contribute to downsizing of a high-frequency (microwave) communication device and can improve the characteristics of the filter as compared with the conventional one.

[Brief description of the drawings]

FIG. 1 is a circuit diagram showing a circuit example of a high-frequency (microwave) communication device using a multilayer electronic component of the present invention.

FIG. 2 is a circuit diagram of an embodiment of the multilayer electronic component of the present invention.

FIG. 3 is an exploded perspective view showing an embodiment of the multilayer electronic component of the present invention.

FIG. 4 is a perspective view showing an embodiment of the multilayer electronic component of the present invention.

FIG. 5 is a circuit diagram showing another circuit example of a high-frequency (microwave) communication device using the multilayer electronic component of the present invention.

FIG. 6 is a circuit diagram of a high-frequency (microwave) communication device.

FIG. 7 is a circuit diagram of another high-frequency (microwave) communication device.

[Explanation of symbols]

 Reference Signs List 11 antenna 12 switching element 13 receiving circuit 14 transmitting circuit

Continuation of the front page F term (reference) 5J006 HB01 HB05 JA01 JA03 LA01 LA21 5J024 AA01 DA35 EA01 EA03 5K062 AA01 AE05 BA01 BE08 BF07

Claims (3)

[Claims] An insulator layer and a conductor pattern are laminated, a filter and a balun are formed in the laminated body, and the filter and the balun are connected between an unbalanced terminal and a pair of balanced terminals. Laminated electronic components. 2. The multilayer electronic component according to claim 1, wherein the filter is a band-pass filter. 3. The multilayer electronic component according to claim 1, wherein the filter is a low-pass filter.