JP4195568B2 - Multilayer electronic components - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a multilayer electronic component mounted on a mobile communication terminal or a high-frequency (microwave) communication device such as a wireless LAN.
[0002]
[Prior art]
As shown in FIG. 8, a receiving circuit 83 and a transmitting circuit 84 are connected to the mobile communication terminal via a switching element 82 connected to the antenna 81, and a received signal from the antenna 81 is connected to the receiving circuit 83. In some cases, the switching elements 82 are alternately switched at a high speed so as to transmit the transmission signals from 84 to the antenna 81, respectively. In this mobile communication terminal, a filter 85 is inserted between the switching element 82 and the high-frequency amplifier 86 of the transmission circuit 84. Reference numeral 88 denotes a frequency mixer.
In recent years, this type of mobile communication terminal has been configured with several ICs, passive components of peripheral circuits, and filters. In addition, the driving voltage of this IC is lowered to be used for a mobile communication terminal that is saving power. Under such circumstances, in this type of mobile communication terminal, balanced input / output type ICs are being used for high-frequency amplifiers for the purpose of improving the S / N ratio accompanying the reduction in drive voltage.
[0003]
[Problems to be solved by the invention]
However, many switching elements 82 are still unbalanced. For this reason, the filter 85 of the transmission circuit 84 is formed as an unbalanced type on the printed circuit board of the mobile communication terminal using discrete parts for the circuit elements constituting the filter, or the circuit elements constituting the filter are integrated. The formed unbalanced type is generally mounted on a printed circuit board of a mobile communication terminal. Further, balanced input / output type ICs used for high frequency amplifiers generally differ from the output impedance of a filter, such as 100Ω or 200Ω, for example. Therefore, in this type of mobile communication terminal, in order to convert the unbalanced signal output from the filter 85 into a balanced signal and to match the impedance of the filter 85 and the high-frequency amplifier 86, as shown in FIG. It is necessary to insert a balun 87 between the filter 85 and the high frequency amplifier 86, and a space for mounting the balun 87 on the printed circuit board of the mobile communication terminal, and the filter 85 and the balun 87 and the balun 87 and the high frequency amplifier 86 are connected. This requires a space for forming a wiring pattern to increase the size.
[0004]
In this type of mobile communication terminal, since the switching element 82, the filter 85, the balun 87, and the high-frequency amplifier 86 are sequentially connected via the wiring pattern of the printed circuit board of the mobile communication terminal, the filter 85 and the balun 87 are connected. In order to match the impedance between them, it is necessary to unify the input / output impedance of the filter 85 and the input impedance of the balun 87 to 50Ω. Therefore, the characteristics of the filter are limited by the input / output impedance, and the function as a filter may not be sufficiently exhibited.
[0005]
An object of the present invention is to provide a multilayer electronic component that contributes to miniaturization of a high-frequency (microwave) communication device and can improve the noise removal capability outside the use frequency band.
[0006]
[Means for Solving the Problems]
The multilayer electronic component of the present invention incorporates a low-pass filter and a balun in a laminate in which an insulator layer and a conductor pattern are laminated, and the low-pass filter and the balun are mutually viewed when the laminate is seen through from the lamination direction of the laminate. It is formed in the laminated body so as to be arranged horizontally, and the coil constituting the low-pass filter and the coil constituting the balun are formed apart by 300 μm or more in the direction perpendicular to the lamination direction of the laminated body, and the low-pass filter and the balun are unbalanced. And a pair of balancing terminals.
[0007]
In the multilayer electronic component of the present invention, the first coil and the first capacitor are connected in parallel in the multilayer body in which the insulator layer and the conductor pattern are laminated, and the first coil is connected between one end of the first coil and the ground. A low-pass filter in which a second capacitor is connected, a third capacitor is connected between the other end of the first coil and the ground, a second coil and a third coil are connected, and one end is connected to the second coil. A grounded fourth coil is electromagnetically coupled, and a third coil is electromagnetically coupled with a fifth coil having one end grounded, and the low-pass filter and the balun are arranged in the stacking direction of the laminate. Are formed in the laminated body so that they are arranged side by side when seen through the laminated body, and the coil constituting the low-pass filter and the coil constituting the balun are formed apart by 300 μm or more in the direction perpendicular to the laminating direction of the laminated body. Is Low pass filter and the balun are connected between the unbalanced terminal and a pair balanced terminals of.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
In the multilayer electronic component of the present invention, a low-pass filter and a balun are integrally formed in a multilayer body in which an insulator layer and a conductor pattern are laminated. The low-pass filter and the balun are formed so that the low-pass filter is formed on one side of the stacked body and the balun is formed on the other side so as to be arranged horizontally when the stacked body is seen through from the stacking direction of the insulating layers. The low-pass filter and the balun formed in this way are connected between an unbalanced terminal provided in the laminate and a pair of balanced terminals. In this case, the low-pass filter and the balun are connected to each other by connecting the conductor pattern constituting the low-pass filter formed on the same insulator layer and the conductor pattern constituting the balun on the same insulator layer.
Therefore, in the multilayer electronic component of the present invention, the low-pass filter and the balun are integrally formed apart from each other in the multilayer body as described above, so that the characteristics of the multilayer electronic component deteriorate due to interference with each other (especially in the passband). (Reduction of return loss) can be prevented. Further, the output impedance of the low-pass filter can be set without being affected by the required output impedance of the balun according to the input impedance of the IC (for example, 100Ω or 200Ω). In this multilayer electronic component, an unbalanced terminal is connected to the unbalanced line, and a pair of balanced terminals are connected to the balanced line.
[0009]
【Example】
Hereinafter, the multilayer electronic component of the present invention will be described with reference to FIGS.
FIG. 1 is a circuit diagram showing a circuit example of a high-frequency (microwave) communication device using the multilayer electronic component of the present invention, FIG. 2 is a circuit diagram of the multilayer electronic component of the present invention, and FIG. 3 is a multilayer mold of the present invention. It is a disassembled perspective view which shows the Example of an electronic component.
In the mobile communication terminal using the multilayer electronic component of the present invention, the antenna 11 is connected to the common end of the switching element 12, and the receiving circuit 13 and the transmitting circuit 14 are respectively connected to the branch ends of the switching element 12. The multilayer electronic component 10 of the present invention is inserted between the branch end of the switching element 12 and the input end of the high-frequency amplifier 16 using the balanced input / output type IC of the transmission circuit 14.
[0010]
In the multilayer electronic component 10, a low-pass filter connected to an unbalanced terminal and a balun connected between the low-pass filter and a pair of balancing terminals are formed in the multilayer body. As shown in FIG. 2, the low-pass filter and the balun have a coil L1 and a capacitor C1 connected in parallel, a capacitor C2 between one end of the coil L1 and the ground, and a capacitor C3 between the other end of the coil L1 and the ground. The connected π-type third-order low-pass filter, the coil L2 and the coil L3 are connected, the coil L4 having one end grounded is electromagnetically coupled, and the coil L3 having one end grounded is electromagnetically coupled. It is constituted by a so-called merchandise type balun formed by combining them. The multilayer electronic component 10 is mounted on a printed wiring board of a mobile communication terminal. The unbalanced terminal of the multilayer electronic component 10 is connected to an unbalanced transmission line connected to the branch end of the switching element 12. A pair of balancing terminals of the multilayer electronic component 10 is connected to a balanced transmission line connected to an input terminal of a balanced input / output type IC used in the high frequency amplifier 16.
[0011]
Such a low-pass filter and balun are formed in these laminated bodies by laminating an insulator layer and a conductor pattern as shown in FIG.
The insulator layers 31A to 31J are formed using an insulating material such as a magnetic material, a non-magnetic material, or a dielectric material.
A grounding conductor pattern 32A is formed on the surface of the insulating layer 31A. The grounding conductor pattern 32A is drawn out at two locations on the opposing end surfaces of the insulating layer 31A.
A capacitor conductor pattern 33 and a capacitor conductor pattern 34 are formed on the surface of the insulator layer 31B. The capacitive conductor pattern 33 and the capacitive conductor pattern 34 are formed on one half surface (left half surface in FIG. 3) of the insulator layer. A capacitor C2 is formed between the capacitance conductor pattern 33 and the ground conductor pattern 32A. In addition, a capacitor C3 is formed between the capacitor conductor pattern 34 and the ground conductor pattern 32A.
A capacitive conductor pattern 35 is formed on the surface of the insulator layer 31C. The capacitor conductor pattern 35 is formed on one half surface (left half surface in FIG. 3) of the insulator layer so as to face the capacitor conductor patterns 33 and 34 via the insulator layer 31C. The capacitor C1 is formed by the capacitor conductor pattern 35 and the capacitor conductor patterns 33 and 34.
A grounding conductor pattern 32B is formed on the surface of the insulating layer 31D. This grounding conductor pattern 32B is formed on one half surface (the right half surface in FIG. 3) of the insulator layer.
A coil conductor pattern 36, a coil conductor pattern 37, and a coil conductor pattern 38 are formed on the surface of the insulator layer 31E. The coil conductor pattern 36 is formed on one half surface (left half surface in FIG. 3) of the insulator layer. The coil conductor patterns 37 and 38 are formed on the remaining half surface (right half surface in FIG. 3) of the insulator layer.
A coil conductor pattern 37 and a coil conductor pattern 38 are formed on the surface of the insulator layer 31F. The coil conductor pattern 37 and the coil conductor pattern 38 are formed side by side in the width direction of the insulator layer on one half surface (the right half surface in FIG. 3) of the insulator layer.
A coil conductor pattern 36, a coil conductor pattern 37, and a coil conductor pattern 38 are formed on the surface of the insulator layer 31G. The coil conductor pattern 36 is formed on one side (left half surface in FIG. 3) of the insulator layer. The coil conductor pattern 37 and the coil conductor pattern 38 are formed side by side in the width direction of the insulator layer on the remaining half surface (the right half surface in FIG. 3) of the insulator layer. Then, the coil conductor pattern 36 of the insulator layer 31E and the coil conductor pattern 36 of the insulator layer 31G are spirally connected through a through hole to form the coil L1. Further, the coil conductor pattern 37 of the insulator layers 31E to 31G is spirally connected through a through hole to form the coil L2. Further, the coil conductor pattern 38 of the insulator layers 31E to 31G is spirally connected through the through hole to form the coil L3. The coil L2 and the coil L3 are connected to each other by connecting the coil conductor pattern 37 and the coil conductor pattern 38 on the surface of the insulating layer 31E. The coil L2 constituting the balun and the coil L1 constituting the low-pass filter are connected to each other by connecting the coil conductor pattern 36 and the coil conductor pattern 37 of the insulator layer 31G. Further, the coil L3 is in a state where one end of the coil conductor pattern 38 of the insulator layer 31G is electrically floated by extending to a position away from the end face of the insulator layer 31G without connecting anywhere. It has become.
A coil conductor pattern 39 and a coil conductor pattern 40 are formed on the surface of the insulator layer 31H. The coil conductor pattern 39 and the coil conductor pattern 40 are formed side by side in the width direction of the insulator layer on one half surface (the right half surface in FIG. 3) of the insulator layer. One end of the coil conductor pattern 39 and one end of the coil conductor pattern 40 are drawn to end surfaces facing each other.
A coil conductor pattern 39 and a coil conductor pattern 40 are formed on the surface of the insulator layer 31I. The coil conductor pattern 39 and the coil conductor pattern 40 are formed side by side in the width direction of the insulator layer on one half surface (the right half surface in FIG. 3) of the insulator layer. One end of the coil conductor pattern 39 and one end of the coil conductor pattern 40 are drawn to end surfaces facing each other. Then, the coil conductor pattern 39 of the insulator layers 31H and 31I is spirally connected through a through hole to form a coil L4, and the coil conductor pattern 40 of the insulator layers 31H and 31I is connected through a through hole. A coil L5 is formed in a spiral connection.
As shown in FIG. 4, an unbalanced terminal 21, balanced terminals 22, 23, four ground terminals G, and a dummy terminal NC are formed in the laminated body thus laminated. The capacitor conductor pattern 33 of the insulator layer 31B and the coil conductor pattern 36 of the insulator layer 31E are connected via the unbalanced terminal 21, and the capacitor conductor pattern 34 of the insulator layer 31B and the insulator layer 31G are connected. The common connection point of the coil conductor pattern 36 and the coil conductor pattern 37 is connected via the dummy electrode NC, and the ground conductor pattern 32B and the coil conductor patterns 39 and 40 of the insulator layer 31H serve as the ground terminal G. Connected through. Further, the grounding conductor pattern 32A is the four ground terminals G, the coil conductor pattern 39 of the insulator layer 31I is the balancing terminal 22, and the coil conductor pattern 40 of the insulator layer 31I is the balancing terminal 23. Connected.
[0012]
As shown in FIG. 5, the multilayer electronic component formed in this way has a low-pass filter and a balun arranged side by side when viewed through the laminated body from the lamination direction of the insulator layer. A low-pass filter is formed on the other side (left half in FIG. 5), and a balun is formed on the other side (right half in FIG. 5).
Such a multilayer electronic component has a line width of the conductor pattern for the coil of the low-pass filter of 100 μm, a line width of the conductor pattern for the coil of the balun of 75 μm, and the insulation of the conductor pattern for the coil of the low-pass filter When the interval W in the direction perpendicular to the stacking direction of the body layers is set to 520 μm, the impedance ratio between the unbalanced terminal and the balanced terminal is 50Ω: 50Ω, and the passband is 2.4 to 2.5 GHz as shown in FIG. A characteristic in which an attenuation pole is formed in the vicinity can be obtained, and when this multilayer electronic component is used, a Bluetooth band signal can be passed and a harmonic component doubled can be attenuated. At this time, the size of the multilayer electronic component was 3.2 mm × 1.6 mm in length and width and 1 mm in height. In FIG. 6, the horizontal axis represents frequency, the vertical axis represents attenuation, A represents transmission characteristics, and B represents reflection characteristics.
[0013]
FIG. 7 shows a coil conductor pattern of a low-pass filter and a coil conductor pattern of a balun in the state that the element sizes (length and width are 3.2 mm × 1.6 mm, height is 1 mm) are the same for this multilayer electronic component. The return loss at 2.5 GHz was compared by changing the interval W in the direction perpendicular to the stacking direction of the insulator layers from 50 to 400 μm. In the multilayer electronic component of the present invention, the return loss at 2.5 GHz increases as the distance W between the insulating layer of the coil conductor pattern of the low-pass filter and the insulator layer of the balun coil conductor pattern increases. When the interval W in the direction perpendicular to the lamination direction of the insulating layer of the coil conductor pattern of the low-pass filter and the coil conductor pattern of the balun is 300 μm or more, the variation due to the return loss interval W at 2.5 GHz is reduced. Therefore, the multilayer electronic component of the present invention has a low-pass filter by setting a gap W in the direction perpendicular to the stacking direction of the insulator layers of the coil conductor pattern of the low-pass filter and the coil conductor pattern of the balun to 300 μm or more. The mutual interference between the baluns can be considerably reduced, the reflection characteristics in the passband can be improved, and the characteristics of the multilayer electronic component can be improved. In FIG. 7, the horizontal axis indicates the interval W (μm) in the direction perpendicular to the stacking direction of the insulator layers of the low-pass filter coil conductor pattern and the balun coil conductor pattern, and the vertical axis indicates the attenuation (dB). ing.
[0014]
As mentioned above, although the Example of the multilayer electronic component of this invention was described, this invention is not limited to these Examples. For example, the balun has been described as a merchandise type in the embodiment, but may be a pure transmission type or a trifilar type. The low-pass filter and the balun connect the coil conductor pattern constituting the coil L1 and the coil conductor pattern constituting the coil L2 via an external terminal or via a through hole in the insulator layer. By doing so, they may be connected to each other. Furthermore, the low-pass filter can have various circuit configurations.
Furthermore, in the embodiment, the case where the switching element 12 is inserted between the branch end of the switching element 12 and the input end of the high frequency amplifier using the balanced input / output type IC of the transmission circuit has been described. It can also be inserted between the input end of the IC and the output end of the VCO.
Furthermore, in the embodiments, the case of a mobile communication terminal has been described. However, the present invention may be applied to a wireless LAN as long as it is inserted between an unbalanced line and a balanced line.
[0015]
【The invention's effect】
As described above, the multilayer electronic component of the present invention incorporates the low-pass filter and the balun in the laminate in which the insulator layer and the conductor pattern are laminated, and the low-pass filter and the balun are laminated from the lamination direction of the laminate. Are formed in the laminated body so that they are arranged side by side when viewed through, and the coil constituting the low-pass filter and the coil constituting the balun are formed at a distance of 300 μm or more in the direction perpendicular to the laminating direction of the laminated body. Since the filter and balun are connected between the unbalanced terminal and a pair of balanced terminals, a single chip can be used to eliminate noise outside the operating frequency band and convert balanced and unbalanced signals without degrading characteristics. Can be achieved with parts. Further, the output impedance of the filter can be set so that the filter characteristics are optimized without being affected by the required balun output impedance.
Therefore, the multilayer electronic component of the present invention can contribute to the miniaturization of a high-frequency (microwave) communication device and can improve the noise removal capability outside the use frequency band as compared with the prior art.
In addition, since the multilayer electronic component of the present invention does not interfere with each other between the low-pass filter and the balun, the low-pass filter and the balun can be designed without considering the influence of each other, and the design becomes easy. Can reduce the design cost.
[Brief description of the drawings]
FIG. 1 is a circuit diagram showing a circuit example of a high-frequency (microwave) communication device using a multilayer electronic component of the present invention.
FIG. 2 is a circuit diagram of the multilayer electronic component of the present invention.
FIG. 3 is an exploded perspective view showing an embodiment of the multilayer electronic component of the present invention.
FIG. 4 is a perspective view of an embodiment of the multilayer electronic component of the present invention.
FIG. 5 is a perspective view from above of the multilayer electronic component of the present invention.
FIG. 6 is a graph showing characteristics of an example of the multilayer electronic component of the present invention.
FIG. 7 is a table showing characteristics of the multilayer electronic component of the present invention.
FIG. 8 is a circuit diagram of a high-frequency (microwave) communication device.
FIG. 9 is a circuit diagram of another high-frequency (microwave) communication device.
[Explanation of symbols]
11 Antenna 12 Switching element 13 Reception circuit 14 Transmission circuit

Claims (1)

An insulator layer and a conductor pattern are laminated , a first coil and a first capacitor are connected in parallel in the laminate, a second capacitor is connected between one end of the first coil and ground, a low-pass filter third capacitor is connected between the other end and ground first coil, the second coil and the third coil is connected, a fourth coil having one end to said second coil is grounded the electromagnetically coupled to, said third balun one end coil is electromagnetically coupled to the fifth coil which is grounded is formed,
The low-pass filter and the balun, as arranged in a lateral one another when viewed the laminate from the laminating direction of the insulator layer, the conductor pattern is insulating constituting the conductor pattern and said balun constituting the low pass filter Entai The positions formed on the layers are shifted from each other laterally , and the coil constituting the low-pass filter and the coil constituting the balun are formed apart by 300 μm or more in the direction perpendicular to the stacking direction of the insulator layers. ,
By connecting a conductor pattern constituting the other end of the first coil of the low-pass filter and a conductor pattern constituting one end of the second coil of the balun, the low-pass filter and the balun are connected to an unbalanced terminal. A multilayer electronic component connected between a pair of balancing terminals.

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