JP4195565B2

JP4195565B2 - Multilayer electronic components

Info

Publication number: JP4195565B2
Application number: JP2002053332A
Authority: JP
Inventors: 政秀高嶋; 吉則伊藤
Original assignee: Toko Inc
Current assignee: Toko Inc
Priority date: 2002-02-28
Filing date: 2002-02-28
Publication date: 2008-12-10
Anticipated expiration: 2022-02-28
Also published as: JP2003258585A

Description

【０００１】
【発明の属する技術分野】
本発明は、移動体通信端末や、Ｗ−ＬＡＮなどの高周波（マイクロ波）通信機器に実装される積層型電子部品に関する。
【０００２】
【従来の技術】
移動体通信端末に、図１８に示すように受信回路１８３と送信回路１８４を、アンテナ１８１に接続されたスイッチング素子１８２を介して接続し、アンテナ１８１からの受信信号を受信回路１８３に、送信回路１８４からの送信信号をアンテナ１８１にそれぞれ伝送するようにスイッチング素子１８２を高速で交互に切替えるものがある。この移動体通信端末の受信回路１８３では、高周波増幅器１８５と周波数混合器１８６間にフィルタ１８７が挿入されている。
近年、この種の移動体通信端末では、何個かのＩＣと、その周辺回路の受動部品、フィルタによって構成されるようになってきている。また、このＩＣは、省電力化されつつある移動体通信端末に用いるために駆動電圧が低電圧化されている。この様な状況の中で、この種の移動体通信端末では、駆動電圧の低電圧化に伴うＳ／Ｎ比の向上を目的に周波数混合器に平衡入出力タイプのＩＣが用いられつつある。
【０００３】
【発明が解決しようとする課題】
しかしながら、スイッチング素子１８２や高周波増幅器１８５は、今だ不平衡型のものが多い。そのため、受信回路１８３のフィルタ１８７は、フィルタを構成する回路素子にディスクリート部品を用いて移動体通信端末のプリント基板上で不平衡タイプのものを形成したり、フィルタを構成する回路素子を一体に形成した不平衡タイプのものを移動体通信端末のプリント基板上に実装するのが一般的になっている。また、周波数混合器に用いられる平衡入出力タイプのＩＣは、入力インピーダンスが例えば100Ωや200Ωといったように、一般的にフィルタの出力インピーダンスと異なっている。従って、この種の移動体通信端末では、フィルタ１８７から出力された不平衡信号を平衡信号に変換し、かつフィルタ１８７と周波数混合器１８６のインピーダンスの整合を取るために、図１９に示すように、フィルタ１８７と周波数混合器１８６の間にバラン１８８を挿入する必要があり、移動体通信端末のプリント基板にバラン１８８を実装するためのスペースと、バラン１８８とフィルタ１８７及びバラン１８８と周波数混合器１８６を接続するための配線パターンを形成するスペースが必要となり、形状が大型化する。
【０００４】
また、この種の移動体通信端末では、移動体通信端末のプリント基板の配線パターンを介して高周波増幅器１８５、フィルタ１８７、バラン１８８、周波数混合器１８６が順次接続されるので、フィルタ１８７とバラン１８８間のインピーダンスの整合を取るために、フィルタ１８７の入出力インピーダンスとバラン１８８の入力インピーダンスを50Ωに統一する必要がある。そのため、フィルタの特性は入出力インピーダンスによって制限されることになり、フィルタとしての機能を充分に発揮できない場合があった。
【０００５】
本発明は、高周波（マイクロ波）通信機器の小型化に貢献し、使用周波数帯域外のノイズ除去能力を向上させることができる積層型電子部品を提供することを目的とする。
【０００６】
【課題を解決するための手段】
本発明の積層型電子部品は、絶縁体層と導体パターンを積層した積層体内に、フィルタとバランを内蔵し、フィルタとバランは、互いに重畳しないように横にずらして形成され、不平衡用端子と１対の平衡用端子間に接続される。フィルタを構成するコイルとバランを構成するコイルは、積層方向にずらして配置される。また、フィルタとバランは、同一の絶縁体層に形成されたフィルタを構成する導体パターンとバランを構成する導体パターンをこの絶縁体層上で接続するか、積層体に設けられた外部電極を介して接続するか、絶縁体層に設けられたスルーホールを介して接続することにより互いに接続される。
【０００７】
また、本発明の積層型電子部品は、絶縁体層と導体パターンを積層した積層体内に、第１の共振器と第２の共振器を電磁気的に結合したバンドパスフィルタと、第１のコイルと第２のコイルが接続され、第１のコイルに一端が接地された第３のコイルを電磁気的に結合し、第２のコイルに一端が接地された第４のコイルを電磁気的に結合したバランを内蔵し、バンドパスフィルタとバランは、互いに重畳しないように横にずらし、かつフィルタを構成するコイルとバランを構成するコイルとを積層方向にずらして積層体内に形成され、バンドパスフィルタとバランが不平衡用端子と１対の平衡用端子間に接続される。このバンドパスフィルタとバランの接続は、同一の絶縁体層に形成された第２の共振器の一端に接続されたコンデンサを構成する導体パターンとバランの第１のコイルを構成する導体パターンをこの絶縁体層上で接続したり、バンドパスフィルタとバランを外部端子を介して接続したり、バンドパスフィルタとバランを絶縁体層に設けたスルーホールを介して接続したりすることにより行われる。
また、本発明の積層型電子部品は、絶縁体層と導体パターンを積層した積層体内に、コイルと第１のコンデンサが並列に接続され、コイルの一端とアース間に第２のコンデンサが接続され、コイルの他端とアース間に第３のコンデンサが接続されたローパスフィルタと、第１のコイルと第２のコイルが接続され、第１のコイルに一端が接地された第３のコイルを電磁気的に結合し、第２のコイルに一端が接地された第４のコイルを電磁気的に結合したバランを内蔵し、ローパスフィルタとバランは、互いに重畳しないように横にずらして積層体内に形成され、ローパスフィルタとバランが不平衡用端子と１対の平衡用端子間に接続される。このローパスフィルタとバランの接続は、同一の絶縁体層に形成されたローパスフィルタのコイルを構成する導体パターンとバランの第１のコイルを構成する導体パターンをこの絶縁体層上で接続したり、ローパスフィルタとバランを外部端子を介して接続したり、ローパスフィルタとバランを絶縁体層に設けたスルーホールを介して接続したりすることにより行われる。
【０００８】
【発明の実施の形態】
本発明の積層型電子部品は、絶縁体層と導体パターンを積層した積層体内にフィルタとバランが一体に形成される。このフィルタとバランは、絶縁体層の積層方向から積層体を透視したとき、互いに横に並ぶ様に積層体の一方の側にフィルタが、他方の側にバランが形成される。この様に形成されたフィルタとバランは、積層体に設けられた不平衡用端子と１対の平衡用端子間に接続される。この場合、フィルタとバランは、同一の絶縁体層に形成されたフィルタを構成する導体パターンとバランを構成する導体パターンを絶縁体層上で接続することにより互いに接続される。
従って、本発明の積層型電子部品は、積層体内にフィルタとバランが前述の様に一体に形成されるので、互いの影響を小さくできると共に、ＩＣの入力インピーダンス（例えば100Ωや200Ω）に応じて必要とされるバランの出力インピーダンスに影響されることなくフィルタの出力インピーダンスを設定することができる。この積層型電子部品は、不平衡用端子が不平衡線路に接続され、１対の平衡用端子が平衡線路に接続される。
【０００９】
【実施例】
以下、本発明の積層型電子部品を図１乃至図１７を参照して説明する。
図１は本発明の積層型電子部品を用いた高周波（マイクロ波）通信機器の回路例を示す回路図、図２は本発明の積層型電子部品の回路図、図３は本発明の積層型電子部品の第１の実施例を示す分解斜視図である。
本発明の積層型電子部品を用いた移動体通信端末は、スイッチング素子１２の共通端にアンテナが接続され、受信回路１３と送信回路１４がスイッチング素子１２の分岐端にそれぞれ接続される。そして、受信回路１３の高周波増幅器１５の出力端と周波数混合器１６に用いられている平衡入出力タイプのＩＣの入力端間に本発明の積層型電子部品１０が挿入される。
【００１０】
この積層型電子部品１０は、積層体内に、不平衡用端子に接続されたフィルタと、このフィルタと１対の平衡用端子間に接続されたバランが形成される。この積層型電子部品１０は、移動体通信端末のプリント配線基板に実装される。そして、この積層型電子部品１０の不平衡用端子が、高周波増幅器１５の出力端に接続された不平衡伝送線路に接続される。また、積層型電子部品１０の１対の平衡用端子が、周波数混合器１６に用いられたＩＣの入力端に接続された平衡伝送線路に接続される。
【００１１】
この積層型電子部品１０のフィルタとバランは、例えば図２に示す様に、コイルＬ１とコンデンサＣ１を並列接続した第１の共振器と、コイルＬ２とコンデンサＣ２を並列接続した第２の共振器を電磁気的に結合して形成されたバンドパスフィルタと、コイルＬ３とコイルＬ４が接続され、コイルＬ３に一端が接地されたコイルＬ５を電磁気的に結合し、コイルＬ４に一端が接地されたコイルＬ６を電磁気的に結合して形成したいわゆるマーチャンド型のバランによって構成される。このバンドパスフィルタは、２つの共振器を電磁気的に結合させたもので、コイルＬ１とコンデンサＣ１の接続点がコンデンサＣ４を介して不平衡用端子２１に接続され、コイルＬ２とコンデンサＣ２の接続点がコンデンサＣ５を介してバランのコイルＬ３に接続される。このバランは、コイルＬ５が平衡用端子２２に接続され、コイルＬ６が平衡用端子２３に接続される。
なお、バンドパスフィルタのコンデンサＣ３は２つの共振器が容量結合することにより生じる容量であり、バランのコイルＬ４の他端は電気的に浮いた状態となっている。
【００１２】
この様なフィルタとバランは、図３のように絶縁体層と導体パターンを積層することによりこれらの積層体内に形成される。
絶縁体層３１Ａ乃至３１Ｌは、磁性体、非磁性体、誘電体等、絶縁性を有する材料を用いて形成される。
絶縁体層３１Ａの表面には、アース用導体パターン３２Ａが形成される。このアース用導体パターン３２Ａは、絶縁体層３１Ａの４つの端面に引出される。
絶縁体層３１Ｂ、３１Ｃ、３１Ｄ、３１Ｅの表面には、コイル用導体パターン３３Ａとコイル用導体パターン３３Ｂがそれぞれ形成される。コイル用導体パターン３３Ａとコイル用導体パターン３３Ｂは、絶縁体層の片側半面（図３では左半面）に、絶縁体層の幅方向に並べて形成される。そして、絶縁体層３１Ｂ乃至３１Ｅのコイル用導体パターン３３Ａをスルーホールを介して螺旋状に接続してコイルＬ１が形成され、絶縁体層３１Ｂ乃至３１Ｅのコイル用導体パターン３３Ｂをスルーホールを介して螺旋状に接続してコイルＬ２が形成される。このコイルＬ１とコイルＬ２は、絶縁体層３１Ｂの表面のコイル用導体パターン３３Ａとコイル用導体パターン３３Ｂを接続することにより互いに接続され、コイル用導体パターン３３Ａとコイル用導体パターン３３Ｂの接続点が絶縁体層３１Ｂの端面に引出される。また、絶縁体層３１Ｂ乃至３１Ｅのコイル用導体パターン３３Ａ間に形成される容量及び、絶縁体層３１Ｂのコイル用導体パターン３３Ａとアース用導体パターン３２Ａ間に形成される容量によりコイルＬ１と並列にコンデンサＣ１が形成される。また、絶縁体層３１Ｂ乃至３１Ｅのコイル用導体パターン３３Ｂ間に形成される容量及び、絶縁体層３１Ｂのコイル用導体パターン３３Ｂとアース用導体パターン３２Ａ間に形成される容量によりコイルＬ２と並列にコンデンサＣ２が形成される。
絶縁体層３１Ｆの表面には、アース用導体パターン３２Ｂが形成される。このアース用導体パターン３２Ｂは、絶縁体層３１Ｆの３つの端面に引出される。
絶縁体層３１Ｇの表面には、コイル用導体パターン３４とコイル用導体パターン３５が形成される。コイル用導体パターン３４とコイル用導体パターン３５は、絶縁体層の片側半面（図３では右半面）に形成され、互いに接続される。
絶縁体層３１Ｈの表面には、コイル用導体パターン３４、３５と容量用導体パターン３８Ａ、３９Ａが形成される。コイル用導体パターン３４とコイル用導体パターン３５は、絶縁体層３１Ｈの片側半面（図３では右半面）に、絶縁体層の幅方向に並べて形成される。また、容量用導体パターン３８Ａと容量用導体パターン３９Ａは、絶縁体層３１Ｈの残りの半面（図３では左半面）に、絶縁体層の幅方向に並べて形成される。この容量用導体パターン３８Ａは、絶縁体層３１Ｆ〜３１Ｈのスルーホールを介してコイル用導体パターン３３Ａに接続される。また、容量用導体パターン３９Ａは、絶縁体層３１Ｆ〜３１Ｈのスルーホールを介してコイル用導体パターン３３Ｂに接続される。そして、この容量用導体パターン３８Ａと容量用導体パターン３９Ａ間に形成される容量及びコイルＬ１とコイルＬ２間の容量によってコンデンサＣ３が形成される。
絶縁体層３１Ｉの表面には、コイル用導体パターン３４、３５と容量用導体パターン３８Ｂ、３９Ｂが形成される。コイル用導体パターン３４とコイル用導体パターン３５は、絶縁体層３１Ｈの片側半面（図３では右半面）に、絶縁体層の幅方向に並べて形成される。また、容量用導体パターン３８Ｂと容量用導体パターン３９Ｂは、絶縁体層３１Ｉの残りの半面（図３では左半面）に、容量用導体パターン３８Ｂが容量用導体パターン３８Ａと対向し、容量用導体パターン３９Ｂが容量用導体パターン３９Ａと対向するように形成される。そして、絶縁体層３１Ｇ乃至３１Ｉのコイル用導体パターン３４をスルーホールを介して螺旋状に接続してコイルＬ３が形成され、絶縁体層３１Ｇ乃至３１Ｉのコイル用導体パターン３５をスルーホールを介して螺旋状に接続してコイルＬ４が形成される。このコイルＬ３とコイルＬ４は、絶縁体層３１Ｇのコイル用導体３４とコイル用導体３５を接続することにより互いに接続される。このコイルＬ３は、絶縁体層３１Ｉのコイル用導体パターン３４と容量用導体パターン３９Ｂを接続することにより、容量用導体パターン３９Ａと容量用導体パターン３９Ｂ間の容量で形成されるコンデンサＣ５を介してコイルＬ２に接続される。また、コイルＬ４は、絶縁体層３１Ｉのコイル用導体パターン３５の一端をどこにも接続することなく絶縁体層３１Ｉの端面と離れた位置に延在させることにより、一端が電気的に浮いた状態になっている。さらに、容量用導体パターン３８Ａと容量用導体パターン３８Ｂ間に形成された容量によりコンデンサＣ４が形成される。
絶縁体層３１Ｊの表面には、コイル用導体パターン３６とコイル用導体パターン３７が形成される。コイル用導体パターン３６とコイル用導体パターン３７は、絶縁体層３１Ｊの片側半面（図３では右半面）に、コイル用導体パターン３６がコイル用導体パターン３４と対向し、コイル用導体パターン３７がコイル用導体パターン３５と対向するように形成される。このコイル用導体パターン３６とコイル用導体パターン３７は互いに接続され、接続点が絶縁体層３１Ｊの端面まで引出される。
絶縁体層３１Ｋの表面には、コイル用導体パターン３６とコイル用導体パターン３７が形成される。コイル用導体パターン３６とコイル用導体パターン３７は、絶縁体層３１Ｋの片側半面（図３では右半面）に、絶縁体層の幅方向に並べて形成される。コイル用導体パターン３６の一端とコイル用導体パターン３７の一端は、絶縁体層３１Ｋの対向する端面に引出される。また、このコイル用導体パターン３６とコイル用導体パターン３７は、絶縁体層３１Ｌによって覆われる。そして、絶縁体層３１Ｊ、３１Ｋのコイル用導体パターン３６をスルーホールを介して螺旋状に接続してコイルＬ５が形成され、絶縁体層３１Ｊ、３１Ｋのコイル用導体パターン３７をスルーホールを介して螺旋状に接続してコイルＬ６が形成される。
この様に積層された積層体には、図４に示す様に不平衡用端子２１、平衡用端子２２、２３、４つのグランド用端子Ｇ、ダミー端子ＮＣが形成される。そして、容量用導体パターン３８Ｂが不平衡用端子２１に、アース用導体パターン３２Ａ、３２Ｂがグランド用端子Ｇに、絶縁体層３１Ｊのコイル用導体パターン３６とコイル用導体パターン３７の共通接続端がグランド用端子Ｇに、絶縁体層３１Ｋのコイル用導体パターン３６が平衡用端子２２に、絶縁体層３１Ｋのコイル用導体パターン３７が平衡用端子２３にそれぞれ接続される。
【００１３】
この様に形成された積層型電子部品は、図５に示す様に、絶縁体層の積層方向から積層体を透視したとき、バンドパスフィルタとバランが横に並ぶ様に、中心線を基準として一方の側（図５では左半分）にバンドパスフィルタが、他方の側（図５では右半分）にバランが形成される。また、バンドパスフィルタを構成するコイルＬ１、Ｌ２と、バランを構成するコイルＬ３、Ｌ４、Ｌ５、Ｌ６は、その間隔Ｗが200μｍ以上有する様に形成される。
この様な積層型電子部品は、バンドパスフィルタのコイル用導体パターンの線幅を100μｍ、バランのコイル用導体パターンの線幅を75μｍとしたところ、図６と図７の１に示す様に通過帯域が2.11〜2.17ＧＨｚで、1.7ＧＨｚ付近に減衰極が形成された特性を得ることができ、この積層型電子部品を用いた場合、Ｗ−ＣＤＭＡ帯の信号を通過させ、ＤＣＳ1800ＭＨｚ帯を減衰させることができる。また、この時の積層型電子部品の大きさは、縦横が3.2ｍｍ×1.6ｍｍ、高さが１ｍｍとなった。なお、図６において、横軸は周波数、縦軸は減衰量をそれぞれ示し、Ａに伝送特性、Ｂに反射特性をそれぞれ示している。
【００１４】
図８は、本発明の積層型電子部品の第２の実施例を示す分解斜視図である。
絶縁体層８１Ａの表面には、アース用導体パターン８２Ａが形成される。
絶縁体層８１Ｂ、８１Ｃの表面の片側半面（右半面）にコイル用導体パターン８３、８４を形成し、それぞれのコイル用導体パターンを接続して直列に接続されたコイルＬ３とコイルＬ４が形成される。
絶縁体層８１Ｄ、８１Ｅの表面の片側半面（右半面）にコイル用導体パターン８５、８６を形成し、それぞれのコイル用導体パターンを接続してコイルＬ５とコイルＬ６が形成される。
絶縁体層８１Ｆの表面には、アース用導体パターンが形成される。
絶縁体層８１Ｇ乃至８１Ｊの表面の片側半面（左半面）にコイル用導体パターン８７Ａ、８７Ｂを形成し、それぞれのコイル用導体パターンを接続してコイルＬ１とコイルＬ２が形成される。
絶縁体層８１Ｋの表面の片側半面（左半面）に容量用導体パターン８８Ａと容量用導体パターン８９Ａが形成され、容量用導体パターン８８Ａがコイル用導体パターン８７Ａに、容量用導体パターン８９Ａがコイル用導体パターン８７Ｂにそれぞれ接続される。
絶縁体層８１Ｌの表面の片側半面（左半面）に容量用導体パターン８８Ｂと容量用導体パターン８９Ｂが形成され、容量用導体パターン８８Ａと容量用導体パターン８８Ｂ間にコンデンサＣ４が、容量用導体パターン８９Ａと容量用導体パターン８９Ｂ間にコンデンサＣ５がそれぞれ形成される。また、容量用導体パターン８９Ｂは、積層体の側面に設けられた外部電極を介して絶縁体層８１Ｃのコイル用導体パターン８３に接続される。
この様な積層型電子部品は、バンドパスフィルタのコイル用導体パターンの線幅を100μｍ、バランのコイル用導体パターンの線幅を75μｍとしたところ、図７の２に示す様に通過帯域が2.11〜2.17ＧＨｚで、1.7ＧＨｚ付近に減衰極が形成された特性を得ることができ、この積層型電子部品を用いた場合、Ｗ−ＣＤＭＡ帯の信号を通過させ、ＤＣＳ1800ＭＨｚ帯を減衰させることができる。また、この時の積層型電子部品の大きさは、縦横が3.2ｍｍ×1.6ｍｍ、高さが１ｍｍとなった。
【００１５】
図９は、本発明の積層型電子部品の第３の実施例を示す分解斜視図である。
絶縁体層９１Ａの表面には、アース用導体パターン９２Ａが形成される。アース用導体パターン９２Ａは、絶縁体層９１Ａの対向する端面にそれぞれ２箇所ずつ引出される。
絶縁体層９１Ｂの表面には、片側半面（左半面）にコイル用導体パターン８３Ｃが形成される。
絶縁体層９１Ｃ乃至９１Ｇの表面の片側半面（左半面）にコイル用導体パターン９３Ａ、９３Ｂを形成し、それぞれのコイル用導体パターンを接続してコイルＬ１とコイルＬ２が形成される。また、絶縁体層９１Ｆの表面の残りの半面（右半面）には、アース用導体パターン９２Ｂが形成される。
絶縁体層９１Ｈ乃至９１Ｊの表面の片側半面（右半面）にコイル用導体パターン９４、９５を形成し、それぞれのコイル用導体パターンを接続して直列に接続されたコイルＬ３とコイルＬ４が形成される。また、絶縁体層９１Ｉの表面の残りの半面（左半面）に容量用導体パターン９８Ａと容量用導体パターン９９Ａが形成され、容量用導体パターン９８Ａがコイル用導体パターン８３Ａに、容量用導体パターン９９Ａがコイル用導体パターン８３Ｂにそれぞれ接続される。さらに、絶縁体層９１Ｊの表面の残りの半面（左半面）に容量用導体パターン９８Ｂと容量用導体パターン９９Ｂが形成され、容量用導体パターン９９Ｂがコイル用導体パターン９４に接続される。この容量用導体パターン９８Ａと容量用導体パターン９８Ｂ間にコンデンサＣ４が、容量用導体パターン９９Ａと容量用導体パターン９９Ｂ間にコンデンサＣ５がそれぞれ形成される。
絶縁体層９１Ｋ、９１Ｌの表面の片側半面（右半面）にコイル用導体パターン９５、９６を形成し、それぞれのコイル用導体パターンを接続してコイルＬ５とコイルＬ６が形成される。
この様に積層された積層体には、図１０に示す様に対向する側面に４つずつ外部端子が形成される。
この様な積層型電子部品は、バンドパスフィルタのコイル用導体パターンの線幅を100μｍ、バランのコイル用導体パターンの線幅を75μｍとしたところ、図７の３に示す様に通過帯域が2.4〜2.5ＧＨｚで、1.89ＧＨｚ付近に減衰極が形成された特性を得ることができ、この積層型電子部品を用いた場合、Ｂｌｕｅｔｏｏｔｈ帯の信号を通過させ、Ｗ−ＣＤＭＡ帯を減衰させることができる。また、この時の積層型電子部品の大きさは、縦横が3.2ｍｍ×1.6ｍｍ、高さが１ｍｍとなった。
【００１６】
図１１は、本発明の積層型電子部品の第４の実施例を示す分解斜視図である。
絶縁体層１１１Ａの表面には、アース用導体パターン１１２Ａが形成される。アース用導体パターン１１２Ａは、絶縁体層１１１Ａの対向する端面にそれぞれ１箇所ずつ引出される。
絶縁体層１１１Ｂの表面の片側半面（左半面）に形成されたコイル用導体パターン１１３Ｃと絶縁体層１１１Ｃ乃至１１１Ｇの表面の片側半面（左半面）に形成されたコイル用導体パターン１１３Ａ、１１３ＢによってコイルＬ１とコイルＬ２が形成される。また、絶縁体層１１１Ｆの表面の残り半面（右半面）には、アース用導体パターン１１２Ｂが形成される。
絶縁体層１１１Ｈ乃至１１１Ｊの表面の片側半面（右半面）に形成されたコイル用導体パターン１１４、１１５によって直列に接続されたコイルＬ３とコイルＬ４が形成される。また、絶縁体層１１１Ｉの表面の残りの半面に形成された容量用導体パターン１１８Ａ、１１９Ａと絶縁体層１１１Ｊの表面の残りの半面に形成された容量用導体パターン１１８Ｂ、１１９ＢによってコンデンサＣ４とコンデンサＣ５が形成される。
絶縁体層１１１Ｋ、１１１Ｌの表面の片側半面に形成されたコイル用導体パターン１１６、１１７によってコイルＬ５とコイルＬ６が形成される。
この様に積層された積層体には、図１２に示す様に対向する側面に３つずつ外部端子が形成される。
この様な積層型電子部品は、バンドパスフィルタのコイル用導体パターンの線幅を100μｍ、バランのコイル用導体パターンの線幅を75μｍとしたところ、図７の４に示す様に通過帯域が2.4〜2.5ＧＨｚで、1.92ＧＨｚ付近に減衰極が形成された特性を得ることができ、この積層型電子部品を用いた場合、Ｂｌｕｅｔｏｏｔｈ帯の信号を通過させ、Ｗ−ＣＤＭＡ帯を減衰させることができる。また、この時の積層型電子部品の大きさは、縦横が3.2ｍｍ×1.6ｍｍ、高さが１ｍｍとなった。
【００１７】
また、積層型電子部品１０のフィルタとバランは、図１３に示す様に、コイルＬ７とコンデンサＣ６を並列に接続し、コイルＬ７の一端とアース間にコンデンサＣ７を、コイルＬ７の他端とアース間にコンデンサＣ８をそれぞれ接続したローパスフィルタと、コイルＬ８とコイルＬ９が接続され、コイルＬ８に一端が接地されたコイルＬ１０を電磁気的に結合し、コイルＬ９に一端が接地されたコイルＬ１１を電磁気的に結合して形成したいわゆるマーチャンド型のバランによって構成されてもよい。
【００１８】
この様なフィルタとバランは、図１４のように絶縁体層と導体パターンを積層することによりこれらの積層体内に形成される。
絶縁体層１４１Ａ乃至１４１Ｊは、磁性体、非磁性体、誘電体等、絶縁性を有する材料を用いて形成される。
絶縁体層１４１Ａの表面には、アース用導体パターン１４２Ａが形成される。
絶縁体層１４１Ｂの表面の片側半面（図１４では左半面）には、容量用導体パターン１４３、１４４が形成される。このアース用導体パターン１４２Ａと容量用導体パターン１４３間にコンデンサＣ７が形成される。また、アース用導体パターン１４２Ａと容量用導体パターン１４４間にコンデンサＣ８が形成される。
絶縁体層１４１Ｃの表面の片側半面（左半面）には、容量用導体パターン１４５が形成される。この容量用導体パターン１４５と容量用導体パターン１４３、１４４によってコンデンサＣ６が形成される。
絶縁体層１４１Ｄの表面には、アース用導体パターン１４２Ｂが形成される。
絶縁体層１４１Ｅの表面の片側半面（左半面）に形成されたコイル用導体パターン１４６と絶縁体層１４１Ｇの表面の片側半面（左半面）に形成されたコイル用導体パターン１４６を螺旋状に接続してコイルＬ７が形成される。
絶縁体層１４１Ｅの表面の残り半面（右半面）に形成されたコイル用導体パターン１４７、１４８、絶縁体層１４１Ｆの表面の片側半面（右半面）に形成されたコイル用導体パターン１４７、１４８及び、絶縁体層１４１Ｇの表面の残り半面（右半面）に形成されたコイル用導体パターン１４７、１４８によって直列に接続されたコイルＬ８とコイルＬ９が形成される。このコイルＬ８とローパスフィルタを構成するコイルＬ７は、絶縁体層１４１Ｇのコイル用導体パターン１４６とコイル用導体パターン１４７を接続することにより、互いに接続される。
絶縁体層１４１Ｈ、１４１Ｉの表面の残り半面（右半面）に形成されたコイル用導体パターン１４９、１５０によってコイルＬ１０とコイルＬ１１が形成される。
この様に積層された積層体には、図１５に示す様に対向する側面に４つずつ外部端子が形成される。
この様に形成された積層型電子部品は、図１６に示す様に、絶縁体層の積層方向から積層体を透視したとき、ローパスフィルタとバランが横に並ぶ様に、中心線を基準として一方の側（図１６では左半分）にローパスフィルタが、他方の側（図１６では右半分）にバランが形成される。また、ローパスフィルタを構成するコイルＬ７と、バランを構成するコイルＬ８、Ｌ９、Ｌ１０、Ｌ１１は、その間隔Ｗが300μｍ以上有する様に形成される。
この様な積層型電子部品は、ローパスフィルタのコイル用導体パターンの線幅を100μｍ、バランのコイル用導体パターンの線幅を75μｍとしたところ、図１７に示す様に通過帯域が2.4〜2.5ＧＨｚで、５ＧＨｚ付近に減衰極が形成された特性を得ることができ、この積層型電子部品を用いた場合、Ｂｌｕｅｔｏｏｔｈ帯の信号を通過させ、２倍高調波成分を減衰させることができる。また、この時の積層型電子部品の大きさは、縦横が3.2ｍｍ×1.6ｍｍ、高さが１ｍｍとなった。なお、図１７において、横軸は周波数、縦軸は減衰量を示し、Ａに伝送特性を、Ｂに反射特性を示している。
【００１９】
以上、本発明の積層型電子部品の実施例を述べたが、本発明はこれらの実施例に限定されるものではない。例えば、バランは、実施例ではマーチャンド型のものについて説明したが、純伝送型や、トリファイラ型でもよい。また、バンドパスフィルタとバランは、コイルＬ３を構成するコイル用導体パターンとコンデンサＣ５を構成する容量用導体パターンを絶縁体層のスルーホールを介して接続してもよい。さらに、コンデンサＣ３を構成する２つの容量用導体パターンは、実施例では横に並べて形成されているが、絶縁体層を介して対向する様に形成されてもよい。またさらに、バンドパスフィルタは様々な回路構成にすることができる。
また、ローパスフィルタとバランは、コイルＬ７を構成するコイル用導体パターンとコイルＬ８を構成するコイル用導体パターンを、外部端子を介して接続したり、絶縁体層のスルーホールを介して接続したりすることにより互いに接続されてもよい。さらに、ローパスフィルタは様々な回路構成にすることができる。
さらに、実施例では、受信回路の高周波増幅器の出力端と周波数混合器の平衡入出力タイプのＩＣの入力端間に挿入する場合を説明したが、周波数混合器の平衡入出力タイプのＩＣの入力端とＶＣＯの出力端間に挿入することもできる。
またさらに、実施例では移動体通信端末の場合を説明したが、不平衡線路と平衡線路間に挿入されればよく、本発明をＷ−ＬＡＮに適用することもできる。
【００２０】
【発明の効果】
以上述べた様に、本発明の積層型電子部品は、絶縁体層と導体パターンを積層した積層体内に、フィルタとバランを内蔵し、フィルタとバランは、互いに重畳しないように横にずらして形成され、不平衡用端子と１対の平衡用端子間に接続されるので、従来の様にプリント基板上で配線することなく、使用周波数帯域外のノイズの除去と平衡信号と不平衡信号の変換を１つのチップ部品で達成できる。また、必要とされるバランの出力インピーダンスに影響されることなくフィルタの特性が最良になる様にフィルタの出力インピーダンスを設定することができる。
従って、本発明の積層型電子部品は、高周波（マイクロ波）通信機器の小型化に貢献することができると共に、従来よりも使用周波数帯域外のノイズ除去能力を向上させることができる。
【図面の簡単な説明】
【図１】本発明の積層型電子部品を用いた高周波（マイクロ波）通信機器の回路例を示す回路図である。
【図２】本発明の積層型電子部品の回路図である。
【図３】本発明の積層型電子部品の第１の実施例を示す分解斜視図である。
【図４】本発明の積層型電子部品の第１の実施例の斜視図である。
【図５】本発明の積層型電子部品の上面図である。
【図６】本発明の積層型電子部品の第１の実施例の特性を示すグラフである。
【図７】本発明の積層型電子部品の特性を示す表である。
【図８】本発明の積層型電子部品の第２の実施例を示す分解斜視図である。
【図９】本発明の積層型電子部品の第３の実施例を示す分解斜視図である。
【図１０】本発明の積層型電子部品の第３の実施例の斜視図である。
【図１１】本発明の積層型電子部品の第４の実施例を示す分解斜視図である。
【図１２】本発明の積層型電子部品の第４の実施例の斜視図である。
【図１３】本発明の積層型電子部品の別の回路図である。
【図１４】本発明の積層型電子部品の第５の実施例の分解斜視図である。
【図１５】本発明の積層型電子部品の第５の実施例の斜視図である。
【図１６】本発明の積層型電子部品の上面図である。
【図１７】本発明の積層型電子部品の第５の実施例の特性を示すグラフである。
【図１８】高周波（マイクロ波）通信機器の回路図である。
【図１９】別の高周波（マイクロ波）通信機器の回路図である。
【符号の説明】
１１アンテナ
１２スイッチング素子
１３受信回路
１４送信回路[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a multilayer electronic component mounted on a mobile communication terminal or a high-frequency (microwave) communication device such as a W-LAN.
[0002]
[Prior art]
As shown in FIG. 18, a receiving circuit 183 and a transmitting circuit 184 are connected to the mobile communication terminal via a switching element 182 connected to the antenna 181, and a reception signal from the antenna 181 is connected to the receiving circuit 183. Some switching elements 182 are alternately switched at high speed so that transmission signals from 184 are transmitted to the antenna 181. In the receiving circuit 183 of this mobile communication terminal, a filter 187 is inserted between the high frequency amplifier 185 and the frequency mixer 186.
In recent years, this type of mobile communication terminal has been configured with several ICs, passive components of peripheral circuits, and filters. In addition, the driving voltage of this IC is lowered to be used for a mobile communication terminal that is saving power. Under such circumstances, in this type of mobile communication terminal, balanced input / output type ICs are being used for frequency mixers for the purpose of improving the S / N ratio accompanying the reduction in drive voltage.
[0003]
[Problems to be solved by the invention]
However, many switching elements 182 and high-frequency amplifiers 185 are still unbalanced. For this reason, the filter 187 of the receiving circuit 183 is configured such that an unbalanced type is formed on the printed circuit board of the mobile communication terminal using discrete parts for the circuit elements constituting the filter, or the circuit elements constituting the filter are integrated. The formed unbalanced type is generally mounted on a printed circuit board of a mobile communication terminal. Also, balanced input / output type ICs used in frequency mixers generally differ from the output impedance of the filter, such as 100Ω or 200Ω, for example. Accordingly, in this type of mobile communication terminal, in order to convert the unbalanced signal output from the filter 187 into a balanced signal and to match the impedance of the filter 187 and the frequency mixer 186, as shown in FIG. The balun 188 needs to be inserted between the filter 187 and the frequency mixer 186, the space for mounting the balun 188 on the printed circuit board of the mobile communication terminal, the balun 188, the filter 187, the balun 188, and the frequency mixer A space for forming a wiring pattern for connecting 186 is required, and the shape is increased.
[0004]
In this type of mobile communication terminal, the high frequency amplifier 185, the filter 187, the balun 188, and the frequency mixer 186 are sequentially connected via the wiring pattern of the printed circuit board of the mobile communication terminal. In order to match the impedance between them, it is necessary to unify the input / output impedance of the filter 187 and the input impedance of the balun 188 to 50Ω. Therefore, the characteristics of the filter are limited by the input / output impedance, and the function as a filter may not be sufficiently exhibited.
[0005]
An object of the present invention is to provide a multilayer electronic component that contributes to miniaturization of a high-frequency (microwave) communication device and can improve the noise removal capability outside the use frequency band.
[0006]
[Means for Solving the Problems]
The multilayer electronic component of the present invention incorporates a filter and a balun in a laminate in which an insulator layer and a conductor pattern are laminated, and the filter and the balun are formed by shifting laterally so as not to overlap each other. And a pair of balancing terminals. The coil constituting the filter and the coil constituting the balun are arranged shifted in the stacking direction. In addition, the filter and the balun connect the conductor pattern constituting the filter formed on the same insulator layer and the conductor pattern constituting the balun on the insulator layer, or through an external electrode provided in the laminate. Or by connecting through a through hole provided in the insulator layer.
[0007]
In addition, the multilayer electronic component of the present invention includes a bandpass filter in which a first resonator and a second resonator are electromagnetically coupled in a laminate in which an insulator layer and a conductor pattern are laminated, and a first coil. And the second coil are connected, the third coil having one end grounded is electromagnetically coupled to the first coil, and the fourth coil having one end grounded is electromagnetically coupled to the second coil. Built-in balun, the bandpass filter and the balun are laterally shifted so as not to overlap each other, and the coil constituting the filter and the coil constituting the balun are shifted in the laminating direction and formed in the laminated body. A balun is connected between the unbalanced terminal and the pair of balanced terminals. The band-pass filter and the balun are connected by connecting the conductor pattern constituting the capacitor connected to one end of the second resonator formed in the same insulator layer and the conductor pattern constituting the first coil of the balun. The connection is performed on the insulator layer, the band pass filter and the balun are connected via an external terminal, or the band pass filter and the balun are connected via a through hole provided in the insulator layer.
In the multilayer electronic component of the present invention, the coil and the first capacitor are connected in parallel in the multilayer body in which the insulator layer and the conductor pattern are stacked, and the second capacitor is connected between one end of the coil and the ground. A low-pass filter in which a third capacitor is connected between the other end of the coil and the ground, and a third coil in which the first coil and the second coil are connected and one end is grounded to the first coil. The balun is electromagnetically coupled to the second coil with one end grounded to the second coil, and the low-pass filter and the balun are formed laterally so as not to overlap each other. The low-pass filter and the balun are connected between the unbalanced terminal and the pair of balanced terminals. The connection between the low-pass filter and the balun is to connect the conductor pattern constituting the coil of the low-pass filter formed on the same insulator layer and the conductor pattern constituting the first coil of the balun on the insulator layer, The low-pass filter and the balun are connected through an external terminal, or the low-pass filter and the balun are connected through a through hole provided in an insulator layer.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
In the multilayer electronic component of the present invention, a filter and a balun are integrally formed in a multilayer body in which an insulator layer and a conductor pattern are laminated. The filter and the balun are formed so that the filter is formed on one side of the stacked body and the balun is formed on the other side so as to be arranged side by side when the stacked body is seen through from the stacking direction of the insulating layers. The filter and balun formed in this way are connected between an unbalanced terminal provided in the laminate and a pair of balanced terminals. In this case, the filter and the balun are connected to each other by connecting the conductor pattern constituting the filter formed on the same insulator layer and the conductor pattern constituting the balun on the insulator layer.
Therefore, in the multilayer electronic component of the present invention, since the filter and the balun are integrally formed in the multilayer body as described above, the influence of each other can be reduced and the input impedance of the IC (for example, 100Ω or 200Ω) can be reduced. The output impedance of the filter can be set without being influenced by the required output impedance of the balun. In this multilayer electronic component, an unbalanced terminal is connected to the unbalanced line, and a pair of balanced terminals are connected to the balanced line.
[0009]
【Example】
Hereinafter, the multilayer electronic component of the present invention will be described with reference to FIGS.
FIG. 1 is a circuit diagram showing a circuit example of a high-frequency (microwave) communication device using the multilayer electronic component of the present invention, FIG. 2 is a circuit diagram of the multilayer electronic component of the present invention, and FIG. 3 is a multilayer mold of the present invention. It is a disassembled perspective view which shows the 1st Example of an electronic component.
In the mobile communication terminal using the multilayer electronic component of the present invention, an antenna is connected to the common end of the switching element 12, and the receiving circuit 13 and the transmitting circuit 14 are connected to the branch end of the switching element 12. The multilayer electronic component 10 of the present invention is inserted between the output terminal of the high frequency amplifier 15 of the receiving circuit 13 and the input terminal of the balanced input / output type IC used in the frequency mixer 16.
[0010]
In the multilayer electronic component 10, a filter connected to an unbalanced terminal and a balun connected between the filter and a pair of balancing terminals are formed in the multilayer body. The multilayer electronic component 10 is mounted on a printed wiring board of a mobile communication terminal. The unbalanced terminal of the multilayer electronic component 10 is connected to an unbalanced transmission line connected to the output terminal of the high frequency amplifier 15. A pair of balancing terminals of the multilayer electronic component 10 is connected to a balanced transmission line connected to an input terminal of an IC used in the frequency mixer 16.
[0011]
For example, as shown in FIG. 2, the filter and balun of the multilayer electronic component 10 include a first resonator in which a coil L1 and a capacitor C1 are connected in parallel, and a second resonator in which a coil L2 and a capacitor C2 are connected in parallel. A band-pass filter formed by electromagnetically coupling, a coil L3 and a coil L4 are connected, a coil L5 having one end grounded to the coil L3 is electromagnetically coupled, and a coil having one end grounded to the coil L4 It is constituted by a so-called merchandise type balun formed by electromagnetically coupling L6. This band pass filter is obtained by electromagnetically coupling two resonators. The connection point between the coil L1 and the capacitor C1 is connected to the unbalanced terminal 21 via the capacitor C4, and the connection between the coil L2 and the capacitor C2 is performed. The point is connected to the balun coil L3 via a capacitor C5. In this balun, the coil L5 is connected to the balancing terminal 22 and the coil L6 is connected to the balancing terminal 23.
Note that the capacitor C3 of the band-pass filter is a capacitance generated by capacitive coupling of the two resonators, and the other end of the balun coil L4 is in an electrically floating state.
[0012]
Such a filter and balun are formed in these laminates by laminating an insulator layer and a conductor pattern as shown in FIG.
The insulator layers 31A to 31L are formed using an insulating material such as a magnetic material, a non-magnetic material, or a dielectric material.
A grounding conductor pattern 32A is formed on the surface of the insulating layer 31A. The grounding conductor pattern 32A is drawn to the four end faces of the insulating layer 31A.
A coil conductor pattern 33A and a coil conductor pattern 33B are formed on the surfaces of the insulator layers 31B, 31C, 31D, and 31E, respectively. The coil conductor pattern 33A and the coil conductor pattern 33B are formed side by side in the width direction of the insulator layer on one half surface (left half surface in FIG. 3) of the insulator layer. The coil conductor pattern 33A of the insulator layers 31B to 31E is spirally connected through a through hole to form a coil L1, and the coil conductor pattern 33B of the insulator layers 31B to 31E is connected to the through hole. A coil L2 is formed in a spiral connection. The coil L1 and the coil L2 are connected to each other by connecting the coil conductor pattern 33A and the coil conductor pattern 33B on the surface of the insulating layer 31B, and the connection point between the coil conductor pattern 33A and the coil conductor pattern 33B is It is pulled out to the end face of the insulator layer 31B. Further, the capacitance formed between the coil conductor pattern 33A of the insulator layers 31B to 31E and the capacitance formed between the coil conductor pattern 33A and the ground conductor pattern 32A of the insulator layer 31B are arranged in parallel with the coil L1. A capacitor C1 is formed. Further, the capacitance formed between the coil conductor pattern 33B of the insulator layers 31B to 31E and the capacitance formed between the coil conductor pattern 33B of the insulator layer 31B and the ground conductor pattern 32A are arranged in parallel with the coil L2. A capacitor C2 is formed.
A grounding conductor pattern 32B is formed on the surface of the insulating layer 31F. This grounding conductor pattern 32B is drawn out to the three end faces of the insulating layer 31F.
A coil conductor pattern 34 and a coil conductor pattern 35 are formed on the surface of the insulator layer 31G. The coil conductor pattern 34 and the coil conductor pattern 35 are formed on one half surface (the right half surface in FIG. 3) of the insulator layer and connected to each other.
Coil conductor patterns 34 and 35 and capacitor conductor patterns 38A and 39A are formed on the surface of the insulating layer 31H. The coil conductor pattern 34 and the coil conductor pattern 35 are formed side by side in the width direction of the insulator layer on one half surface (the right half surface in FIG. 3) of the insulator layer 31H. The capacitive conductor pattern 38A and the capacitive conductor pattern 39A are formed side by side in the width direction of the insulator layer on the remaining half surface (left half surface in FIG. 3) of the insulator layer 31H. The capacitive conductor pattern 38A is connected to the coil conductor pattern 33A through the through holes of the insulator layers 31F to 31H. The capacitive conductor pattern 39A is connected to the coil conductor pattern 33B through the through holes of the insulator layers 31F to 31H. The capacitor C3 is formed by the capacitance formed between the capacitance conductor pattern 38A and the capacitance conductor pattern 39A and the capacitance between the coil L1 and the coil L2.
Coil conductor patterns 34 and 35 and capacitor conductor patterns 38B and 39B are formed on the surface of the insulator layer 31I. The coil conductor pattern 34 and the coil conductor pattern 35 are formed side by side in the width direction of the insulator layer on one half surface (the right half surface in FIG. 3) of the insulator layer 31H. Further, the capacitive conductor pattern 38B and the capacitive conductor pattern 39B are arranged on the remaining half surface (left half surface in FIG. 3) of the insulator layer 31I, and the capacitive conductor pattern 38B faces the capacitive conductor pattern 38A. The pattern 39B is formed to face the capacitive conductor pattern 39A. Then, the coil conductor pattern 34 of the insulator layers 31G to 31I is spirally connected through a through hole to form a coil L3, and the coil conductor pattern 35 of the insulator layers 31G to 31I is connected to the through hole. A coil L4 is formed in a spiral connection. The coil L3 and the coil L4 are connected to each other by connecting the coil conductor 34 and the coil conductor 35 of the insulator layer 31G. This coil L3 is connected to the coil conductor pattern 34 of the insulator layer 31I and the capacitor conductor pattern 39B via a capacitor C5 formed by a capacitance between the capacitor conductor pattern 39A and the capacitor conductor pattern 39B. Connected to coil L2. Moreover, the coil L4 is in a state where one end of the coil conductor pattern 35 of the insulator layer 31I is electrically floated by extending to a position away from the end face of the insulator layer 31I without connecting anywhere. It has become. Further, a capacitor C4 is formed by the capacitance formed between the capacitive conductor pattern 38A and the capacitive conductor pattern 38B.
A coil conductor pattern 36 and a coil conductor pattern 37 are formed on the surface of the insulator layer 31J. The coil conductor pattern 36 and the coil conductor pattern 37 are arranged on one half surface (the right half surface in FIG. 3) of the insulator layer 31J, the coil conductor pattern 36 faces the coil conductor pattern 34, and the coil conductor pattern 37 is It is formed so as to face the coil conductor pattern 35. The coil conductor pattern 36 and the coil conductor pattern 37 are connected to each other, and the connection point is drawn to the end surface of the insulator layer 31J.
A coil conductor pattern 36 and a coil conductor pattern 37 are formed on the surface of the insulator layer 31K. The coil conductor pattern 36 and the coil conductor pattern 37 are formed side by side in the width direction of the insulator layer on one half surface (the right half surface in FIG. 3) of the insulator layer 31K. One end of the coil conductor pattern 36 and one end of the coil conductor pattern 37 are drawn out to opposite end surfaces of the insulator layer 31K. Further, the coil conductor pattern 36 and the coil conductor pattern 37 are covered with an insulator layer 31L. The coil conductor pattern 36 of the insulator layers 31J and 31K is spirally connected through a through hole to form a coil L5, and the coil conductor pattern 37 of the insulator layers 31J and 31K is connected through a through hole. A coil L6 is formed in a spiral connection.
As shown in FIG. 4, an unbalanced terminal 21, balanced terminals 22, 23, four ground terminals G, and a dummy terminal NC are formed in the laminated body thus laminated. The capacitor conductor pattern 38B is connected to the unbalanced terminal 21, the ground conductor patterns 32A and 32B are connected to the ground terminal G, and the common connection ends of the coil conductor pattern 36 and the coil conductor pattern 37 of the insulator layer 31J are connected to each other. To the ground terminal G, the coil conductor pattern 36 of the insulator layer 31K is connected to the balancing terminal 22, and the coil conductor pattern 37 of the insulator layer 31K is connected to the balancing terminal 23.
[0013]
As shown in FIG. 5, the multilayer electronic component formed in this way has a center line as a reference so that the bandpass filter and the balun are arranged horizontally when the laminate is seen through from the lamination direction of the insulator layers. A bandpass filter is formed on one side (left half in FIG. 5), and a balun is formed on the other side (right half in FIG. 5). Further, the coils L1 and L2 constituting the band pass filter and the coils L3, L4, L5 and L6 constituting the balun are formed so that the interval W is 200 μm or more.
In such a multilayer electronic component, when the line width of the coil conductor pattern of the bandpass filter is 100 μm and the line width of the coil conductor pattern of the balun is 75 μm, as shown in FIG. 6 and FIG. The band is 2.11 to 2.17 GHz, and a characteristic in which an attenuation pole is formed in the vicinity of 1.7 GHz can be obtained. When this multilayer electronic component is used, a signal in the W-CDMA band is passed and the DCS 1800 MHz band is attenuated. be able to. At this time, the size of the multilayer electronic component was 3.2 mm × 1.6 mm in length and width and 1 mm in height. In FIG. 6, the horizontal axis represents frequency, the vertical axis represents attenuation, A represents transmission characteristics, and B represents reflection characteristics.
[0014]
FIG. 8 is an exploded perspective view showing a second embodiment of the multilayer electronic component of the present invention.
A grounding conductor pattern 82A is formed on the surface of the insulator layer 81A.
Coil conductor patterns 83 and 84 are formed on one half surface (right half surface) of the surface of the insulator layers 81B and 81C, and the coil L3 and the coil L4 connected in series are formed by connecting the respective coil conductor patterns. The
Coil conductor patterns 85 and 86 are formed on one half surface (right half surface) of the surfaces of the insulator layers 81D and 81E, and the coil conductor patterns 85 and 86 are connected to form the coil L5 and the coil L6.
A grounding conductor pattern is formed on the surface of the insulating layer 81F.
Coil conductor patterns 87A and 87B are formed on one half (left half) of the surfaces of the insulator layers 81G to 81J, and the coils L1 and L2 are formed by connecting the coil conductor patterns.
A capacitive conductor pattern 88A and a capacitive conductor pattern 89A are formed on one half (left half) of the surface of the insulating layer 81K, the capacitive conductor pattern 88A is used as a coil conductor pattern 87A, and the capacitive conductor pattern 89A is used as a coil. Each is connected to the conductor pattern 87B.
A capacitive conductor pattern 88B and a capacitive conductor pattern 89B are formed on one half (left half) of the surface of the insulating layer 81L, and the capacitor C4 is connected between the capacitive conductor pattern 88A and the capacitive conductor pattern 88B. Capacitor C5 is formed between 89A and capacitive conductor pattern 89B. Further, the capacitor conductor pattern 89B is connected to the coil conductor pattern 83 of the insulator layer 81C via an external electrode provided on the side surface of the multilayer body.
In such a multilayer electronic component, when the line width of the coil conductor pattern of the bandpass filter is 100 μm and the line width of the coil conductor pattern of the balun is 75 μm, the passband is 2.11 as shown in 2 of FIG. A characteristic in which an attenuation pole is formed in the vicinity of 1.7 GHz at ˜2.17 GHz can be obtained. When this multilayer electronic component is used, a signal in the W-CDMA band can be passed and the DCS 1800 MHz band can be attenuated. . At this time, the size of the multilayer electronic component was 3.2 mm × 1.6 mm in length and width and 1 mm in height.
[0015]
FIG. 9 is an exploded perspective view showing a third embodiment of the multilayer electronic component of the present invention.
A grounding conductor pattern 92A is formed on the surface of the insulating layer 91A. Two grounding conductor patterns 92A are drawn out to two opposing end surfaces of the insulating layer 91A.
On the surface of the insulating layer 91B, a coil conductor pattern 83C is formed on one half surface (left half surface).
Coil conductor patterns 93A and 93B are formed on one half (left half) of the surfaces of the insulating layers 91C to 91G, and the coil L1 and the coil L2 are formed by connecting the coil conductor patterns. A grounding conductor pattern 92B is formed on the remaining half surface (right half surface) of the surface of the insulating layer 91F.
Coil conductor patterns 94 and 95 are formed on one half surface (right half surface) of the surfaces of the insulating layers 91H to 91J, and the coil conductor patterns 94 and 95 are connected to each other to form coils L3 and L4 connected in series. The Further, a capacitive conductor pattern 98A and a capacitive conductor pattern 99A are formed on the remaining half (left half) of the surface of the insulating layer 91I, and the capacitive conductor pattern 98A is formed into a coil conductor pattern 83A and a capacitive conductor pattern 99A. Are connected to the coil conductor pattern 83B. Further, a capacitive conductor pattern 98B and a capacitive conductor pattern 99B are formed on the remaining half surface (left half surface) of the insulator layer 91J, and the capacitive conductor pattern 99B is connected to the coil conductor pattern 94. A capacitor C4 is formed between the capacitance conductor pattern 98A and the capacitance conductor pattern 98B, and a capacitor C5 is formed between the capacitance conductor pattern 99A and the capacitance conductor pattern 99B.
Coil conductor patterns 95 and 96 are formed on one half surface (right half surface) of the surfaces of the insulator layers 91K and 91L, and the coil conductor patterns 95 and 96 are connected to form the coil L5 and the coil L6.
In the laminated body thus laminated, four external terminals are formed on opposite side surfaces as shown in FIG.
In such a multilayer electronic component, when the line width of the coil conductor pattern of the band pass filter is 100 μm and the line width of the coil conductor pattern of the balun is 75 μm, the pass band is 2.4 as shown in FIG. A characteristic in which an attenuation pole is formed in the vicinity of 1.89 GHz at about 2.5 GHz can be obtained. When this multilayer electronic component is used, a Bluetooth band signal can be passed and the W-CDMA band can be attenuated. . At this time, the size of the multilayer electronic component was 3.2 mm × 1.6 mm in length and width and 1 mm in height.
[0016]
FIG. 11 is an exploded perspective view showing a fourth embodiment of the multilayer electronic component of the present invention.
A grounding conductor pattern 112A is formed on the surface of the insulator layer 111A. Each of the grounding conductor patterns 112A is drawn out to one end face of the insulating layer 111A.
The coil conductor pattern 113C formed on one half (left half) of the surface of the insulator layer 111B and the coil conductor patterns 113A and 113B formed on one half (left half) of the surfaces of the insulator layers 111C to 111G. Coil L1 and coil L2 are formed. In addition, a ground conductor pattern 112B is formed on the remaining half surface (right half surface) of the surface of the insulator layer 111F.
A coil L3 and a coil L4 connected in series by the coil conductor patterns 114 and 115 formed on one half surface (right half surface) of the surface of the insulator layers 111H to 111J are formed. Capacitor C4 and capacitor C4 are formed by capacitive conductor patterns 118A and 119A formed on the remaining half of the surface of insulator layer 111I and capacitive conductor patterns 118B and 119B formed on the remaining half of the surface of insulator layer 111J. C5 is formed.
The coil L5 and the coil L6 are formed by the coil conductor patterns 116 and 117 formed on one half of the surface of the insulator layers 111K and 111L.
In the laminated body thus laminated, three external terminals are formed on opposite side surfaces as shown in FIG.
In such a multilayer electronic component, when the line width of the coil conductor pattern of the bandpass filter is 100 μm and the line width of the coil conductor pattern of the balun is 75 μm, the pass band is 2.4 as shown in 4 of FIG. A characteristic in which an attenuation pole is formed in the vicinity of 1.92 GHz at about 2.5 GHz can be obtained, and when this multilayer electronic component is used, a Bluetooth band signal can be passed and the W-CDMA band can be attenuated. . At this time, the size of the multilayer electronic component was 3.2 mm × 1.6 mm in length and width and 1 mm in height.
[0017]
Further, as shown in FIG. 13, the filter and the balun of the multilayer electronic component 10 connect a coil L7 and a capacitor C6 in parallel, connect a capacitor C7 between one end of the coil L7 and the ground, and connect the other end of the coil L7 to the ground. A low-pass filter having a capacitor C8 connected therebetween, a coil L8 and a coil L9 are connected, a coil L10 having one end grounded is electromagnetically coupled, and a coil L11 having one end grounded is electromagnetically coupled to the coil L9. Alternatively, it may be constituted by a so-called merchandized balun formed by combining them.
[0018]
Such a filter and balun are formed in these laminated bodies by laminating an insulator layer and a conductor pattern as shown in FIG.
The insulator layers 141A to 141J are formed using an insulating material such as a magnetic material, a non-magnetic material, or a dielectric material.
A grounding conductor pattern 142A is formed on the surface of the insulating layer 141A.
Capacitor conductor patterns 143 and 144 are formed on one half surface (left half surface in FIG. 14) of the surface of the insulator layer 141B. A capacitor C7 is formed between the ground conductor pattern 142A and the capacitor conductor pattern 143. Further, a capacitor C8 is formed between the grounding conductor pattern 142A and the capacitor conductor pattern 144.
A capacitive conductor pattern 145 is formed on one half surface (left half surface) of the surface of the insulator layer 141C. The capacitor conductor C 145 and the capacitor conductor patterns 143 and 144 form a capacitor C6.
A grounding conductor pattern 142B is formed on the surface of the insulator layer 141D.
The coil conductor pattern 146 formed on one half (left half) of the surface of the insulator layer 141E and the coil conductor pattern 146 formed on one half (left half) of the surface of the insulator layer 141G are spirally connected. Thus, the coil L7 is formed.
Coil conductor patterns 147 and 148 formed on the remaining half surface (right half surface) of the insulator layer 141E, coil conductor patterns 147 and 148 formed on one half surface (right half surface) of the surface of the insulator layer 141F, and The coil L8 and the coil L9 connected in series are formed by the coil conductor patterns 147 and 148 formed on the remaining half surface (right half surface) of the surface of the insulator layer 141G. The coil L8 and the coil L7 constituting the low-pass filter are connected to each other by connecting the coil conductor pattern 146 and the coil conductor pattern 147 of the insulator layer 141G.
A coil L10 and a coil L11 are formed by the coil conductor patterns 149 and 150 formed on the remaining half surface (right half surface) of the surfaces of the insulator layers 141H and 141I.
In the laminated body thus laminated, four external terminals are formed on opposite side surfaces as shown in FIG.
As shown in FIG. 16, the multilayer electronic component formed in this way has a low-pass filter and a balun arranged side by side so that the low-pass filter and the balun are arranged side by side when viewed through the laminate from the lamination direction of the insulator layer. A low-pass filter is formed on the other side (left half in FIG. 16), and a balun is formed on the other side (right half in FIG. 16). Further, the coil L7 constituting the low-pass filter and the coils L8, L9, L10, L11 constituting the balun are formed so that the interval W is 300 μm or more.
In such a multilayer electronic component, when the line width of the coil conductor pattern of the low-pass filter is 100 μm and the line width of the coil conductor pattern of the balun is 75 μm, the pass band is 2.4 to 2.5 GHz as shown in FIG. Thus, a characteristic in which an attenuation pole is formed in the vicinity of 5 GHz can be obtained. When this multilayer electronic component is used, a signal in the Bluetooth band can be passed and the second harmonic component can be attenuated. At this time, the size of the multilayer electronic component was 3.2 mm × 1.6 mm in length and width and 1 mm in height. In FIG. 17, the horizontal axis represents frequency, the vertical axis represents attenuation, A represents transmission characteristics, and B represents reflection characteristics.
[0019]
As mentioned above, although the Example of the multilayer electronic component of this invention was described, this invention is not limited to these Examples. For example, the balun has been described as a merchandise type in the embodiment, but may be a pure transmission type or a trifilar type. Further, the band-pass filter and the balun may connect the coil conductor pattern constituting the coil L3 and the capacitor conductor pattern constituting the capacitor C5 through a through hole in the insulator layer. Further, the two capacitor conductor patterns constituting the capacitor C3 are formed side by side in the embodiment, but may be formed to face each other with an insulator layer interposed therebetween. Furthermore, the bandpass filter can have various circuit configurations.
In addition, the low-pass filter and the balun connect the coil conductor pattern constituting the coil L7 and the coil conductor pattern constituting the coil L8 via an external terminal or via a through hole in the insulator layer. By doing so, they may be connected to each other. Furthermore, the low-pass filter can have various circuit configurations.
Furthermore, in the embodiment, the case of inserting between the output terminal of the high frequency amplifier of the receiving circuit and the input terminal of the balanced input / output type IC of the frequency mixer has been described. It can also be inserted between the end and the output end of the VCO.
Furthermore, in the embodiment, the case of a mobile communication terminal has been described. However, the present invention may be applied to a W-LAN as long as it is inserted between an unbalanced line and a balanced line.
[0020]
【The invention's effect】
As described above, the multilayer electronic component of the present invention includes a filter and a balun built in a laminate in which an insulator layer and a conductor pattern are laminated, and the filter and the balun are formed so as not to overlap each other. Since it is connected between an unbalanced terminal and a pair of balanced terminals, it eliminates noise outside the operating frequency band and converts balanced and unbalanced signals without wiring on the printed circuit board as in the past. Can be achieved with one chip component. Further, the output impedance of the filter can be set so that the filter characteristics are optimized without being affected by the required balun output impedance.
Therefore, the multilayer electronic component of the present invention can contribute to the miniaturization of a high-frequency (microwave) communication device and can improve the noise removal capability outside the use frequency band as compared with the prior art.
[Brief description of the drawings]
FIG. 1 is a circuit diagram showing a circuit example of a high-frequency (microwave) communication device using a multilayer electronic component of the present invention.
FIG. 2 is a circuit diagram of the multilayer electronic component of the present invention.
FIG. 3 is an exploded perspective view showing a first embodiment of the multilayer electronic component of the present invention.
FIG. 4 is a perspective view of the first embodiment of the multilayer electronic component of the present invention.
FIG. 5 is a top view of the multilayer electronic component of the present invention.
FIG. 6 is a graph showing characteristics of the first example of the multilayer electronic component of the present invention.
FIG. 7 is a table showing characteristics of the multilayer electronic component of the present invention.
FIG. 8 is an exploded perspective view showing a second embodiment of the multilayer electronic component of the present invention.
FIG. 9 is an exploded perspective view showing a third embodiment of the multilayer electronic component of the present invention.
FIG. 10 is a perspective view of a third embodiment of the multilayer electronic component of the present invention.
FIG. 11 is an exploded perspective view showing a fourth embodiment of the multilayer electronic component of the present invention.
FIG. 12 is a perspective view of a fourth embodiment of the multilayer electronic component of the present invention.
FIG. 13 is another circuit diagram of the multilayer electronic component of the present invention.
FIG. 14 is an exploded perspective view of a fifth embodiment of the multilayer electronic component of the present invention.
FIG. 15 is a perspective view of a fifth embodiment of the multilayer electronic component of the present invention.
FIG. 16 is a top view of the multilayer electronic component of the present invention.
FIG. 17 is a graph showing characteristics of the fifth example of the multilayer electronic component of the present invention.
FIG. 18 is a circuit diagram of a high-frequency (microwave) communication device.
FIG. 19 is a circuit diagram of another high-frequency (microwave) communication device.
[Explanation of symbols]
11 Antenna
12 Switching element
13 Receiver circuit
14 Transmitter circuit

Claims

An insulator layer and a conductor pattern are laminated , and a band pass filter in which the first resonator and the second resonator are electromagnetically coupled, and the first coil and the second coil are connected to the laminate. A balun is formed in which a third coil having one end grounded is electromagnetically coupled to the first coil, and a fourth coil having one end grounded is electromagnetically coupled to the second coil;
The band-pass filter and the balun do not overlap each other in the stacking direction , and the positions where the conductor pattern constituting the band-pass filter and the conductor pattern constituting the balun are formed on the insulator layer are lateral to each other. Formed to
The bandpass filter and the balun formed so as not to overlap each other in the laminating direction are formed by shifting the coil constituting the bandpass filter and the coil constituting the balun in the laminating direction,
A conductor pattern constituting a capacitor connected to one end of the second resonator of the bandpass filter and a conductor pattern constituting one end of the first coil of the balun are formed on the same insulator layer, and A multilayer electronic component , wherein the band-pass filter and the balun are connected between an unbalanced terminal and a pair of balanced terminals by being connected.

An insulator layer and a conductor pattern are laminated , and a band pass filter in which the first resonator and the second resonator are electromagnetically coupled, and the first coil and the second coil are connected to the laminate. A balun is formed in which a third coil having one end grounded is electromagnetically coupled to the first coil, and a fourth coil having one end grounded is electromagnetically coupled to the second coil;
The band-pass filter and the balun do not overlap each other in the stacking direction , and the positions where the conductor pattern constituting the band-pass filter and the conductor pattern constituting the balun are formed on the insulator layer are lateral to each other. Formed to
The bandpass filter and the balun formed so as not to overlap each other in the laminating direction are formed by shifting the coil constituting the bandpass filter and the coil constituting the balun in the laminating direction,
The conductor pattern constituting the capacitor connected to one end of the second resonator of the bandpass filter and the conductor pattern constituting the first coil of the balun are connected via an external terminal, thereby A multilayer electronic component comprising a bandpass filter and the balun connected between an unbalanced terminal and a pair of balanced terminals.

An insulator layer and a conductor pattern are laminated , and a band pass filter in which the first resonator and the second resonator are electromagnetically coupled, and the first coil and the second coil are connected to the laminate. A balun is formed in which a third coil having one end grounded is electromagnetically coupled to the first coil, and a fourth coil having one end grounded is electromagnetically coupled to the second coil;
The band-pass filter and the balun do not overlap each other in the stacking direction , and the positions where the conductor pattern constituting the band-pass filter and the conductor pattern constituting the balun are formed on the insulator layer are lateral to each other. Formed to
The bandpass filter and the balun formed so as not to overlap each other in the laminating direction are formed by shifting the coil constituting the bandpass filter and the coil constituting the balun in the laminating direction,
A conductor pattern constituting a capacitor connected to one end of the second resonator of the bandpass filter and a conductor pattern constituting the first coil of the balun are passed through a through hole provided in the insulator layer. And the band-pass filter and the balun are connected between the unbalanced terminal and the pair of balanced terminals.

An insulator layer and a conductive pattern laminated, these stack, the first coil and the first capacitor are connected in parallel, a second capacitor connected between one end and the ground of the first coil, a low-pass filter third capacitor is connected between the other end and ground of the first coil, the second coil and the third coil is connected, a fourth one end to said second coil is grounded coil electromagnetically coupled to, said third balun one end coil is electromagnetically coupled to the fifth coil which is grounded is formed,
The low-pass filter and the balun, as not to overlap in the stacking direction to each other, the conductor patterns forming the conductive pattern and the balun for a low-pass filter is, by shifting the position formed on the insulator layer next to each other Formed,
A conductor pattern constituting the other end of the first coil of the low-pass filter and a conductor pattern constituting one end of the second coil of the balun are formed on the same insulating layer and connected to each other, whereby the low- pass filter A multilayer electronic component, wherein the filter and the balun are connected between an unbalanced terminal and a pair of balanced terminals.

An insulator layer and a conductive pattern laminated, these stack, the first coil and the first capacitor are connected in parallel, a second capacitor connected between one end and the ground of the first coil, a low-pass filter third capacitor is connected between the other end and ground of the first coil, the second coil and the third coil is connected, a fourth one end to said second coil is grounded coil electromagnetically coupled to, said third balun one end coil is electromagnetically coupled to the fifth coil which is grounded is formed,
The low-pass filter and the balun are formed by shifting the positions where the conductor pattern constituting the low-pass filter and the conductor pattern constituting the balun are formed on the insulator layer to each other so as not to overlap each other in the stacking direction. And
The conductor pattern constituting the first coil of the low-pass filter and the conductor pattern constituting the second coil of the balun are connected via an external terminal, whereby the low-pass filter and the balun are connected to the unbalanced terminal. A multilayer electronic component connected between a pair of balancing terminals.

Laminating an insulator layer and a conductor pattern, and in these laminates, a first coil and a first capacitor are connected in parallel, and a second capacitor is connected between one end of the first coil and the ground, a low-pass filter third capacitor is connected, the second coil and the third coil is connected between the other end and ground of the first coil, the fourth one end to said second coil is grounded coil electromagnetically coupled to, said third balun one end coil is electromagnetically coupled to the fifth coil which is grounded is formed,
The low-pass filter and the balun are formed by shifting the positions where the conductor pattern constituting the low-pass filter and the conductor pattern constituting the balun are formed on the insulator layer to each other so as not to overlap each other in the stacking direction. And
By connecting the conductor pattern constituting the first coil of the low-pass filter and the conductor pattern constituting the second coil of the balun through a through hole provided in the insulator layer, A multilayer electronic component, wherein the balun is connected between an unbalanced terminal and a pair of balanced terminals.