JP4195569B2 - Multilayer electronic components - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a multilayer electronic component mounted on a mobile communication terminal or a high-frequency (microwave) communication device such as a wireless LAN.
[0002]
[Prior art]
As shown in FIG. 14, a receiving circuit 143 and a transmitting circuit 144 are connected to the mobile communication terminal via a switching element 142 connected to the antenna 141, and a reception signal from the antenna 141 is connected to the receiving circuit 143. Some switching elements 142 are alternately switched at high speed so that transmission signals from 144 are transmitted to the antenna 141, respectively. In the receiving circuit 143 of this mobile communication terminal, a filter 147 is inserted between the high frequency amplifier 145 and the frequency mixer 146.
In recent years, this type of mobile communication terminal has come to be constituted by several ICs, passive components of peripheral circuits, and filters. In addition, the driving voltage of this IC is lowered to be used for a mobile communication terminal that is saving power. Under such circumstances, in this type of mobile communication terminal, balanced input / output type ICs are being used for frequency mixers for the purpose of improving the S / N ratio accompanying the reduction in drive voltage.
[0003]
[Problems to be solved by the invention]
However, many switching elements 142 and high-frequency amplifiers 145 are still unbalanced. For this reason, the filter 147 of the receiving circuit 143 is formed using an unbalanced type on the printed circuit board of the mobile communication terminal using discrete parts for the circuit elements constituting the filter, or the circuit elements constituting the filter are integrated. The formed unbalanced type is generally mounted on a printed circuit board of a mobile communication terminal. Also, balanced input / output type ICs used in frequency mixers generally differ from the output impedance of the filter, such as 100Ω or 200Ω, for example. Therefore, in this type of mobile communication terminal, in order to convert the unbalanced signal output from the filter 147 into a balanced signal and to match the impedance of the filter 147 and the frequency mixer 146, as shown in FIG. The balun 148 needs to be inserted between the filter 147 and the frequency mixer 146, the space for mounting the balun 148 on the printed circuit board of the mobile communication terminal, the balun 148, the filter 147, the balun 148, and the frequency mixer A space for forming a wiring pattern for connecting 146 is required, and the shape increases.
[0004]
In this type of mobile communication terminal, the high frequency amplifier 145, the filter 147, the balun 148, and the frequency mixer 146 are sequentially connected via the wiring pattern of the printed circuit board of the mobile communication terminal. In order to match the impedance between them, it is necessary to unify the input / output impedance of the filter 147 and the input impedance of the balun 148 to 50Ω. Therefore, the characteristics of the filter are limited by the input / output impedance, and the function as a filter may not be sufficiently exhibited.
[0005]
An object of the present invention is to provide a multilayer electronic component that contributes to miniaturization of a high-frequency (microwave) communication device and can improve the noise removal capability outside the use frequency band.
[0006]
[Means for Solving the Problems]
The multilayer electronic component of the present invention incorporates a bandpass filter and a balun in a laminate in which an insulator layer and a conductor pattern are laminated, and the bandpass filter and the balun are seen through the laminate from the lamination direction of the laminate. And the band-pass filter and the balun are connected between the unbalanced terminal and the pair of balanced terminals.
In addition, the multilayer electronic component of the present invention includes a bandpass filter in which a first resonator and a second resonator are electromagnetically coupled in a laminate in which an insulator layer and a conductor pattern are laminated, and a first coil. And the second coil are connected, the third coil having one end grounded is electromagnetically coupled to the first coil, and the fourth coil having one end grounded is electromagnetically coupled to the second coil. Built-in balun, the bandpass filter and the balun are formed in the laminated body so that they are arranged side by side when the laminated body is seen through from the laminating direction of the laminated body, and the distance between the bandpass filter and the balun is 200 μm or more. The band pass filter and the balun are connected between the unbalanced terminal and the pair of balanced terminals.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
In the multilayer electronic component of the present invention, a band pass filter and a balun are integrally formed in a multilayer body in which an insulator layer and a conductor pattern are laminated. When the band-pass filter and the balun are seen through the laminated body from the lamination direction of the laminated body, the band-pass filter is formed on one side of the laminated body and the balun is formed on the other side so as to be arranged side by side. Further, the coil constituting the band pass filter and the coil constituting the balun are formed apart from each other by 200 μm or more in the direction perpendicular to the lamination direction of the laminate. The filter and balun formed in this way are connected between an unbalanced terminal provided in the laminate and a pair of balanced terminals. In this case, the band-pass filter and the balun are connected to each other by connecting the conductor pattern constituting the filter formed on the same insulator layer and the conductor pattern constituting the balun on the same insulator layer.
Therefore, in the multilayer electronic component of the present invention, the bandpass filter and the balun are integrally formed apart from each other in the multilayer body as described above. It is possible to prevent deterioration of the characteristics, particularly the attenuation characteristics at the frequency of the attenuation pole. Further, the output impedance of the filter can be set without being affected by the required output impedance of the balun according to the input impedance of the IC (for example, 100Ω or 200Ω). In this multilayer electronic component, an unbalanced terminal is connected to the unbalanced line, and a pair of balanced terminals are connected to the balanced line.
[0008]
【Example】
Hereinafter, the multilayer electronic component of the present invention will be described with reference to FIGS.
FIG. 1 is a circuit diagram showing a circuit example of a high-frequency (microwave) communication device using the multilayer electronic component of the present invention, FIG. 2 is a circuit diagram of the multilayer electronic component of the present invention, and FIG. 3 is a multilayer mold of the present invention. It is a disassembled perspective view which shows the 1st Example of an electronic component.
In the mobile communication terminal using the multilayer electronic component of the present invention, an antenna is connected to the common end of the switching element 12, and the receiving circuit 13 and the transmitting circuit 14 are connected to the branch end of the switching element 12. The multilayer electronic component 10 of the present invention is inserted between the output terminal of the high frequency amplifier 15 of the receiving circuit 13 and the input terminal of the balanced input / output type IC used in the frequency mixer 16.
[0009]
In the multilayer electronic component 10, a bandpass filter connected to an unbalanced terminal and a balun connected between the bandpass filter and a pair of balancing terminals are formed in the multilayer body. For example, as shown in FIG. 2, the bandpass filter and the balun electromagnetically connect a first resonator in which a coil L1 and a capacitor C1 are connected in parallel, and a second resonator in which a coil L2 and a capacitor C2 are connected in parallel. A band pass filter formed by coupling, a coil L3 and a coil L4 are connected, a coil L5 having one end grounded to the coil L3 is electromagnetically coupled, and a coil L6 having one end grounded to the coil L4 is electromagnetically coupled. It is constituted by a so-called merchandise type balun formed by being bonded to the. This band pass filter is obtained by electromagnetically coupling two resonators. The connection point between the coil L1 and the capacitor C1 is connected to the unbalanced terminal 21 via the capacitor C4, and the connection between the coil L2 and the capacitor C2 is performed. The point is connected to the balun coil L3 via a capacitor C5. In this balun, the coil L5 is connected to the balancing terminal 22 and the coil L6 is connected to the balancing terminal 23.
Note that the capacitor C3 of the band-pass filter is a capacitance generated by capacitive coupling of the two resonators, and the other end of the balun coil L4 is in an electrically floating state.
The multilayer electronic component 10 is mounted on a printed wiring board of a mobile communication terminal. The unbalanced terminal of the multilayer electronic component 10 is connected to an unbalanced transmission line connected to the output terminal of the high frequency amplifier 15. A pair of balancing terminals of the multilayer electronic component 10 is connected to a balanced transmission line connected to an input terminal of an IC used in the frequency mixer 16.
[0010]
Such a band pass filter and a balun are formed in these laminated bodies by laminating | stacking an insulator layer and a conductor pattern like FIG.
The insulator layers 31A to 31L are formed using an insulating material such as a magnetic material, a non-magnetic material, or a dielectric material.
A grounding conductor pattern 32A is formed on the surface of the insulating layer 31A. The grounding conductor pattern 32A is drawn to the four end faces of the insulating layer 31A.
A coil conductor pattern 33A and a coil conductor pattern 33B are formed on the surfaces of the insulator layers 31B, 31C, 31D, and 31E, respectively. The coil conductor pattern 33A and the coil conductor pattern 33B are formed side by side in the width direction of the insulator layer on one half surface (left half surface in FIG. 3) of the insulator layer. The coil conductor pattern 33A of the insulator layers 31B to 31E is spirally connected through a through hole to form a coil L1, and the coil conductor pattern 33B of the insulator layers 31B to 31E is connected to the through hole. A coil L2 is formed in a spiral connection. The coil L1 and the coil L2 are connected to each other by connecting the coil conductor pattern 33A and the coil conductor pattern 33B on the surface of the insulating layer 31B, and the connection point between the coil conductor pattern 33A and the coil conductor pattern 33B is It is pulled out to the end face of the insulator layer 31B. Further, the capacitance formed between the coil conductor pattern 33A of the insulator layers 31B to 31E and the capacitance formed between the coil conductor pattern 33A and the ground conductor pattern 32A of the insulator layer 31B are arranged in parallel with the coil L1. A capacitor C1 is formed. Further, the capacitance formed between the coil conductor pattern 33B of the insulator layers 31B to 31E and the capacitance formed between the coil conductor pattern 33B of the insulator layer 31B and the ground conductor pattern 32A are arranged in parallel with the coil L2. A capacitor C2 is formed.
A grounding conductor pattern 32B is formed on the surface of the insulating layer 31F. This grounding conductor pattern 32B is drawn out to the three end faces of the insulating layer 31F.
A coil conductor pattern 34 and a coil conductor pattern 35 are formed on the surface of the insulator layer 31G. The coil conductor pattern 34 and the coil conductor pattern 35 are formed on one half surface (the right half surface in FIG. 3) of the insulator layer and connected to each other.
Coil conductor patterns 34 and 35 and capacitor conductor patterns 38A and 39A are formed on the surface of the insulating layer 31H. The coil conductor pattern 34 and the coil conductor pattern 35 are formed side by side in the width direction of the insulator layer on one half surface (the right half surface in FIG. 3) of the insulator layer 31H. The capacitive conductor pattern 38A and the capacitive conductor pattern 39A are formed side by side in the width direction of the insulator layer on the remaining half surface (left half surface in FIG. 3) of the insulator layer 31H. The capacitive conductor pattern 38A is connected to the coil conductor pattern 33A through the through holes of the insulator layers 31F to 31H. The capacitive conductor pattern 39A is connected to the coil conductor pattern 33B through the through holes of the insulator layers 31F to 31H. The capacitor C3 is formed by the capacitance formed between the capacitance conductor pattern 38A and the capacitance conductor pattern 39A and the capacitance between the coil L1 and the coil L2.
Coil conductor patterns 34 and 35 and capacitor conductor patterns 38B and 39B are formed on the surface of the insulator layer 31I. The coil conductor pattern 34 and the coil conductor pattern 35 are formed side by side in the width direction of the insulator layer on one half surface (the right half surface in FIG. 3) of the insulator layer 31H. Further, the capacitive conductor pattern 38B and the capacitive conductor pattern 39B are arranged on the remaining half surface (left half surface in FIG. 3) of the insulator layer 31I, and the capacitive conductor pattern 38B faces the capacitive conductor pattern 38A. The pattern 39B is formed to face the capacitive conductor pattern 39A. Then, the coil conductor pattern 34 of the insulator layers 31G to 31I is spirally connected through a through hole to form a coil L3, and the coil conductor pattern 35 of the insulator layers 31G to 31I is connected to the through hole. A coil L4 is formed in a spiral connection. The coil L3 and the coil L4 are connected to each other by connecting the coil conductor 34 and the coil conductor 35 of the insulator layer 31G. This coil L3 is connected to the coil conductor pattern 34 of the insulator layer 31I and the capacitor conductor pattern 39B via a capacitor C5 formed by a capacitance between the capacitor conductor pattern 39A and the capacitor conductor pattern 39B. Connected to coil L2. Moreover, the coil L4 is in a state where one end of the coil conductor pattern 35 of the insulator layer 31I is electrically floated by extending to a position away from the end face of the insulator layer 31I without connecting anywhere. It has become. Further, a capacitor C4 is formed by the capacitance formed between the capacitive conductor pattern 38A and the capacitive conductor pattern 38B.
A coil conductor pattern 36 and a coil conductor pattern 37 are formed on the surface of the insulator layer 31J. The coil conductor pattern 36 and the coil conductor pattern 37 are arranged on one half surface (the right half surface in FIG. 3) of the insulator layer 31J, the coil conductor pattern 36 faces the coil conductor pattern 34, and the coil conductor pattern 37 is It is formed so as to face the coil conductor pattern 35. The coil conductor pattern 36 and the coil conductor pattern 37 are connected to each other, and the connection point is drawn to the end surface of the insulator layer 31J.
A coil conductor pattern 36 and a coil conductor pattern 37 are formed on the surface of the insulator layer 31K. The coil conductor pattern 36 and the coil conductor pattern 37 are formed side by side in the width direction of the insulator layer on one half surface (the right half surface in FIG. 3) of the insulator layer 31K. One end of the coil conductor pattern 36 and one end of the coil conductor pattern 37 are drawn out to opposite end surfaces of the insulator layer 31K. Further, the coil conductor pattern 36 and the coil conductor pattern 37 are covered with an insulator layer 31L. The coil conductor pattern 36 of the insulator layers 31J and 31K is spirally connected through a through hole to form a coil L5, and the coil conductor pattern 37 of the insulator layers 31J and 31K is connected through a through hole. A coil L6 is formed in a spiral connection.
As shown in FIG. 4, an unbalanced terminal 21, balanced terminals 22, 23, four ground terminals G, and a dummy terminal NC are formed in the laminated body thus laminated. The capacitor conductor pattern 38B is connected to the unbalanced terminal 21, the ground conductor patterns 32A and 32B are connected to the ground terminal G, and the common connection ends of the coil conductor pattern 36 and the coil conductor pattern 37 of the insulator layer 31J are connected to each other. To the ground terminal G, the coil conductor pattern 36 of the insulator layer 31K is connected to the balancing terminal 22, and the coil conductor pattern 37 of the insulator layer 31K is connected to the balancing terminal 23.
[0011]
As shown in FIG. 5, the multilayer electronic component formed in this way has a center line as a reference so that the bandpass filter and the balun are arranged horizontally when the laminate is seen through from the lamination direction of the insulator layers. A bandpass filter is formed on one side (left half in FIG. 5), and a balun is formed on the other side (right half in FIG. 5).
Such a multilayer electronic component has a band-pass filter coil conductor pattern line width of 100 μm, a balun coil conductor pattern line width of 75 μm, a band-pass filter coil conductor pattern and a balun coil conductor pattern. When the interval W in the direction perpendicular to the stacking direction of the insulator layers was set to 120 μm, the passband was 2.11 to 2.17 GHz as shown in 1 of FIGS. 6 and 8, and an attenuation pole was formed in the vicinity of 1.7 GHz. When this multilayer electronic component is used, a signal in the W-CDMA band can be passed and the DCS 1800 MHz band can be attenuated. At this time, the size of the multilayer electronic component was 3.2 mm × 1.6 mm in length and width and 1 mm in height. In FIG. 6, the horizontal axis represents frequency, the vertical axis represents attenuation, A represents transmission characteristics, and B represents reflection characteristics.
[0012]
FIG. 7 shows a band-pass filter coil conductor pattern and a balun coil conductor with the same element size (3.2 mm × 1.6 mm, height 1 mm). The attenuation at 1880 MHz is compared by changing the interval W in the direction perpendicular to the stacking direction of the insulating layers of the pattern from 50 to 450 μm. As shown in FIG. 7, the multilayer electronic component of the present invention has an increasing distance W in the direction perpendicular to the lamination direction of the insulator layers of the bandpass filter coil conductor pattern and the balun coil conductor pattern. When the amount of attenuation at 1880 MHz increases and the interval W in the direction perpendicular to the stacking direction of the insulator layers of the bandpass filter coil conductor pattern and the balun coil conductor pattern becomes 200 μm or more, the attenuation of the present invention at 1880 MHz There was a tendency for the quantity to be better than that of the bandpass filter alone. Accordingly, the multilayer electronic component according to the present invention has a bandpass filter having a gap W in the direction perpendicular to the stacking direction of the insulator layer of the coil conductor pattern of the bandpass filter and the coil conductor pattern of the balun by 200 μm or more. The interference between the filter and the balun can be significantly reduced, and the attenuation at 1880 MHz can be improved compared to the bandpass filter alone. In FIG. 7, the horizontal axis represents the interval W (μm) in the direction perpendicular to the lamination direction of the insulator layers of the bandpass filter coil conductor pattern and the balun coil conductor pattern, and the vertical axis represents the attenuation (dB). Is shown.
[0013]
FIG. 9 is an exploded perspective view showing a second embodiment of the multilayer electronic component of the present invention.
A grounding conductor pattern 92A is formed on the surface of the insulating layer 91A.
Coil conductor patterns 93 and 94 are formed on one half surface (right half surface) of the surfaces of the insulator layers 91B and 91C, and the coil conductor patterns 93 and 94 are connected to each other to form the coils L3 and L4 connected in series. The
Coil conductor patterns 95 and 96 are formed on one half (right half) of the surfaces of the insulating layers 91D and 91E, and the coil L5 and the coil L6 are formed by connecting the coil conductor patterns.
A grounding conductor pattern is formed on the surface of the insulating layer 91F.
Coil conductor patterns 97A and 97B are formed on one half surface (left half surface) of the surfaces of the insulator layers 91G to 91J, and the coil L1 and the coil L2 are formed by connecting the coil conductor patterns.
A capacitive conductor pattern 98A and a capacitive conductor pattern 99A are formed on one half (left half) of the surface of the insulating layer 91K. The capacitive conductor pattern 98A is a coil conductor pattern 97A, and the capacitive conductor pattern 99A is a coil. Each is connected to the conductor pattern 97B.
A capacitive conductor pattern 98B and a capacitive conductor pattern 99B are formed on one half (left half) of the surface of the insulating layer 91L, and the capacitor C4 is connected between the capacitive conductor pattern 98A and the capacitive conductor pattern 98B. Capacitors C5 are respectively formed between 99A and the capacitive conductor pattern 99B. Further, the capacitor conductor pattern 99B is connected to the coil conductor pattern 93 of the insulator layer 91C via an external electrode provided on the side surface of the multilayer body.
Such a multilayer electronic component has a band-pass filter coil conductor pattern having a line width of 100 μm, a balun coil conductor pattern having a line width of 75 μm, and a band-pass filter coil conductor pattern and a balun coil conductor. When the interval W in the direction perpendicular to the stacking direction of the insulating layer of the pattern is set to 200 μm or more, the pass band is 2.11 to 2.17 GHz and the attenuation pole is formed near 1.7 GHz as shown in 2 of FIG. When this multilayer electronic component is used, a signal in the W-CDMA band can be passed and the DCS 1800 MHz band can be attenuated. At this time, the size of the multilayer electronic component was 3.2 mm × 1.6 mm in length and width and 1 mm in height.
[0014]
FIG. 10 is an exploded perspective view showing a third embodiment of the multilayer electronic component of the present invention. A grounding conductor pattern 102A is formed on the surface of the insulating layer 101A. Two grounding conductor patterns 102A are drawn out to two opposing end surfaces of the insulating layer 101A.
On the surface of the insulator layer 101B, a coil conductor pattern 103C is formed on one half surface (left half surface).
Coil conductor patterns 103A and 103B are formed on one half surface (left half surface) of the surfaces of the insulating layers 101C to 101G, and the coil L1 and the coil L2 are formed by connecting the coil conductor patterns. In addition, a grounding conductor pattern 102B is formed on the remaining half surface (right half surface) of the surface of the insulating layer 101F.
Coil conductor patterns 104 and 105 are formed on one half surface (right half surface) of the surfaces of the insulator layers 101H to 101J, and the coil conductor patterns 104 and 105 are connected to form a coil L3 and a coil L4 connected in series. The Further, a capacitive conductor pattern 108A and a capacitive conductor pattern 109A are formed on the remaining half (left half) of the surface of the insulator layer 101I, and the capacitive conductor pattern 108A is formed on the coil conductor pattern 103A and the capacitive conductor pattern 109A. Are connected to the coil conductor pattern 103B. Further, the capacitive conductor pattern 108B and the capacitive conductor pattern 109B are formed on the remaining half surface (left half surface) of the insulator layer 101J, and the capacitive conductor pattern 109B is connected to the coil conductor pattern 104. A capacitor C4 is formed between the capacitive conductor pattern 108A and the capacitive conductor pattern 108B, and a capacitor C5 is formed between the capacitive conductor pattern 109A and the capacitive conductor pattern 109B.
Coil conductor patterns 105 and 106 are formed on one half (right half) of the surfaces of the insulating layers 101K and 101L, and the coil conductor patterns 105 and 106 are connected to form a coil L5 and a coil L6.
In the laminated body thus laminated, four external terminals are formed on opposite side surfaces as shown in FIG.
Such a multilayer electronic component has a band-pass filter coil conductor pattern having a line width of 100 μm, a balun coil conductor pattern having a line width of 75 μm, and a band-pass filter coil conductor pattern and a balun coil conductor. When the interval W in the direction perpendicular to the lamination direction of the insulating layer of the pattern is set to 200 μm or more, the pass band is 2.4 to 2.5 GHz and the attenuation pole is formed in the vicinity of 1.89 GHz as shown in 3 of FIG. When this multilayer electronic component is used, a Bluetooth band signal can be passed and the W-CDMA band can be attenuated. At this time, the size of the multilayer electronic component was 3.2 mm × 1.6 mm in length and width and 1 mm in height.
[0015]
FIG. 12 is an exploded perspective view showing a fourth embodiment of the multilayer electronic component of the present invention.
A grounding conductor pattern 122A is formed on the surface of the insulating layer 121A. Each of the grounding conductor patterns 122A is drawn out to one end face of the insulator layer 121A.
The coil conductor pattern 123C formed on one half (left half) of the surface of the insulator layer 121B and the coil conductor patterns 123A and 123B formed on one half (left half) of the surfaces of the insulator layers 121C to 121G. Coil L1 and coil L2 are formed. A grounding conductor pattern 122B is formed on the remaining half surface (right half surface) of the surface of the insulator layer 121F.
Coils L3 and L4 connected in series are formed by coil conductor patterns 124 and 125 formed on one half surface (right half surface) of the surfaces of the insulator layers 121H to 121J. Capacitor C4 and capacitor 129 are formed by capacitive conductor patterns 128A and 129A formed on the remaining half of the surface of insulator layer 121I and capacitive conductor patterns 128B and 129B formed on the remaining half of the surface of insulator layer 121J. C5 is formed.
The coil L5 and the coil L6 are formed by the coil conductor patterns 126 and 127 formed on one half of the surface of the insulator layers 121K and 121L.
In the laminated body thus laminated, three external terminals are formed on opposite side surfaces as shown in FIG.
Such a multilayer electronic component has a band-pass filter coil conductor pattern having a line width of 100 μm, a balun coil conductor pattern having a line width of 75 μm, and a band-pass filter coil conductor pattern and a balun coil conductor. When the interval W in the direction perpendicular to the lamination direction of the insulating layer of the pattern is set to 200 μm or more, the pass band is 2.4 to 2.5 GHz and the attenuation pole is formed near 1.92 GHz as shown in 4 of FIG. When this multilayer electronic component is used, a Bluetooth band signal can be passed and the W-CDMA band can be attenuated. At this time, the size of the multilayer electronic component was 3.2 mm × 1.6 mm in length and width and 1 mm in height.
[0016]
As mentioned above, although the Example of the multilayer electronic component of this invention was described, this invention is not limited to these Examples. For example, the balun has been described as a merchandise type in the embodiment, but may be a pure transmission type or a trifilar type. Further, the band-pass filter and the balun may connect the coil conductor pattern constituting the coil L3 and the capacitor conductor pattern constituting the capacitor C5 through a through hole in the insulator layer. Further, the two capacitor conductor patterns constituting the capacitor C3 are formed side by side in the embodiment, but may be formed to face each other with an insulator layer interposed therebetween. Furthermore, the bandpass filter can have various circuit configurations.
Further, in the embodiment, the case of inserting between the output terminal of the high frequency amplifier of the receiving circuit and the input terminal of the balanced input / output type IC of the frequency mixer has been described. It can also be inserted between the terminal and the output terminal of the VCO, or inserted between the unbalanced line of the transmission circuit and the input terminal of the balanced input / output type IC.
Furthermore, although the case of the mobile communication terminal has been described in the embodiment, it may be inserted between the unbalanced line and the balanced line, and the present invention can be applied to a wireless LAN.
[0017]
【The invention's effect】
As described above, the multilayer electronic component of the present invention incorporates a bandpass filter and a balun in a laminate in which an insulator layer and a conductor pattern are laminated, and the bandpass filter and the balun are separated from the lamination direction of the laminate. When the layered body is seen through, they are arranged side by side so that the gap between the bandpass filter and the balun is 200 μm or more. The bandpass filter and the balun are unbalanced terminals and a pair of balanced terminals. Since they are connected to each other, it is possible to achieve removal of noise outside the use frequency band and conversion of balanced signals and unbalanced signals with one chip component without degrading characteristics. Further, the output impedance of the filter can be set so that the filter characteristics are optimized without being affected by the required balun output impedance.
Therefore, the multilayer electronic component of the present invention can contribute to the miniaturization of a high-frequency (microwave) communication device and can improve the noise removal capability outside the use frequency band as compared with the prior art.
In addition, since the multilayer electronic component of the present invention does not interfere with each other between the bandpass filter and the balun, it is possible to design the bandpass filter and the balun without considering the influence of each other. At the same time, the design cost can be reduced.
[Brief description of the drawings]
FIG. 1 is a circuit diagram showing a circuit example of a high-frequency (microwave) communication device using a multilayer electronic component of the present invention.
FIG. 2 is a circuit diagram of the multilayer electronic component of the present invention.
FIG. 3 is an exploded perspective view showing a first embodiment of the multilayer electronic component of the present invention.
FIG. 4 is a perspective view of the first embodiment of the multilayer electronic component of the present invention.
FIG. 5 is a top view of the multilayer electronic component of the present invention.
FIG. 6 is a graph showing characteristics of the first example of the multilayer electronic component of the present invention.
FIG. 7 is a graph showing characteristics of the multilayer electronic component of the present invention.
FIG. 8 is a table showing characteristics of the multilayer electronic component of the present invention.
FIG. 9 is an exploded perspective view showing a second embodiment of the multilayer electronic component of the present invention.
FIG. 10 is an exploded perspective view showing a third embodiment of the multilayer electronic component of the present invention.
FIG. 11 is a perspective view of a third embodiment of the multilayer electronic component of the present invention.
FIG. 12 is an exploded perspective view showing a fourth embodiment of the multilayer electronic component of the present invention.
FIG. 13 is a perspective view of a fourth embodiment of the multilayer electronic component of the present invention.
FIG. 14 is a circuit diagram of a high-frequency (microwave) communication device.
FIG. 15 is a circuit diagram of another high-frequency (microwave) communication device.
[Explanation of symbols]
11 Antenna 12 Switching element 13 Reception circuit 14 Transmission circuit

Claims (1)

An insulator layer and a conductor pattern are laminated , and a band pass filter in which the first resonator and the second resonator are electromagnetically coupled, and the first coil and the second coil are connected to the laminate. A balun is formed in which a third coil having one end grounded is electromagnetically coupled to the first coil, and a fourth coil having one end grounded is electromagnetically coupled to the second coil;
The band-pass filter and the balun are aligned horizontally with each other when seen through the laminate from the laminating direction of the insulator layers, and, as a distance of the band-pass filter and the balun are more 200 [mu] m, the band-pass filter The conductor pattern constituting the balun and the conductor pattern constituting the balun are formed by shifting the positions formed on the insulator layer laterally from each other,
The coil constituting the band-pass filter and the coil constituting the balun are formed so as to be displaced from each other in the stacking direction of the insulator layer,
By connecting a conductor pattern constituting a capacitor connected to one end of the second resonator of the bandpass filter and a conductor pattern constituting one end of the first coil of the balun, the bandpass filter And a balun connected between the unbalanced terminal and the pair of balanced terminals.

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