JPH1197962A - High-frequency component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a high-frequency component which can be made small-sized and has superior frequency characteristics, while easily making high the characteristic impedance of a transmission line constituting an impedance element. SOLUTION: A high-frequency component 10 is constituted by connecting a high-pass filter F1 composed of a transmission line L1 and capacitors C1 to C3 between a 1st port P1 and a 2nd port P2 and also connecting a low-pass filter F2 composed of a transmission line L2 as an inductance element and capacitors C4 and C5 as capacitance elements between the 1st port P1 and a 3rd port P3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a high-frequency component for distributing and coupling high-frequency signals in two different frequency ranges in a high-frequency circuit of a mobile communication device, for example, a mobile phone.

[0002]

2. Description of the Related Art FIG. 6 shows a perspective view of a duplexer which is an example of a high-frequency component for distributing and coupling a high-frequency signal. Although not shown, the duplexer 50 includes a high-pass filter (High Pass Filter: HPF) and a low-pass filter (Low Pass Filter: LPF) on the same multilayer substrate 50.
a. Then, external terminals Ta to Tc are provided from the vicinity of one long side of the back surface of the multilayer substrate 50a to the side surface to which one long side is close. Further, external terminals Td to Tf are provided from the vicinity of the other long side on the back surface of the multilayer substrate 50a to the side surface to which the other long side is close.

FIGS. 7 (a) to 7 (f) and FIGS. 8 (a) to 8 (b) show a top view and a bottom view of each dielectric layer constituting the duplexer 50 of FIG. The duplexer 50
It is formed by sequentially laminating the first to ninth dielectric layers 51 to 59 from above.

[0004] Capacitor electrodes C51, C52, C53, C54, C55, C56, and C are provided on the upper surfaces of the second, third, fourth, and eighth dielectric layers 52, 53, 54, and 58, respectively.
57, C58, C59 and C60 are respectively formed.
Further, on the upper surface of the fifth dielectric layer 55, the transmission line L51,
L52 are respectively formed.

Further, seventh and ninth dielectric layers 57, 5
The ground electrodes G51 and G52 are formed on the upper surface of 9, respectively. The lower surface of the ninth dielectric layer 59 (FIG. 7)
In (d)), external terminals Ta to Tf are formed.

The second to seventh dielectric layers 52 to 57 have via holes VHb 'to VHg' at predetermined positions.

The capacitor electrodes C51, C53,
C56, capacitor electrodes C52, C54, and C57, and capacitor electrode C59, and ground electrodes G51 and G52 form three capacitors that constitute an HPF, and capacitor electrodes C55 and C58, and capacitor electrode C60 and an LPF that constitute ground electrodes G51 and G52. Are formed, respectively. The transmission line L51 uses an HPF.
Is connected to the transmission line L52 by L
Inductance elements constituting the PF are respectively formed. With the above configuration, the high-frequency component 50 is configured on one multilayer substrate 50a.

[0008]

However, in the conventional duplexer, which is a high-frequency component, the transmission lines constituting the inductance elements of the HPF and the LPF are formed on one dielectric layer, so that one layer is formed. There is a problem that the length of the transmission line per unit becomes long and the high-frequency component (duplexer) becomes large.

In order to shield the transmission line from external electromagnetic field noise, the transmission line is disposed between the two ground electrodes. However, due to the effect of stray capacitance generated between the transmission line and the ground electrode, The characteristic impedance of the transmission line decreases. Therefore, the insertion loss of a high-frequency component using this transmission line as an inductance increases,
As a result, there is a problem that the bandwidth of the high-frequency component is reduced.

In order to increase the characteristic impedance of the transmission line, there is a method of increasing the distance between the transmission line and the ground electrode. However, in this case, it is difficult to reduce the size of the high-frequency component. is there.

SUMMARY OF THE INVENTION The present invention has been made to solve such a problem, and it is possible to easily realize a high characteristic impedance of a transmission line constituting an inductance element, and it is possible to reduce the size and the frequency. An object is to provide a high-frequency component having excellent characteristics.

[0012]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a laminate comprising a plurality of dielectric layers laminated, and a band built in the laminate and having a different center frequency. A high-frequency component comprising at least two filters each having an inductance element and a capacitance element, wherein the inductance element forming the filter includes a plurality of transmission line conductors each having a dielectric layer in a stacking direction of the stack. And at least one transmission line which is electrically connected in series so that traveling directions of high-frequency signals propagating through two adjacent transmission line conductors of the plurality of transmission line conductors are the same as each other. It is characterized by consisting of tracks.

Further, the combination of the filters is a high-pass filter and a low-pass filter.

According to the high-frequency component of the present invention, the transmission line constituting the inductance element is composed of a plurality of transmission line conductors. Therefore, if the characteristic impedance of the transmission line is constant, the transmission line conductor per layer is constant. Can be made shorter than before.

Further, since the traveling directions of the high-frequency signals propagating through the two adjacent transmission line conductors via the dielectric layer are the same, the circulating directions of the magnetic flux generated around each of the transmission line conductors are the same. Direction. Therefore, the coupling between the transmission line conductors can be increased by reducing the distance between two adjacent transmission line conductors.

[0016]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a circuit diagram of one embodiment of the high-frequency component according to the present invention. In the high-frequency component 10, a high-pass filter (HighPass Filter: HPF) F1 is connected between the first port P1 and the second port P2, and between the first port P1 and the third port P3. Is connected to a low pass filter (Low Pass Filter: LPF) F2. At this time, the HPFF 1 includes a transmission line L1 as an inductance element and capacitors C1 to C as capacitance elements.
LPFF2 is composed of a transmission line L2 as an inductance element and capacitors C4 and C5 as capacitance elements.

Specifically, in the HPFF1, a series circuit including a capacitor C1 and a capacitor C2 is connected between a first port P1 and a second port P2, and a connection point between the capacitor C1 and the capacitor C2 is , Is grounded via a series circuit including a transmission line L1 and a capacitor C3.

The LPFF 2 has a transmission line L 2 and a capacitor C between the first port P 1 and the third port P 3.
4 is connected, and the connection point on the third port P3 side between the transmission line L2 and the capacitor C4 is grounded via the capacitor C5.

With this configuration, a high-frequency signal in a high frequency range passes between the first port P1 and the second port P2, and a high-frequency signal in a low frequency range passes through the first port P1 and the third port. It can pass between the port P3. At this time, the pass area of the HPFF1 and the pass area of the LPFF2 are selected such that the pass areas do not overlap each other.

For example, an antenna is connected to the first port P1, a transmitting circuit is connected to the second port P2, and a receiving circuit is connected to the third port P3.
In the case where the transmission signal of 950 MHz is used for the lcellular 800), the transmission signal of 950 MHz output from the transmission circuit passes through the HPFF 1 and is transmitted from the antenna. On the other hand, the received signal of 820 MHz received by the antenna passes through LPFF2,
Output to the receiving circuit.

As another example, an antenna is provided for the first port P1, a transmitting / receiving circuit corresponding to 1.9 GHz is provided for the second port P2, and a transmitting / receiving circuit corresponding to 800 MHz is provided for the third port P3. Each is connected to a plurality of high frequency signals in different frequency ranges, for example, 1.9 GHz PCS (P
Personal Communication Service) high frequency signal and 800
In the case of distributing or coupling with a high frequency signal of AMPS (Advanced Mobile Phone Service) of MHz, the received signal of 1.9 GHz received by the antenna passes through the HPFF 1 and is output to the 1.9 GHz receiving circuit. The 800 MHz received signal received by the antenna passes through the LPFF 2 and is output to the 800 MHz receiving circuit. Conversely, the transmission signal output from the 1.9 GHz transmission circuit passes through the HPFF 1 and is transmitted from the antenna,
The transmission signal output from the 00 MHz transmission circuit is LP
The signal passes through the FF2 and is transmitted from the antenna. In this case, it can be used as a dual band high frequency distributor or high frequency coupler. Therefore, the size of the dual band mobile communication device can be reduced.

FIG. 2 is a perspective view of the high-frequency component 10 shown in FIG. As shown in FIG. 2, the high-frequency component 10 is
1 and a multi-layer substrate 10 incorporating LPFF2 (not shown)
a from the vicinity of one long side of the back surface of the multilayer substrate 10a to the side surface to which one long side is close.
Tc is provided, and external terminals Td to Tf are provided from the vicinity of the other long side of the back surface to the side surface to which the other long side is close.

FIGS. 3 (a) to 3 (h) and FIGS. 4 (a) to 4 (e) show a top view and a bottom view of each dielectric layer constituting the high frequency component 10 of FIG. The high-frequency component 10 has a first
To the twelfth dielectric layers 11 to 22 sequentially from the top.

On the upper surfaces of the second, third, fourth, ninth, and eleventh dielectric layers 12, 13, 14, 19, and 21, a capacitor electrode C11, which is an electrode for forming a capacitance element, is provided.
C12, C13, C14, C15, C16, C17, C
18, C19 and C20 are printed and formed, respectively.

The fifth and sixth dielectric layers 15, 16
On the upper surface of the transmission line conductors L11, L
12, L13 and L14 are printed and formed, respectively. At this time, the transmission line conductors L11 and L13 and the transmission line conductors L12 and L14 are respectively connected to the fifth dielectric layer 1
5 are opposed to each other.

Further, on the upper surfaces of the eighth, tenth, and twelfth dielectric layers 18, 20, 22, a ground electrode G11,
G12 and G13 are printed and formed, respectively. Further, on the lower surface of the twelfth dielectric layer 22 (FIG. 4E),
External terminals Ta, T serving as first to third ports P1 to P3
c, Te and external terminals Tb, Td, Tf serving as ground terminals
Is formed.

Further, the second to eighth dielectric layers 12 to 18
Are provided with via holes VHb to VHh at predetermined positions.

The capacitor electrodes C11, C14,
The capacitor C1 of the HPFF1 is connected to the capacitor C16, and the capacitor C1 of the HPFF1 is connected to the capacitor electrodes C12, C15 and C17.
2 with the capacitor electrode C19 and the ground electrodes G11, G
12, the capacitor C3 of the HPFF1 is formed, and the capacitor C4 of the LPFF2 is formed by the capacitor electrodes C13 and C18, and the capacitor electrode C20 and the ground electrode G are formed.
12, G13 form the capacitor C5 of the LPFF2.

The transmission line conductors L11 and L13 and the transmission line conductors L12 and L14 have the same traveling direction of the high-frequency signal propagating through the via hole VHe provided in the fifth dielectric layer 15, respectively. 3 (e) and 3 (f), and are electrically connected in series.
One transmission line L1 forming F1 and one transmission line L2 forming LPFF2 are formed.

Here, the 1.9 GHz PCS and 8
The frequency dependency of the pass characteristics between the first port P1 and the second port P2 and between the first port P1 and the third port P3 in the dual-band high-frequency component used for the 00 MHz AMPS is described. As shown in FIG. In FIG. 5, the solid line is between the first port P1 and the second port P2, and the broken line is between the first port P1 and the third port P3.

From this drawing, it can be seen that almost zero (dB) is shown around 1.9 GHz between the first port P1 and the second port P2, and 80 between the first port P1 and the third port P3.
It is understood that the signal shows almost zero (dB) around 0 MHz. This indicates that in the above configuration, mutual interference between the 1.9 GHz high frequency signal and the 800 MHz high frequency signal is sufficiently suppressed.

As described above, according to the high-frequency component of the above embodiment, the transmission line of the high-pass filter connected between the first port and the second port, and the first port and the second Since the transmission line of the low-pass filter connected to the third port is formed of two transmission line conductors adjacent to each other via the dielectric layer, if the characteristic impedance of the transmission line is constant, The length of the transmission line conductor per layer is
It can be reduced to about half of the conventional value.

Therefore, the high-frequency component of the present embodiment can ensure a specific impedance of the transmission line at a predetermined value with a small component size as compared with the conventional high-frequency component, thereby realizing the miniaturization of the high-frequency component. . More specifically, comparing the external dimensions of the high-frequency component of the present embodiment with transmission lines having substantially the same characteristic impedance and the external dimensions of the high-frequency component of the conventional example, it is found that 0.5mm (L) × 3.2mm (W) × 1.0mm
Compared with (H), the high-frequency component of the present embodiment is 3.2 mm
(L) x 2.5 mm (W) x 1.1 mm (H),
The volume is less than 2/3.

Further, since the traveling directions of the high-frequency signals propagating in the two adjacent transmission line conductors via the dielectric layer are the same, the circumferential direction of the magnetic flux generated around each of the transmission line conductors is the same. Direction. Therefore, two transmission line conductors adjacent to each other via the dielectric layer are electromagnetically coupled by the magnetic flux circling in the same direction,
In a portion where two adjacent transmission line conductors are adjacent to each other and overlap, a magnetic flux circulating around the two adjacent transmission line conductors is generated.

As a result, by reducing the distance between two adjacent transmission line conductors, the coupling between the two adjacent transmission line conductors can be increased, and a desired characteristic impedance can be easily obtained. Therefore, even if the transmission line is arranged between the two ground electrodes in order to block the transmission line from external electromagnetic field noise,
By compensating for a decrease in the characteristic impedance of the transmission line due to the effect of stray capacitance generated between the transmission line and the ground electrode, it is possible to increase the characteristic impedance of the transmission line. Accordingly, it is possible to suppress a reduction in insertion loss and a reduction in bandwidth of the high-frequency component. That is, a high-frequency component having excellent frequency characteristics can be realized.

Further, since the high-frequency component is composed of a high-pass filter and a low-pass filter, the number of transmission lines and capacitors constituting each filter can be reduced. Therefore, the high-frequency component can be further downsized.

In the above embodiment, the circuit diagrams of the high-frequency components shown in FIGS. 1 and 3 to 4 and the top and bottom views of each dielectric layer constituting the high-frequency components are examples. The transmission lines constituting the inductive element were substantially opposed to each other via the dielectric layer in the laminating direction, and were electrically connected in series so that the traveling directions of the high-frequency signals propagating in two adjacent ones became the same direction. Anything formed by a plurality of transmission line conductors is considered to be within the scope of the present invention.

The case where the transmission line conductor has a substantially spiral shape has been described. However, in addition to the spiral shape, a spiral shape, a meander shape, or a combination thereof may be used depending on the occupied area and the specification of the desired characteristic impedance. May be used.

Further, a combination of a plurality of filters is
Although the case of the high-pass filter and the low-pass filter has been described, other combinations such as a band-pass filter and a band-reject filter, a band-pass filter and a band-pass filter, a band-reject filter and a band-reject filter, etc. You may.

[0040]

According to the high frequency component of the present invention, since the transmission lines forming the inductance elements of at least two filters having different bands of the center frequency are formed by the transmission line conductors of a plurality of layers, the transmission is performed. If the characteristic impedance of the line is constant, the length of the transmission line conductor per layer can be made shorter than before. Therefore, downsizing of the high-frequency component can be realized.

Further, since the traveling directions of the high-frequency signals propagating in the two adjacent transmission line conductors via the dielectric layer are the same, the circulating directions of the magnetic flux generated around each of the transmission line conductors are the same. Direction. Therefore, by narrowing the distance between two adjacent transmission line conductors via the dielectric layer, the coupling between the two adjacent transmission line conductors can be increased, and a desired characteristic impedance can be easily obtained. .

As a result, even if a transmission line is arranged between two ground electrodes in order to block the transmission line from external electromagnetic field noise, the transmission line is generated between the transmission line and the ground electrode. A decrease in the characteristic impedance of the transmission line due to the influence of the stray capacitance can be compensated, and the characteristic impedance of the transmission line can be increased. Accordingly, it is possible to suppress a reduction in insertion loss and a reduction in bandwidth of the high-frequency component. That is, a high-frequency component having excellent frequency characteristics can be realized.

According to the high frequency component of the second aspect, since the high frequency component includes the low pass filter and the high pass filter, the number of inductance elements and capacitance elements constituting each filter can be reduced. Therefore, the high-frequency component can be further downsized.

[Brief description of the drawings]

FIG. 1 is a circuit diagram of one embodiment of a high-frequency component according to the present invention.

FIG. 2 is a perspective view of the high-frequency component of FIG. 1;

FIG. 3 is a top view of (a) a first dielectric layer to (h) an eighth dielectric layer constituting the high-frequency component of FIG. 2;

FIG. 4 is a top view of (a) a ninth dielectric layer to (d) a twelfth dielectric layer constituting the high-frequency component of FIG. 2 and (e) a first dielectric layer.
FIG. 4 is a bottom view of a second dielectric layer.

FIG. 5 shows a high-frequency component of FIG.
FIG. 9 is a diagram illustrating frequency characteristics when used in a dual band of z.

FIG. 6 is a schematic side view showing an example of a conventional high-frequency component.

FIG. 7 is a top view of (a) a first dielectric layer to (h) an eighth dielectric layer constituting the high-frequency component of FIG. 6;

8A is a top view and FIG. 8B is a bottom view of a ninth dielectric layer included in the high-frequency component of FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 High frequency component 10a Laminated body 11-22 Dielectric layer C1-C5 Capacitance element (capacitor) F1 High-pass filter (HPF) F2 Low-pass filter (LPF) L1, L2 Inductance element (transmission line) L11-L14 Transmission line conductor

Claims (2)

[Claims] 1. A laminated body comprising a plurality of dielectric layers laminated, and at least two filters including an inductance element and a capacitance element which are built in the laminated body and have bands having different center frequencies. An inductance element constituting the filter, a plurality of transmission line conductors are substantially opposed to each other via a dielectric layer in a stacking direction of the multilayer body, and an adjacent one of the plurality of transmission line conductors A high-frequency component comprising at least one transmission line electrically connected in series so that traveling directions of high-frequency signals propagating through two matching transmission line conductors are the same. 2. The high-frequency component according to claim 1, wherein the combination of the filters is a high-pass filter and a low-pass filter.