JP2002271109A - Laminated duplexer element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laminated duplexer element in which the best frequency characteristics can be set for each filter circuit. SOLUTION: This laminated duplexer element is provided with a filter circuit for reception and a filter circuit for transmission. The filter circuit for reception has grounding conductors 171 and 179 provided to hold a plurality of conductor pieces 172, 176, 177, and 178 containing resonance lines 173, 174, and 175 between them through dielectric layers 152-157 and pass signals in a first frequency band. The filter circuit for transmission has grounding conductors 179 and 186 provided to hold a plurality of conductor pieces 180 and 185 containing resonance lines 181, 182, and 183 between them through dielectric layers 158-165 and pass signals in a second frequency band, which is different from the first frequency band. One or more of the conductor pieces and grounding conductors of the filter circuit for reception are provided on layers, which are different from those on which the conductor pieces and grounding conductors of the filter circuit for transmission are provided.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated duplexer used for a mobile telephone, a portable telephone and the like.

[0002]

2. Description of the Related Art Conventionally, a portable telephone sometimes uses a duplexer for performing communication for transmitting and receiving frequencies of two different frequency bands using one antenna.

A duplexer of this type includes two filter circuits for passing signals of different frequency bands, and one of the filter circuits is set so as to pass a signal of a frequency band for reception, and the other filter circuit is set for the other filter circuit. The circuit is set to pass a signal in a frequency band for transmission. In addition, for example, Japanese Patent Application Laid-Open No.
A coaxial dielectric resonator as disclosed in Japanese Patent No. 267909 has been used.

[0004] However, with the recent miniaturization of electronic equipment, it has been desired to reduce the size and weight of portable telephones, and the necessity of miniaturization of electronic components constituting electronic circuits has arisen. In a duplexer using a dielectric resonator, there is a limit to downsizing.

In order to further reduce the size of the duplexer, a multilayer duplexer in which a filter circuit is constituted by conductor pieces such as strip lines has been proposed (JP-A-6-85506 and JP-A-11-122007). .

[0006]

However, the above-described conventional duplexer is susceptible to the electric influence between the two filter circuits and the electric influence from the outside world, and has good characteristics in both filter circuits. Was difficult to obtain. If the material and thickness of each insulating layer and the distance between the resonance line and the ground conductor are set so that the characteristics of one filter circuit are in a good state, the best characteristics can be obtained as the characteristics of the other filter circuit. Was not able to be done.

SUMMARY OF THE INVENTION An object of the present invention is to provide a multilayer duplexer element that can set the best frequency characteristics in each filter circuit in view of the above problems.

[0008]

In order to achieve the above object, according to the present invention, there is provided a first filter circuit having a plurality of conductor pieces including a resonance line and passing a signal in a first frequency band. And a second filter circuit having a plurality of conductor pieces including a resonance line and passing a signal in a second frequency band different from the first frequency band, and an outer surface of the multilayer element A first input / output terminal formed and connected to one input / output terminal of the first filter circuit; and a second input / output terminal formed on the outer surface of the multilayer body and connected to one input / output terminal of the second filter circuit. An input / output terminal, a common input / output terminal formed on an outer surface of the stacked element body and connected to the other input / output terminal of the first filter circuit and the other input / output terminal of the second filter circuit; And a ground terminal formed on the outer surface of the body In the layer duplexer element, a plurality of conductor pieces each including a conductor piece including a resonance line of the first filter circuit and a conductor piece including a resonance line of the second filter circuit are sandwiched for each filter via an insulator layer. And one or more of the conductor pieces and the ground conductor of the first filter circuit are provided on a layer different from the layer on which the conductor pieces and the ground conductor of the second filter circuit are provided. The proposed laminated duplexer element is proposed.

According to the laminated duplexer element, since the conductor piece including the resonance line of the first filter circuit is sandwiched by the ground conductor via the insulator layer, the first filter circuit is connected to the outside by the ground conductor. Shielded from the second filter circuit. Further, since the conductor piece including the resonance line of the second filter circuit is sandwiched by the ground conductor via the insulator layer, the ground filter shields the second filter circuit from the outside and the first filter circuit.
Further, by providing at least one of the conductor piece and the ground conductor of the first filter circuit on a layer different from the layer provided with the conductor piece and the ground conductor of the second filter circuit, In order to obtain the best characteristics, the thickness of each insulator layer and the distance between the resonance line and the ground conductor can be set.

According to a second aspect of the present invention, in the multilayer duplexer according to the first aspect, a distance between two ground conductors sandwiching the resonance line of the first filter circuit sandwiches the resonance line of the second filter circuit. A laminated duplexer element having a value different from the distance between two ground conductors is proposed.

According to the laminated duplexer element, in each of the first filter circuit and the second filter circuit, a distance between two ground conductors sandwiching the resonance line is set to a different value, and a pass frequency band of each filter circuit is set. Is set.

According to a third aspect of the present invention, in the laminated duplexer element according to the first or second aspect, the first
At least one of between the resonance line of the filter circuit and the second input / output terminal or at least between the resonance line of the second filter circuit and the first input / output terminal, the one or more layers have the input line. A laminated duplexer element including a ground conductor connected to the ground terminal so as to surround the output terminal.

According to the laminated duplexer element, the ground conductor connected to the ground terminal so as to surround the second input / output terminal is provided between the resonance line of the first filter circuit and the second input / output terminal. When provided, electrical coupling between the resonance line of the first filter circuit and the second input / output terminal is suppressed. Further, when a ground conductor connected to the ground terminal is provided between the resonance line of the second filter circuit and the first input / output terminal so as to surround the first input / output terminal, the second filter circuit Electrical coupling between the first resonance line and the first input / output terminal is suppressed. Thereby, the characteristics of each filter circuit can be set individually and can be stabilized.

According to a fourth aspect of the present invention, in the multilayer duplexer device according to any one of the first to third aspects, a portion where the first filter circuit is formed and a portion where the second filter circuit is formed. And a stacked duplexer element in which are stacked in the stacking direction.

According to the laminated duplexer element, the first filter circuit portion and the second filter circuit portion are arranged so as to overlap in the laminating direction, so that the mounting area is reduced and high-density mounting is enabled.

According to a fifth aspect of the present invention, in the multilayer duplexer according to any one of the first to third aspects, the multilayer element comprises a portion where the first filter circuit is formed, and a second filter. The present invention proposes a multilayer duplexer in which portions where circuits are formed are arranged in the direction in which the layers extend.

According to the laminated duplexer element, since the first filter circuit portion and the second filter circuit portion are arranged side by side in the direction in which the layers extend, the height of the laminated duplexer device can be set low. It can be applied to thin electronic devices.

According to a sixth aspect of the present invention, in the multilayer duplexer according to any one of the first to third aspects, the laminated element body includes a part in which the first filter circuit is formed, and A laminated duplexer element that is laminated on a part of a part where two filter circuits are formed is proposed.

According to the laminated duplexer element, a part of the portion where the first filter circuit is formed is laminated so as to overlap only a part of the portion where the second filter circuit is formed. Can be suppressed and the mounting area can be reduced.

According to a seventh aspect of the present invention, in the multilayer duplexer element according to the fourth aspect, the resonance line comprises a strip-shaped conductor piece having one end connected to the ground terminal and the other end open. A laminated duplexer element is proposed in which the resonance line is arranged so as to intersect at right angles with the resonance line of the second filter circuit via an insulating layer.

According to the laminated duplexer element, the resonance lines of the first filter circuit and the resonance lines of the second filter circuit are arranged so as to intersect at right angles with each other via the insulating layer. Can be easily arranged on different outer surfaces of the laminated body.

According to an eighth aspect of the present invention, in the multilayer duplexer element according to the fourth aspect, the resonance line is formed of a strip-shaped conductor piece having one end connected to the ground terminal and the other end opened, and the first filter. One end of the resonance line of the circuit is located at the other end of the resonance line of the second filter circuit, and the other end of the resonance line of the first filter circuit is located at one end of the resonance line of the second filter circuit. Are disposed between the resonance line of the first filter circuit and the resonance line of the second filter circuit as ground conductors provided so as to sandwich the conductor piece with an insulator layer interposed therebetween. And first and second ground conductors provided on different layers from each other, wherein the first ground conductor is provided in a half area on the open end side of the resonance line of the first filter circuit. With the said The ground conductor is provided in a half area on the open end side of the resonance line of the second filter circuit, and the distance between the resonance line of the first filter circuit and the first ground conductor is equal to the distance. The distance between the resonance line of the second filter circuit and the first ground conductor is set smaller than the distance between the resonance line of the second filter circuit and the second ground conductor. The present invention proposes a multilayer duplexer that is set to be smaller than the distance between the resonance line of one filter circuit and the second ground conductor.

According to the laminated duplexer element, a capacitance is generated between the first ground conductor and the open end of the resonance line of the first filter circuit, and compared with the case where there is no capacitance at the same resonance frequency. The first
The length of the resonance line of the filter circuit can be shortened, and the Q of the first filter circuit can be increased. Similarly, a capacitance is generated between the second ground conductor and the open end of the resonance line of the second filter circuit, and the resonance line of the second filter circuit is compared with the case where there is no capacitance at the same resonance frequency. Can be shortened, and the Q of the second filter circuit can be increased. Further, since the number of stacked insulating layers can be reduced, the outer shape of the stacked element body can be reduced in size.

[0024]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is an external perspective view showing a laminated duplexer element according to a first embodiment of the present invention, FIG. 2 is an equivalent circuit thereof, FIG. 3 is an exploded perspective view thereof, and FIG.
It is sectional drawing of a line perspective direction. In the present embodiment, an example of a laminated duplexer element used when both a transmitting circuit and a receiving circuit using different frequencies use one antenna will be described.

In the figure, reference numeral 100 denotes a laminated duplexer element, which comprises a rectangular parallelepiped laminated body 110 having a resonance line formed in an inner layer, and the outer surface of the laminated body 110 is extended from a bottom surface 111 to an upper surface 112. External terminals 121 to 128 are formed. The external terminal 121 is a terminal connected to the antenna.
The external terminal 122 is a terminal connected to the receiving circuit, the external terminal 123
Is a terminal connected to the transmission circuit. The other external terminals 124 to 128 are ground terminals.

As shown in the equivalent circuit of FIG. 2, a filter circuit 130 for reception and a filter circuit 140 for transmission are formed inside the laminated body 110.

The receiving filter circuit 130 has
This is a band-pass filter that passes a high-frequency signal within a band of 2.20 GHz (the first round is several bands).
1 to 133, inductors 134a and 134h, capacitors 134b to 134
i.

In the receiving filter circuit 130, the resonator 1
One end of 31 is grounded, the other end is connected to one end of capacitor 134b, and is connected to external terminal 121 for the antenna via inductor 134a. One end of the resonator 132 is grounded, and the other end is connected to one end of each of the capacitors 134d and 134e. One end of the resonator 133 is grounded, the other end is connected to one end of the capacitor 134i, and the inductor 134h
Is connected to an external terminal 122 for reception. One end of the capacitor 134e is connected to the other ends of the capacitors 134b and 134d, and the other end of the capacitor 134e is connected to the capacitor 134e.
f, 134g is connected to the other end.

The transmission filter circuit 140 has 1.90 to
This is a band-pass filter that passes a high-frequency signal in a band of 2.02 GHz (second frequency band).
1 to 143, capacitors 144a to 144c, and an inductor 144d.

In the transmission filter circuit 140, the resonator 1
One end of 41 is grounded, and the other end is connected to a transmitting external terminal 123 via a capacitor 144a. One end of the resonator 142 is grounded, and the other end is connected to an external terminal 12 via a capacitor 144b.
3 and to the antenna external terminal 121 via a capacitor 144c. One end of the resonator 143 is grounded, and the other end is connected to an external terminal 121 for an antenna via an inductor 144d. Here, a mutual inductance M is provided between the resonator 141 and the resonator 142, and a mutual inductance M is provided between the resonator 142 and the resonator 143.
have.

Each of the above-mentioned receiving filter circuit 130 and transmitting filter circuit 140 is composed of a conductor piece and a resonance line provided on the laminated body 110. That is, as shown in FIG. 3, the laminated body 110 is formed by laminating a plurality of dielectric layers (insulator layers) 151 to 166 each having the same thickness. Is provided with a resonance line, a conductor piece, or a ground conductor on the surface.

In FIG. 3, the uppermost and third dielectric layers 151 and 153 are dummy layers, and a ground conductor 171 is provided on the surface of the second dielectric layer 152. This ground conductor 1
Reference numeral 71 is connected to external terminals 124 to 128 serving as ground terminals, and portions corresponding to the external terminals 121 to 123 are cut out for insulation.

At a predetermined position on the surface of the fourth dielectric layer 154, a conductor piece 172 which forms a capacitor by being coupled to resonance lines 174 and 175 described later is provided.

On the surface of the fifth dielectric layer 155, there are provided three resonance lines 173, 174 and 175 formed of strip lines parallel to each other at predetermined intervals, one end of which is grounded and the other end is open. . One end of the connection conductor 176 is connected to a predetermined position of one end of the resonance line 173, and the other end of the connection conductor 176 is connected to the external terminal 121 for an antenna. Further, the connection conductor 177 is provided at a predetermined position of one end of the resonance line 175.
Are connected, and the other end of the connection conductor 177 is connected to the external terminal 122 for reception.

At a predetermined position on the surface of the sixth dielectric layer 156, there is provided a conductor piece 178 which is coupled to the resonance lines 173 and 174 to form a capacitor.

The seventh dielectric layer 157 is a dummy layer.

On the surface of the eighth dielectric layer 158, a ground conductor 179 is provided. This ground conductor 179 is connected to external terminals 124 to 128 which serve as ground terminals, and external terminals 121 to 123
Is cut out for insulation.

The ninth and tenth dielectric layers 159 and 160 are dummy layers.

A conductor piece 180 is provided on the surface of the eleventh dielectric layer 161. One end of the conductor piece 180 is connected to an external terminal for transmission.
The other end is connected to an open end of a resonance line 183 to be described later, and is arranged at a position where a capacitance is formed.

On the surface of the twelfth dielectric layer 162, there are provided three resonance lines 181, 182, 183, which are strip lines parallel to each other at a predetermined interval, one end of which is grounded and the other end is open. . One end of the connection conductor 184 is connected to a predetermined position of one end of the resonance line 181, and the other end of the connection conductor 184 is connected to the external terminal 121 for the antenna. Further, these resonance lines 181, 182, 183 are arranged in parallel with the resonance lines 173, 174, 175 so that the ground end and the open end coincide.

At a predetermined position on the surface of the thirteenth dielectric layer 163, there is provided a rectangular conductor piece 185 coupled to the open ends of the resonance lines 181, 182, 183 to form a capacitance.

Fourteenth and fifteenth dielectric layers 164 and 165
Is a dummy layer.

A ground conductor 186 is provided on the surface of the sixteenth dielectric layer 166. The ground conductor 186 is connected to external terminals 124 to 128 serving as ground terminals,
The part corresponding to 23 is cut out for insulation.

In the above-described laminated body 110, the receiving filter is formed by the second to eighth dielectric layers 152 to 158 and the resonance lines, the ground conductors, and the conductor pieces provided on the surfaces of these layers. The circuit 130 is configured, and from the eighth layer to the sixteenth layer
The transmission filter circuit 140 is constituted by the first dielectric layers 158 to 166 and the resonance line, the ground conductor, and the conductor piece provided on the surface of these layers.

In the laminated duplexer element 100, the resonance lines 173, 174, 175 and the conductor pieces 172, 176, 177, 178 constituting the reception filter circuit 130 are sandwiched by the ground conductors 171 and 179 via the dielectric layers 152, 153, 156 and 157. The filter circuit 130 is shielded from the outside world and the transmission filter circuit 140, and the resonance lines 181, 182, 183 and the conductor piece 18 constituting the transmission filter circuit 140 are formed.
Since the ground conductors 179 and 186 sandwich the dielectric layers 158, 159, 160, 163, 164, and 165 via the dielectric layers 158, 159, 160, 163, 164, and 165, the transmission filter circuit 140 is shielded from the outside and the reception filter circuit 130 by the ground conductors 179 and 186. Thus, each of the filter circuits 130 and 140 can exhibit good characteristics without being affected by the outside and the other filter circuits.

Further, at least one of the resonance line, the ground conductor, and the conductor piece constituting the reception filter circuit 130 is formed of a layer provided with the resonance line, the conductor piece, and the ground conductor of the transmission filter circuit 140. Are provided in different layers, so that the thickness of each insulator layer and the distance between the resonance line and the ground conductor can be set so as to obtain the best characteristics for each filter. Thereby, each filter circuit 13
The impedance characteristics of the 0,140 pass frequency band can be set to an optimal state.

As shown in FIG. 5, the frequency characteristics of the laminated duplexer element 100 show good frequency characteristics in each of the receiving filter circuit 130 and the transmitting filter circuit 140. That is, as shown by the characteristic curve of Rx in FIG. 5, the receiving filter circuit 130 shows a good pass characteristic in the receiving frequency band, and generates a large attenuation outside the receiving frequency band. Further, as shown in the characteristic curve of Tx in FIG.
Reference numeral 140 shows good pass characteristics in the transmission frequency band, and causes significant attenuation outside the transmission frequency band.

The laminated duplexer element 100 is
Part of the receiving filter circuit 130 and the transmitting filter circuit 140
Are stacked in the direction perpendicular to the bottom surface 111 of the multilayer body 110, so that the mounting area on the main device is reduced and high-density mounting is enabled.

In the first embodiment, the two ground conductors 179 and 186 sandwiching the resonance lines 181, 182, and 183 in the transmission filter circuit 140 are smaller than the distance between the two ground conductors 171 and 179 sandwiching the resonance lines 173, 174, and 175 in the reception filter circuit 130.
By setting the distance between them large, the impedance characteristics in the pass frequency band of each filter circuit 130, 140 were set to be in a good state, but the present invention is not limited to this. It is preferable to set individually and arbitrarily according to the arrangement of the conductor pieces.

Next, a second embodiment of the present invention will be described.

FIG. 6 is an external perspective view showing a laminated duplexer element 200 according to the second embodiment, and FIG. 7 is an exploded perspective view thereof. In the figure, the same components as those in the first embodiment described above are denoted by the same reference numerals, and description thereof will be omitted. The difference between the second embodiment and the first embodiment is that the arrangement of the resonance lines 181, 182, 183, the conductor pieces 180, 185, and the connection lines 184 constituting the transmission filter circuit 140 is changed,
1,182,183 are the resonance lines 173,174,
That is, they are arranged to intersect at right angles to 175.

With the above configuration, the same effect as that of the first embodiment can be obtained, and the external terminal 121 for the antenna, the external terminal 122 for the reception, and the external terminal 123 for the transmission are different from each other in the laminated element body 110. Since the external terminals 121, 122, 123 can be easily formed on the side surfaces, it is possible to prevent the external terminals 121, 122, 123 from being short-circuited, and to prevent the external terminals 121, 122, 12
The size of the multilayer body 110 can be reduced while the size of 3 is the same as that of the first embodiment.

Next, a third embodiment of the present invention will be described.

FIG. 8 is an exploded perspective view of a laminated duplexer element 300 according to the third embodiment. The appearance and the equivalent circuit of the multilayer duplexer element in the third embodiment are the same as those in the first embodiment.

The difference between the third embodiment and the first embodiment is that, in the third embodiment, as shown in FIG. 9, the receiving filter circuit 130 is provided on the surface of the fifth dielectric layer 155. A ground conductor 311 is provided between the resonant transmission lines 173, 174, 175 and the transmission external end 123 so as to surround the transmission external terminal 123, and as shown in FIG. In addition, a ground conductor 321 is provided between the resonance lines 181, 182, 183 of the transmission filter circuit 140 and the reception external terminal 122 so as to surround the reception external terminal 122.

According to the above configuration, the same effect as that of the first embodiment can be obtained, and the electrical coupling between the resonance lines 173, 174, 175 of the reception filter circuit 130 and the transmission external terminal 123 is suppressed by the ground conductor 311. You. In addition, the resonance lines 181, 182, 183 of the transmission filter circuit 140 and the reception external terminal
Electrical coupling with the ground conductor 122 is suppressed by the ground conductor 321. Thus, the characteristics of each of the filter circuits 130 and 140 can be individually set without being affected by the other filter circuit, and the characteristics can be stabilized.

The laminated duplexer element 30 shown in FIG.
Ground conductors 312, 313 surrounding the transmitting external terminal 123 may be provided on the surfaces of the dielectric layers 154, 156 on which other conductor pieces 172, 178 constituting the receiving filter circuit 130 are provided, as shown in FIG. Ground conductors 322 and 323 surrounding the external receiving terminal 122 may be provided on the surfaces of the dielectric layers 161 and 163 on which the other conductor pieces 180 and 185 constituting the trust filter circuit 140 are provided.

The ground conductor 3 surrounding the external receiving terminal 122
Only 21,322,323 may be provided, or the external terminal 123 for transmission may be provided.
, Only the ground conductors 311, 312, and 313 may be provided.

The ground conductor surrounding the external terminal 122 for reception or the external terminal 123 for transmission is preferably provided on the same layer as the layer on which the resonance line is formed, but the layer on which the ground conductor is provided is particularly defined. The same effect can be obtained by providing a ground conductor surrounding the external terminal on at least one layer.

Next, a fourth embodiment of the present invention will be described.

FIG. 12 is an exploded perspective view showing a laminated duplexer element 400 according to the fourth embodiment, and FIG. 13 is a sectional view taken along the line AA in FIG. In the figure, the same components as those in the first embodiment described above are denoted by the same reference numerals, and description thereof will be omitted. The difference between the fourth embodiment and the first embodiment is that in the fourth embodiment, a predetermined amount of capacitance is formed between the open ends of the resonance lines 173, 174, 175 of the receiving filter circuit 130 and the ground conductor. And resonant line
173, 174, 175 and Q of the filter circuit 130 are improved, and the resonance lines 181, 182, 183 of the transmission filter circuit 140 are improved.
That is, a predetermined amount of capacitance is formed between the open end and the ground conductor to shorten the resonance lines 181, 182, 183 and improve the Q of the filter circuit 140. Further, the above-mentioned capacitance can be obtained by dividing the ground conductor arranged in the layer between the resonance lines 173, 174, 175 and the resonance lines 181, 182, 183 into two layers and arranging them in different layers.

That is, in the multilayer duplexer 400 of the fourth embodiment, the resonance lines 173, 174,
The resonance lines 173 and 17 of the receiving filter circuit 130 are set so that the positions of the ground end and the open end of the 175 are opposite to those in the first embodiment.
4,175, conductor pieces 172,178, and connection conductors 176,177 were arranged.
Further, the eighth and ninth dielectric layers 158 and 159 in the first embodiment were removed.

The multilayer duplexer 400 of the fourth embodiment has a structure in which the resonance line 173 and the resonance line 173 are provided on the surface of the seventh dielectric layer 157.
Ground conductors 411 were provided in approximately one-half the area corresponding to the open ends of 174 and 175, and a plurality of via-hole conductors 412 connected to the ground conductors 411 were provided. Further, a ground conductor 421 was provided on the surface of the eighth dielectric layer 160 in a region almost half of the open ends of the resonance lines 181, 182, 183. Ground conductor 4
11 and ground conductor 412 are connected via a plurality of via-hole conductors 412.

With the above configuration, the receiving filter circuit 130
L1 between the resonant lines 173, 174, 175 and the ground conductor 411
Is set smaller than the distance L2 between the resonance lines 181, 182, 183 of the transmission filter circuit 140 and the ground conductor 411.
Further, the resonance lines 181, 182, 183 of the transmission filter circuit 140
A distance L3 between the ground conductor 421 and the ground conductor 421 is set smaller than a distance L4 between the resonance lines 173, 174, 175 of the receiving filter circuit 130 and the ground conductor 421.

As a result, a capacitance is generated between the open ends of the resonance lines 173, 174, 175 of the reception filter circuit 130 and the ground conductor 411, so that the length of the resonance lines 173, 174, 175 can be shortened and the reception filter circuit can be reduced. 13
The Q of 0 can be increased. The open ends of the resonance lines 181, 182, 183 of the transmission filter circuit 140 and the ground conductor 421
Between the resonance line 181,
The lengths of 182 and 183 can be reduced, and the Q of the transmission filter circuit 140 can be increased.

Further, each of the ground conductors 411 and 421 is provided in a half area on a different side of the dielectric layers 157 and 160, and is connected via a via-hole conductor 412 at a portion where they overlap each other. The conductors 411 and 421 can electrically shield the reception filter circuit 130 and the transmission filter circuit 140.

The resonance lines 173, 174, 175 of the reception filter circuit 130 and the resonance lines 18 of the transmission filter circuit 140
By reducing the lengths of 1,182,183 and the number of dielectric layers, the size of the laminated duplexer element 400 can be reduced.

It is needless to say that the same effects as those of the first embodiment can be obtained in the fourth embodiment.

Next, a fifth embodiment of the present invention will be described.

FIG. 14 is an external perspective view showing a laminated duplexer element 500 according to the fifth embodiment, FIG. 15 is a sectional view taken along the line AA in FIG. 14, and FIG. 16 is an exploded perspective view thereof. In the present embodiment, the laminated duplexer element has the same equivalent circuit and frequency characteristics as those of the first embodiment, and the receiving filter circuit 130 and the transmitting filter circuit 140 are formed side by side. An example of the duplexer element will be described.

In the figure, reference numeral 500 denotes a laminated duplexer element, which comprises a rectangular parallelepiped laminated body 510 having a resonance line formed in an inner layer, and the outer surface of the laminated body 510 extends from a bottom surface 511 to an upper surface 512. External terminals 521 to 528 are formed. The external terminal 521 is a terminal connected to the antenna.
The external terminal 522 is a terminal connected to the receiving circuit,
Is a terminal connected to the transmission circuit. The other external terminals 524 to 528 are ground terminals.

Inside the laminated element body 510, there are formed the receiving filter circuit 130 and the transmitting filter circuit 140 shown in the equivalent circuit of FIG.

Each of the above-mentioned reception filter circuit 130 and transmission filter circuit 140 is composed of a conductor piece and a resonance line provided on the laminated body 510. That is, as shown in FIG. 16, the laminated body 510 is formed by laminating a plurality of dielectric layers (insulator layers) 551 to 560 each having the same thickness and a rectangular plane, and a predetermined dielectric layer is formed. A resonance line, a conductor piece, or a ground conductor is provided on the surface of the body layer.

In FIG. 16, the uppermost dielectric layer 551 is a dummy layer, and a ground conductor 571 is provided on the surface of the second dielectric layer 552 in a half area on one end side in the long side direction. Have been. This ground conductor 571 is connected to the external terminal 5 serving as a ground terminal.
Portions corresponding to the external terminals 521 and 523 for antenna and transmission are cut out for insulation.

The third dielectric layer 553 is a dummy layer.

On the surface of the fourth dielectric layer 554, a ground conductor 572 is provided in a half area on the other end side in the long side direction. This ground conductor 572 is connected to the external terminal 52 serving as a ground terminal.
6,527,528, and the portions corresponding to the antenna and receiving external terminals 521,522 are notched for insulation.

On the surface of the fifth dielectric layer 555, a conductor piece 5
One end of the conductor piece 573 is provided with an external terminal 523 for transmission.
And the other end is arranged at a position where it is coupled to an open end of a resonance line 577 described later to form a capacitance.

On the surface of the sixth dielectric layer 556, a conductor piece 574 which is coupled to resonance lines 581 and 582, which will be described later, at a predetermined position in a region on the other half of the other side in the long side direction to form a capacitor.
Is provided. Further, on the surface of the sixth dielectric layer 556, three resonance lines 575, 576, 578 made of strip lines parallel to each other are provided at predetermined intervals in a region on one end half in the long side direction, One end of each is grounded and the other end is open. One end of the connection conductor 579 is connected to a predetermined position of one end of the resonance line 575, and the connection conductor 5
The other end of 79 is connected to an external terminal 521 for an antenna. In addition, these resonance lines 575, 576, 578
It is arranged to be parallel to the short side of 56.

On the surface of the seventh dielectric layer 557, there are three resonance lines formed of strip lines parallel to each other at a predetermined position in a predetermined position in the other half of the other side in the long side direction. 580, 581, 582 are provided, and these resonance lines 580, 581, 5
One end of each of the 82 is grounded and the other end is open.
One end of the connection conductor 583 is connected to a predetermined position of one end of the resonance line 580, and the other end of the connection conductor 583 is connected to an external terminal 521 for an antenna. One end of the connection conductor 584 is connected to a predetermined position of one end of the resonance line 582, and the connection conductor 584
Is connected to an external terminal 522 for reception.

Further, on the surface of the seventh dielectric layer 557, a capacitance is formed by coupling to the open ends of the resonance lines 575, 576, and 578 at a predetermined position within a region on one end side in the long side direction. A rectangular conductor piece 585 is provided.

On the surface of the eighth dielectric layer 558, the resonance lines 580 and 58 are located at predetermined positions in a region on the other end half in the long side direction.
A conductor piece 586 is provided that couples to 1 to form a capacitor.

The ninth dielectric layer 559 is a dummy layer.

On the surface of the tenth dielectric layer 560, a ground conductor 587 is provided over almost the entire area. The ground conductor 587 is connected to external terminals 524 to 528 serving as ground terminals, and portions corresponding to the external terminals 521 to 523 are cut away for insulation.

In the laminated element body 510 described above, the reception filter circuit 130 is constituted by the resonance line, the ground conductor, and the conductor piece provided in the other half of the other side in the long side direction. A transmission filter circuit 140 is configured by a resonance line, a ground conductor, and a conductor piece provided in a region on one half of one end.

The distance L5 between the two ground conductors 572, 587 sandwiching the resonance lines 580, 581, 582 in the reception filter circuit 130 and the resonance lines 575, 5 in the transmission filter circuit 140
The distance L6 between the two ground conductors 571 and 787 sandwiching 76 and 577 is set to a different value. Further, at least one of the resonance line, the ground conductor, and the conductor piece constituting the reception filter circuit 130 is a layer different from the layer in which the resonance line, the conductor piece, and the ground conductor of the transmission filter circuit 140 are provided. It is provided in. Thereby, in each of the receiving and transmitting filter circuits 130 and 140, the impedance characteristic in the pass frequency band can be set to an optimal state.

Further, since the resonance lines 580, 581, 582 and the conductor pieces 574, 583, 584, 586 constituting the reception filter circuit 130 are sandwiched by the ground conductors 572, 587 via the dielectric layers 554, 555, 558, 559, the reception filter circuit 130 is externally circulated by the ground conductors 582, 587. The resonance lines 575, 576, 577 and the conductor pieces 573, 579 585, which are shielded from the transmission filter circuit 140 and constitute the transmission filter circuit 140, are dielectric layers 552, 55.
Since the transmission filter circuit 140 is sandwiched between the ground conductors 571 and 587 via the 3,554,557,558 and 559, the transmission filter circuit 140 is shielded from the outside and the reception filter circuit 130 by the ground conductors 571 and 587. As a result, each of the filter circuits 130 and 140 can exhibit good characteristics without being affected by the outside and the other filter circuits.

Further, in the multilayer duplexer element 500 of the fifth embodiment, the portion of the receiving filter circuit 130 and the portion of the transmitting filter circuit 140 are arranged side by side on the bottom surface 511 of the multilayer body 510. The height of 500 can be set low, making it applicable to thin electronic devices.

In the fifth embodiment, the transmission filter circuit 140 is larger than the distance between the two ground conductors 572, 587 sandwiching the resonance lines 580, 581, 582 in the reception filter circuit 130.
Ground conductors 57 sandwiching the resonance lines 575, 576, 576
By setting the distance between 1,587 to be large, the impedance characteristics in the pass frequency band of each filter circuit 130, 140 were set to be in a good state, but the present invention is not limited to this. It is preferable to set arbitrarily and individually according to the arrangement of the line and the conductor piece.

Further, in the fifth embodiment, the portion constituting the receiving filter circuit 130, that is, the portion sandwiched between the ground conductors 572 and 587 is provided on the bottom surface 511 side of the multilayer body 510.
As in the multilayer duplexer element 500A according to the sixth embodiment shown in FIGS. 17 and 18, a part configuring the reception filter circuit 130 may be provided on the upper surface 512 side of the multilayer body 510.
As in the multilayer duplexer element 500B of the seventh embodiment shown in FIGS. 9 and 20, a part configuring the reception filter circuit 130 may be provided at an intermediate position between the bottom surface 511 and the upper surface 512 of the multilayer body 510.

Further, as in the eighth embodiment shown in FIGS. 21 and 22, a portion to be a dummy layer on the upper surface 512 side of the portion forming the receiving filter circuit 130 in the laminated element body 510 of the fifth embodiment is replaced by A stacked duplexer element 500C including the removed staircase-shaped stacked element body 510C may be configured.

Further, as in the ninth embodiment shown in FIG. 23, the portion forming the reception filter circuit 130 and the portion forming the transmission filter circuit 140 in the multilayer duplexer element 500 of the fifth embodiment are separated into different layers. And a laminated duplexer element 500D in which a part of the part configuring the reception filter circuit 130 and a part of the part configuring the transmission filter circuit 140 overlap each other. Even if a part of the part forming the reception filter circuit 130 and a part of the part forming the transmission filter circuit 140 overlap each other, it is possible to suppress the electric interference between the filter circuits and to reduce The mounting area on the device can be reduced.

It should be noted that the configuration of each of the above embodiments is a specific example of the present invention, and it is needless to say that the present invention is not limited to only these configurations, and that the configurations of the embodiments may be combined. No.

[0094]

As described above, according to the laminated duplexer element of the present invention, the first filter circuit and the second filter circuit are shielded from each other by the ground conductor. Since it is shielded from the outside, the best characteristics can be obtained in both filter circuits. Further, by providing at least one of the conductor piece and the ground conductor of the first filter circuit on a layer different from the layer provided with the conductor piece and the ground conductor of the second filter circuit, Since the thickness and the distance between the resonance line and the ground conductor can be set for each filter circuit, the best characteristics can be obtained for each filter.

According to the laminated duplexer element of the second aspect, in addition to the above effects, in each of the first filter circuit and the second filter circuit, the distance between the two ground conductors sandwiching the resonance line is reduced. By setting different values, the impedance characteristics of the pass frequency band of each filter circuit are set to the best condition.

According to the laminated duplexer element of the third aspect, in addition to the above-described effects, the ground conductor is provided so as to surround the input / output terminal, so that the resonance line of the second filter circuit and the first input / output terminal are provided. Since the electrical coupling between the terminals and the electrical coupling between the resonance line of the first filter circuit and the second input / output terminal are suppressed, the characteristics of each filter circuit can be individually set and stable. Can be done.

According to the laminated duplexer element of the fourth aspect, in addition to the above-described effects, the first filter circuit portion and the second filter circuit portion are arranged so as to overlap in the laminating direction of the laminated element body. Therefore, the mounting area on the main device is reduced, and high-density mounting becomes possible.

According to the laminated duplexer element of the fifth aspect, in addition to the above effects, the first filter circuit portion and the second filter circuit portion are arranged side by side in the direction in which the layers of the laminated body extend. Therefore, the height of the laminated duplexer element can be set low, and it can be applied to a thin electronic device.

According to the laminated duplexer element of the sixth aspect, in addition to the above effects, a part of the portion where the first filter circuit is formed is only a part of a portion where the second filter circuit is formed. Since they are stacked so that they overlap,
Electrical interference between the filter circuits can be suppressed, and the mounting area can be reduced.

According to the laminated duplexer element of the present invention, in addition to the above effects, the resonance line of the first filter circuit and the resonance line of the second filter circuit are arranged so as to intersect each other at right angles. Therefore, the input / output terminals of each filter circuit can be easily arranged on different outer surfaces of the multilayer body.

According to the laminated duplexer element of the eighth aspect, in addition to the above effects, the length of the resonance line can be shortened and the number of laminated insulating layers can be reduced. The external shape of the body can be formed small. Further, the Q of each filter circuit can be increased.

[Brief description of the drawings]

FIG. 1 is an external perspective view showing a laminated duplexer element according to a first embodiment of the present invention.

FIG. 2 is a diagram showing an equivalent circuit of the laminated duplexer element according to the first embodiment of the present invention.

FIG. 3 is an exploded perspective view showing the laminated duplexer element according to the first embodiment of the present invention.

FIG. 4 is a sectional view taken along a line AA in FIG. 3;

FIG. 5 is a diagram showing frequency characteristics of the multilayer duplexer element according to the first embodiment of the present invention.

FIG. 6 is an external perspective view showing a laminated duplexer element according to a second embodiment of the present invention.

FIG. 7 is an exploded perspective view showing a laminated duplexer element according to a second embodiment of the present invention.

FIG. 8 is an exploded perspective view showing a laminated duplexer element according to a third embodiment of the present invention.

FIG. 9 is a plan view showing a main part according to a third embodiment of the present invention.

FIG. 10 is a plan view showing a main part according to a third embodiment of the present invention.

FIG. 11 is an exploded perspective view showing another configuration example of the laminated duplexer element according to the third embodiment of the present invention.

FIG. 12 is an exploded perspective view showing a laminated duplexer element according to a fourth embodiment of the present invention.

13 is a sectional view taken along the line AA in FIG. 12;

FIG. 14 is an external perspective view showing a laminated duplexer element according to a fifth embodiment of the present invention.

FIG. 15 is a sectional view taken along the line AA in FIG. 14;

FIG. 16 is an exploded perspective view showing a laminated duplexer element according to a fifth embodiment of the present invention.

FIG. 17 is an exploded perspective view showing a laminated duplexer element according to a sixth embodiment of the present invention.

18 is a sectional view taken along line AA in FIG. 17;

FIG. 19 is an exploded perspective view showing a laminated duplexer element according to a seventh embodiment of the present invention.

20 is a sectional view taken along the line AA in FIG. 20;

FIG. 21 is an exploded perspective view showing a laminated duplexer element according to an eighth embodiment of the present invention.

FIG. 22 is a sectional view taken along the line AA in FIG. 22;

FIG. 23 is a side sectional view showing a laminated duplexer element according to a ninth embodiment of the present invention.

[Explanation of symbols]

100, 200, 300, 300A, 400, 500, 500A to 500D: laminated duplexer element, 110, 210, 510: laminated body, 111, 211, 511: bottom, 112, 212, 512 ... top, 121, 521: external terminal for antenna, 122, 522: external terminal for reception, 123, 523: external terminal for transmission, 124 to 128, 524 528: External terminal for grounding, 130: Filter circuit for receiving, 131, 132, 133: Resonator, 134a, 134h: Inductor, 134b, 134d, 134e, 134f, 134g: Capacitor, 140
... Transmission filter circuits, 144a, 144b, 144c ... Capacitors,
144d ... inductor, 151-166 ... dielectric layer (insulator layer),
171,179,186… ground conductor, 172,178,180,185… conductor piece, 17
3,174,175,181,182,183… Resonance line, 175,176,184… Connection conductor, 311,312,313,321,322,323… Ground conductor, 411,421…
Ground conductor, 412: Via hole conductor, 551 to 560: Dielectric layer (insulator layer), 571,572,587,588,589,591,592,593 ... Ground conductor, 573,574,585,586 ... Conductor piece, 575,576,577,580,5
81,582… Resonant line, 579,583,584… Connection conductor.

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H03H 7/09 H03H 7/46 A 7/46 H01F 15/00 DF term (Reference) 5E070 AA01 AB01 CB03 CB13 CB15 EA01 5J006 HB05 HB22 JA22 KA03 LA03 LA09 LA13 LA23 NA03 NA04 NB07 NC03 5J024 AA01 BA18 CA04 CA06 CA09 CA10 CA17 DA01 DA29 DA32 EA03 EA05 KA03

Claims (8)

[Claims] A first conductor having a plurality of conductor pieces including a resonance line;
A first filter circuit for passing a signal in a frequency band,
A multilayer element including a plurality of conductor pieces including a resonance line and including a second filter circuit that allows a signal in a second frequency band different from the first frequency band to pass therethrough, and formed on an outer surface of the multilayer element; A first input / output terminal connected to one input / output terminal of the first filter circuit, and a second input / output terminal formed on an outer surface of the multilayer body and connected to one input / output terminal of the second filter circuit A terminal, a common input / output terminal formed on an outer surface of the multilayer element and connected to the other input / output end of the first filter circuit and the other input / output end of the second filter circuit; And a grounding terminal formed on an outer surface of the multilayered duplexer element, wherein a conductor piece including the resonance line of the first filter circuit and a conductor piece including the resonance line of the second filter circuit are individually provided for each filter circuit. Sandwiched between insulator layers And a plurality of ground conductors arranged as described above, and one of the conductor pieces and the ground conductor of the first filter circuit.
At least one is provided on a layer different from the layer on which the conductor piece and the ground conductor of the second filter circuit are provided. 2. A distance between two ground conductors sandwiching a resonance line of the first filter circuit is set to a value different from a distance between two ground conductors sandwiching a resonance line of the second filter circuit. The laminated duplexer element according to claim 1, wherein: 3. In at least one of between a resonance line of the first filter circuit and the second input / output terminal or between a resonance line of the second filter circuit and the first input / output terminal. The multilayer duplexer element according to claim 1 or 2, wherein a ground conductor connected to the ground terminal is provided on at least one of the layers so as to surround the input / output terminal. 4. The laminated element body according to claim 1, wherein a portion on which the first filter circuit is formed and a portion on which the second filter circuit is formed are arranged so as to overlap in a laminating direction. 4. The multilayer duplexer according to claim 1. 5. The laminated element body according to claim 1, wherein a portion where the first filter circuit is formed and a portion where the second filter circuit is formed are arranged side by side in a direction in which the layers extend. 4. The multilayer duplexer according to claim 1. 6. The laminated element body according to claim 1, wherein a part of a part where the first filter circuit is formed is laminated on a part of a part where the second filter circuit is formed. The laminated duplexer element according to claim 3. 7. The resonance line is formed of a strip-shaped conductor piece having one end connected to the ground terminal and the other end open, wherein the resonance line of the first filter circuit is different from the resonance line of the second filter circuit. The laminated duplexer element according to claim 4, wherein the laminated duplexer element is arranged so as to intersect at right angles with an insulator layer interposed therebetween. 8. The resonance line includes a strip-shaped conductor piece having one end connected to the ground terminal and the other end open, and one end of the resonance line of the first filter circuit is connected to the resonance line of the second filter circuit. Each resonance line is arranged such that the other end of the resonance line of the first filter circuit is located on the other end side and the other end of the resonance line of the second filter circuit is located on one end side of the resonance line of the second filter circuit. A first and a second ground provided on different layers from each other and disposed between the resonance line of the first filter circuit and the resonance line of the second filter circuit as ground conductors provided so as to be sandwiched therebetween. A conductor, wherein the first ground conductor is provided in a half area on the open end side of the resonance line of the first filter circuit, and the second ground conductor is provided on a resonance line of the second filter circuit. 1/2 of the open end side The distance between the resonance line of the first filter circuit and the first ground conductor is smaller than the distance between the resonance line of the second filter circuit and the first ground conductor. The distance between the resonance line of the second filter circuit and the second ground conductor is set smaller than the distance between the resonance line of the first filter circuit and the second ground conductor. The laminated duplexer element according to claim 4, wherein