JP2762332B2 - Multilayer dielectric duplexer - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a band-pass filter (B
The present invention relates to a multilayer dielectric duplexer in which a PF section and a band elimination filter (BEF) section are combined. More specifically, a plurality of resonator substrates each having a quarter-wave resonance type strip line are stacked in the thickness direction so as to sandwich the coupling adjustment substrate therebetween, and are provided independently on the outer periphery of the resonator substrate. A polarized band-pass filter section in which island-shaped electrodes are connected by a conductor, and a plurality of resonator boards having the same structure are stacked in the thickness direction so as to sandwich a shielding board therebetween. And a band rejection filter unit in which independent island-shaped electrodes are connected by a coil, and both filter units are connected by a combining coil and combined to form a laminated dielectric duplexer. This dielectric duplexer is suitable for, for example, various wireless devices for microwaves.

[0002]

2. Description of the Related Art As a microwave duplexer, a band-pass filter using an integrated dielectric coaxial resonator having a plurality of holes and a band rejection filter using a plurality of single-hole type dielectric coaxial resonators are known. Combined dielectric duplexers are known. The band-pass filter has a structure in which a polarized capacitor is connected to an integrated dielectric coaxial resonator, and the capacitors are connected by a conductive wire to add a polarized feedback circuit. The band rejection filter has a structure in which a coupling capacitor is connected to each of a single type dielectric coaxial resonator and each capacitor is connected by a coil. A transmission terminal is provided at one end of the band-pass filter, and a reception terminal is provided at one end of the band rejection filter. Then, the other ends of both filters are connected by a combining coil, combined and connected to an antenna.

An integrated dielectric coaxial resonator constituting a band-pass filter has several (for example, four in the case of four stages) resonator holes arranged side by side in a rectangular parallelepiped dielectric block.
The structure is such that a connector hole is provided between them, and a metallized layer is formed on the entire outer surface except for one surface where each hole is opened and on the inner surface of the resonator hole. Of the surfaces where the holes are open, the surface without the metallized layer is the open surface, and the surface with the metallized layer is the short circuit surface. This is a quarter-wave resonance type, and each resonator is coupled by a connector hole therebetween. Prepare another wiring board, and mount the same number of polarized capacitors as the number of resonators on it. Then, a lead terminal is connected between the inner metallized layer of each resonator hole and each capacitor. First and second, depending on the conductor pattern formed on the wiring board in advance,
And the third and fourth capacitors are connected respectively, thereby forming a polarized feedback circuit.

In each of the dielectric coaxial resonators constituting the band rejection filter, a resonator hole is provided at the center of a prismatic dielectric, and the entire outer surface of the resonator excluding one surface where the resonator hole is opened is connected to the resonator. This is a structure in which a metallized layer is formed on the inner surface of the hole. Of the surfaces where the resonator holes are open, the surface without the metallized layer is the open surface, and the surface with the metallized layer is the short-circuited surface. A plurality of the dielectric coaxial resonators are arranged in parallel. Separately, a wiring board is prepared, mounted with the same number of coupling capacitors as the number of resonators, and each capacitor is connected with a coil. Then, a lead terminal is connected between the internal electrode of each dielectric coaxial resonator (the inner metallization layer of the resonator hole) and each capacitor.

[0005]

In the case of the above-described dielectric coaxial resonator structure, a wiring board and a polarized or coupling capacitor are required separately from the resonator. The capacitor and the inner metallization layer of the resonator hole must be connected by lead terminals, which increases the number of components, increases the number of mounting steps, and complicates assembly. In the dielectric coaxial resonator structure, since a hole is formed in the dielectric block, there is essentially a limit to miniaturization.

[0006] By the way, as a microwave filter,
There is also a type in which the resonator is configured by a strip line. For example, in the case of a 1/4 wavelength resonator, a linear strip line type resonator conductor is provided on a dielectric substrate, one end of which is open and the other end is short-circuited to an external electrode. When a bandpass filter is configured, it can be configured by arranging a plurality of resonator conductors on a dielectric substrate and commonly connecting the short-circuit side. However, a band-stop filter cannot be constructed,
Therefore, a duplexer in which a band-pass filter and a band rejection filter are combined cannot be realized.

SUMMARY OF THE INVENTION An object of the present invention is to eliminate the drawbacks of the prior art as described above, and to integrate a polarizing and coupling capacitor into a resonator substrate to eliminate the need for a wiring substrate and the like. An object of the present invention is to provide a laminated dielectric duplexer having a structure in which the number of parts is reduced to reduce assembling steps such as complicated soldering as much as possible and the size is easily reduced.

[0008]

Means for Solving the Problems The present invention basically comprises:
This is a dielectric duplexer obtained by combining a laminated band-pass filter unit and a laminated band rejection filter unit and connecting them by a combining coil. The band-pass filter unit is 1
A quarter wavelength resonant stripline type resonator substrate and a coupling adjusting substrate are alternately laminated in the thickness direction, and the resonator substrate has a structure in which a polarized capacitor is integrally incorporated, and a conductor is connected thereto. This is a configuration in which a pole feedback circuit is formed. The band rejection filter unit has a structure in which a similar quarter-wave resonance stripline type resonator substrate and a shielding substrate are alternately stacked in the thickness direction, and the resonator substrate has a structure in which a coupling capacitor is integrally incorporated. This is a configuration in which a coil is connected and coupled.

Here, each resonator substrate typically has an internal electrode formed in the longitudinal direction of the inner center of a strip-shaped dielectric substrate, and independent island-shaped electrodes and external electrodes are formed on the outer peripheral portion excluding one end surface. Is formed. The coupling adjustment substrate has an electrode on the outer periphery. The shield substrate has a built-in shield electrode that extends in a plane substantially perpendicular to the thickness direction, and has an electrode on the outer periphery. A plurality of the resonator substrates are stacked so that a coupling adjusting substrate or a shielding substrate is sandwiched therebetween. Further, outer substrates are provided further outside the resonator substrates located on both sides in the thickness direction. The outer substrate has electrodes on the outer main surface and the outer peripheral portion. In the band-pass filter section, the island-shaped electrodes are connected by conductors to form a polarized feedback circuit, and in the band-stop filter section, the island-shaped electrodes are connected by coils.
Then, the island-shaped electrodes of the resonator substrate located on both sides of both filter portions are used as a receiving or transmitting coupling electrode and an antenna coupling electrode.

Here, it is preferable that the band pass filter section and the band rejection filter section are continuous and the outer surface is integrally metallized. For example, the band-pass filter unit uses the outer island electrode as the receiving coupling electrode, the center island electrode as the antenna coupling electrode, and the band rejection filter unit uses the outer island electrode as the transmitting coupling electrode and the center electrode. The island electrodes are used as antenna coupling electrodes. A receiving terminal is connected to the receiving coupling electrode, a transmitting terminal is connected to the transmitting coupling electrode, and an antenna terminal is connected to one of the antenna coupling electrodes.

[0011] In addition to the above structure, the resonator substrate is composed of, for example, a combination of an external dielectric having a cutout provided in a part thereof to be substantially U-shaped, and an internal dielectric fitted into the cutout of the external dielectric. Provide electrodes on the surface and outer periphery
A structure in which the four-wavelength resonance strip line is formed three-dimensionally so as to be folded may be used. The coupling adjusting substrate has a structure in which an opening or a cut portion is formed in a part of the dielectric substrate to adjust the degree of coupling in addition to a simple plate-shaped dielectric substrate. A structure in which a conductor pattern is formed on the main surface of the dielectric substrate may be used. The shield substrate preferably has a structure in which a shield electrode is formed at an interface where two dielectrics are stacked. Usually, at least the open surface side of such a dielectric duplexer is covered with a shield such as a metal case or a metal plate.

In the configuration of the polarized feedback circuit, for example, in the case of a four-stage filter, the first and second, and the third and fourth resonator substrate are connected between the island-shaped electrodes by conductors, respectively. I do. In this case, it is also possible to provide a conductor pattern on the outer peripheral surface of the coupling adjustment substrate and thereby form a connection portion.

[0013]

The resonator substrate has one inner electrode and one outer electrode.
It becomes a 波長 wavelength resonance type strip line type resonator.
The non-electrode portion (one on which no electrode is formed) at one end of the outer peripheral surface is an open surface, and the one on which the other electrode is formed is a short-circuit surface. However, in the case of the folded type, the open surface and the short-circuit surface appear at the same end. The coupling adjustment substrate sandwiched between the resonator substrates adjusts the coupling between the adjacent resonators according to the material, thickness, shape and position of the openings and cuts. The shielding substrate located between the resonator substrates prevents direct coupling between adjacent resonators, and functions as independent resonators.

In each of the above-described resonator substrates, a capacitance is generated between the island-shaped electrodes formed on the outer peripheral portion and the internal electrodes of the resonator substrate, and the capacitance acts as a polarized or coupling capacitor. Therefore, by connecting appropriate island-shaped electrodes with conductors, a band-pass filter characteristic exhibiting polarization can be exhibited. Further, by connecting the island-shaped electrodes with a coil, a band rejection filter characteristic is developed.

[0015]

1 shows an embodiment of a laminated dielectric duplexer according to the present invention, and FIG. 2 is a partially assembled perspective view of the same. As shown in both figures, it is composed of a combination of a bandpass filter section 10 and a band rejection filter section 20. Each of the filter units 10 and 20 has four resonator substrates. The receiving terminal 12 is mounted on one side of the band-pass filter unit 10, and the transmitting terminal 22 is mounted on one side of the band rejection filter unit 20. Then, the antenna terminal 14 is attached to the opposite side of the band-pass filter unit 10, and the antenna terminal 14 is connected to the band rejection filter unit 20 by the combining coil 24 and combined.

The main body of the band-pass filter section 10 includes 1
Four quarter-wavelength resonant stripline type resonator substrates 30
, 30d and three coupling adjusting substrates 32a,.
2c are alternately stacked in the thickness direction. Further, outside substrates 34a and 34b are arranged outside the resonator substrates 30a and 30d located on both sides. Each resonator substrate 30a,
.., 30d (the positions of the open surface and the short circuit surface) are all the same.

All the resonator substrates 30a,..., 30d have substantially the same shape, and have a quarter-wave resonance strip line. That is, the internal electrode 4 extends in the longitudinal direction of the inner center of the strip-shaped dielectric substrate 40 (the entire bonding surface of the two dielectric pieces).
1, and an external electrode 42 is formed on the outer peripheral portion excluding one end face. The end face on the non-electrode side is an open face, and the end face on the electrode formation side is a short-circuit face. Independent on the outer peripheral part near the electrode-free end face of each resonator substrate (separated from other electrodes)
An island electrode 43 is provided.

The band rejection filter section 20 is composed of four resonator boards 50a,.
0d and three shielding substrates 52a,..., 52c are alternately stacked in the thickness direction. Furthermore, outside substrates 54a, 50d are located outside the resonator substrates 50a, 50d located on both sides.
54b is arranged. Each of the resonator substrates 50a,..., 50d has the same direction (the positions of the open surface and the short-circuit surface).

The resonator substrates 50a,..., 50d used in the band rejection filter unit 20 are the same as those of the band pass filter unit 1 described above.
, And 30d, which is the same structure as the resonator substrates 30a,. The internal electrode 61 is formed in the longitudinal direction of the center of the strip-shaped dielectric substrate 60, and the external electrode 62 is formed on the outer peripheral portion excluding one end surface. An independent island-shaped electrode 63 is provided on the outer peripheral portion near the non-electrode end face of each resonator substrate.

The dielectric substrate constituting the above-mentioned resonator substrate is a sintered body of a high dielectric constant material for microwave, such as barium titanate, which is usually used for a microwave filter. Here, the resonator substrate is composed of a combination of two dielectric pieces. One dielectric piece has an electrode on the outer peripheral surface except one end, the other dielectric has an electrode on the outer peripheral surface except one end and its vicinity, and an island-shaped electrode is provided near the end surface on the non-electrode side. Structure. A resonator substrate can be formed by joining the two dielectric pieces. A polarized or coupling capacitor is formed between the island electrode and the internal electrode. In these resonator substrates, the resonance frequency or the capacitance of the capacitor can be finely adjusted by trimming the external electrode or the island electrode.

In practice, the resonator substrate having such a structure can be mass-produced by the following manufacturing method. Two sintered substrates of a high dielectric constant material for microwaves having a predetermined thickness and width are prepared. Silver paste is applied to the entire upper and lower surfaces and one end surface of one sintered substrate and baked, and silver paste is applied to the entire lower surface, one end surface, and most of the continuous upper surface on the other sintered substrate. At the same time, a silver paste is applied in the form of a strip separated from the upper surface on the side opposite to the end face, and baked. Next, an adhesive silver paste is applied to the entire upper surface of one sintered substrate and the entire lower surface of the other sintered substrate, joined, and baked and integrated. Thereafter, when the resonator substrate is cut into a predetermined width, many resonator substrates as described above can be manufactured.

Each of the coupling adjusting substrates 32a,..., 32c has an electrode 45 on the outer peripheral portion (except for a part) of the dielectric substrate 44. Each of the shielding substrates 52a,..., 52c has a built-in shield electrode extending in a plane perpendicular to the thickness direction.
An electrode is provided on the outer peripheral portion (except for a part). Specifically, the main surfaces of the two dielectrics 64a and 64b (but one side)
A shield electrode 65 is formed on the outer periphery of the substrate, and an electrode 66 is provided on the outer periphery, and the two dielectrics 64a and 64b are bonded so that the shield electrode 65 is back-to-back. The outer substrates 34a, 34b, 54a, 54b are the dielectric substrates 4
Electrodes 47 are provided on the outer main surface and the outer peripheral portion (except for some portions) of
Is formed. One end surface of each substrate is an electrodeless portion, and the vicinity thereof is also an electrodeless portion so that each electrode is not connected to the island-shaped electrode. Each of these substrates does not necessarily need to be made of the same material as the resonator substrate.
For example, a material having a lower dielectric constant than the resonator substrate, such as forsterite, may be used.

These are combined with the resonator substrate 30 as described above.
, 30d and 50a,..., 50d are arranged so as to be in the same direction, and integrated by using an adhesive or the like.
In this configuration, the outer surface can be integrally metallized. The outer substrates 34b and 54b can be replaced by shield substrates. In this embodiment, since the substrate can be shared by both filter sections, substantially (although there is a slight difference in relation to adjustment of the resonance frequency, etc.), the resonator substrate, the coupling adjustment substrate,
A total of four types of two types of outer substrates (a shielding substrate can be constituted by a combination of both outer substrates) can be manufactured. In addition, in order to make the drawings easy to understand, in each of the drawings, the electrode portions are shaded, and the non-electrode portions (portions where the dielectric base material is exposed) are shown with fine dots.

In the band-pass filter section 10, between the island-shaped electrodes 43 of the first resonator substrate 30a and the second resonator substrate 30b, and between the third resonator substrate 30c and the fourth resonator substrate 30c. The conductors (for example, tin-plated copper wires) 36 connect between the island-shaped electrodes 43 of the substrate 30d, thereby forming a polarized feedback circuit. In the band rejection filter unit 20, three coils 56 connect the four island-shaped electrodes 63 formed on the resonator substrates 50a,..., 50d.

Usually, such a dielectric duplexer is
Cover it with a metal case and mount it on a circuit board. Each terminal is connected to the conductor pattern of the circuit board, and an earth tab or the like provided on a metal case is soldered to the earth pattern of the circuit board to perform electrical connection and mechanical fixing.

Now, the above-described strip-line type resonator substrate is formed by the internal electrodes formed in the dielectric substrate.
A 波長 wavelength resonator is formed, which is short-circuited by the external electrode. Therefore, basically, the resonance wavelength (in other words, the resonance frequency) is determined by the length dimension of the resonator substrate (length of the internal electrode). The thickness of the resonator substrate (dimensions in the stacking direction)
Is larger, the resonance frequency is lower, and as the width (interval between the internal electrode and the external electrode) is smaller, the resonance frequency is lower. In the band-pass filter section 10, each resonator substrate is subjected to coupling adjustment between the stages by a coupling adjustment substrate located therebetween, thereby exhibiting a band-pass filter characteristic.
The input and output are coupled by the capacitance between the internal electrodes and the island-shaped electrodes of the resonator substrate located at both ends. Further, a pole is generated by the polarized feedback circuit, and a steep filter characteristic is obtained.
Further, in the band rejection filter unit 20, the resonator substrates shielded from each other by the shielding substrate are inter-stage coupled by a coupling capacitor formed between the island-shaped electrode and the internal electrode and an additional coil. A band rejection filter characteristic occurs. By making the resonance frequencies of both filter sections correspond to the reception frequency, transmission and reception of the antenna can be shared.

FIG. 3 shows another embodiment of the laminated dielectric duplexer according to the present invention. The basic configuration is the same as that of the embodiment shown in FIG. Bandpass filter unit 70
Are four resonator boards 71a,..., 71d of a quarter wavelength resonance strip line type and three coupling adjustment boards 72a,
, 72c are alternately stacked in the thickness direction, and outer substrates 73a, 73b are arranged on both sides thereof. The band rejection filter unit 74 includes four resonator substrates 75a,.
5c and three shielding substrates 76a,..., 76c are alternately laminated in the thickness direction, and outer substrates 77a, 77b are provided on both sides.
Is a format for placing. Then, the respective dielectric substrates are positioned and combined with an adhesive or the like to be integrated. Here, the shape of each substrate is a shape having a step (one corner is cut out).
The band-pass filter unit 70 and the band-stop filter unit 74 are connected by the combining coil 78 and combined.

FIG. 4 shows details of the resonator substrate. Each resonator substrate is provided with a cutout in a part thereof, the whole is substantially U-shaped, and one leg is formed longer than the other, and a combination of an internal dielectric 81 fitted into the cutout. It is. The external dielectric 80 has an electrode 83 formed on the outer peripheral portion excluding the long leg end surface 82. In addition, the internal dielectric 81 joins the two long and short dielectric pieces 84 and 85 via the electrode 86 except for one end of which is aligned and excluding the vicinity thereof, and is independent of the vicinity of the joining surface of the longer dielectric piece 84. This is a structure in which an island-shaped electrode 87 is formed, and an electrode 89 is formed on the protruding end surface 88 of the island-shaped electrode 87, the long dielectric piece 84, and the outer peripheral portions of both the dielectric pieces 84 and 85. Then, the internal dielectric 81 is oriented such that the electrode-free end surface 88 is located near the long leg end surface 82 of the external dielectric 80 and the outer peripheral electrode 89 of the internal dielectric 81 contacts the cut surface of the external dielectric 80.
The inner dielectric 81 is inserted into the cut of the outer dielectric 80 and fixed by glass bonding or the like.

As a result, such a resonator substrate is obtained by folding a strip line type quarter-wave resonator in which electrodes are formed in a W-shape on both outer and inner sides of a long and thin rod-like dielectric, and further folded in half. In this case, the size can be reduced by effectively using the dielectric material. Here, the long leg end surface 82 of the outer dielectric 80 is made to protrude beyond the tip of the long dielectric piece 84 of the inner dielectric 81, and the resulting electrode portion extending inside the long leg is exposed. 8
3a is used as a frequency trimming electrode. When the portion is cut off, the length of the resonator appears to be shortened, so that the resonance frequency can be adjusted so as to be shifted to a higher frequency side.

As shown in FIG. 5, the coupling adjusting substrate has a structure in which an electrode 91 is provided on an outer peripheral surface (excluding a step portion and a front end surface) of a plate-like dielectric material 90 with one corner cut out.
As shown in FIG. 6, the shield substrate also has a shield electrode 93 formed on one surface of two plate-shaped dielectrics 92a and 92b with one corner cut out, and an outer peripheral surface (excluding a step portion and a tip end surface thereof). ) Is provided with an electrode 94, and the shield electrode 9 is provided.
3 are joined back to back. The outer substrate also has a plate shape with one corner cut out, and has electrodes formed on the outer main surface and the outer peripheral portion (except for a part).

Returning to FIG. 3, the resonator substrates 71a, 71b
A conductor 95 is connected between the island-shaped electrodes 87 and between the island-shaped electrodes 87 of the resonator substrates 71c and 71d to form a polarized feedback circuit. Also, coils 96 are connected between the island-shaped electrodes 87 of the resonator substrates 75a,. The receiving terminal 97 is provided on the island electrode of the resonator substrate 71a, the antenna terminal 98 is provided on the island electrode of the resonator substrate 71d, and the transmitting terminal 99 is provided on the island electrode of the resonator substrate 75a. The operation as a dielectric duplexer is the same as that of the above-described embodiment, and the description thereof will be omitted.

The present invention is not limited only to the above embodiment. The coupling adjusting substrate may have an opening or a cut portion at the center of the dielectric substrate, in addition to a simple plate.
By adjusting the shape, the degree of coupling between adjacent resonator substrates can be adjusted. Alternatively, a conductor film for coupling adjustment may be provided on the main surface of the dielectric substrate. However, the conductor film is formed so as not to contact the electrode of the resonator substrate. The conductor film may be provided on only one of the main surfaces, or may be provided on both main surfaces. Further, the conductive film may be configured to be connected to an electrode on the outer periphery. Since the electromagnetic field can be controlled by the conductive film, the degree of coupling between adjacent resonator substrates can be adjusted.

In the above embodiment, both the band-pass filter section and the band-stop filter section use four resonator substrates.
Although this is an example of a stage configuration, the present invention can be applied to a plurality of stages. Usually, this dielectric duplexer is covered with a metal case. Alternatively, other shielding means such as attaching a metal plate having an L-shaped cross section near the open surface may be used instead. In any case, the metal plate or conductive film provided on the open side exhibits a shielding effect, and when mounted on a circuit board, the entire outer wall is almost surrounded by a conductor (electrode, metal plate, etc.). Unnecessary coupling due to radio wave jump between outputs is prevented, and the attenuation characteristics are improved.

[0034]

As described above, the present invention comprises a quarter-wave resonance strip line having electrodes formed inside a dielectric substrate, and an island-shaped electrode formed on the outer periphery to form a polarized or coupled electrode. Since a resonator substrate in which a capacitor is integrally formed is used, a wiring board and a capacitor, which are conventionally required, are not required, and the number of components and the number of mounting steps are reduced. As a result, the dielectric duplexer can be further miniaturized, and the area occupied by mounting can be reduced, which is advantageous for miniaturization of equipment. Further, by using a common resonator substrate and a common component between the shielding substrate and the outer substrate, the number of components can be reduced.

[Brief description of the drawings]

FIG. 1 is a perspective view showing one embodiment of a dielectric duplexer according to the present invention.

FIG. 2 is a partially assembled perspective view thereof.

FIG. 3 is a perspective view showing another embodiment of the dielectric duplexer according to the present invention.

FIG. 4 is an explanatory diagram of a resonator substrate used in the resonator substrate.

FIG. 5 is an explanatory view of a coupling adjustment substrate.

FIG. 6 is an explanatory view of a shield substrate.

[Explanation of symbols]

 REFERENCE SIGNS LIST 10 band pass filter section 20 band rejection filter section 24 synthesis coil 30 a,..., 30 d resonator board 32 a,. 52a,..., 52c Shielding substrate 54a, 54b Outer substrate 56 Coil 63 Island electrode

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-60-54502 (JP, A) JP-A-6-169202 (JP, A) JP-A-6-169201 (JP, A) JP-A-6-169201 77705 (JP, A) (58) Fields investigated (Int. Cl. ⁶ , DB name) H01P 1/213 H01P 1/203 H01P 1/205 H01P 7/08

Claims (6)

(57) [Claims] 1. A plurality of resonator substrates each having a quarter-wavelength resonance strip line formed by forming electrodes on the inside and outer periphery of a dielectric substrate, and laminating them so as to sandwich a coupling adjustment substrate therebetween. A band-pass filter unit in which an outer substrate is arranged further outside the resonator substrate located on both sides in the thickness direction,
A band-stop filter section in which a plurality of resonator substrates similar to the above are stacked so as to sandwich a shielding substrate therebetween, and outer substrates are further disposed outside the resonator substrates located on both sides in the thickness direction. The coupling adjustment substrate has an electrode on the outer peripheral portion, the shield substrate has a built-in shield electrode extending in a plane substantially perpendicular to the thickness direction and has an electrode on the outer peripheral portion, and the outer substrate Has electrodes on the outer main surface and the outer periphery, forms independent island electrodes on the outer periphery of each resonator substrate, and connects the island electrodes with conductors in the bandpass filter to A feedback circuit is formed. In the band rejection filter section, each island-shaped electrode is connected by a coil, and the island-shaped electrodes of the resonator substrate located on both sides of both filter sections are connected to the reception or transmission coupling electrode and the antenna coupling electrode. And the coupling current for both antennas Synthesized laminated dielectric duplexer connected between a synthetic coil. 2. The band-pass filter section and the band-stop filter section are continuously metallized on the outer surface, and the band-pass filter section has an outer island electrode as a receiving coupling electrode and a center island electrode as an antenna. 2. The duplexer according to claim 1, wherein the band-rejection filter portion is a transmission coupling electrode on the outer island electrode, and the antenna coupling electrode is a central island electrode on the center. 3. The resonator substrate has an internal electrode formed in a longitudinal direction inside the center of the dielectric substrate, and independent island-shaped electrodes and external electrodes formed on an outer peripheral portion excluding one end surface.
3. The duplexer according to claim 1, wherein the duplexer comprises a wavelength resonance strip line. 4. A resonator substrate is formed by combining an external dielectric having a cutout in a part thereof and having a substantially U-shape as a whole, and an internal dielectric inserted into the cut of the external dielectric. The duplexer according to claim 1 or 2, wherein the duplexer has a three-dimensional structure formed by folding a quarter-wave resonance strip line. 5. An external dielectric having a cutout provided in a part thereof to be substantially U-shaped and having one leg portion longer than the other, and an internal portion fitted into the cutout of the external dielectric. A structure in which a dielectric is combined, wherein the outer dielectric has an electrode on an outer peripheral portion except for an end surface of a long leg portion, and the inner dielectric has two long and short dielectric pieces aligned at one end and excluding the vicinity thereof. Forming an island-shaped electrode that is independently exposed near the bonding surface of the longer dielectric piece while being joined via the electrode,
The island-shaped electrode and the long dielectric piece have a structure in which an electrode is formed on an outer peripheral portion excluding a protruding end face, and the inner dielectric has an electrode-free end face located near a long leg end face of the outer dielectric, and 2. A structure in which an outer peripheral electrode of an inner dielectric is fitted and fixed in a notch of an outer dielectric in a direction in contact with a cut surface of an outer dielectric, and is formed in a three-dimensional manner so that a quarter-wavelength resonance strip line is folded. 2. The duplexer according to 2. 6. The duplexer according to claim 1, wherein the shield substrate has a structure in which a shield electrode is formed at an interface where two dielectrics are stacked.