JP2003258585A - Stacked type electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a stacked type electronic component capable of contributing to downsizing of a high frequency (microwave) communication apparatus and enhancing the eliminating capability of noise at a frequency band other than the operating frequency band. <P>SOLUTION: A lamination body comprising a stacked insulation layer and a stacked conductor pattern incorporates a filter and a balun. The filter and the balun are formed aside with each other so as not to be overlapped in the stacked body, and connected between an unbalancing terminal and a couple of balancing terminals. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated electronic component mounted on a mobile communication terminal or a high frequency (microwave) communication device such as a W-LAN.

[0002]

2. Description of the Related Art As shown in FIG. 18, a receiving circuit 183 and a transmitting circuit 184 are connected to a mobile communication terminal via a switching element 182 connected to an antenna 181, and a reception signal from the antenna 181 is received by the receiving circuit. There is a switching element 183 that alternately switches the switching element 182 at high speed so as to transmit the transmission signals from the transmission circuit 184 to the antenna 181. Reception circuit 1 of this mobile communication terminal
In 83, a filter 187 is inserted between the high frequency amplifier 185 and the frequency mixer 186. In recent years, mobile communication terminals of this type have been configured with some ICs, passive components of their peripheral circuits, and filters. In addition, this IC has a low drive voltage for use in a mobile communication terminal, which is being reduced in power consumption. In such a situation, in this type of mobile communication terminal, a balanced input / output type IC is being used in a frequency mixer for the purpose of improving the S / N ratio accompanying the lowering of the driving voltage.

[0003]

However, many switching elements 182 and high-frequency amplifiers 185 are still of unbalanced type. Therefore, the filter 187 of the receiving circuit 183 uses a discrete component as a circuit element forming a filter to form an unbalanced type on a printed circuit board of a mobile communication terminal, or integrates a circuit element forming a filter. The formed unbalanced type is generally mounted on a printed circuit board of a mobile communication terminal. The balanced input / output type IC used in the frequency mixer generally has an input impedance different from the output impedance of the filter, for example, 100Ω or 200Ω. Therefore, in this type of mobile communication terminal, the unbalanced signal output from the filter 187 is converted into a balanced signal, and the filter 187 and the frequency mixer 186 are used.
19, it is necessary to insert a balun 188 between the filter 187 and the frequency mixer 186 as shown in FIG. 19, so that the balun 188 can be mounted on the printed circuit board of the mobile communication terminal. Space and
A space for forming a wiring pattern for connecting the balun 188 and the filter 187 and a wiring pattern for connecting the balun 188 and the frequency mixer 186 is required, and the size becomes large.

Further, in this type of mobile communication terminal, the high frequency amplifier 185, the filter 187, the balun 188, and the frequency mixer 186 are sequentially connected through the wiring pattern of the printed circuit board of the mobile communication terminal, so the filter 187 is used.
And the balun 188 to match the impedance between the input and output impedance of the filter 187 and the balun 1
It is necessary to unify the input impedance of 88 to 50Ω. Therefore, the characteristics of the filter are limited by the input / output impedance, and the function as the filter may not be sufficiently exhibited.

It is an object of the present invention to provide a laminated electronic component that contributes to downsizing of high frequency (microwave) communication equipment and can improve noise removal ability outside the used frequency band.

[0006]

A multilayer electronic component of the present invention has a filter and a balun built in a laminate in which an insulating layer and a conductor pattern are laminated, and the filter and the balun are laterally arranged so as not to overlap each other. They are formed in a staggered manner and are connected between the unbalanced terminal and the pair of balanced terminals. The coil forming the filter and the coil forming the balun are arranged so as to be offset in the stacking direction. The filter and the balun may be formed by connecting the conductor pattern forming the filter and the conductor pattern forming the balun on the same insulator layer on this insulator layer, or by interposing an external electrode provided on the laminate. Are connected to each other, or they are connected to each other through a through hole provided in the insulator layer.

Further, the multilayer electronic component of the present invention includes a bandpass filter in which a first resonator and a second resonator are electromagnetically coupled to each other in a laminate in which an insulating layer and a conductor pattern are laminated, A first coil and a second coil are connected, a third coil whose one end is grounded is electromagnetically coupled to the first coil, and a fourth coil whose one end is grounded is electromagnetically coupled to the second coil. The band-pass filter and the balun are formed in the laminated body by displacing the band-pass filter and the balun laterally so that they do not overlap each other, and displacing the coil forming the filter and the coil forming the balun in the laminating direction. A pass filter and a balun are connected between the unbalanced terminal and the pair of balanced terminals. The bandpass filter and the balun are connected to each other by connecting the conductor pattern forming the capacitor connected to one end of the second resonator formed in the same insulator layer and the conductor pattern forming the first coil of the balun. It is performed by connecting on the insulating layer, connecting the bandpass filter and the balun through an external terminal, or connecting the bandpass filter and the balun through a through hole provided in the insulating layer. Further, in the multilayer electronic component of the present invention, the coil and the first capacitor are connected in parallel in the laminated body in which the insulating layer and the conductor pattern are laminated, and the second capacitor is connected between one end of the coil and the ground. , A low-pass filter in which a third capacitor is connected between the other end of the coil and the ground, and a third coil in which the first coil and the second coil are connected and one end of which is grounded are electromagnetically coupled. Electrically coupled to the second coil and one end of which is grounded
Built-in balun that electromagnetically couples the coil, and the low-pass filter and the balun are laterally shifted so that they do not overlap each other and are formed in the laminated body. The low-pass filter and the balun are the unbalanced terminal and a pair of balanced terminals. Connected in between. This low-pass filter and the balun are connected by connecting the conductor pattern forming the coil of the low-pass filter formed on the same insulator layer and the conductor pattern forming the first coil of the balun on the insulator layer, It is performed by connecting the low-pass filter and the balun through an external terminal, or by connecting the low-pass filter and the balun through a through hole provided in the insulating layer.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION In the laminated electronic component of the present invention, a filter and a balun are integrally formed in a laminated body in which an insulating layer and a conductor pattern are laminated. The filter and the balun have a filter formed on one side of the laminated body and a balun formed on the other side so that they are arranged side by side when the laminated body is seen through in the laminating direction of the insulating layers. The thus-formed filter and balun are connected between the unbalanced terminal and the pair of balanced terminals provided in the laminated body. In this case, the filter and the balun are connected to each other by connecting the conductor pattern forming the filter and the conductor pattern forming the balun formed on the same insulator layer on the insulator layer. Therefore, in the multilayer electronic component of the present invention, since the filter and the balun are integrally formed in the multilayer body as described above, mutual influences can be reduced and the input impedance of the IC (for example, 10
The output impedance of the filter can be set without being affected by the required output impedance of the balun according to 0Ω or 200Ω). In this laminated electronic component, the unbalanced terminals are connected to the unbalanced line, and the pair of balanced terminals are connected to the balanced line.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A laminated electronic component of the present invention will be described below with reference to FIGS. FIG. 1 is a circuit diagram showing a circuit example of a high frequency (microwave) communication device using the laminated electronic component of the present invention, FIG. 2 is a circuit diagram of the laminated electronic component of the present invention, and FIG. 3 is a laminated type of the present invention. It is a disassembled perspective view which shows the 1st Example of an electronic component. In the mobile communication terminal using the laminated electronic component of the present invention, the antenna is connected to the common end of the switching element 12, and the reception circuit 13 and the transmission circuit 14 are connected to the branch ends of the switching element 12, respectively. Then, the laminated electronic component 10 of the present invention is inserted between the output end of the high frequency amplifier 15 of the receiving circuit 13 and the input end of the balanced input / output type IC used in the frequency mixer 16.

This laminated electronic component 10 has
A filter connected to the unbalanced terminal and a balun connected between the filter and the pair of balanced terminals are formed.
The laminated electronic component 10 is mounted on a printed wiring board of a mobile communication terminal. And this laminated electronic component 1
The unbalanced terminal of 0 is connected to the unbalanced transmission line connected to the output terminal of the high frequency amplifier 15. Further, the pair of balancing terminals of the multilayer electronic component 10 are connected to the balanced transmission line connected to the input end of the IC used in the frequency mixer 16.

As shown in FIG. 2, for example, the filter and balun of the multilayer electronic component 10 includes a first resonator in which a coil L1 and a capacitor C1 are connected in parallel, and a second resonator in which a coil L2 and a capacitor C2 are connected in parallel. , A band-pass filter formed by electromagnetically coupling the resonators, a coil L3 and a coil L4 are connected, and one end of the coil L3 is grounded, and a coil L5 is electromagnetically coupled, and one end of the coil L4 is grounded. The coil L6 is electromagnetically coupled to form a so-called marchand type balun. This bandpass filter is an electromagnetically coupled two resonators, the connection point of the coil L1 and the capacitor C1 is connected to the unbalance terminal 21 via the capacitor C4,
The connection point between the coil L2 and the capacitor C2 is the capacitor C5.
Is connected to the balun coil L3 via. In this balun, the coil L5 is connected to the balancing terminal 22,
6 is connected to the balancing terminal 23. The capacitor C3 of the bandpass filter is a capacitance generated by capacitively coupling two resonators, and the other end of the balun coil L4 is in an electrically floating state.

Such a filter and balun are formed in these laminated bodies by laminating an insulating layer and a conductor pattern as shown in FIG. Insulator layers 31A to 31L
Is formed using a material having an insulating property such as a magnetic substance, a non-magnetic substance, or a dielectric substance. A ground conductor pattern 32A is formed on the surface of the insulator layer 31A. The ground conductor pattern 32A is drawn out to the four end faces of the insulator layer 31A. A coil conductor pattern 33A and a coil conductor pattern 33B are formed on the surfaces of the insulating layers 31B, 31C, 31D, 31E, respectively. The coil conductor pattern 33A and the coil conductor pattern 33B are formed side by side in the width direction of the insulator layer on one half surface (left half surface in FIG. 3) of the insulator layer. Then, the insulator layers 31B to 31
The coil conductor pattern 33A of E is spirally connected through the through hole to form the coil L1.
The coil conductor patterns 33B of 1B to 31E are spirally connected via the through holes to form the coil L2. The coil L1 and the coil L2 are connected to each other by connecting the coil conductor pattern 33A and the coil conductor pattern 33B on the surface of the insulator layer 31B, and the coil conductor pattern 33A and the coil conductor pattern 33B.
The connection point of is drawn out to the end surface of the insulator layer 31B. Also,
Coil conductor pattern 33 of insulator layers 31B to 31E
Due to the capacitance formed between A and the capacitance formed between the coil conductor pattern 33A of the insulator layer 31B and the ground conductor pattern 32A, the capacitor C is connected in parallel with the coil L1.
1 is formed. Further, the coil L is formed by the capacitance formed between the coil conductor patterns 33B of the insulator layers 31B to 31E and the capacitance formed between the coil conductor pattern 33B of the insulator layer 31B and the ground conductor pattern 32A.
A capacitor C2 is formed in parallel with 2. Insulator layer 31
The conductor pattern 32B for grounding is formed on the surface of F. The ground conductor pattern 32B is used for the insulator layer 31.
It is drawn to the three end faces of F. A coil conductor pattern 34 and a coil conductor pattern 35 are formed on the surface of the insulator layer 31G. The coil conductor pattern 34 and the coil conductor pattern 35 are formed on one half surface (right half surface in FIG. 3) of the insulator layer and are connected to each other. Insulator layer 31
On the surface of H, conductor patterns 34, 35 for coils and conductor patterns 38A, 39A for capacitors are formed. The coil conductor pattern 34 and the coil conductor pattern 35 are formed side by side in the width direction of the insulator layer on one half surface (right half surface in FIG. 3) of the insulator layer 31H. In addition, the conductor pattern for capacitance 38A and the conductor pattern for capacitance 39A are formed on the insulator layer 31.
The remaining half surface of H (left half surface in FIG. 3) is formed side by side in the width direction of the insulating layer. This capacitance conductor pattern 38A
Is connected to the coil conductor pattern 33A through the through holes of the insulating layers 31F to 31H. The capacitor conductor pattern 39A is connected to the coil conductor pattern 33B through the through holes of the insulator layers 31F to 31H. The capacitor L1 and the capacitor L1 formed between the capacitor conductor pattern 38A and the capacitor conductor pattern 39A.
A capacitor C3 is formed by the capacitance between the coil and the coil L2. Coil conductor patterns 34 and 35 and capacitor conductor patterns 38B and 39B are formed on the surface of the insulator layer 31I. The coil conductor pattern 34 and the coil conductor pattern 35 are formed side by side in the width direction of the insulator layer on one half surface (right half surface in FIG. 3) of the insulator layer 31H. In addition, the capacitance conductor pattern 38B and the capacitance conductor pattern 3
In 9B, the capacitance conductor pattern 38B faces the capacitance conductor pattern 38A and the capacitance conductor pattern 39B faces the capacitance conductor pattern 39A on the remaining half surface (the left half surface in FIG. 3) of the insulator layer 31I. Is formed. Then, the coil conductor patterns 34 of the insulator layers 31G to 31I are spirally connected to each other through the through holes to form the coil L.
3 are formed, and the coil conductor patterns 35 of the insulator layers 31G to 31I are spirally connected to each other through the through holes to form the coil L4. This coil L3 and coil L
4 are connected to each other by connecting the coil conductor 34 and the coil conductor 35 of the insulator layer 31G. The coil L3 corresponds to the coil conductor pattern 3 of the insulator layer 31I.
By connecting 4 and the conductor pattern 39B for capacitance,
Capacitance conductor pattern 39A and capacity conductor pattern 39B
The coil L via the capacitor C5 formed by the capacitance between
Connected to 2. Further, the coil L4 has an insulator layer 31I.
The one end of the coil conductor pattern 35 is extended to a position apart from the end surface of the insulator layer 31I without being connected to any other end, whereby one end is in an electrically floating state. Further, the capacitor C4 is formed by the capacitance formed between the capacitance conductor pattern 38A and the capacitance conductor pattern 38B.
Is formed. A coil conductor pattern 36 and a coil conductor pattern 37 are formed on the surface of the insulator layer 31J. The coil conductor pattern 36 and the coil conductor pattern 37 are formed on one half surface (right half surface in FIG. 3) of the insulator layer 31J.
Further, the coil conductor pattern 36 is formed so as to face the coil conductor pattern 34, and the coil conductor pattern 37 is formed so as to face the coil conductor pattern 35. The coil conductor pattern 36 and the coil conductor pattern 37 are connected to each other, and the connection point is extended to the end surface of the insulator layer 31J. A coil conductor pattern 36 and a coil conductor pattern 37 are formed on the surface of the insulator layer 31K. Coil conductor pattern 36 and coil conductor pattern 37
Is on one half surface (right half surface in FIG. 3) of the insulator layer 31K,
It is formed side by side in the width direction of the insulating layer. One end of the coil conductor pattern 36 and one end of the coil conductor pattern 37 are drawn out to the end faces of the insulator layer 31K that face each other. The coil conductor pattern 36 and the coil conductor pattern 37 are covered with the insulator layer 31L. Then, the coil conductor pattern 3 of the insulator layers 31J and 31K
6 in a spiral shape through a through hole to form a coil L5.
Are formed, and the coil conductor patterns 37 of the insulator layers 31J and 31K are spirally connected to each other through the through holes to form the coil L6. As shown in FIG. 4, an unbalanced terminal 21 and a balanced terminal 2 are attached to the laminated body thus laminated.
2, 23, four ground terminals G and dummy terminals NC are formed. Then, the capacitance conductor pattern 38B is connected to the unbalanced terminal 21 and the ground conductor patterns 32A and 32B.
Is the ground terminal G, the common connection end of the coil conductor pattern 36 and the coil conductor pattern 37 of the insulator layer 31J is the ground terminal G, and the coil conductor pattern 36 of the insulator layer 31K is the balancing terminal 22. , The coil conductor patterns 37 of the insulator layer 31K are connected to the balancing terminals 23, respectively.

As shown in FIG. 5, the laminated electronic component thus formed has a bandpass filter and a balun arranged side by side when the laminated body is seen through from the laminating direction of the insulating layers.
A bandpass filter is formed on one side (left half in FIG. 5) and a balun is formed on the other side (right half in FIG. 5) with respect to the center line. In addition, coils L1 and L2 forming a bandpass filter and coils L3 and L forming a balun.
4, L5 and L6 are formed so that the distance W between them is 200 μm or more. In such a multilayer electronic component, when the line width of the coil conductor pattern of the bandpass filter is 100 μm and the line width of the balun coil conductor pattern is 75 μm, it passes as shown in FIG. 6 and FIG. Band 2.11 ~ 2.17G
It is possible to obtain a characteristic that an attenuation pole is formed near 1.7 GHz at Hz, and when this laminated electronic component is used, W-
It is possible to pass a signal in the CDMA band and attenuate the DCS1800 MHz band. The size of the laminated electronic component at this time was 3.2 mm × 1.6 mm in height and width and 1 mm in height. In FIG. 6, the horizontal axis represents the frequency and the vertical axis represents the amount of attenuation. A represents the transmission characteristic and B represents the reflection characteristic.

FIG. 8 is an exploded perspective view showing a second embodiment of the laminated electronic component of the present invention. A ground conductor pattern 82A is formed on the surface of the insulator layer 81A. Coil L connected in series by forming coil conductor patterns 83 and 84 on one half surface (right half surface) of the surfaces of the insulator layers 81B and 81C and connecting the coil conductor patterns to each other in series.
3 and the coil L4 are formed. Insulator layers 81D, 81E
Coil conductor pattern 8 on one half (right half) of the surface of
5, 86 are formed, and the coil conductor patterns are connected to form the coil L5 and the coil L6. A conductor pattern for grounding is formed on the surface of the insulator layer 81F. Coil conductor patterns 87A and 87B are formed on one half surface (left half surface) of the surfaces of the insulating layers 81G to 81J,
Connect the coil conductor patterns to the coil L1.
And the coil L2 is formed. The conductor pattern 88A for capacitance and the conductor pattern 89A for capacitance are formed on one half surface (left half surface) of the surface of the insulator layer 81K.
8A is connected to the coil conductor pattern 87A, and the capacitor conductor pattern 89A is connected to the coil conductor pattern 87B. One half surface (left half surface) of the surface of the insulator layer 81L
And a conductor pattern 88B for capacitance and a conductor pattern 89 for capacitance
B is formed, and a capacitor C4 is formed between the capacitance conductor pattern 88A and the capacitance conductor pattern 88B, and a capacitor C5 is formed between the capacitance conductor pattern 89A and the capacitance conductor pattern 89B. Further, the capacitor conductor pattern 89B is connected to the coil conductor pattern 83 of the insulator layer 81C via the external electrode provided on the side surface of the laminate. In such a multilayer electronic component, when the line width of the coil conductor pattern of the bandpass filter is 100 μm and the line width of the balun coil conductor pattern is 75 μm, the pass band is 2.11 as shown in 2 of FIG. ~ 2.17GHz, 1.7GH
It is possible to obtain a characteristic that an attenuation pole is formed in the vicinity of z, and when this laminated electronic component is used, it is possible to pass a signal in the W-CDMA band and attenuate the DCS1800 MHz band. The size of the laminated electronic component at this time was 3.2 mm × 1.6 mm in height and width and 1 mm in height.

FIG. 9 is an exploded perspective view showing a third embodiment of the laminated electronic component of the present invention. A ground conductor pattern 92A is formed on the surface of the insulator layer 91A. Two ground conductor patterns 92A are respectively drawn out to opposite end surfaces of the insulator layer 91A. Insulator layer 91B
A coil conductor pattern 83C is formed on one surface (left half surface) of the surface of the. The coil conductor pattern 93 is formed on one half surface (left half surface) of the surfaces of the insulator layers 91C to 91G.
A and 93B are formed and the respective coil conductor patterns are connected to form a coil L1 and a coil L2. In addition, a conductor pattern 92B for ground is formed on the remaining half surface (right half surface) of the surface of the insulator layer 91F. Coil L connected in series by forming coil conductor patterns 94 and 95 on one half surface (right half surface) of the surfaces of the insulator layers 91H to 91J and connecting the coil conductor patterns to each other in series.
3 and the coil L4 are formed. Further, the conductor pattern for capacitance 98 is formed on the remaining half surface (left half surface) of the surface of the insulator layer 91I.
A and a capacitance conductor pattern 99A are formed, and the capacitance conductor pattern 98A is connected to the coil conductor pattern 83A, and the capacitance conductor pattern 99A is connected to the coil conductor pattern 83B. Furthermore, a capacitance conductor pattern 98B and a capacitance conductor pattern 99B are formed on the remaining half surface (left half surface) of the insulator layer 91J, and the capacitance conductor pattern 99B is connected to the coil conductor pattern 94. The capacitance conductor pattern 98A and the capacitance conductor pattern 98
A capacitor C4 is formed between B and a capacitor C5 is formed between the capacitance conductor pattern 99A and the capacitance conductor pattern 99B. Coil conductor patterns 95 and 96 are formed on one half surface (right half surface) of the surfaces of the insulator layers 91K and 91L, and the coil conductor patterns are connected to form a coil L5 and a coil L6. In the laminated body thus laminated, four external terminals are formed on opposite side surfaces as shown in FIG. In such multilayer electronic components, the line width of the conductor pattern for the coil of the bandpass filter is 100μ.
When the line width of the conductor pattern for coil of m and balun is 75 μm, the pass band is 2.4 to 2.5 GH as shown in 3 of FIG.
With z, it is possible to obtain the characteristic that an attenuation pole is formed near 1.89 GHz. When this laminated electronic component is used, Blu
It is possible to pass signals in the Ethooth band and attenuate the W-CDMA band. The size of the laminated electronic component at this time was 3.2 mm × 1.6 mm in height and width and 1 mm in height.

FIG. 11 shows a fourth example of the multilayer electronic component of the present invention.
FIG. 3 is an exploded perspective view showing the embodiment of FIG. A conductor pattern 112A for grounding is formed on the surface of the insulator layer 111A. The conductor pattern 112A for ground is the insulator layer 111.
One is drawn out to each of the opposite end faces of A. By the coil conductor pattern 113C formed on one half surface (left half surface) of the surface of the insulator layer 111B and the coil conductor patterns 113A and 113B formed on one half surface (left half surface) of the surfaces of the insulator layers 111C to 111G, The coil L1 and the coil L2 are formed. In addition, the insulator layer 111
On the remaining half surface (right half surface) of the surface of F, the grounding conductor pattern 112B is formed. Insulator layers 111H to 11H
The coil L3 and the coil L4 connected in series are formed by the coil conductor patterns 114 and 115 formed on one half surface (right half surface) of the surface of 1J. In addition, the conductor patterns for capacitance 118A and 119A formed on the remaining half surface of the insulator layer 111I and the conductor pattern for capacitance 118B formed on the remaining half surface of the insulator layer 111J,
119B forms capacitors C4 and C5. Coil L5 and coil L6 are formed by the coil conductor patterns 116 and 117 formed on one half surfaces of the surfaces of the insulator layers 111K and 111L. In the laminated body thus laminated, three external terminals are formed on opposite side surfaces as shown in FIG. In such a multilayer electronic component, when the line width of the coil conductor pattern of the bandpass filter is 100 μm and the line width of the balun coil conductor pattern is 75 μm, the pass band is 4 as shown in FIG.
It is possible to obtain the characteristic that the attenuation pole is formed in the vicinity of 1.92 GHz at 2.4 to 2.5 GHz. When this laminated electronic component is used, the signal in the Bluetooth band is passed, and the W-C
The DMA band can be attenuated. The size of the laminated electronic component at this time was 3.2 mm × 1.6 mm in height and width and 1 mm in height.

Further, as shown in FIG. 13, the filter and the balun of the multilayer electronic component 10 include a coil L7 and a capacitor C.
6 are connected in parallel, a capacitor C7 is connected between one end of the coil L7 and the ground, and a low-pass filter in which a capacitor C8 is connected between the other end of the coil L7 and the ground, and a coil L8 and a coil L9 are connected to the coil L8. It may be configured by a so-called marchand type balun formed by electromagnetically coupling the coil L10 whose one end is grounded and electromagnetically coupling the coil L11 whose one end is grounded to the coil L9.

Such a filter and balun are formed in these laminated bodies by laminating an insulating layer and a conductor pattern as shown in FIG. Insulator layers 141A to 14A
1J is formed using an insulating material such as a magnetic substance, a non-magnetic substance, or a dielectric substance. The conductor pattern 142A for grounding is formed on the surface of the insulator layer 141A. Capacitor conductor patterns 143 and 144 are formed on one half surface (left half surface in FIG. 14) of the surface of the insulator layer 141B.
A capacitor C7 is formed between the ground conductor pattern 142A and the capacitance conductor pattern 143. Further, the ground conductor pattern 142A and the capacitor conductor pattern 144
A capacitor C8 is formed between them. On one half surface (left half surface) of the surface of the insulator layer 141C, the capacitive conductor pattern 1 is formed.
45 is formed. The capacitor C is formed by the capacitance conductor pattern 145 and the capacitance conductor patterns 143 and 144.
6 is formed. The conductor pattern 142B for ground is formed on the surface of the insulator layer 141D. Insulator layer 141
A coil conductor pattern 146 formed on one half surface (left half surface) of the surface of E and a coil conductor pattern 146 formed on one half surface (left half surface) of the surface of the insulator layer 141G are spirally connected to form a coil. L7 is formed. Insulator layer 1
Coil conductor patterns 147 and 148 formed on the remaining half surface (right half surface) of the surface of 41E, coil conductor patterns 147 and 148 formed on one side half surface (right half surface) of the insulator layer 141F, and insulator Coil conductor pattern 1 formed on the remaining half surface (right half surface) of the surface of the layer 141G
47 and 148 form a coil L8 and a coil L9 connected in series. The coil L8 and the coil L7 forming a low-pass filter are the coil conductor pattern 146 and the coil conductor pattern 147 of the insulator layer 141G.
Are connected to each other. Insulator layer 1
The coil L10 and the coil L11 are formed by the coil conductor patterns 149 and 150 formed on the remaining half surface (right half surface) of the surfaces of 41H and 141I. In the laminated body thus laminated, four external terminals are formed on opposite side surfaces as shown in FIG. As shown in FIG. 16, the multilayer electronic component formed in this manner has one side with respect to the center line such that the low-pass filter and the balun are laterally aligned when the multilayer body is seen through from the stacking direction of the insulating layers. A low pass filter is formed on the side (left half in FIG. 16) and a balun is formed on the other side (right half in FIG. 16). Further, the coil L7 forming the low-pass filter and the coils L8, L9, L10, L11 forming the balun have an interval W of 300 μm.
It is formed to have the above. Such a multilayer electronic component can reduce the line width of the coil conductor pattern of the low-pass filter.
100μm, the line width of the conductor pattern for the balun coil is 75μ
When m is set, the pass band is 2.4 to 2.5 as shown in FIG.
At GHz, it is possible to obtain a characteristic that an attenuation pole is formed near 5 GHz. When this laminated electronic component is used, Bl
It is possible to pass a signal in the Bluetooth band and attenuate the second harmonic component. At this time, the size of the multilayer electronic component is 3.2mm x 1.6mm in height and width, and 1mm in height.
Became. In FIG. 17, the horizontal axis represents frequency and the vertical axis represents the amount of attenuation. A represents the transmission characteristic and B represents the reflection characteristic.

Although the embodiments of the laminated electronic component of the present invention have been described above, the present invention is not limited to these embodiments. For example, although the balun is described as a marchand type in the embodiment, it may be a pure transmission type or a trifilar type. Further, in the bandpass filter and the balun, the coil conductor pattern forming the coil L3 and the capacitance conductor pattern forming the capacitor C5 may be connected via a through hole in the insulator layer. Furthermore, the capacitor C
Although the two capacitor conductor patterns forming part 3 are formed side by side in the embodiment, they may be formed so as to face each other with the insulator layer interposed therebetween. Furthermore, the bandpass filter can have various circuit configurations. The low-pass filter and the balun connect the coil conductor pattern forming the coil L7 and the coil conductor pattern forming the coil L8 via an external terminal or via a through hole in the insulating layer. May be connected to each other. Further, the low pass filter can have various circuit configurations. Further, in the embodiment, the case of inserting between the output terminal of the high frequency amplifier of the receiving circuit and the input terminal of the balanced input / output type IC of the frequency mixer has been described, but the input of the balanced input / output type IC of the frequency mixer is described. It can also be inserted between the end and the output end of the VCO. Furthermore, in the embodiment, the case of the mobile communication terminal has been described, but it is sufficient if the mobile communication terminal is inserted between the unbalanced line and the balanced line.
-Also applicable to LAN.

[0020]

As described above, the laminated electronic component of the present invention has the following features: a laminated body in which an insulating layer and a conductor pattern are laminated;
Built-in filter and balun, the filter and balun are formed laterally so as not to overlap each other, and are connected between the unbalanced terminal and a pair of balanced terminals, so that they are It is possible to achieve removal of noise outside the used frequency band and conversion of balanced signals and unbalanced signals with one chip component without wiring. Further, the output impedance of the filter can be set so that the characteristics of the filter are optimized without being affected by the required output impedance of the balun. Therefore, the multilayer electronic component of the present invention can contribute to downsizing of high-frequency (microwave) communication equipment, and can improve noise removal capability outside the used frequency band as compared with the related art.

[Brief description of drawings]

FIG. 1 is a circuit diagram showing a circuit example of a high frequency (microwave) communication device using a laminated electronic component of the present invention.

FIG. 2 is a circuit diagram of the multilayer electronic component of the present invention.

FIG. 3 is an exploded perspective view showing a first embodiment of the multilayer electronic component of the present invention.

FIG. 4 is a perspective view of a first embodiment of a multilayer electronic component of the present invention.

FIG. 5 is a top view of the multilayer electronic component of the present invention.

FIG. 6 is a graph showing characteristics of the first example of the multilayer electronic component of the present invention.

FIG. 7 is a table showing characteristics of the multilayer electronic component of the present invention.

FIG. 8 is an exploded perspective view showing a second embodiment of the multilayer electronic component of the present invention.

FIG. 9 is an exploded perspective view showing a third embodiment of the multilayer electronic component of the present invention.

FIG. 10 is a perspective view of a third embodiment of the multilayer electronic component of the present invention.

FIG. 11 is an exploded perspective view showing a fourth embodiment of the multilayer electronic component of the present invention.

FIG. 12 is a perspective view of a fourth embodiment of the multilayer electronic component of the present invention.

FIG. 13 is another circuit diagram of the multilayer electronic component of the present invention.

FIG. 14 is an exploded perspective view of a fifth embodiment of the multilayer electronic component of the present invention.

FIG. 15 is a perspective view of a fifth embodiment of the multilayer electronic component of the present invention.

FIG. 16 is a top view of the multilayer electronic component of the present invention.

FIG. 17 is a graph showing the characteristics of the fifth example of the multilayer electronic component of the present invention.

FIG. 18 is a circuit diagram of a high frequency (microwave) communication device.

FIG. 19 is a circuit diagram of another high frequency (microwave) communication device.

[Explanation of symbols]

11 antenna 12 switching elements 13 Receiver circuit 14 Transmitter circuit

Claims (11)

[Claims] 1. A filter and a balun are built in a laminated body in which an insulating layer and a conductor pattern are laminated, and the filter and the balun are formed laterally offset so as not to overlap with each other, and an unbalanced terminal and A laminated electronic component characterized by being connected between a pair of balancing terminals. 2. The multilayer electronic component according to claim 1, wherein the coil forming the filter and the coil forming the balun are arranged so as to be offset from each other in the stacking direction. 3. The filter and the balun are connected to each other by connecting a conductor pattern forming a filter and a conductor pattern forming a balun formed on the same insulator layer on the insulator layer. The multilayer electronic component according to claim 1 or 2. 4. The filter and the balun are connected to each other through an external electrode provided in the laminated body or a through hole provided in an insulating layer.
The laminated electronic component according to. 5. The filter is a bandpass filter,
The multilayer electronic component according to any one of claims 1 to 4, which is a low-pass filter. 6. A bandpass filter in which a first resonator and a second resonator are electromagnetically coupled, a first coil and a second coil are provided in a laminate in which an insulator layer and a conductor pattern are laminated. A third balun connected to the first coil, one end of which is grounded, is electromagnetically coupled, and a second coil is electromagnetically coupled to a fourth coil whose one end is grounded. The bandpass filter and the balun are laterally displaced so that they do not overlap with each other, and the coil forming the filter and the coil forming the balun are displaced in the laminating direction to be formed in the laminated body, and the same insulator layer is formed. The bandpass filter is formed by connecting a conductor pattern forming a capacitor connected to one end of the formed second resonator and a conductor pattern forming a first coil of the balun on the insulator layer. And the ba A laminated electronic component in which a run is connected between an unbalanced terminal and a pair of balanced terminals. 7. A bandpass filter in which a first resonator and a second resonator are electromagnetically coupled, a first coil and a second coil are provided in a laminate in which an insulator layer and a conductor pattern are laminated. A third balun connected to the first coil, one end of which is grounded, is electromagnetically coupled, and a second coil is electromagnetically coupled to a fourth coil whose one end is grounded. The bandpass filter and the balun are laterally displaced so as not to overlap each other, and the coil forming the filter and the coil forming the balun are formed in the laminated body by being displaced in the laminating direction. A multilayer electronic component, wherein the bandpass filter and the balun are connected between an unbalanced terminal and a pair of balanced terminals by connecting a balun through an external terminal. 8. A bandpass filter in which a first resonator and a second resonator are electromagnetically coupled, a first coil and a second coil are provided in a laminated body in which an insulating layer and a conductor pattern are laminated. A third balun connected to the first coil, one end of which is grounded, is electromagnetically coupled, and a second coil is electromagnetically coupled to a fourth coil whose one end is grounded. The bandpass filter and the balun are laterally displaced so as not to overlap each other, and the coil forming the filter and the coil forming the balun are formed in the laminated body by being displaced in the laminating direction. A laminated type characterized in that the bandpass filter and the balun are connected between an unbalanced terminal and a pair of balanced terminals by connecting a balun through a through hole provided in the insulator layer. Electronic components. 9. A coil and a first capacitor are connected in parallel in a laminated body in which an insulating layer and a conductor pattern are laminated,
A second capacitor is connected between one end of the coil and the ground, and a low-pass filter in which a third capacitor is connected between the other end of the coil and the ground, the first coil and the second coil are connected, A third coil whose one end is grounded to the first coil
Built-in balun that electromagnetically couples the coil of No. 4 and electromagnetically couples the fourth coil of which one end is grounded to the second coil. The low-pass filter and the balun are laterally displaced so as not to overlap each other. By connecting the conductor pattern forming the coil of the low-pass filter formed in the same insulator layer and the conductor pattern forming the first coil of the balun on the insulator layer, A laminated electronic component, wherein the low-pass filter and the balun are connected between an unbalanced terminal and a pair of balanced terminals. 10. A coil and a first capacitor are connected in parallel in a laminate in which an insulating layer and a conductor pattern are laminated, and a second capacitor is connected between one end of the coil and ground, A low-pass filter having a third capacitor connected between the end and the ground, the first coil and the second
Built-in balun in which the third coil is electromagnetically coupled to the first coil, and the third coil is electromagnetically coupled to the first coil, and the fourth coil is electromagnetically coupled to the second coil. However, the low-pass filter and the balun are formed in a laminated body by laterally shifting so as not to overlap with each other, and by connecting the low-pass filter and the balun through an external terminal, the low-pass filter and the balun are connected to each other. A laminated electronic component characterized by being connected between a balancing terminal and a pair of balancing terminals. 11. A coil and a first capacitor are connected in parallel in a laminated body in which an insulating layer and a conductor pattern are laminated, and a second capacitor is connected between one end of the coil and ground, and another coil A low-pass filter having a third capacitor connected between the end and the ground, the first coil and the second
Built-in balun in which the third coil is electromagnetically coupled to the first coil, and the third coil is electromagnetically coupled to the first coil, and the fourth coil is electromagnetically coupled to the second coil. Then, the low-pass filter and the balun are formed laterally offset so as not to overlap each other in the laminated body, and by connecting the low-pass filter and the balun through a through hole provided in the insulator layer, A laminated electronic component, wherein a low-pass filter and the balun are connected between an unbalanced terminal and a pair of balanced terminals.