JP2003264171A5 - - Google Patents

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Publication number
JP2003264171A5
JP2003264171A5 JP2003039795A JP2003039795A JP2003264171A5 JP 2003264171 A5 JP2003264171 A5 JP 2003264171A5 JP 2003039795 A JP2003039795 A JP 2003039795A JP 2003039795 A JP2003039795 A JP 2003039795A JP 2003264171 A5 JP2003264171 A5 JP 2003264171A5
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JP
Japan
Prior art keywords
etching
mask
substrate
film
difficult
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Application number
JP2003039795A
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English (en)
Japanese (ja)
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JP4109135B2 (ja
JP2003264171A (ja
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Priority to JP2003039795A priority Critical patent/JP4109135B2/ja
Priority claimed from JP2003039795A external-priority patent/JP4109135B2/ja
Publication of JP2003264171A publication Critical patent/JP2003264171A/ja
Publication of JP2003264171A5 publication Critical patent/JP2003264171A5/ja
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Publication of JP4109135B2 publication Critical patent/JP4109135B2/ja
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Expired - Fee Related legal-status Critical Current

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JP2003039795A 2003-02-18 2003-02-18 難エッチング材のエッチング方法 Expired - Fee Related JP4109135B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003039795A JP4109135B2 (ja) 2003-02-18 2003-02-18 難エッチング材のエッチング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003039795A JP4109135B2 (ja) 2003-02-18 2003-02-18 難エッチング材のエッチング方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2002061328A Division JP3840123B2 (ja) 2002-03-07 2002-03-07 難エッチング材のエッチング方法

Publications (3)

Publication Number Publication Date
JP2003264171A JP2003264171A (ja) 2003-09-19
JP2003264171A5 true JP2003264171A5 (enrdf_load_html_response) 2005-08-25
JP4109135B2 JP4109135B2 (ja) 2008-07-02

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003039795A Expired - Fee Related JP4109135B2 (ja) 2003-02-18 2003-02-18 難エッチング材のエッチング方法

Country Status (1)

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JP (1) JP4109135B2 (enrdf_load_html_response)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7358192B2 (en) * 2004-04-08 2008-04-15 Applied Materials, Inc. Method and apparatus for in-situ film stack processing
JP4653426B2 (ja) 2004-06-25 2011-03-16 セイコーエプソン株式会社 半導体装置
JP4905969B2 (ja) * 2007-03-08 2012-03-28 株式会社アルバック 磁気デバイスの製造装置
JP2011091374A (ja) * 2009-09-11 2011-05-06 Samco Inc サファイア基板のエッチング方法
US11119405B2 (en) 2018-10-12 2021-09-14 Applied Materials, Inc. Techniques for forming angled structures

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