JP2003249525A - Manufacturing method for display panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To mount a semiconductor element by preventing conduction failure due to peeled off paste or film thermosetting bonding agent and generation of air bubbles, etc., even if the bonding agent is cured. <P>SOLUTION: Semiconductor elements GD and SD are mounted on one substrate L1 of a display panel L comprising a pair of substrates, via a first anisotropic conductive film 6A in between. Then a flexible wiring substrate F is mounted at a place where the peripheral part of one substrate L1 of the display panel L and neighborhood of the place on which the semiconductor elements GD and SD are mounted, via a second anisotropic conductive film 6B in between. At this time, the flexible wiring substrate F is mounted within 20 hours after mounting the semiconductor elements GD and SD. The glass transition temperature of the second anisotropic conductive film 6B is made lower than that of the first anisotropic conductive film 6A. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a liquid crystal panel (liqu
id crystal display panel) and PDP (plasma display)
panel) and other display panel manufacturing methods.

[0002]

2. Description of the Related Art In recent years, mounting of semiconductor elements has been increased in density.
Along with the progress of higher quality and thinner devices, the TAB method (Tape Automated Bonding method) is being changed to the flip chip method (Flip Chip Bonding method). In particular, since liquid crystal display devices are required to be thin and lightweight, a flip chip method capable of achieving high density, high quality, and thinness in mounting a liquid crystal driving LSI in a COG structure (Chip On Glass structure) (Flip Chip Bonding method) is used. The flip chip method is one of face-down methods and is a method of directly connecting a connection electrode on a semiconductor element to a wiring electrode of a substrate or a package. In the COG, an anisotropic conductive film (ACF) or the like is used. The protruding electrodes (bumps) are connected to the wiring electrodes of the glass substrate using a paste or film adhesive. This C
The OG (chip on glass) method is based on PDP (plasma display).
It is also used in the manufacturing method of display panels such as. As a paste or film adhesive,
There are thermoplastics, but in recent years, thermosetting ones have been widely used.

9 to 11 schematically show the connection of the semiconductor devices GD and SD by the COG method. The COG method in the liquid crystal display panel L is a method in which the semiconductor elements GD and SD are directly connected face down to the one substrate L1 of the pair of glass substrates. One of the connection methods is the protruding electrodes of the semiconductor elements GD and SD. (Bumps) 4a, 4b and wiring electrode terminals 11, 1 formed on one glass substrate L1
2 and the anisotropic conductive resin film (Anisotropic C
There is a method of connecting by thermocompression bonding via an onductive film (ACF) 6. FIG. 11 shows an apparatus used for mounting. The ACF 6 is obtained by dispersing conductive particles 6c in a resin adhesive film, and by heating and pressurizing, the protruding electrodes (bumps) 4a of the semiconductor elements GD, SD,
4b and the electrode terminals 11 and 12 on the one substrate L1 are sandwiched and brought into contact with the conductive particles 6c,
Electrical conduction is obtained, and the ACF 6 is cured to bond the semiconductor elements GD and SD to the one substrate L1. The mounting method is as shown in FIG.
1 is fixed on the fixed stage S2, and the ACF6 is mounted on the mounting area.
Is attached, the semiconductor elements GD, SD and the flexible wiring board F are aligned and heated and pressed by a heating tool S3 which moves up and down from above. Thus, in the modularization process, the semiconductor devices SD, G
The D is mounted via the ACF 6, and the flexible wiring board F is disposed on the outer peripheral edge of the one substrate L1 via the ACF 6 to manufacture a liquid crystal display device.

[0004]

By the way, conventionally, after the semiconductor elements SD and GD are mounted, the semiconductor elements SD and G are not mounted.
A drive state inspection of D (energization inspection) is performed, and then a mounting process of the flexible wiring board F is performed. As the inspection of the driving states of the semiconductor elements SD and GD, visual inspection may be performed before the inspection using the inspection device. Further, after mounting the semiconductor elements SD and GD, for example, when the manufacturing site (factory) includes holidays (Saturday and Sunday), the flexible wiring board F is mounted on holidays and the semiconductor elements SD are mounted. , The flexible wiring board F is mounted after conducting the energization inspection of GD, and in a standby state in which it takes 2 to 3 days between the mounting of the semiconductor elements GD and SD and the mounting of the flexible wiring board F. There is a chance

However, when a long time elapses after the mounting of the semiconductor elements GD and SD until the mounting of the flexible wiring board F, the COG connection portions of the semiconductor elements GD and SD (particularly both ends of the semiconductor elements GD and SD) have a conduction defect. Had a problem that occurs. That is, the ACF 6 on the semiconductor element GD, SD side cures and shrinks, and a shrinkage stress is applied to the semiconductor elements GD, SD (reference numeral f1 in FIG. 6A), and one substrate L1 warps according to the stress. However, when the flexible wiring board F is mounted after a long time has passed, the cured state of the ACF 6 or the like reaches a completely stable state. Therefore, the pressure bonding head S3 of the apparatus shown in FIG.
The pressing force due to acts as an unreasonable stress on the flexible wiring board F (a reaction force for returning the warp, and this stress is also a force (symbol f2) for making one board L1 into a flat plate state) (FIG. 6). (B)) The cured paste-like or film-like thermosetting adhesive may be peeled off to form a gap or bubbles (FIG. 7).
(A)). In addition, the conductive particles 6c of the ACF 6 are as shown in FIG.
The thermocompression bonding of the device causes a trace of the conductive particles 6c (hereinafter referred to as "indentation") due to the pressure on the wiring electrode terminals 11 and 12 and the bumps 4a and 4b, but this indentation occurs. The energization inspection is performed by counting the number of indentations, but if the indentations are lost, it causes a conduction failure. As a result, there is a problem in that a COG connection portion of the semiconductor elements GD and SD (particularly both ends of the semiconductor elements GD and SD) causes a conduction failure.

The flexible wiring board F can flexibly (flexibly) even if the flat plate state is lost due to the stress or the like, but the flexible wiring board F can be mounted in the flat plate state by thermocompression bonding. Is required as an ideal mounting for display panel manufacturing.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a semiconductor element by preventing a conductive failure due to peeling of the adhesive or generation of air bubbles even when the paste or film thermosetting adhesive is cured. An object of the present invention is to provide a method of manufacturing a display panel that enables mounting and that manufactures a display panel with high mounting accuracy.

[0008]

In order to solve the above problems, a method of manufacturing a display panel according to claim 1 of the present invention comprises:
After mounting a semiconductor element on one substrate of a display panel having a pair of substrates via a paste-shaped or film-shaped thermosetting adhesive, the semiconductor element is mounted on the peripheral portion of one substrate of the display panel. In a method of manufacturing a display panel, in which a flexible wiring board is mounted in the vicinity of a substrate through a paste or film thermosetting adhesive, the flexible wiring board is mounted within 20 hours after mounting the semiconductor element. And

According to the present invention, when the semiconductor element is mounted, the thermosetting adhesive cures and shrinks, and a shrinkage stress is applied to the semiconductor element, so that one substrate of the display panel warps. When the flexible wiring board is mounted within 20 hours after mounting, the cured state of the adhesive has not reached a completely stable state. Therefore, when the flexible wiring board is thermocompression-bonded, the adhesive of the semiconductor element already mounted is mounted. It is possible to obtain a highly reliable adhesive effect while maintaining the flat plate state of one substrate of the display panel without peeling off, generation of bubbles or loss of indentation.

According to a second aspect of the present invention, the method for manufacturing a display panel is based on the first aspect of the invention, and the flexible wiring board is higher than the glass transition temperature of the thermosetting adhesive when the semiconductor element is mounted. Is characterized in that the glass transition temperature of the thermosetting adhesive when mounting is lower.

According to the present invention, the glass transition temperature of the thermosetting adhesive when mounting the flexible wiring board is lower than the glass transition temperature of the thermosetting adhesive when mounting the semiconductor element. Therefore, the influence of heat when the flexible wiring board is thermocompression-bonded is hard to be transmitted to the adhesive of the semiconductor element already mounted (hard to exert a thermal influence), and a highly reliable adhesive effect is obtained.

A method of manufacturing a display panel according to a third aspect of the present invention is based on the invention of the first or second aspect, and after mounting the semiconductor element, while mounting the flexible wiring board, the semiconductor element is mounted. It is characterized in that the energization inspection process of is not involved.

In the conventional display panel process, after the semiconductor element is mounted, the semiconductor element is inspected for electricity, and then the flexible wiring board mounting step is carried out. Since it does not involve the energization inspection process, the flexible wiring board will inevitably be mounted quickly, and the paste-like or film-like thermosetting adhesive will be peeled off or bubbles will be generated when mounting the semiconductor element. The flexible wiring board can be thermocompression-bonded without causing a conduction failure.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described below with reference to the drawings.

(First Embodiment) In this embodiment, as shown in FIGS. 1 and 2, a driver element (semiconductor element) is directly mounted on one of a pair of substrates sandwiching a liquid crystal layer.
The present invention is applied to OG mounting, and a liquid crystal display panel L
The semiconductor elements GD and SD for driving the liquid crystal display panel L and the flexible wiring substrate F are mounted on the one substrate L1. In the liquid crystal display panel L, power and signals are supplied from the flexible wiring board F to the semiconductor elements GD and SD, and power and signals are supplied from the semiconductor elements GD and SD in the liquid crystal display panel L. The semiconductor elements GD and SD are
A source driver SD and a gate driver G, which are called driver ICs (Driver ICs), are respectively connected to the signal lines and the scanning lines vertically and horizontally arranged on the liquid crystal display panel L.
It is D.

A pair of upper and lower substrates L1 of the liquid crystal display panel L1,
Each of L2 is a strip shape, and a lower first substrate (one substrate, AM substrate) L1 and an upper second substrate L2 are arranged in parallel, and the first substrate L1 and the second substrate L2 are arranged. And the liquid crystal 3 is sealed between them. Reference numerals 7A and 7B are
It is a polarizing plate which is an optical member having a function of transmitting only specific polarized light with respect to incident light. In this embodiment, two polarizing plates are provided on the outermost surface and the outermost surface of the liquid crystal display panel L. The liquid crystal display device having such a structure is called a two-sheet polarizing plate system, but there is also a one-sheet polarizing plate system.

The first substrate L1 is formed larger than the second substrate L2. Therefore, when the two substrates L1 and L2 are superposed on each other, the semiconductor elements GD and SD partially projecting to the outer peripheral edge of the AM substrate L1. Mounting region L6 is formed. Electrodes 11 and 12 made of aluminum (Al) or the like are provided on the surface (upper surface) of the first substrate L1 on the semiconductor element side. Electrode 11 (left in FIG. 1) is an input electrode, and electrode 1
Reference numeral 2 (right in FIG. 1) is an output electrode.

In the mounting region L6, a wiring pattern P1 for semiconductor mounting is formed and a plurality of semiconductor elements G are formed.
D and SD are mounted by the mounting method of the present invention.
A wiring pattern P2 is formed on the liquid crystal display panel L side, and a wiring pattern P3 is formed on the back surface side of the flexible wiring board F.

The wiring pattern P1 is composed of semiconductor elements GD and S.
A wiring group (bus wiring) for supplying signals and power to D (driving driver), and an AM substrate (AM-LCD) L
In No. 1, pattern formation is possible at the same time in a film formation process of a switching element such as a thin film transistor (TFT) formed on one substrate L1. The wiring pattern P1 of the present embodiment is formed by forming a film of aluminum material by sputtering to a film thickness of 0.1 to 0.2 μm and then patterning by photolithography. A plurality of electrode protrusions (bumps) 4a, 4b made of gold (Au), silver (Ag) or the like are formed on the semiconductor elements GD, SD,
The electrode protrusions 4a and 4b are formed by an anisotropic conductive film (ACF) 6
It is electrically connected to the wiring pattern P1 through the conductive particles 6c of A.

The flexible wiring board F has a mounting area L6.
In the peripheral portion of one substrate (first substrate) L1 of the display panel in the vicinity of where the semiconductor elements GD and SD are mounted. That is, the flexible wiring board F is mounted on the outer peripheral edge portions of the two sides 1a and 1b of the quadrangular first board L1. This flexible wiring board F is made of a synthetic resin material such as polyimide, and one side of the mounting region L6 side is formed into a large number of concave and convex shapes, of which the convex portion Fa is the outer peripheral edge portion of the first substrate L1. It is mounted and arranged along the line. Specifically, as shown in FIG. 2, a flexible wiring board F having a large number of concavo-convex shapes on one side of the mounting region L6 is used, and a convex portion Fa of the flexible wiring board F is located near the positions of the semiconductor elements GD and SD. It is implemented in. The distance H from the side surfaces of the semiconductor elements GD and SD to the position of the flexible wiring board F is usually set in the range of 0.3 mm to 1 mm.

Next, a method of manufacturing the above display panel will be described. As shown in FIG. 3, the liquid crystal display panel L is transported by the movable stage S1 and the mounting area L6 of the liquid crystal display panel L is placed on the fixed stage S2. A pressure bonding head S3 is arranged on the fixed stage S2 so that it can be moved up and down. Fixed stage S2 and pressure bonding head S3
Has a built-in heater for heating the semiconductor element SD,
Used for thermocompression bonding of GD. The crimping head S3 also serves as a suction means for the semiconductor elements GD and SD.
The heating and pressurizing time, the heating temperature, and the pressure of the fixed stage S2 are controlled and controlled.

Then, one substrate L1 of the display panel L
Then, a paste or film thermosetting adhesive (first anisotropic conductive film (ACF)) 6 was prepared as follows.
Within a predetermined time after mounting the semiconductor elements GD, SD via A, the flexible wiring board F is coated with a paste or film thermosetting adhesive (second anisotropic conductive film (ACF)) 6B. To implement via. Here, when the semiconductor elements GD and SD are mounted, a paste-like or film-like thermosetting adhesive (first anisotropic conductive film (AC
F)) 6A is a paste-like or film-like thermosetting adhesive (first anisotropic conductive film (AC) having a glass transition temperature Tg for mounting the flexible wiring board F).
F)) It is preferable to use one having a glass transition temperature Tg higher than 6B. The effect of heat when the flexible wiring board F is thermocompression bonded is already mounted on the semiconductor element G.
This is because it is difficult to give a thermal influence to the thermosetting adhesive 6A of D and SD.

Anisotropic Conductive F which is a paste or film thermosetting adhesive.
ilm: ACF) 6A, 6B has conductive particles 6c dispersed in an insulating adhesive, has conductivity in the thickness direction (connection direction), and has insulation in the surface direction (lateral direction). , Conductive particles 6c and an adhesive. The connection is basically thermocompression bonding, the conductive particles 6c are responsible for the function of electrical connection, and the adhesive is responsible for the function of maintaining the pressed state.

Anisotropic conductive film (for example, Hitachi Chemical Co., Ltd.)
6A, 6B is for coating an insulating thin film resin on the surface of the conductive particles 6c having a diameter of about 3 μm to 10 μm. In the lateral direction, the insulating property is maintained even if the conductive particles 6c come into contact with each other without being broken. The anisotropic conductive films 6A and 6B are supplied in a structure such as a double-sided tape before being attached to the liquid crystal display panel L, and after the adhesive layer side is attached to the liquid crystal display panel L, the separator is peeled off and adhered. The agent layer is exposed, and then the semiconductor elements GD and SD are mounted (heated and pressed) to form the semiconductor element G.
The adhesive in the D and SD parts is cured to obtain the original adhesive force.
The separator also serves as a protective sheet for the anisotropic conductive films 6A and 6B. As the insulating thin film resin, polytetrafluoroethylene or PET (poly-ethylene tere
phthalate resin) is used. A thermosetting resin is used as the adhesive. As the conductive particles 6c, there is one in which a metal thin film is plated on the surface of a polymer sphere. In addition, it is also possible to use conductive particles without the insulating thin film resin here. The paste or film thermosetting adhesive 6 may be a conductive adhesive (conductive paste). Some adhesives include thermoplastic resins, but in recent years, thermosetting adhesives have been widely used.

First, when mounting the semiconductor elements GD and SD, the mounting area L of the first substrate L1 on the fixed stage S2 is mounted.
The first anisotropic conductive film (ACF) 6A is adhered to 6 (temporary fixing step), and the protruding electrodes 4a, 4 of the semiconductor elements GD, SD are attached.
Positioning is performed so that b and the electrodes 11 and 12 of the wiring patterns P1 and P2 are in contact with each other (alignment step). Then, the semiconductor elements GD and SD are thermocompression bonded by the pressure bonding head S3 and the fixed stage S2 heated to a predetermined temperature (main pressure bonding step). That is, the pressure bonding head S3 that has attracted the semiconductor elements GD and SD is moved up and down to perform thermocompression bonding. Although the mounting positions of the gate driver GD and the source driver SD are different, the movable stage S1 is moved to place one side 1a and the other side 1b of the liquid crystal display panel L on the fixed stage S2. For the pressure bonding of the semiconductor devices GD and SD, a multi-head batch bonding in which one side of the liquid crystal display panel L is simultaneously pressed by a large number of pressure bonding heads, or a batch bonding in which one side of the liquid crystal display panel L is simultaneously pressed by a single pressure bonding head. There is crimping etc.

After the semiconductor elements GD and SD have been thermocompression bonded as described above, the flexible wiring board F is secondly anisotropically attached to the edges of the two sides 1a and 1b of the first board L1 within at least 20 hours. Thermocompression bonding is performed via the conductive film 6B. Specifically, the second anisotropic conductive film (ACF) 6B is attached to the first substrate L1 on the fixed stage S2 (temporary fixing step), and the electrodes of the wiring P3 of the flexible wiring substrate F and the first Board L
Positioning is performed so that the electrodes of the first wiring pattern P1 are in contact with each other (alignment step), and then the flexible wiring board F is thermocompression bonded by the pressure bonding head S3 and the fixed stage S2 heated to a predetermined temperature (main pressure bonding step). . By this thermocompression bonding, the semiconductor elements GD and SD and the flexible wiring board F are connected to the first anisotropic conductive film (ACF) 6A and the second anisotropic conductive film (ACF) 6A.
In order to be electrically connected through the anisotropic conductive film 6B, the conduction test is performed in this state. That is, the conventional energization inspection that has been performed after the semiconductor element is mounted is not performed. However, if the flexible wiring board F is mounted within 20 hours after the semiconductor elements GD and SD are mounted, the driving state inspection (energization inspection) of the semiconductor elements GD and SD is performed, and then the flexible wiring board F is mounted. The mounting process may be performed.

(Second Embodiment) In the present embodiment, as shown in FIG. 4, the present invention is applied to a small liquid crystal display panel L such as a mobile phone or a personal digital assistant (PDA).
One gate driver GD and one source driver SD are mounted in a mounting region L6 formed on one side 1a of the substrate L1 of the liquid crystal display panel L. In the present embodiment, the semiconductor element and the flexible wiring board F are mounted only in the mounting area L6 on one side 1a of the first board L1 of the conventional example. The mounting method is similar to that of the first embodiment. Note that, as shown in FIG. 5, there is also one in which only one semiconductor element IC that also serves as the gate driver GD and the source driver SD is mounted in the mounting region L6 on one side 1a side of the one substrate L1.

The warped state of one substrate L1 of the liquid crystal display panel L in the first and second embodiments will now be described. First, when the semiconductor elements GD and SD are mounted, their thermosetting properties are set. The adhesive 6A cures and shrinks, and shrinkage stress is applied to the semiconductor elements GD and SD (reference numeral f1 in FIG. 6A), so that one substrate L1 of the liquid crystal display panel L is warped (FIG. 6A). ). Next, conventionally, when the flexible wiring board F is mounted after a long time elapses, the cured state of the ACF 6A reaches a completely stable state. Therefore, the pressing force of the pressure bonding head S3 imposes an excessive stress on the flexible wiring board F ( This is a reaction force to return the warp, and this stress is also a force to bring one substrate L1 into a flat plate state, which acts as a symbol f2) in Fig. 6 (b), and the cured first ACF 6A is peeled off. Occurs (Fig. 7
(A)), whereby the COG of the semiconductor devices GD and SD
There is a problem that a connection part (particularly both ends of the semiconductor elements GD and SD) has a conduction defect. However, in the present embodiment, when the flexible wiring board F is mounted within 20 hours after mounting the semiconductor elements GD and SD, the cured state of the thermosetting adhesive 6A has not reached a completely stable state. The adhesive 6A of the already mounted semiconductor elements GD and SD is not peeled off when the flexible wiring board F is thermocompression-bonded, and a highly reliable adhesive effect is obtained while maintaining the flat state of the one board L1. (FIG. 7B).
Further, according to each of the above-described embodiments, the mounting of the flexible wiring board F by thermocompression bonding is also mounted in a flat plate state.

[0029]

(Embodiment 1) Next, the occurrence rate of defects in the mounting state of the semiconductor elements GD, SD due to the waiting time (hr) between the mounting of the semiconductor elements GD, SD and the mounting of the flexible wiring board F will be described. An experiment was conducted to investigate. In this experiment, one substrate L1 of the liquid crystal display panel L has a thickness t of 0.5.
8 mm (reference numeral A1 in FIG. 8) and 0.7 mm (reference numeral B1 in FIG. 8) were used and mounted with different waiting times (hr). Then, the semiconductor elements GD and SD and the flexible wiring board F were actually mounted under the conditions shown in Table 1 below. The mounting example is based on the first embodiment in which a large number of semiconductor elements GD and SD are mounted, but the glass transition of the first anisotropic conductive film (ACF) 6A and the second anisotropic conductive film 6B. The same temperature Tg was used. What is the failure rate?
This is a conduction failure due to peeling of CF6A or generation of bubbles.

[0030]

[Table 1]

In Table 1, "temporary fixing" means, as mentioned above, the first and second anisotropic conductive films (ACF) 6A,
6B is a step of adhering 6B, and "main pressure bonding" is a step of performing thermocompression bonding by the pressure bonding head S3 and the fixed stage S2 heated to a predetermined temperature as described above. In addition,
After the “temporary fixing” step, there is an alignment step which is a step of aligning the semiconductor elements GD, SD and the like. One of the substrates L1 of the liquid crystal display panel L has a thickness t of 0.5 mm (reference numeral A1 in FIG. 8) and 0.7 mm (reference numeral B in FIG. 8).
Table 2 shows a rate of occurrence of defects in the mounted state of the semiconductor elements GD and SD, which is mounted using the method 1), and FIG. 8 is a graph of this. Semiconductor device GD, SD
H from the side of the board to the position of the flexible wiring board F
Is 0.8 mm.

[0032]

[Table 2]

As is clear from Table 2 and FIG. 8, one of the substrates L1 of the liquid crystal display panel L has a thickness t of 0.5 mm (reference numeral A1 in Table 1) and a thickness t of 0.7 mm (see Table 1). 1
In either case of the medium code B2), the semiconductor elements GD, SD
The longer the waiting time (hr) from the mounting (COG connection part) to the mounting of the flexible wiring board F becomes,
It can be seen that the ACF 6A at the COG connection portion of the semiconductor elements GD and SD is peeled off to form a gap or a bubble, which causes a conduction defect in direct proportion. That is, since the occurrence rate of defects is within the allowable range within 20 hours after mounting the semiconductor elements GD and SD (0.2% or less is within the allowable range), 2 after mounting the semiconductor elements GD and SD.
It is desirable to mount the flexible wiring board F within 0 hours, but if the flexible wiring board is mounted within 15 hours after mounting the semiconductor elements GD and SD, the failure occurrence rate is "0.1%". , And more preferably.

(Embodiment 2) Next, semiconductor elements GD and SD
The glass transition temperature Tg of the thermosetting adhesive 6B when mounting the flexible wiring board F is lower than the glass transition temperature Tg of the thermosetting adhesive 6A when mounting. Table 3 is a diagram showing the mounting conditions. In FIG. 8, the code A2 is when t = 0.5 mm, and the code B2
Is t = 0.7 mm, and the semiconductor elements GD, SD
Table 4 shows a comparison with the occurrence rate of defects in the mounting state. The distance H from the side surfaces of the semiconductor elements GD and SD to the position of the flexible wiring board F is 0.8 mm.

[0035]

[Table 3]

[0036]

[Table 4]

As is clear from Table 4 and FIG.
However, as the waiting time (hr) between the mounting of the semiconductor elements GD and SD to the mounting of the flexible wiring board F becomes longer, the AC of the COG connection portion of the semiconductor elements GD and SD becomes longer.
It can be seen that the conduction failure occurs in direct proportion due to the peeling of F6A and the formation of a gap. Then, one of the substrates L1 of the liquid crystal display panel L having a thickness t of 0.5 mm (reference numeral A2 in Table 1) and one having a thickness t of 0.7 mm (Table 1
In either case of the medium code B2), the semiconductor elements GD, SD
Since the defect occurrence rate is within the allowable range within 20 hours after mounting the semiconductor device (0.2% or less is within the allowable range), the flexible wiring board F is mounted within 20 hours after mounting the semiconductor elements GD and SD. It is preferable to mount the flexible wiring board F within 15 hours after mounting the semiconductor elements GD and SD, and it is more preferable because the failure occurrence rate is “0”. From the comparison between Table 2 and Table 4, the second difference when mounting the flexible wiring board F is higher than the glass transition temperature of the first anisotropic conductive film 6A when mounting the semiconductor elements GD and SD. It can be seen that when the glass transition temperature of the anisotropic conductive film 6B is lowered, the incidence of defects is low.

Further, one substrate L1 of the liquid crystal display panel L
Has a larger thickness t (reference numeral B1 and B2 t = 0.7 mm)
It can be seen that there is less conduction failure due to peeling or bubble formation of the ACF 6A of the semiconductor elements GD and SD, compared to the thin one (t = 0.5 mm of reference characters A1 and A2). This is because the thermosetting adhesive 6A cures and shrinks during mounting of the semiconductor elements GD, SD, and the semiconductor elements GD, S
The contraction stress is applied to D, and one substrate L1 of the display panel L
However, it is considered that when the thickness t is large, the above-mentioned warpage is difficult to occur.

As described above, the present invention can be configured in various forms other than the above-mentioned embodiments. For example, although the case where the display panel L is used in a liquid crystal display device has been described, the same effect can be obtained by using the present invention in another display panel such as a PDP (plasma display panel) panel.

[0040]

According to the method of manufacturing a display panel of the present invention, when the flexible wiring board is mounted within 20 hours after mounting the semiconductor element, the cured state of the adhesive does not reach a completely stable state. , The adhesive of the semiconductor element already mounted is not peeled off when the flexible wiring board is thermocompression bonded, and the highly reliable adhesive effect is obtained while maintaining the flat state of one board of the display panel. Thus, it is possible to manufacture not only a semiconductor element for one substrate of the display panel but also a display panel having a high mounting accuracy of a flexible wiring substrate.

[0041]

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a mounted state of a semiconductor element and a flexible wiring board in a display panel according to a first embodiment of the present invention.

FIG. 2 is a perspective view showing a mounted state of a semiconductor element and a flexible wiring board in the display panel according to the first embodiment.

FIG. 3 is a sectional view showing a manufacturing apparatus used for mounting the semiconductor element and the flexible wiring board in the first embodiment.

FIG. 4 is a sectional view showing a mounted state of a semiconductor element and a flexible wiring board in a display panel according to a second embodiment of the present invention.

FIG. 5 is a perspective view showing a mounting state of a semiconductor element and a flexible wiring board in the display panel according to the second embodiment.

FIG. 6 is a cross-sectional view illustrating a warped state of one substrate of the liquid crystal display panel in each of the above embodiments.

FIG. 7 is a cross-sectional view for explaining a state of a paste or film thermosetting adhesive and a conventional peeled state of one substrate of the liquid crystal display panel in each of the above embodiments.

FIG. 8 is a graph showing the relationship between the mounting state of semiconductor elements and the incidence of defects.

FIG. 9 is a cross-sectional view showing a mounted state of a semiconductor element and a flexible wiring board in a conventional liquid crystal display panel.

FIG. 10 is a plan view showing a mounting state of a semiconductor element and a flexible wiring board in a conventional liquid crystal display panel.

FIG. 11 is a perspective view showing a method of manufacturing a display panel.

[Explanation of symbols]

4a, 4b Protruding electrodes (bumps) 6 Paste or film thermosetting adhesive 6A Paste or film thermosetting adhesive (first anisotropic conductive film; ACF) 6B Paste or film Thermosetting adhesive (second anisotropic conductive film; ACF) 6c conductive particles 11, 12 electrode F flexible wiring board GD, SD semiconductor element L liquid crystal display panel L1 one substrate (first substrate, AM substrate) ) L2 other substrate (second substrate) P1, P2, P3 wiring pattern S1 movable stage S2 fixed stage S3 pressure bonding head

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Tsuyoshi Ishigame             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. (72) Inventor Hiroyoshi Takezawa             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. (72) Inventor Naohiro Fukuda             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. (72) Inventor Tsutomu Aida             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. (72) Inventor Daijuro Takano             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. F term (reference) 5F044 NN13 NN19 RR17 RR19

Claims (3)

[Claims] 1. A semiconductor device is mounted on one substrate of a display panel having a pair of substrates via a paste-shaped or film-shaped thermosetting adhesive, and then a peripheral portion of the one substrate of the display panel. In a method for manufacturing a display panel, in which a flexible wiring board is mounted near a semiconductor element mounted via a paste-shaped or film-shaped thermosetting adhesive, a flexible wiring board is mounted within 20 hours after mounting the semiconductor element. A method for manufacturing a display panel, which is characterized by mounting. 2. The glass transition temperature of the thermosetting adhesive when mounting the flexible wiring board is lower than the glass transition temperature of the thermosetting adhesive when mounting the semiconductor element. The method for manufacturing a display panel according to claim 1. 3. The semiconductor element energization inspection step is not interposed during mounting of the flexible wiring board after mounting of the semiconductor element.
A method for manufacturing a display panel according to any one of the above.