JP2003240802A - Contact probe and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent a shift of a pitch between contact pins in a contact probe and its manufacturing method. <P>SOLUTION: In this contact probe 11, a plurality of pattern wires 13 are stuck onto the surface of a film main body 12, and respective tip parts of the pattern wires serve as contact pins 15. A spring layer mounted to the back face of the film main body is protruded from the tip part of the film main body, while between the projection part of the spring layer and the contact pins, a pin supporting part 18 is arranged. The pin supporting part 18 is provided with a plurality of grooves 20a corresponding to pitches of the contact pins positioned on the contact pin side. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is used as a probe pin, a socket pin, etc., and is incorporated in a probe card, a test socket, etc., and contacts each terminal of a semiconductor IC chip, a liquid crystal device, etc. to perform an electrical test. And a manufacturing method thereof.

[0002]

2. Description of the Related Art Generally, a contact pin is used to make an electrical test by contacting each terminal of a semiconductor chip such as an IC chip or an LSI chip or an LCD (liquid crystal display). In recent years, along with the high integration and miniaturization of IC chips and the like, the contact pads, which are electrodes, have been made narrower in pitch, and there has been a demand for narrower pitch of contact pins. However, in the contact probe of the tungsten needle used as the contact pin, it is difficult to cope with the narrow pitch of many pins due to the limit of the diameter of the tungsten needle.

On the other hand, for example, Japanese Patent Publication No. 7-820
Japanese Unexamined Patent Application Publication No. 27-27 proposes a technique of a contact probe in which a plurality of pattern wirings are formed on a resin film and each tip of these pattern wirings is arranged in a protruding state from the resin film to form a contact pin. In this technical example, by using the contact pins at the tips of the plurality of pattern wirings, the pitch of the multi-pins can be narrowed and a large number of complicated parts can be eliminated.

With respect to this technique, the applicant of the present invention, as shown in FIGS. 12 and 13, uses contact pins 5 through a pin support portion 8 in order to prevent the contact pins 5 from being deformed or damaged by a load. A contact probe 1 having a spring layer 6 that elastically supports 5 is proposed. This contact probe 1 has an elastic body layer 9 made of silicon rubber and a non-elastic body layer 10 made of ceramics as a pin support portion 8. The elastic body layer 9 absorbs a load and each contact is made by the non-elastic body layer 10. It is excellent in that a constant load can be applied to the pin 5.

The contact probe 1 has a structure in which a pattern wiring 3 made of Ni (nickel) or an Ni alloy is attached to one surface of a film body 2, and the tip of the pattern wiring 3 has a contact pin 5. It is said that. The film body 2 is configured by laminating a metal film layer 2B such as Cu (copper) or Ni on the polyimide resin film layer 2A as a ground. The spring layer 6 is fixed to the film body 2 with an adhesive 7.

[0006]

In the contact probe provided with the spring layer having the above-mentioned pin supporting portion, when the spring layer and the film body are bonded together, compression heating is performed at a high temperature to cure the adhesive and fix it. However, due to the difference in thermal expansion coefficient between the ceramic non-elastic layer and the film body, there is a disadvantage in that the pitch between the contact pins is deviated after fixing, as shown in FIG.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a contact probe capable of preventing a pitch deviation between contact pins and a manufacturing method thereof.

[0008]

The present invention has the following features to attain the object mentioned above. That is, the contact probe of the present invention is a contact probe in which a plurality of pattern wirings are deposited on the surface of the film body, and each tip of these pattern wirings serves as a contact pin, and a spring layer is provided on the back surface of the film body. Is attached, the spring layer is arranged in a protruding state from the tip end portion of the film body, and a pin supporting portion is provided between the protruding portion of the spring layer and the contact pin. The surface located on the contact pin side has a plurality of grooves corresponding to the pitch of the contact pins.

In this contact probe, since the pin support portion has a plurality of grooves corresponding to the pitch of the contact pins on the surface located on the contact pin side, even if the pitch between the contact pins changes due to a difference in thermal expansion or the like. ,
It is possible to prevent the contact pins from being constrained in the groove and widening the pitch to be displaced.

A method of manufacturing a contact probe according to the present invention is a method of manufacturing a contact probe in which a plurality of pattern wirings are deposited on the surface of a film body, and the tip ends of these pattern wirings serve as contact pins. Contact pin forming step of depositing a plurality of pattern wirings on the front surface of the film body and using the tip ends of these pattern wirings as contact pins; and spring layer attaching step of depositing a spring layer on the back surface of the film body. And a pin fixing step of arranging the pin support portion in a protruding state from the front end portion of the film main body and applying heat between the protruding portion of the spring layer and the contact pin with an adhesive and then curing the adhesive by heat. The pin supporting portion has a surface located on the contact pin side, which corresponds to the pitch of the contact pins before heat curing in the pin fixing step. And a plurality of previously formed a groove.

In this method of manufacturing a contact probe,
Since a plurality of grooves corresponding to the pitch of the contact pins are formed on the surface of the pin support portion located on the contact pin side before heat curing in the pin fixing step, in the pin fixing step,
Even if a difference in thermal expansion occurs between the pin support portion and the film body due to heating, the contact pin is fixed in the groove in a regulated state. Therefore, it is possible to prevent a pitch deviation between the pins when fixing the pin support portion.

Further, the contact probe of the present invention employs a technique in which a plurality of contact pins are arranged in each groove of the pin support portion. That is, in this contact probe, by arranging a plurality of contact pins in each groove of the pin support portion, it is possible to widen the groove width as compared with the groove in which one pin is arranged, and the groove is not processed. It is easy and improves the assembly workability. Even if the groove has a groove width in which a plurality of pins are arranged in this way, it may be formed according to the pitch between the contact pins.

Further, the contact probe of the present invention employs a technique in which the bottom surface of the groove is formed so as to be inclined toward the contact pin side from the base end side to the tip end side of the contact pin. Further, the method of manufacturing the contact probe of the present invention employs a technique of forming the bottom surface of the groove by inclining toward the contact pin side from the base end side to the tip end side of the contact pin.

That is, in these contact probes and the method for manufacturing the contact probes, the bottom surface of the groove is formed so as to be inclined toward the contact pin side from the base end side of the contact pin toward the tip end side, so that the bottom surface is an inclined surface. The tip of the contact pin arranged in the groove is bent outward. As a result, the contact angle of the contact pin with the electrode can be set larger.

In the contact probe of the present invention, it is preferable that an elastic layer is provided between the groove and the contact pin. That is, in this contact probe, since the elastic layer is provided between the groove and the contact pin, the load applied to the contact pin can be absorbed by the elastic layer.

In the method of manufacturing the contact probe of the present invention, there is a technique of forming the groove by laser processing in which a mask is applied to a surface located on the contact pin side and a non-masked portion is irradiated with laser light. Adopted. That is, in this method of manufacturing a contact probe, a plurality of grooves can be simultaneously processed by forming a groove on the surface located on the contact pin side by laser processing and irradiating the unmasked portion with laser light. With
Higher precision and fine groove processing can be performed.

The contact probe manufacturing method of the present invention employs a technique of forming the groove by machining with a dicing blade. That is, in this method of manufacturing a contact probe, since the groove is formed by machining with a dicing blade, it is possible to perform more precise and fine groove processing in processing the groove and the groove whose bottom surface is an inclined surface. .

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION A contact probe according to a first embodiment of the present invention and a method for manufacturing the same will be described below with reference to FIGS.
Will be described with reference to. In these figures, reference numeral 1
Reference numeral 1 is a contact probe, 12 is a film body, and 13 is a pattern wiring.

The contact probe of this embodiment is an IC
It is a type that is cut out in a predetermined shape as a probe for use, and its contact pin is tilted downward and supported by the probe device. As shown in FIGS. 1 and 2, the contact probe 11 has, for example, a two-layer structure including a resin film layer 12A made of polyimide or the like and a metal film layer 12B made of Cu (copper) or the like, and has a substantially home-base shape. In the eggplant film body 12, the surface of the film body 12 (on the resin film layer 12A side, as shown in FIG.
Also, a plurality of pattern wirings 13 made of a Ni-based alloy or the like are adhered to the lower surface of the film body 12 in FIG. 2 with an adhesive agent 14, and the tip ends of each of the pattern wirings 13 serve as contact pins 15.

A spring layer 16 is attached to the back surface of the film body 12 (the upper surface of the film body 12 in FIGS. 1 and 2), and the spring layer 16 is located at a position facing the back surface of the contact pin 15. Is projected to.
The spring layer 16 is composed of a thin plate (for example, a thickness of about 200 μm) made of spring steel such as SUP material defined in JIS G 4801. As shown in FIG. The metal film layer 12B located on the back surface side of the substrate is adhered to the metal film layer 12B with a liquid or sheet-like adhesive agent 17, so that the protruding portion 16A at the tip thereof is
Is projected from the tip of the film body 12 to a position facing the back surface of the contact pin 15. In this case, the contact pin 15 in this embodiment has, for example, a thickness and a width of about 50 μm,
The length from the tip of the film body 12 to the tip of the contact pin 15 is about 550 μm, and the protrusion 16A of the spring layer 16 has a length corresponding thereto.

Further, a pin support portion 18 is provided in a space located between the spring layer 16 and the back surface of the contact pin 15, and the pin support portion 18 is, as shown in FIGS. , The protruding portion 16A of the spring layer 16 and the contact pin 1
5 is interposed between the silicone rubber 19 and the elastic member, and the ceramic member 20 is embedded in the silicon rubber 19 and serves as the inelastic member layer. The ceramic member 20 that constitutes this non-elastic layer is made of silicon nitride, aluminum nitride, or the like.

Further, as shown in FIGS. 3 and 4, the ceramic member 20 has a plurality of grooves 20a in which the contact pins 15 are arranged on the surface located on the contact pin 15 side. That is, the grooves 20a are formed in accordance with the pitch P between the contact pins 15, and each contact pin 15 is fixed in a state of being fitted into the groove 20a.

Further, in the present embodiment, for example, the protruding portion 16A of the spring layer 16 and the back surface of the contact pin 15 are located with a distance of about 165 to 200 μm,
In the silicone rubber 19 filled in the space between the protruding portion 16A of the spring layer 16 and the back surface of the contact pin 15,
Ceramic member 2 having a thickness of about 130 to 140 μm
0 is buried.

Moreover, the ceramic member 20 and the spring layer 1
6 is separated from each other by a distance of about 25 μm, and the ceramic member 20 and the back surface of the contact pin 15 are separated from each other by a distance of about 10 to 20 μm. Member 2
0, the gap between the ceramic member 20 and the spring layer 1
In the gap between the protruding portion 16A of 6 and the silicone rubber 19
Is filled. Between the ceramic member 20 and the tip surface of the film body 12, as shown in FIG.
For example, they are separated by a gap of about 50 μm and are also filled with silicone rubber 19.

That is, as shown in FIGS. 2 and 3, the silicon rubber 19 is the first layer 19A (elastic body located on the contact pin 15 side) arranged between the back surface of the contact pin 15 and the ceramic member 20. Layer) and a second layer 19B (an elastic layer located on the side of the protruding portion 16A of the spring layer 16) arranged between the ceramic member 20 and the protruding portion 16A of the spring layer 16 and a communicating portion. By 19C,
The first layer 19A and the second layer 19B are in communication with each other.
That is, the ceramic member 20 is arranged so as to be sandwiched between the first layer 19A and the second layer 19B of the silicon rubber 19, and the ceramic member 20 and the film body 1 are arranged.
An assembling error can be absorbed by the communicating portion 19C of the silicone rubber 19 located between the two.

Further, the silicon rubber 19 and the ceramic member 20 constituting the pin support portion 18 are subjected to an electrical test by the contact probe 11, and the contact pin 15
A device for confirming the connection between a pad and a pad (or bump) of a semiconductor chip or the like emits light toward the periphery of the contact pin 15, but it is colored black so that the light can be absorbed. Is preferred.

The contact probe 11 is incorporated into mechanical parts such as a mounting base 505, a top clamp 506, and a bottom clamp 507, as shown in FIG.
The probe device is positioned and attached to. In this attached state, the contact probe 11 is supported by being tilted so that the contact pin 15 at its tip faces downward as shown in FIG. 6, and the tip of each contact pin 15 is, for example, a semiconductor chip. The pads (or bumps) 509a as electrode terminals provided on the peripheral portion of the upper surface of the semiconductor chip 509 are brought into contact with each other, so that an electrical test of the semiconductor chip 509 and the like can be performed via the pattern wiring 13 and the wiring of the printed board 508. Done.

Next, the contact probe 1 of this embodiment
The manufacturing method of No. 1 will be described below.

[Groove Forming Step] First, as shown in FIG. 4, each contact pin 15 is arranged on the surface of the ceramic member 20 located on the contact pin 15 side before heat curing in a pin fixing step described later. The plurality of grooves 20a are formed in advance. At this time, the contact pin 1 of the pin support portion 18
A method in which the surface located on the 5 side is machined with a dicing blade of a fine groove processing machine (such as a dicer) to form the groove 20a, or a surface located on the contact pin 15 side is masked and unmasked. A method of forming a groove 20a by performing laser processing for irradiating a laser beam on the above is used.
According to the laser processing, a plurality of grooves can be processed at the same time, and highly precise and fine processing is possible. Further, according to the machining with the dicing blade,
In the processing of the groove and the groove in which the bottom surface is an inclined surface, it is possible to perform the groove processing with higher accuracy and fineness as compared with laser processing or the like.

[Contact Pin Forming Step] On the other hand, a plurality of pattern wirings 13 formed on a supporting metal plate by plating using a mask technique are adhered to the surface of the film body 12 with an adhesive 14. At this time, the pattern wiring 1
Each tip of 3 is projected from the film main body 12 and attached so as to become the contact pin 15. After that, the pattern wiring 13 is peeled off from the supporting metal plate together with the film body 12, so that the pattern wiring 13 and the film body 12 are formed.

[Spring Layer Adhering Step and Pin Fixing Step] Next, as shown in FIG. 7, silicon rubber 19 is applied to the back surface side of the contact pin 15, and the ceramic member 20 is placed in the silicon rubber 19. Silicon rubber 1 is also embedded in the ceramic member 20.
9 is applied, and the silicone rubber 19 and the film body 12
By depositing the spring layer 16 on the back surface of the above, the silicon rubber 19 and the ceramic member 20 are provided between the back surface of the contact pin 15 and the protruding portion 16A of the spring layer 16. Then, when the silicone rubber 19 is heated and cured in this state, the silicone rubber 19 is adhered to the back surface of the contact pin 15 and also to the protruding portion 16A of the spring layer 16.

In this step, the position is adjusted so that each contact pin 15 is arranged in the groove 20a of the ceramic member 20 before the above-mentioned heat curing, and in this state,
The silicone rubber 19 is hardened to fix the spring layer 16, the pin support 18 and the contact pin 15 to each other. At this time, even if a difference in thermal expansion occurs between the ceramic member 20 and the film body 12 due to heating, the contact pin 15
Are held in the grooves 20a, the pitch between the contact pins 15 can be prevented from shifting even if the silicone rubber 19 hardens.

The thickness between the metal film layer 12B of the film body 12 and the spring layer 16 is appropriately adjusted by changing the thickness of the liquid or sheet adhesive 17, for example. Further, since the silicone rubber 19 has fluidity, it enters into the gaps between the contact pins 15 from the back surface side of the contact pins 15, but by removing unnecessary portions of the entered silicone rubber 19 by laser processing or the like. , The lower surface side of the first layer 19A of the silicon rubber 19 is aligned.

As described above, when the silicon rubber 19 in which the ceramic member 20 is embedded is applied to the back surface of the contact pin 15 and the spring layer 16 is further applied thereon, the back surface of the contact pin 15 and the spring layer 16 are formed. Silicon rubber 1 in which ceramic member 20 is embedded between protrusion 16A
9 is bonded, and the contact probe 11 is manufactured.

In the present embodiment, the ceramic member 20 of the pin support portion 18 has the plurality of grooves 20a in which the contact pins 15 are arranged on the surface located on the contact pin 15 side. Even if the pitch between the holes 15 changes, the contact pin 15 can be prevented from being constrained in the groove 20a and widening the pitch.

The pin support portion 18 is made of silicone rubber 1.
Since the ceramic member 20 is embedded in the spring 9, the load applied to the contact pin 15 is applied to the spring layer 16 via the ceramic member 20 unlike the case where only the silicon rubber 19 is interposed. Projection 16A
Can be reliably transmitted to the spring layer 1 and a constant load can be applied to the contact pin 15.
The contact pin 15 of No. 6 can be surely pressed, and the contact property can be favorably maintained. Moreover, since the spring layer 16 is elastically deformed and the pin support portion 18 is contracted, the contact pin 15 can be strongly pressed against the pad (or bump) to increase the needle pressure, so that the contact pin 15 alone is used. It is also possible to obtain an advantage that a stable contact property can be secured as compared with the case of giving.

Next, a second embodiment of the contact probe and method for manufacturing the same according to the present invention will be described with reference to FIGS. 8 and 9.

The difference between the second embodiment and the first embodiment is that in the first embodiment, one contact pin 15 is arranged in one groove 20a, whereas in the second embodiment, one contact pin 15 is arranged. As shown in FIGS. 8 and 9, in each groove 120a formed in the ceramic member 120 of the pin support 118,
The point is that a plurality of contact pins 15 are arranged. In this embodiment, two contact pins 15 are arranged in the groove 120a. That is, in the present embodiment, by disposing a plurality of contact pins 15 in each groove 120a of the ceramic member 120, the groove width can be made wider than the groove when one pin is arranged. It is easy to remove and the assembly workability is improved.

Next, a third embodiment of the contact probe and the manufacturing method thereof according to the present invention will be described with reference to FIG.

The difference between the third embodiment and the first embodiment is that in the first embodiment, the bottom surface of the groove 20a is a surface parallel to the pattern wiring 13, whereas in the third embodiment, As shown in FIG. 10, the bottom surface of the groove 220a formed in the ceramic member 220 of the pin support portion 218 is formed to be inclined toward the contact pin 15 side from the base end side to the tip end side of the contact pin 15. It is a point.

That is, in the present embodiment, the bottom surface of the groove 220a is a surface inclined from the base end side of the contact pin 15 toward the contact pin 15 side toward the tip end side and inclined with respect to the pattern wiring 13. As a result, the bottom surface becomes an inclined surface, and the tip of the contact pin 15 disposed in the groove 220a is bent outward. Thereby, the contact angle of the contact pin 15 to the electrode (pad or bump) can be set larger.

Next, a fourth embodiment of the contact probe and the manufacturing method thereof according to the present invention will be described with reference to FIG.

The difference between the fourth embodiment and the first embodiment is that in the first embodiment, the pin support portion 18 is provided separately from the spring layer 16, whereas in the fourth embodiment, As shown in FIG. 11, the pin support portion 418 is integrally formed in advance with the protrusion 416A of the spring layer 416.
That is, in this embodiment, a groove 416B is formed in the protrusion 416A itself of the spring layer 416 without using a ceramic member, and the contact pin 15 is formed in the groove 416B.
Are arranged. Therefore, in this embodiment, the number of parts can be reduced and the assembling work can be simplified.

The technical scope of the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention. For example, in the first to third embodiments, as the pin support portion,
Although an example constituted by silicon rubber and a ceramic member is shown, another elastic layer capable of contracting may be used instead of silicon rubber, and another non-elastic layer may be used instead of the ceramic member. Good. The first layer 19A, which is an elastic layer, does not necessarily have to be provided, but if an elastic layer such as the first layer is provided between the groove and the contact pin, the elastic layer serves as the contact pin. The applied load can be absorbed.

Further, in each of the above-mentioned embodiments, the method is applied to the method of manufacturing the IC contact probe, but it may be applied to other methods. For example, the present invention may be applied to a contact probe used for an IC chip test socket mounted in an IC chip burn-in test device or the like or an LCD test probe device for protecting the IC chip by holding it inside. Good.

[0046]

The present invention has the following effects.
That is, according to the contact probe and the method for manufacturing the contact probe of the present invention, since a plurality of grooves corresponding to the pitch of the contact pins are formed on the surface of the pin support portion located on the contact pin side, there is a difference in thermal expansion. Even if the pitch between the contact pins changes, it is possible to prevent the contact pins from being constrained in the groove and widening the pitch and shifting.

[Brief description of drawings]

FIG. 1 is a perspective view of a main part of a contact probe in a first embodiment of a contact probe and a method for manufacturing the same according to the present invention.

FIG. 2 is a sectional view taken along the line BB of FIG.

FIG. 3 is a plan view of a principal part of the contact probe and the method for manufacturing the same according to the present invention as viewed from the pattern wiring side showing the contact probe.

FIG. 4 is a perspective view of a main part showing a ceramic member in the first embodiment of the contact probe and the method for manufacturing the same according to the present invention.

FIG. 5 is an exploded perspective view of a probe device to which the contact probe is attached in the first embodiment of the contact probe and the manufacturing method thereof according to the present invention.

FIG. 6 is a cross-sectional view of essential parts showing a state in which the contact probe is incorporated in a mechanical part in the first embodiment of the contact probe and the method for manufacturing the same according to the present invention.

FIG. 7 is a cross-sectional view of essential parts showing a protruding portion of a spring layer, a pin support portion, a contact pin, and the like in a spring layer attaching step in the contact probe and the method for manufacturing the same according to the first embodiment of the present invention.

FIG. 8 is a plan view of a main part of the contact probe according to the second embodiment of the present invention as viewed from the pattern wiring side showing the contact probe.

FIG. 9 is a perspective view of a main part showing a ceramic member in the second embodiment of the contact probe and the method for manufacturing the same according to the present invention.

FIG. 10 is a fragmentary cross-sectional view showing a contact probe in the third embodiment of the contact probe and the method for manufacturing the same according to the present invention.

FIG. 11 is a fragmentary cross-sectional view showing a contact probe in the fourth embodiment of the contact probe and the method for manufacturing the same according to the present invention.

FIG. 12 is a perspective view of relevant parts showing a conventional contact probe according to the present invention.

13 is a sectional view taken along the line AA of FIG.

FIG. 14 is a plan view of an essential part of a contact probe of a conventional example according to the present invention, as viewed from the pattern wiring side after fixing a spring layer.

[Explanation of symbols]

11 Contact probe 12 film body 12A resin film layer 12B metal film layer 13 pattern wiring 15 contact pins 16 spring layers 16A protrusion 17 Adhesive 18 pin support 19 Silicon rubber 20 ceramics 20a groove

Continued front page    (72) Atsushi Matsuda             Six of 12 techno parks, Sanda City, Hyogo Prefecture             Mitsubishi Materials Corporation Mita factory (72) Inventor Osamu Yamada             Six of 12 techno parks, Sanda City, Hyogo Prefecture             Mitsubishi Materials Corporation Mita factory (72) Inventor Tatsuo Sugiyama             Six of 12 techno parks, Sanda City, Hyogo Prefecture             Mitsubishi Materials Corporation Mita factory F-term (reference) 2G003 AA00 AA07 AB01 AG04                 2G011 AA17 AB01 AB06 AB07 AB08                       AE03 AE22 AF07                 2G132 AA00 AB01 AD01 AF02                 4M106 AA01 BA01 DD04

Claims (8)

[Claims] 1. A contact probe in which a plurality of pattern wirings are deposited on the surface of a film body, and each tip of these pattern wirings serves as a contact pin, wherein a spring layer is deposited on the back surface of the film body. The spring layer is arranged in a projecting state from the tip of the film body, and a pin supporting portion is provided between the projecting portion of the spring layer and the contact pin, and the pin supporting portion is the contact pin. A contact probe having a plurality of grooves corresponding to the pitch of the contact pins on the surface located on the side. 2. The contact probe according to claim 1, wherein a plurality of the contact pins are arranged in each groove of the pin support portion. 3. The contact probe according to claim 1, wherein the bottom surface of the groove is formed so as to be inclined toward the contact pin side from the base end side to the tip end side of the contact pin. Contact probe to do. 4. The contact probe according to claim 1, wherein an elastic layer is provided between the groove and the contact pin. 5. A method of manufacturing a contact probe, wherein a plurality of pattern wirings are deposited on a surface of a film body, and each tip end of these pattern wirings serves as a contact pin. A contact pin forming step in which the tip ends of these pattern wirings are used as contact pins on the front surface of the film, a spring layer applying step in which a spring layer is applied to the back surface of the film body, and a pin supporting portion is formed in the film body. And a pin fixing step of heat-curing the adhesive after the adhesive is applied between the protruding portion of the spring layer and the contact pin, and the pin supporting portion is provided on the pin support portion. Is characterized in that a plurality of grooves corresponding to the pitch of the contact pins are formed on the surface located on the contact pin side before heat curing in the pin fixing step. Method of manufacturing a contact probe to be. 6. The method of manufacturing a contact probe according to claim 5, wherein the bottom surface of the groove is formed so as to be inclined toward the contact pin side from the base end side to the tip end side of the contact pin. A method for manufacturing a characteristic contact probe. 7. The method of manufacturing a contact probe according to claim 5, wherein the groove is masked on a surface located on the contact pin side, and laser light is irradiated to an unmasked portion. A method of manufacturing a contact probe, comprising: 8. The method for manufacturing a contact probe according to claim 5, wherein the groove is formed by machining with a dicing blade.