JP2001249144A - Contact probe, probe device and method for making contact probe - Google Patents

Abstract

PROBLEM TO BE SOLVED: To match a contact probe with electrodes which are short in scrubbing direction and match the contact probe also with finer electrode pitches of the subject of inspection by facilitating positioning. SOLUTION: A plurality of pattern wires each coated with a film have contact pins at their respective ends projecting from the film, and a projection 44 which is brought into contact with the pad 18a of an IC chip is formed at the end of each contact pin.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a contact for performing an electrical test such as a circuit test by bringing a contact pin into contact with a fine electrode of an object to be inspected such as a semiconductor IC chip or an LCD (liquid crystal display). The present invention relates to a probe and a probe device.

[0002]

2. Description of the Related Art Generally, a probe device is a semiconductor chip such as an IC chip or an LSI, or an LCD (liquid crystal display).
The contact pins of the contact probe are pressed into contact with the respective electrode pads (hereinafter, referred to as pads), and are connected to a tester via a printed circuit board to be used for an electrical test. As shown in FIG. 17, the contact probe 1 has a film 3 attached on a plurality of pattern wirings 2 made of a Ni-based alloy or the like via an adhesive layer and projects from the film 3. Are formed as contact pins 2a. Also wide base 1 of the film
A window portion 4 is formed in b, and a lead-out wiring portion 5 for the pattern wiring 2 is provided in the window portion 4. The film 3 may be formed of a resin film layer of polyimide or the like, or may be a resin film layer of polyimide or the like and a metal film layer of copper foil or the like laminated as a ground.

Such a contact probe 1 is shown in FIG.
As shown in FIG. 19, the probe device 8 is incorporated in mechanical parts 7 such as a mounting base, a top clamp, and a bottom clamp to form a probe device 8 and a contact pin 2a.
.. Correspond to fine electrode terminals such as pads or bumps of a semiconductor IC chip or LCD (FIG. 19 shows pad 1 of IC chip 18).
8a). That is, FIG. 18 and FIG.
In the probe device 8 shown in FIG. 9, for example, a top clamp 11 is mounted on a printed circuit board 10 having a disk shape and having a central window 10a, and the tip 1a of the contact probe 1 is mounted on the lower surface thereof using a double-sided tape or the like. The mounting base 12 is fixed to the top clamp 11 with bolts or the like. Then, the base 1 b of the contact probe 1 is pressed by the bottom clamp 14. At this time, the printed circuit board 10 and the base 1b of the contact probe 1 are mutually positioned by the positioning pins. As a result, the tip portion 1a of the contact probe 1 is held in a downwardly inclined state on the lower surface of the mounting base 12, and the lead-out wiring portion 5 of the pattern wiring 2 at the base 1b of the contact probe 1
The elastic body 15 is pressed through the window 4 to the electrode 16 on the lower surface of the printed circuit board 10 to be kept in contact.

The pattern wirings 2 including the contact pins 2a of the contact probe 1 are manufactured by photolithography and plating using a mask exposure technique, and the tip 20 of the contact pins 2a is shown in FIG.
As shown by 0, it is formed in a substantially semicircular plate shape. Here, the distal end portion 20 of the contact pin 2 a is formed on the upper surface 21, the lower surface 22, and the side surface 23 of a circular arc shape to be adhered to the film 3.
It is composed of Also, in order to reduce the contact resistance when contacting the pad 18a, a polished contact surface 24 is formed by diagonally notching from the lower surface 22 to the distal end of the side surface 23 at the tips of the contact pins 2a as shown in FIG. Was.

When the contact pins 2a are brought into contact with the pads 18a of the IC chip 18, for example, the pads 18a
Are arranged horizontally, the inclination angle θ of the contact pin 2a with respect to the pad 18a is set to, for example, about 20 °. On the other hand, since the surface of the pad 18a formed of an aluminum alloy, gold, or the like is oxidized in the air and covered with a thin oxide film or an adsorbent, overdrive is applied to the pad 18a as shown in FIG. It is necessary to scrape the oxide film and the adsorbed material on the surface with the contact surface 24 of the tip portion 20 (referred to as scrubbing), to expose the metal such as aluminum and gold inside, and to ensure the conduction with the contact pin 2a at the contact surface 24. There is.

Here, the overdrive means the pad 1
This is an operation of further bringing the pad 18a and the contact pin 2a relatively closer from the state where the tip of the contact pin 2a is in contact with the contact pin 8a. By this operation, the contact pin 2a is pressed by the pad 18a and the pad 18a
Bend in a direction to reduce the inclination angle θ with respect to
The tip of the contact pin 2a moves along the surface of the pad 18a to scrub the pad 18a. For example, when the distance (referred to as an overdrive amount) at which the pad 18a and the contact pin 2a are relatively approached by overdrive is the same, the smaller the initial inclination angle θ of the contact pin 2a, the smaller the contact pin 2a. The length of the scrub by the tip rubbing the pad 18a (called the scrub length) is reduced.

[0007]

Incidentally, recent ICs
As the size of the chip 18 is reduced, the size of the pad 18a is also reduced. For this reason, the inclination angle θ of the contact pin 2a remains at the conventional size (θ = 20 °), that is, the length (scrub length) at which the tip end of the contact pin 2a rubs the pad 18a when overdrive is applied. However, if the conventional length is not used, it is impossible to cope with such a miniaturized pad 18a.
There is a possibility that the tip of a may protrude from the pad 18a.

However, when the inclination angle of the contact pin 2a is reduced, the contact angle of the contact pin 2a with respect to the pad 18a is also reduced.
a, the force (needle pressure) for pressing the tip of the contact pin 2a against the pad 18a is reduced.
There is a risk that good scrub may not be performed due to slipping on the surface of a. Also, the pad 18a of the IC chip 18
As shown in FIG. 21, passivation 2
In some cases, an insulating film (insulating member) referred to as No. 6 is provided, and the passivation 26 protrudes to a position higher than the surface of the pad 18a. Therefore, when the inclination angle θ is reduced, the contact pins 2
a may contact the passivation 26 and damage the passivation 26.

For example, when the IC chip 18 has a substantially rectangular shape and its pads 18a are provided along four sides of the IC chip 18, usually, the pads 18a correspond to each side of the IC chip 18, respectively. Although four contact probes 1 will be used, the tip of the contact pin must be aligned with accuracy within several μm for each contact probe, which is troublesome and secures the accuracy of alignment. Becomes difficult. Therefore, for example, at least two contact probes 1 described above,
The contact pins 2a are connected to each other with the contact pins 2a facing the IC chip 18 so as to surround the IC chip 18, and these contact probes 1 are used as contact probe portions corresponding to the pads 18a on each side of the IC chip 18, respectively. A contact probe has been considered which is formed integrally to facilitate alignment of the contact pin 2a with the pad 18a.

On the other hand, with the miniaturization of the IC chip 18, the distance between the pads 18a provided on adjacent sides in the corner portion of the IC chip 18 is also getting closer.
For this reason, in a contact probe having a plurality of contact probe portions, when attached to the probe device 8, the contact pins 2 a are brought into contact with the pads 18 a at the corners of the IC chip 18 in the two adjacent contact probe portions. Must be provided close to each other. Here, at the time of the manufacturing step and the work of attaching the contact probe to the probe device 8, the tip portion of each contact probe portion is handled as a whole without being inclined. Then, when mounted at the conventional inclination angle θ,
For example, when two adjacent contact probe portions are developed on a plane, the contact pins 2a of these contact probe portions may partially overlap.

SUMMARY OF THE INVENTION The present invention has been made in view of such circumstances, and has as its object to provide a contact probe and a probe device which can cope with an electrode having a short length in a scrub direction. Another object of the present invention is to facilitate positioning and to cope with a finer electrode pitch of a test object.

[0012]

According to a first aspect of the present invention, there is provided a contact probe, wherein each tip of a plurality of pattern wirings on which a film is attached protrudes from the film to form contact pins. A projection is provided at the tip of the contact pin, and the amount of projection H of the projection from the tip of the contact pin is 3
μm or more.

In the contact probe thus configured, a projection is provided at the tip of the contact pin, and the electrode of the object to be inspected is scrubbed satisfactorily by the projection. Can be smaller. Thereby, the scrub length of the contact pin at the time of overdrive can be reduced, and it is possible to cope with an electrode having a short length in the scrub direction. Also, since the projections provide a portion other than the tip of the contact pin apart from the object to be inspected, even if the inclination angle of the contact pin is reduced, for example, interference between the passivation provided on the electrode and the contact pin may be prevented. Can be avoided. Here, the projection provided on the contact pin may be formed, for example, by plating the tip of the contact pin, or may be formed by bonding. If the protrusion amount H of the protrusion from the tip of the contact pin is smaller than 3 μm, the portion other than the protrusion of the contact pin becomes too close to the test object during overdrive, and contacts the test object. And may damage it. For this reason, the protrusion amount H of the projection portion
Is 3 μm or more. In addition, in order to reduce the scrub length of the object to be inspected due to the tip of the contact pin, the protrusion has a short width in the longitudinal direction of the contact pin. Therefore, when the protrusion amount H is larger than 100 μm, The protrusion amount H of the protrusion becomes larger than the width of the protrusion in the longitudinal direction of the contact pin. Since the contact pin abuts against the object to be inspected in an inclined state, when the protrusion amount H is too large, the projection may be bent by the stress received during the scrub. For this reason, it is preferable that the protrusion amount H of the protrusion is 100 μm or less.

According to a second aspect of the present invention, there is provided a contact probe, wherein a film is attached to a plurality of pattern wirings each of which has a tip part forming a contact pin, so that the film protrudes further to the tip side than the tip part. A mask is applied except for a portion adjacent to the tip of the contact pin, and a metal layer thicker than the contact pin is formed in a portion adjacent to the tip by plating, and the mask is formed. It is characterized in that a protrusion made of the metal layer is formed at the tip of the contact pin after being removed. According to a third aspect of the present invention, in the contact probe, a film covering the plurality of pattern wirings, each of which has a tip portion forming a contact pin, including the tip portion is adhered to the plurality of pattern wirings via an adhesive. A mask is applied except for the tip of the contact pin,
At the tip of the contact pin, a metal layer is formed by a plating process, the mask is removed, the metal layer is molded, and a projection made of the metal layer is formed at the tip of the contact pin. It is characterized by becoming.

Here, in the contact probe in which the contact pins protrude from the film, a protruding portion is formed by bonding a metal such as gold to the tip of the contact pin, or the protruding portion of the contact pin is formed. A portion other than the portion to be formed is covered with a mask, and a projection is formed by forming a metal layer on a portion not covered with the mask by plating in this state. However, when the protrusions are formed by bonding, the protrusions are made of a relatively soft metal such as gold, and the protrusions are used when scrubbing an object to be inspected or cleaning the tip of a contact pin. It is easy to wear, and the effect of the protruding part is easily lost by repeated use. When the projection is formed by plating,
Since the entire contact pin is in an exposed state, if a plating process is simply performed, a plating metal grows in a spherical shape at the tip of the contact pin, and depending on the degree of the growth, adjacent contact pins may come into contact with each other. In order to prevent such contact between the contact pins, it is preferable to perform plating after covering other portions than the portions where the projections are formed with a mask. However, in such a fine contact pin, only a portion where a protrusion is formed is exposed,
Moreover, it was not easy to cover other portions with a mask. On the other hand, in the contact probe according to claim 2 of the present invention, the film is applied to the pattern wiring so as to protrude further to the tip end than the tip end of the contact pin, and the tip of the contact pin is attached to the pattern wiring. By applying the mask except for the portion adjacent to the portion, only the portion where the protrusion is to be formed is exposed, and other portions other than the portion can be easily covered with the mask. Then, a metal layer thicker than the contact pins is formed in a portion adjacent to the tip portion (portion where the mask is not applied) by plating, and the mask is removed. A projection made of a metal layer can be formed. Further, in the contact probe according to the third aspect of the present invention, the film is attached to the tip of the contact pin, and the film is attached to the pattern wiring via an adhesive, and the pattern wiring is bonded. Filled with the agent. Then, by applying a mask to the pattern wiring except for the end portions of the contact pins, only the portion where the protrusion is formed is exposed, and the other portions can be easily covered with the mask and the adhesive. . Thereby, the mask shape can be made simple. Then, a metal layer is formed by plating on the tip of the contact pin that is not masked, the mask is removed, and the metal layer is formed. Can be formed. The projection can be formed by removing unnecessary portions by, for example, laser processing.

Here, for example, when a foreign substance is attached to the inspection object or the inspection object has an irregular shape, the contact pin is over the foreign object or the convex portion of the inspection object during overdrive. Excessive stress is applied to the contact pins due to riding up. Then, in the case of a contact probe with the contact pins protruding from the film, the base of the contact pins is plastically deformed due to this stress, and the contact pins are likely to be warped. There is a risk that contact will be lost. In contrast, claim 2 of the present invention
Or, in the contact probe according to 3, the film is applied to the tip of the contact pin, and when the contact pin receives stress during overdrive,
The contact pins will flex with the film as a whole while being supported by the film. For this reason,
Since the stress applied to the contact pins is not dispersed and acts locally, the contact pins are less likely to be plastically deformed, and the contact pins are less likely to have poor contact in the next test.

A contact probe according to a fourth aspect of the present invention is a contact probe in which the tips of a plurality of pattern wirings on which a film is adhered project from the film to form contact pins. A plurality of contact probe portions each having the film adhered to the pattern wiring, and the plurality of contact probe portions surround the object to be inspected by directing each set of the contact pins toward the object to be inspected. The contact pins are connected to each other in a state where they are arranged, and a protrusion is provided at a tip end of the contact pin.

In the contact probe configured as described above, since the projections are provided at the tip portions of the contact pins, the inclination angles of the contact pins and the tip portions of the contact probe portions can be reduced. In a state where a plurality of contact probe parts are spread out on a plane, for example, the contact pins of two adjacent contact probe parts can be formed at positions not in contact with each other, and furthermore, the tip of the contact probe part when attached to the probe device By making the inclination angle of the portion small, it is possible to contact each of the rows of closely arranged pads. In addition, since each contact probe section is connected to each other and can be handled collectively, conventionally, a plurality of contact probes are individually created corresponding to the electrodes of the inspection object, and then the contact pins and the electrodes are respectively formed. In contrast to the above-described positioning, it is possible to reduce the trouble in the positioning step and to easily and accurately position the pitch and the height of the contact pins.
Here, in this contact probe, two adjacent contact probe portions may be connected in a state where respective sets of contact pins are substantially orthogonal to each other, and in this case, a general shape of an IC chip is used. And a substantially rectangular IC chip.

In the probe device according to the present invention, a contact probe in which a tip end of a pattern wiring formed on a film protrudes from the film to be a contact pin is mounted on a mechanical part, and the contact pin is attached to an object to be inspected. In the probe device, the contact probe is formed such that a protrusion is formed at a tip of the contact pin, and the contact pin is inclined at an angle of 10 ° or less with respect to the inspection object. The projection is abutted at an angle.

In the probe device thus configured, a projection is provided at the tip of the contact pin, and the electrode of the object to be inspected is scrubbed satisfactorily by the projection. Can be smaller. Thereby, the scrub length of the contact pin at the time of overdrive can be shortened, and it is possible to cope with an electrode having a short length in the scrub direction. Also, since the projections provide a portion other than the tip of the contact pin apart from the object to be inspected, even if the inclination angle of the contact pin is reduced, for example, interference between the passivation provided on the electrode and the contact pin may be prevented. Can be avoided. Here, when the inclination angle of the contact pin is larger than 10 °, the scrub length of the contact pin becomes long, and it becomes impossible to cope with an electrode having a short length in the scrub direction. Therefore, the inclination angle of the contact pin is set to 10 ° or less. Further, if the inclination angle of the contact pin is smaller than 3 °, the contact angle of the contact pin with respect to the electrode of the inspection object also becomes small, and the force for pressing the tip of the contact pin against the electrode becomes small. There is a possibility that the portion slips on the surface of the electrode and good scrub is not performed.
Further, there is a possibility that other parts other than the tip of the contact pin may interfere with the inspection object. For this reason, it is preferable that the inclination angle of the contact pin be 3 ° or more.

According to a seventh aspect of the present invention, there is provided a method for manufacturing a contact probe, wherein a tip portion of a pattern wiring formed on a film is used as a contact pin, wherein the pattern wiring includes the contact. Applying a mask except for a portion adjacent to the tip of the pin, and forming a metal layer thicker than the contact pin by plating on a portion adjacent to the tip, A mask removing step of removing the protrusions made of the metal layer to expose the protrusions. In this method for manufacturing a contact probe, a film is applied to the pattern wiring so as to protrude further to the tip side than the tip end of the contact pin, so that the pattern wiring excludes a portion adjacent to the tip end of the contact pin. By applying the mask, only the portion where the protrusion is formed can be exposed, and the other portions can be easily covered with the mask. Then, a metal layer thicker than the contact pins is formed in a portion adjacent to the tip portion (portion where the mask is not applied) by plating, and the mask is removed. A projection made of a metal layer can be formed.

According to a eighth aspect of the present invention, there is provided a method for manufacturing a contact probe, wherein a tip portion of a pattern wiring formed on a film is used as a contact pin. A mask is applied except for the tip of the contact pin, and a plating step of forming a metal layer by plating on the tip of the contact pin, removing the mask, forming the metal layer to form a protrusion. And forming a protrusion. In this method of manufacturing a contact probe, a film is applied to the tip of the contact pin, and the space between the pattern wirings is filled with an adhesive for applying the film to the pattern wirings. Then, by applying a mask to the pattern wiring except for the end portions of the contact pins, only the portion where the protrusion is formed is exposed, and the other portions can be easily covered with the mask and the adhesive. . Thereby, the mask shape can be made simple. Then, a metal layer is formed by plating on a portion where the mask is not applied, the mask is removed, and the metal layer is formed, thereby forming a protrusion made of the metal layer at the tip of the contact pin. Can be. Here, the protrusion can be formed by removing an unnecessary portion by, for example, laser processing.

[0023]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS [First Embodiment] A first embodiment of the present invention will be described below with reference to FIGS. 1 to 8. Will be described using the same reference numerals. 1 is a perspective view of a tip portion of the contact probe, FIG. 2 is a cross-sectional view of the entire contact probe shown in FIG. 1, taken along line AA, and FIG. 3 is a perspective view of a contact pin of the contact probe according to the embodiment as viewed obliquely from below. FIG. 4 is a side view showing a state where the contact pins according to the embodiment are brought into contact with the pads of the IC chip.

Contact probe 31 of the present embodiment
Has substantially the same configuration as the contact probe 1 shown in FIG. 17, and as shown in FIG. 1, a pattern wiring 32 formed of a metal such as a Ni-based alloy is
3 is attached to one side. Pattern wiring 3
2 is formed as a contact pin 32 a protruding from the front end Fa of the film 33.

As shown in FIGS. 1 and 2, the film 33 is applied on a plurality of pattern wirings 32 composed of a Ni-based alloy layer (second metal layer) via an adhesive layer (not shown). , Protruding from the film 33 are formed as contact pins 32a. As shown in FIG. 2, a window 4 is formed in the wide base Fb of the film 33, and the window 4 is provided with lead-out wiring portions 35 for the pattern wirings 32. Here, the film 33 is formed by laminating a metal film layer 37 of Cu, Ni, Ni-based alloy or the like as a ground on a resin film layer 36 of polyimide or the like on which the pattern wiring 32 is adhered. It may be constituted only by the film layer 36. Further, the film 33 is provided with a positioning hole for positioning and fixing the contact probe 31, for example, and a positioning pin is inserted into the positioning hole so that the mounting position on the probe device is positioned. It may be.

The cross section orthogonal to the longitudinal direction of the contact pin 32a has, for example, a substantially rectangular shape.
As shown in the figure, the front end has a surface connected to the surface to be attached to the film 33 as an upper surface 41, a lower surface 42 facing the upper surface 41, and a side surface 43 provided between the upper and lower surfaces 41, 42.
The lower surface 42 is formed with a protrusion 44 that can be brought into contact with the pad 18a of the IC chip 18. Since the tip of the contact pin 32a has a substantially semi-disc shape, the tip 43a of the side surface 43 has a substantially cylindrical peripheral curved shape.

The projection 44 is formed by plating Ni, a Ni-based alloy or other metal on the lower surface 42.
When the width W of the contact pin 32a in the longitudinal direction is reduced by scrubbing the pad 18a of the IC chip 18, the protrusion 44 moves in the direction of the scrubbing pad 18a as shown in FIG.
a within the range in which the contact pins 32a do not contact the passivations 26A, 26B located at both ends (in FIG. 4, the symbols 26A, 26B are given to the passivations 26, 26 for convenience), the start point of the maximum scrub length (dashed-dotted line). ) To an end point (a state indicated by a two-dot chain line) so as not to come into contact with the passivation 26. That is, if the length L1 of the region of the pad 18a not covered with the passivation 26 is, for example, 45 μm,
The width W is preferably within 10 μm. Further, the protrusion amount H of the protrusion 44 from the lower surface 42 is ensured such that the portion other than the protrusion 44 of the contact pin 32a does not contact the pad 18a and the passivation 26 when the protrusion 44 is brought into contact with the pad 18a. Have been. That is, the height h of the passivation 26 from the pad 18a is, for example, 5
μm, the protrusion amount H is 3 μm or more, preferably 5 μm.
m or more. When the protrusion amount H of the protrusion 44 is smaller than 3 μm, the portion of the contact pin 32a other than the protrusion 44 during the overdrive is the pad 18a.
Too close to the passivation 26 and the pad 18a
Or it may be damaged by contact with the passivation 26. In order to reduce the scrub length of the pad 18a due to the tip of the contact pin 32a,
Since the width W of the protrusion 44 in the longitudinal direction of the contact pin 32a is set to be short, when the protrusion H is larger than 100 μm, the protrusion H of the protrusion 44 becomes smaller than the contact pin 32a of the protrusion 44. Becomes larger than the width W in the longitudinal direction. The contact pin 32a is the pad 18
When the protrusion amount H is too large, the protrusion 44 may be bent due to the stress received during the scrub.
For this reason, the protrusion amount H of the projection 44 is set to 3 μm or more, and preferably 100 μm or less.

In order to fabricate such a contact probe 31, a contact lithography / plating method using a mask exposure technique as shown in FIG.
Produce a prototype with almost the same configuration as. Thereafter, a mask is applied to the contact pins 32a of the exposed pattern wirings 32, which are protruded from the film 33, except for the lower surface 42 (the surface facing the side opposite to the film 33) at the tip. In this state, only the tip of the contact pin 32a is plated with Ni or a Ni-based alloy.
As a result, a protrusion 44 is formed on the lower surface 42 at the tip of the contact pin 32a.

Here, in the first embodiment, when the projection 44 is formed at the tip of the contact pin 32a, a mask is also applied to the side of the lower surface 42 so that the projection 44 is I tried not to protrude to the side,
The present invention is not limited to this, and the side surface 43 may be exposed in addition to the lower surface 42 of the tip of the contact pin 32a, or the entire tip including the upper surface 41 may be exposed. In this case, the side surface 43 and the top surface 41 are also plated with a Ni-based alloy or the like at the tip end, and a spherical projection 44 is formed on the entire tip end. It does not matter if it is within such a range that the protrusions 44 of the adjacent contact pins 32a do not contact each other.

Next, a method of incorporating the contact probe 31 of the first embodiment of the present invention into a probe device according to the present invention by adopting it as a probe for an IC and incorporating the probe into mechanical parts will be described. In the probe device according to the first embodiment, a description of the same configuration as the above-described conventional probe device 8 will be omitted. Further, the contact probe according to the present invention functions as a flexible substrate when incorporated in a probe device because the contact probe is entirely flexible and easily bent.

First, the contact probe 31 is placed on the mounting base 12. At this time, the contact probe 31 is provided with the film 33 side abutting on the mounting base 12. Then, for example, the mounting base 1 is inserted into an alignment hole provided in the film 33.
By inserting the positioning pins provided in 2, the contact pins 32 a of the contact probe 31 are aligned with the IC chip 18. Here, the number of the contact probes 31 is used according to the number of sides on which the pads 18a of the IC chip 18 are formed.

In this state, as in the conventional case, the top clamp 11 is mounted on the printed board 10 having a disk shape and having the center window 10a, and the mounting base 12 having the contact probe 31 mounted on the lower surface 12a.
Is fixed to the top clamp 11 with bolts or the like. Then, the base F of the contact probe 31 is
Hold down b. As a result, as shown in the vertical sectional view of the main part of the probe device of FIG.
The front end portion Fa of the contact probe 32 has a part on the side from which the contact pins 32a protrude protrude from the mounting base 12 and is held on the lower surface 12a of the mounting base 12 in a downwardly inclined state. In Fb, the lead-out wiring portions 5 of the pattern wirings 32 are pressed by the elastic body 15 of the bottom clamp 14 through the window portion 4 to the electrodes 16 on the lower surface of the printed circuit board 10 and are kept in contact.

Here, in the probe device of the present invention, the lower surface 12a of the mounting base 12 is gradually inclined downward from the side where the base Fb of the contact probe 31 is located toward the side where the contact pins 32a are located. The inclination angle θ is set to about 10 °. Each of the contact probes 31 is tilted by about 10 ° with respect to the base Fb by bringing its tip Fa into contact with the lower surface 12a of the mounting base 12, and the contact pins 32a protruding from the tip of each contact probe 31 are formed. Are also inclined by about 10 ° with respect to the base Fb. That is, when the contact pins 32a are brought into contact with the pads 18a of the IC chip 18, which is the inspection object,
For example, assuming that the pad 18a is arranged horizontally, the pad 1
8a is about 1
It is set to 0 °. Further, in the present embodiment, the front end Fa of each contact probe 31 is provided between the lower surface 12 a of the mounting base 12 and each contact probe 31.
A part of the thin plate 4 made of an elastic body having a thickness of about 0.1 mm is projected from the mounting base 12 in the same manner as
5 are interposed. This is because only the contact probe 31 composed of the film 33 and the pattern wiring 32 is too soft, and the portion protruding from the mounting base 12 may be bent immediately when overdrive is applied. 45 from the upper surface side to provide a spring property,
Needle pressure is secured. As the thin plate 45, for example, a metal plate or the like is used. Note that the thin plate 45 does not necessarily have to be attached.

Contact probe 3 according to the present embodiment
The probe device incorporating the contact probe 1 and the contact probe 31 is configured as described above, and its operation will be described below. As shown in FIG. 4, the contact pin 32a
The inclination angle θ of the IC chip 18 with respect to the pad 18a is set to about 10 °. Then, the contact pin 32
As described above, the projection 44
Are formed. At this time, each contact pin 32a
Is in a state in which the protrusion 44 is located between the passivations 26A and 26B and is close to the passivation 26A and is indicated by a non-contact dashed line (this position is a starting point). From this state, if the pad 18a is relatively moved with respect to the contact pin 32a by applying overdrive and the protrusion 44 is pressed against the surface of the pad 18a and scrubbed, the pad 18a is moved by the protrusion 44.
(For example, an aluminum oxide film) can be peeled off. Then, the contact portion 32 is scrubbed to a position (an end point) indicated by a two-dot chain line immediately before the protrusion 44 of the contact pin 32a contacts the other passivation 26B.

At the time of the above scrub, the contact pins 32
a is an IC formed by a projection 44 provided on the lower surface 42 of the tip end.
The surface of the pad 18a is scrubbed by contacting the pad 18a of the chip 18. At this time, the contact pin 32a
The provision of the projections 44 causes portions other than the tip portion to be separated from the surface of the pad 18a. Thereby, the contact pin 32a and the passivation 2
6A is avoided, and the passivation 26 is not damaged.

FIG. 6 schematically shows the scrubbing operation of the contact pin 32a when overdriving is performed using this probe device. Here, FIG. 6A is a side view showing a state where the contact pins according to the embodiment are brought into contact with the pads of the IC chip, and FIG.
FIG. 4 is a side view showing a state in which overdrive is applied from the state of FIG. Here, as shown in FIG. 6, the projection amount of the contact pin 32a from the mounting base 12 is L, and the inclination angle of the contact pin 32a with respect to the pad 18a in the initial state is θ. The overdrive amount OD is determined by the amount of the pad 18a and the contact pin 32
The amount that the pad 18a moves while the pad 18a relatively presses the contact pin 32a from the state where the contact a has started to contact (the state of FIG. 6A). The relationship between the overdrive amount OD for each inclination angle of the contact pin 32a and the scrub length S of the contact pin 32a obtained from FIG. 6 is shown in the table of FIG. 7 and the graph of FIG. Here, the values in the table shown in FIG.
This is a numerical value when friction between the pad 2a and the pad 18a is not considered, and the value of the scrub length S shown here indicates the maximum scrub length for each overdrive amount OD.

As shown in the table of FIG. 7 and the graph of FIG.
Conventional contact pin 32a inclination angle (θ = 20 °)
In the case of (1), the scrub length in the case of the inclination angle (θ = 10 °) of the contact pin 32a in the first embodiment is almost half or less. As a result,
Even if the size of the pad 18a is reduced to about half, the scrub can be performed well. Also, the contact pins 32
The case where the inclination angle θ of a is 5 ° is also shown. In this case, the scrub length is about half that of θ = 10 °,
That is, it is about one-fourth of θ = 20 °. However, if the inclination angle of the contact pin 32a is smaller than 3 °, the protrusion 44
There is a possibility that the scrubbing may not be performed properly due to the shape slipping on the surface 8a, and there is a possibility that other parts than the tip of the contact pin may interfere with the inspection object. And
If the inclination angle of the contact pin 32a is larger than 10 °, the scrub length of the contact pin 32a becomes longer, and it becomes impossible to cope with the pad 18a having a shorter length in the scrub direction. For this reason, the inclination angle of the contact pin 32a is set to 3 ° or more and 10 ° or less.
The appropriate inclination angle θ of the contact pin 32a depends on the material of the pad 18a and the protrusion 4 of the contact pin 32.
Since it also changes depending on conditions such as the shape of No. 4, it is desirable to set an appropriate range according to each condition.

As described above, according to the contact probe 31 and the probe device of the first embodiment, the projection 44 is provided at the tip of the contact pin 32a.
Since the protrusions 44 scrub the pads 18a of the IC chip 18 satisfactorily, the inclination angle of the contact pins 32a can be reduced. Thereby, the scrub length S of the contact pin 32a at the time of overdrive is shortened, and the pad 18a having a short length in the scrub direction is reduced.
Can be handled. Further, since the projection 44 provides a portion other than the tip of the contact pin 32a apart from the pad 18a, even if the inclination angle of the contact pin 32a is reduced, the passivation 26 provided on the pad 18a and the contact pin 32a can be avoided.

[Second Embodiment] Next, FIGS.
The second embodiment of the present invention will be described with reference to FIG. 1, but the same or similar parts as those of the first embodiment of the present invention will be described using the same reference numerals. FIG. 9 is a cross-sectional view illustrating a contact probe according to the second embodiment, and FIGS. 10 and 11 are diagrams illustrating manufacturing steps of the contact probe according to the second embodiment. The contact probe 46 shown in the present embodiment is different from the contact probe 31 shown in the first embodiment in that the film 33 is formed by projecting the plurality of pattern wirings 32 further to the tip side than the tip part forming the contact pin 32a. It was attached. Next, with reference to FIGS. 10 and 11, the steps of forming the contact probe 46 will be described in the order of steps.

[Base Metal Layer Forming Step (First Metal Layer Forming Step)] First, as shown in FIG. 10A, a base metal is formed on a stainless steel supporting metal plate 56 by Cu (copper) plating. A layer (first metal layer) 57 is formed.

[Pattern Forming Step] After forming a photoresist layer 58 on this base metal layer 57, FIG.
As shown in FIG. 10B, a photomask 59 having a predetermined pattern is applied to the photoresist layer 58 by photolithography and exposed, and as shown in FIG. 10C, the photoresist layer 58 is developed and An opening 58a is formed in the remaining photoresist layer (mask) 58 after removing the portion to be the pattern wiring 32.

In this embodiment, the photoresist layer 58 is formed of a negative photoresist.
A desired opening 58a may be formed using a positive photoresist. Here, in the case where the photoresist layer 58 is formed of a negative type photoresist, a portion exposed to light at the time of exposure remains, so that the remaining photoresist layer 58 has a bottom surface which is hardly exposed to light than an upper surface side which is easily exposed to light. The width of the opening 58a tends to be narrower, and the width of the opening 58a is more likely to be wider on the bottom surface than on the upper surface.
On the other hand, in the case where the photoresist layer 58 is formed of a positive type photoresist, a portion not exposed to light at the time of exposure remains.
There is a tendency that the width of the bottom surface, on which light does not easily hit, is larger than that of the top surface, on which light easily hits. That is, in the pattern wiring formed in the opening 58a, the IC chip 1
8 tends to be narrower on the side facing the pad 18a. In the present embodiment, the photoresist layer 58
Corresponds to the “mask” in the claims of the present application. However, the term “mask” in the claims of the present application refers to an exposure / photomask using a photomask 59 like the photoresist layer 58 of the present embodiment.
The invention is not limited to the one in which the opening 58a is formed through the development process. For example, an opening 58a is formed in advance in a portion to be plated (that is, FIG.
A film or the like (formed in a state indicated by reference numeral 58 in (c)) may be used. In the present invention, when such a film or the like is used as a “mask”, the pattern forming step in the present embodiment is unnecessary.

[First Plating Process] And FIG.
As shown in (d), a Ni-based alloy layer (second metal layer) N to be the pattern wiring 32 is formed in the opening 58a by electrolytic plating. Here, the second metal layer is
It is not limited to the Ni-based alloy, and may be made of Ni. After the plating, the photoresist layer 58 is removed as shown in FIG.

[Film Adhering Step] Next, FIG.
As shown in FIG. 3, on the Ni-based alloy layer N, the contact pins 32a shown in FIG.
The film 33 is adhered with an adhesive 60 so as to protrude further to the distal end side than the portion which becomes the distal end portion of the film 33.

[Separation Step] Then, as shown in FIG. 10 (g), after the portion consisting of the film 33, the pattern wiring 32 and the base metal layer 57 is separated from the supporting metal plate 56, the portion is cut through Cu etching. Then, only the pattern wiring 32 is adhered to the film 33.

[Second Plating Process] Then, as shown in the plan view of FIG. 11A, the pattern wiring 32 is formed on the film 33 by the same operation as the formation of the photoresist layer 58 in the pattern forming process. A mask 61 is applied to the side to be attached except for a portion adjacent to the tip end of the pattern wiring 32, and as shown in the cross-sectional view of FIG. To
Third metal layer M thicker than contact pin 32a
Is formed by plating to form the actual tip of the contact pin 32a and the projection 44. The third metal layer M is made of Ni, a Ni-based alloy, or the like, like the pattern wiring 32. Here, since it is difficult to form the mask 61 on the contact pins 32a with a thickness exceeding 50 μm, the thickness of the portion of the third metal layer M located on the contact pins 32a (ie, the protrusions 44). Is preferably 50 μm or less. In the pattern forming step, when the photoresist layer 58 is formed of a positive photoresist to reduce the width of the pattern wiring formed in the opening 58a on the side facing the pad 18a of the IC chip 18, the third Of the metal layer M of the IC chip 18 on the side facing the pad 18a, that is, the width of the protrusion 44, can be reduced.
Is hard to protrude from the pad 18a.

[Mask Removal Step] Then, the mask 61 is removed to expose the projection 44 made of the third metal layer, and the contact probe 46 is completed.

In the contact probe 46 configured as described above, since the film 33 is applied to the tip of the contact pin 32a, when the contact pin 32a is incorporated in the probe device 8 and overdriven to apply stress to the contact pin 32a. , The contact pins 32 a
As shown by the two-dot chain line in FIG.
It will bend as a whole with the film 33. For this reason, for example, foreign matter adheres to the pad 18a,
The pad 18a has an irregular shape, and the contact pin 32a which has contacted the pad 18a during overdrive.
When excessive stress is applied to the contact pins 32,
Since the stress applied to a is not dispersed and acts locally, the plastic deformation of the contact pin 32a is hardly generated, and the contact failure of the contact pin 32a is hardly generated in the next test. .

According to the method of manufacturing the contact probe, the contact pins 32a
Of the film 3
3 is applied, the mask 61 is applied to the side of the film 33 on which the pattern wiring 32 is applied, except for the portion adjacent to the front end portion, so that other portions other than the portion where the projection 44 is formed are provided. Can be easily covered with the mask 61,
The manufacturing process can be simplified, and the contact probe 46 can be easily manufactured.

[Third Embodiment] Next, FIGS.
The third embodiment of the present invention will be described with reference to FIG. 3, but the same or similar parts as those of the second embodiment of the present invention will be described using the same reference numerals. FIG. 12 and FIG.
FIG. 3 is a diagram showing a manufacturing process of the contact probe according to the third embodiment. The method for manufacturing a contact probe according to the present embodiment is for manufacturing a contact probe 47 having substantially the same configuration as the contact probe 46 shown in the second embodiment. The manufacturing method of the contact probe shown in
The film deposition step and the subsequent steps are different.
Next, referring to FIG. 12 and FIG.
Regarding the forming step of No. 7, the film applying step and the subsequent steps will be described in the order of the steps.

[Film Adhering Step] A forming step prior to the present forming step (first plating step shown in FIG. 10D and work of removing the photoresist layer 58 shown in FIG. 10E).
After that, the film 33 is projected on the Ni-based alloy layer N further to the tip side than the contact pin 32a (that is, the tip of the pattern wiring 32) shown in FIG. Are bonded by an adhesive 60. At this time, as shown in FIG.
The amount of the adhesive 60 is adjusted so as to protrude from between the film 33 and the pattern wiring 32, and the space between the pattern wirings 32 is filled with the adhesive 60.

[Separation Step] Then, as shown in FIG. 12 (b), after the portion consisting of the film 33, the pattern wiring 32 and the base metal layer 57 is separated from the supporting metal plate 56, the portion is separated by Cu etching. Then, only the pattern wiring 32 is adhered to the film 33.

[Second Plating Process] And FIG.
As shown in FIG. 13C and the plan view of FIG.
A mask 61 is applied to the side of the substrate which is to be adhered to the pattern wiring 32 except for the tip of the contact pin 32a, and a third metal layer M such as Ni or a Ni-based alloy is applied to a portion where the mask 61 is not applied. Is formed by plating. Here, since the adhesive 60 filling the space between the pattern wirings 32 also serves as a mask, the third metal layer M grows in a mushroom shape around a portion exposed at the tip of the contact pin 32a. .

[Protrusion Forming Step] Then, FIG.
As shown in FIG. 6, the mask 61 is removed, and unnecessary portions of the third metal layer M, such as portions that protrude between the adjacent pattern wirings 32, are cut out by laser processing or the like and formed to form protrusions. 44 is formed, and the contact probe 47 is completed. Here, of the third metal layer M,
Since the portion protruding from above the pattern wiring 32 is thin, it can be easily removed. If the maximum thickness of the third metal layer M is larger than 50 μm, the thickness of the unnecessary portion of the third metal layer M becomes too large to be easily removed, so that the maximum thickness of the third metal layer M ( That is, the protrusion amount H) of the protrusion 44 is preferably set to 50 μm or less.

According to the method of manufacturing the contact probe thus configured, the film 33 is applied to the tip of the contact pin 32a and the space between the contact pins 32a is filled with the adhesive 60. By applying the mask 61 to the side to be adhered to the wiring 32 except for the tip, the other portions other than the portion where the protrusion 44 is formed can be easily covered with the mask 61 and the adhesive 60. Thus, the mask shape can be made simple, the manufacturing process can be further simplified, and the contact probe 47 can be easily manufactured.

[Fourth Embodiment] Next, a fourth embodiment of the present invention will be described with reference to FIGS. 14 to 16, but the same or the same as the first embodiment of the present invention will be described. Similar parts will be described using the same reference numerals. FIG. 14 is a plan view showing the entire contact probe according to the second embodiment, and FIG. 15 is a side view schematically showing a state where the contact probe is mounted on a probe device and a state where the contact probe is developed on a plane. 16 is a contact probe of the fourth embodiment mounted on the probe device according to the present invention,
The tips of the contact pins of two adjacent contact probe portions (described later), and these contact pins and the IC
FIG. 3 is a plan view of a main part showing a positional relationship with a chip pad.
Here, in the fourth embodiment, the IC chip has a substantially square shape, and pads are provided along each side thereof.

The contact probe 51 is formed by connecting four contact probes 31 shown in the first embodiment. Each contact probe 31 is connected to a first contact probe section 31a and a second contact probe section. 3
1b, a third contact probe section 31c, and a fourth contact probe section 31d. Further, a film to be attached to the pattern wiring 32 in the first contact probe portion 31a is a first film 33a, and similarly, the second, third, and fourth contact probe portions 31b, 31
c, 31d films into second, third and fourth films 3
3b, 33c, and 33d. The adjacent contact probe portions are arranged in directions substantially orthogonal to each other, and each of the films 33a, 33b, 33c, 33d
Are interconnected.

These first to fourth films 33a to 33
d indicates that the contact pins 32a are connected to the IC chip 18 respectively.
In the state arranged so as to surround the IC chip 18 toward the four pad rows on the four sides, the portion other than the side from which the contact pins 32a protrude, in the present embodiment, the base F of each film
b to form a single film. Thereby, the first to fourth contact probe sections 31a to 31a-3
1d indicates that the contact pin 32a is the IC chip 1
8 are connected in a state where they are aligned with the pads 18a provided on the respective sides. Further, each contact probe section can be handled collectively. Conventionally, a plurality of contact probes are individually prepared corresponding to the pads 18a of the IC chip 18, and then the contact pins and the pads 18a are respectively formed.
In contrast to the above-described positioning, it is possible to reduce the trouble in the positioning step and to easily and accurately position the pitch and the height of the contact pins 32a.

In the first to fourth contact probe portions 31a to 31d, each of the films 33a to 33d
The tip portions Fa are independent of each other without being connected to each other, so that the tip portion Fa can be bent with respect to the base portion Fb. And each of the films 33a-3
Protrusions 44 are respectively formed on the lower surface 42 of the contact pin 32a protruding from 3d. Thereby, the contact probe 31 of the first embodiment
Similarly, the contact probe portions 31a to 31d of the contact probe 51 have a smaller inclination angle of the tip Fa of each of the films 33a to 33d and the contact pins 32a with respect to the pad 18a of the IC chip 18 as compared with the conventional contact probe. can do.

In the contact probe 51, each of the contact probe portions 31a to 31d is formed in the same manner as the contact probe 31 shown in FIG.
And the mounting base 12 is attached to the probe device according to the present invention. Here, in the probe device according to the present invention, the lower surface 12a of the mounting base 12 is provided so as to be gradually inclined downward from the side where the base Fb of each contact probe portion is located toward the side where the contact pins 32a are located. The inclination angle θ is about 10 °. Thereby, each contact probe part 31a-
31d is a front end F of each of the films 33a to 33d.
a is tilted about 10 ° with respect to the base Fb by abutting the lower surface 12a of the mounting base 12, and the contact pins 32a protruding from the tips of the films 33a to 33d are also about 10 ° with respect to the base Fb. Inclined. Further, each of the contact probe units 31a to 31d includes
Similar to the contact probe 31 shown in FIGS. 5 and 6, a part of the tip Fa on the side where the contact pin 32 a projects is protruded from the mounting base 12. Here, between the lower surface 12a of the mounting base 12 and each contact probe portion, a part of the contact probe portion protrudes from the mounting base 12 in the same manner as the first embodiment, as in the first embodiment. Thus, the thin plate 45 made of an elastic body can be interposed.

Here, as shown in FIG. 15, in the first contact probe portion 31a, the first film 33a
Let D be the length from the base of the tip end Fa inclined to the base Fb to the tip of the contact pin 32a.
When the contact probe 51 is developed on a plane (FIG. 1)
5 when the state is shown by a two-dot chain line) and when mounted on the probe device (when the state is shown by a solid line in FIG. 15).
In, the dimensional difference of the contact probe portion 31a in the direction parallel to the base Fb is D (1−cos θ). Assuming that this dimensional difference is d1, d1 = D (1-cos10 °) and cos10 ° = 0.885 (shown by three significant digits). Therefore, the dimensional difference d1 is determined from the base of the front end Fa to the contact pin. About 1.5% of the length D to the tip of 32a
It is.

The first contact probe section 31a
, The case where the contact probe 51 is unfolded on a plane, and the case where the tip Fa is inclined with respect to the base Fb by the conventional inclination angle (θ = 20 °) (the state shown by the dashed line in FIG. 15) , The dimensional difference d2 of the contact probe portion 31a in the direction parallel to the base Fb is d2 = D
(1−cos 20 °). cos20 ° = 0.94
0 (indicated by three significant digits), the dimension difference d2
Is about 6% of the length D from the base of the tip Fa to the tip of the contact pin 32a. Then, similarly for the other contact probe portions 31b, 31c, 31d,
The dimensional difference d1 of the contact probe portion in the direction parallel to the base portion Fb between the case where the contact probe 51 is developed on a plane and the case where the contact probe is mounted on the probe device is the length from the base of the tip portion Fa to the tip of the contact pin 32a. About 1.5% of D.

That is, the contact probe 5 according to the present invention
According to No. 1, the dimensional difference in the direction parallel to the base Fb of each of the contact probe portions 31a to 31d before and after mounting on the probe device according to the present invention, that is, the state shown by the broken line in FIG. It is possible to reduce the dimensional difference from the state shown in FIG.
31d only). This allows the contact probe 51 to be used at the manufacturing stage or at the time of attaching to the probe device.
Can be manufactured with a slight clearance so that the contact pins of two contact probe portions that are substantially orthogonal to each other and adjacent to each other do not overlap with each other,
In addition, since the inclination angle θ is small in a state where the pad 18a is mounted on the probe device, it can be brought into contact with each row of closely arranged pads 18a.

In the first and fourth embodiments, the projection 44 provided on the contact pin 32a is
The contact pins 32a can be formed by bonding, instead of being formed by plating. In the fourth embodiment, the IC chip 18
Is a substantially square shape, and the contact probe 51 is an IC
Four contact probe portions were provided corresponding to each side of the chip 18. However, without being limited to this, according to the arrangement of the pads of the IC chip to be inspected,
By changing the direction and number of contact probe parts,
A wide variety of pad arrangements can be supported. Here, in the fourth embodiment, the contact probe 51 has a configuration in which a plurality of contact probes 31 shown in the first embodiment are connected. However, the present invention is not limited to this. For example, the configuration may be such that a plurality of contact probes 46 shown in the second embodiment or a plurality of contact probes 47 shown in the third embodiment are connected.

[0065]

According to the present invention, the following effects can be obtained.
According to the contact probe of the first aspect, the projection is provided at the tip of the contact pin, and the electrode of the inspection object is scrubbed satisfactorily by the projection.
By reducing the inclination angle of the contact pin, the scrub length of the contact pin during overdrive can be reduced, and it is possible to cope with an electrode having a short length in the scrub direction. Also, since the projections provide a portion other than the tip of the contact pin apart from the object to be inspected, even if the inclination angle of the contact pin is reduced, for example, interference between the passivation provided on the electrode and the contact pin may be prevented. Can be avoided.

According to the second aspect of the present invention, since the film is attached to the pattern wiring so as to protrude further to the tip end than the tip end of the contact pin, the film is attached to the pattern wiring in the film. Beside
By applying the mask except for the portion adjacent to the tip portion, other portions other than the portion where the protrusion is formed can be easily covered with the mask, and the manufacturing process of the contact probe can be simplified. In addition, since the film is applied to the tip of the contact pin, when it is incorporated in the probe device and overdriven, and stress is applied to the contact pin, the contact pin is supported by the film, and the entire contact pin is supported together with the film. Will bend. For this reason, for example, when a foreign object is attached to the inspection object, or the inspection object has an irregular shape, and excessive stress is applied to the contact pin during overdrive,
Since the stress applied to the contact pins is not dispersed and acts locally, the contact pins are less likely to be plastically deformed, and the contact pins are less likely to have poor contact in the next test.

According to the contact probe of the third aspect of the present invention, the film is applied to the tip of the contact pin, and the space between the pattern wirings is filled with an adhesive for applying the film to the pattern wirings. Therefore, by applying a mask to the side of the film on which the pattern wiring is to be attached, except for the end portion, it is possible to easily cover other portions other than the portion where the projection is formed with the mask and the adhesive. Thereby, the mask shape can be made simple, and the manufacturing process can be further simplified.

According to the contact probe of the fourth aspect, since the projection is provided at the tip of the contact pin, the inclination angle of the contact pin can be reduced. Thus, in a state where a plurality of contact probe portions are developed on a plane at the time of manufacturing or the like, for example, contact pins of two adjacent contact probe portions can be formed at positions not in contact with each other, and when the probe is mounted on a probe device. By reducing the inclination angle of the tip portion of the contact probe portion, it is possible to make contact with the rows of closely arranged pads. In addition, since each contact probe section is connected and can be handled collectively, conventionally, a plurality of contact probes are individually created corresponding to the electrodes of the inspection object, and then the contact pins and the electrodes are respectively formed. While positioning was done,
It is possible to reduce the trouble in the positioning step, and to easily and accurately position the pitch and height of the contact pins. Further, like the contact probe according to claim 5, two contact probe portions adjacent to each other among the contact probe portions may be connected in a state where respective sets of contact pins are substantially orthogonal to each other. In this case, an IC chip having a substantially rectangular shape, which is a general shape of an IC chip, can be used.

According to the probe device of the sixth aspect, since the projection is provided at the tip of the contact pin,
Even if the angle of inclination of the contact pin is reduced, the protruding portion satisfactorily scrubs the inspection object to the electrode. Thus, the inclination angle of the contact pin can be reduced, the scrub length of the contact pin during overdrive can be reduced, and an electrode having a short length in the scrub direction can be accommodated. In addition, since portions other than the tip portion of the contact pin are separated from the object to be inspected by the protrusion, even if the inclination angle of the contact pin is reduced, for example, interference between the passivation provided on the electrode and the contact pin can be avoided. .

According to the method for manufacturing a contact probe according to the seventh aspect, the film is attached to the pattern wiring so as to protrude further to the tip end than the tip end of the contact pin. By applying a mask to the side of the contact probe except for the portion adjacent to the tip, it is possible to easily cover other portions other than the portion forming the protrusion with the mask, simplifying the manufacturing process, and Can be easily manufactured.

According to the method of manufacturing a contact probe according to the eighth aspect, the film is applied to the tip of the contact pin, and the space between the pattern wirings is filled with the adhesive for applying the film to the pattern wirings. By applying a mask to the side of the film on which the pattern wiring is to be attached, except for the tip, other portions other than the portion where the protrusion is formed can be easily covered with the mask and the adhesive. Thus, the mask shape can be made simple, the manufacturing process can be further simplified, and the contact probe can be easily manufactured.

[Brief description of the drawings]

FIG. 1 is a perspective view of a distal end portion of a contact probe according to a first embodiment of the present invention.

FIG. 2 shows the entire A- of the contact probe shown in FIG.
FIG. 2 is a sectional view taken along the line A.

FIG. 3 is a perspective view of a contact pin of the contact probe according to the first embodiment of the present invention as viewed obliquely from below.

FIG. 4 is a side view showing a state where a contact pin is in contact with a pad of an IC chip in the first embodiment of the present invention.

FIG. 5 is a longitudinal sectional view of a main part of a probe device according to the present invention.

FIG. 6 is a side view schematically showing a scrubbing operation of a contact pin when overdriving is performed using the probe device according to the present invention, wherein (a) shows a state where the contact pin is brought into contact with a pad of an IC chip. (B) shows a state in which overdrive has been applied from the state of (a).

FIG. 7 is a table showing the relationship between the overdrive amount for each inclination angle of the contact pin and the scrub length of the contact pin, obtained from FIG. 6;

FIG. 8 is a graph showing the relationship between the amount of overdrive at each inclination angle of the contact pin and the scrub length of the contact pin, obtained from FIG.

FIG. 9 is a sectional view showing a contact probe according to a second embodiment of the present invention.

FIG. 10 is a view showing a manufacturing process of the contact probe according to the second embodiment of the present invention.

FIG. 11 is a view showing a manufacturing process of the contact probe according to the second embodiment of the present invention.

FIG. 12 is a diagram illustrating a manufacturing process of the contact probe according to the third embodiment of the present invention.

FIG. 13 is a diagram showing a manufacturing process of the contact probe according to the third embodiment of the present invention.

FIG. 14 is a plan view showing an entire contact probe according to a fourth embodiment of the present invention.

FIG. 15 is a side view schematically showing a state where the contact probe according to the fourth embodiment of the present invention is mounted on the probe device according to the present invention and a state where the contact probe is developed on a plane.

FIG. 16 shows the tips of the contact pins of the adjacent contact probe portions and the positional relationship between these contact pins and the pads of the IC chip in the contact probe of the fourth embodiment mounted on the probe device according to the present invention. It is a principal part top view.

FIG. 17 is a plan view of a conventional contact probe.

FIG. 18 is an exploded perspective view of a conventional probe device.

19 is a vertical sectional view of a main part of the probe device shown in FIG. 18;

FIG. 20 is a perspective view of a contact pin of a conventional contact probe viewed obliquely from below.

FIG. 21 is a side view showing a contact and a scrub state of a conventional contact pin and a pad of an IC chip.

[Explanation of symbols]

7 Mechanical parts 8 Probe device 18 IC chip (inspected object) 18a Pad (inspected object) 31, 46, 47, 51 Contact probe 32 Pattern wiring 32a Contact pin 33 Film 44 Projection 61 Mask 60 Adhesive M Third Metal layer

Claims (8)

[Claims] 1. A contact probe in which a tip of each of a plurality of pattern wirings on which a film is adhered is a contact pin, wherein a projection is provided at a tip of the contact pin; A contact probe characterized in that an amount of protrusion H from the tip is 3 μm or more. 2. A film is applied to a plurality of pattern wirings each having a tip part forming a contact pin so as to protrude further to the tip side than the tip part, and the pattern wiring is adjacent to the tip part of the contact pin. A mask is applied except for the portion, a metal layer thicker than the contact pin is formed by plating on a portion adjacent to the tip portion, and the mask is removed, and the tip of the contact pin is removed. And a projection formed of the metal layer. 3. A plurality of pattern wirings, each of which forms a contact pin, is covered with a film covering the top of the contact pin via an adhesive. Except for applying a mask, a metal layer is formed by plating at the tip of the contact pin. The mask is removed, the metal layer is formed, and the metal layer is formed at the tip of the contact pin. A contact probe comprising a projection formed of: 4. A contact probe in which each tip of a plurality of pattern wirings on which a film is adhered protrudes from the film to form contact pins, wherein the film is adhered to a pair of the pattern wirings, respectively. Having a plurality of contact probe portions, the plurality of contact probe portions are connected to each other in a state where the contact pins of the respective sets are arranged so as to surround the inspected object toward the inspected object, A contact probe, wherein a projection is provided at a tip of the contact pin. 5. The contact probe according to claim 2, wherein two adjacent contact probe portions of the contact probe portion have respective sets of contact pins substantially orthogonal to each other. 6. A contact probe in which a tip of a pattern wiring formed on a film protrudes from the film and serves as a contact pin is mounted on a mechanical part, and the contact pin is inclined with respect to an object to be inspected. In the probe device to be brought into contact with the contact probe, a projection is formed at a tip end of the contact pin, and the contact pin has an inclination angle of 10 ° or less with respect to the inspection object. A probe device characterized in that the probe device is brought into contact with the probe device. 7. A method for manufacturing a contact probe, wherein a tip of a pattern wiring formed on a film is used as a contact pin, wherein a mask is formed on the pattern wiring except for a portion adjacent to the tip of the contact pin. A plating process of forming a metal layer thicker than the contact pins by plating in a portion adjacent to the tip portion, and removing the mask to expose the protrusions made of the metal layer. A method for manufacturing a contact probe, comprising: a mask removing step. 8. A method for manufacturing a contact probe, wherein a tip of a pattern wiring formed on a film is used as a contact pin, wherein a mask is applied to the pattern wiring except for a tip of the contact pin. At the tip of the contact pin,
A method for manufacturing a contact probe, comprising: a plating step of forming a metal layer by plating; and a projection forming step of forming the projection by removing the mask and forming the metal layer.