JP3204120B2 - Contact probe and probe device having the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a contact probe which is used as a probe pin, a socket pin, or the like, and performs an electrical test by contacting each terminal of a semiconductor IC chip, a liquid crystal device, or the like, and a probe device provided with the same. (Probe card).

[0002]

2. Description of the Related Art In general, a contact pin is used to conduct an electrical test by contacting a semiconductor chip such as an IC chip or an LSI chip or each terminal of an LCD (liquid crystal display). In recent years, as the integration and miniaturization of IC chips and the like have increased, the pitch of contact pads, which are electrodes, has been reduced, and the pitch of contact pins has been required to be narrower. However, with a tungsten needle contact probe used as a contact pin, it has been difficult to cope with a multi-pin narrow pitch due to the limitation of the diameter of the tungsten needle.

On the other hand, for example, Japanese Patent Publication No. 7-820
No. 27 proposes a contact probe technique in which a plurality of pattern wirings are formed on a resin film, and the ends of these pattern wirings are arranged so as to protrude from the resin film and serve as contact pins. In this technology example, by using the tips of a plurality of pattern wirings as contact pins, a multi-pin narrow pitch is achieved, and many complicated components are not required.

[0004]

When positioning the contact pins with respect to the pads, FIG.
As shown in FIG. 8, toward the tip of the contact pin 3a,
A method has been considered in which light is irradiated from below (from the direction of the pad P), the light is reflected on the contact pin 3a, the camera is focused on the pin tip, and the contact pin 3a is positioned. In order to accurately recognize the position of the contact pin 3a in this method, the amount of light reflected from the tip of the contact pin 3a needs to be sufficient to be detected.

In order to obtain a sufficient amount of reflected light, the surface F to be irradiated with light needs to have a high degree of perpendicularity with respect to the direction L of light irradiation. In the above-described pin position recognition method, since light is emitted from the direction of the pad (measurement target) P substantially perpendicularly to the pad surface (contact surface) Pa, the irradiated surface F at the tip of the contact pin 3a is , The degree of parallelism with respect to the pad surface Pa must be high. In order to make the irradiated surface F at the tip of the contact pin 3a closer to the pad surface Pa, it is necessary to make the axis S of the contact pin 3a closer to the pad surface Pa. FIG. 28 shows that the angle of this axis S to the pad surface Pa is only 20 °,
This shows a state in which the amount of reflected light is insufficient. Here, in the case of the tungsten needle, since the axis of the contact pin is oriented in the vertical direction, an irradiated surface substantially perpendicular to the tip of the pin is formed for light emitted from below, This made it easy to obtain a sufficient amount of reflected light.

On the other hand, the contact pin 3a described in the above publication
Is formed by applying a resin film to the pattern wiring formed by plating, except for the tip to be the contact pin 3a, so that the contact pin 3a only protrudes along the surface of the resin film. Accordingly, the angle (of the axis S) of the contact pin 3a is restricted by the angle of the resin film surface, and the angle of the contact pin 3a cannot be freely set independently of the resin film surface (see FIG. 3). Was.

The angle of the resin film surface with respect to the pad surface Pa is made close to vertical by devising a method of incorporating the contact probe into the probe card.
The parallelism of the contact pin 3a tip end surface F to the pad surface Pa is increased (the pad surface P
Although it is not impossible to increase the degree of verticality with respect to a), the following problem arises.

That is, each terminal (pad P) of an IC chip or the like formed of an Al (aluminum) alloy or the like is in a state where its surface is oxidized in air and covered with a thin aluminum oxide film. Therefore, in order to conduct an electrical test of the pad P, it is necessary to peel off the aluminum oxide film on the surface and expose the aluminum inside to ensure conductivity. Therefore, in the above contact probe,
While bringing the contact pin 3a into contact with the surface of the pad P,
The overdrive is applied (the contact pin 3a comes in contact with the pad P and then is further lowered), so that the tip of the contact pin 3a scrapes the aluminum oxide film on the surface of the pad P to expose the aluminum inside. Like that. This operation is called scrub.

As described above, in order to obtain a sufficient amount of reflected light, the angle itself of the resin film surface with respect to the pad surface Pa is made closer to the vertical, whereby the contact pin 3
a When the degree of parallelism of the tip surface F with respect to the pad surface Pa is increased, the scrub distance (the length of scraping off the film along the pad surface Pa) becomes longer, and depending on the angle of the pin axis S with respect to the pad surface Pa, the contact pin may be scrubbed. 3a
There is a problem that the tip end portion protrudes from the pad P. For example, in a substantially square pad having a side of about 90 to 100 μm in plan view, the angle of the pin axis is 15 ° to 2 °.
When the overdrive amount is 75 μm and the scrub distance is set to 8 μm at 0 °, the scrub distance becomes 12 μm or more by only slightly increasing the angle of the pin axis by 5 °.

Further, as described above, when the angle of the resin film surface to the pad surface Pa is increased, the angle
The resin film stands on the pad surface Pa. Here, the resin film (contact probe)
The probe device is configured by being incorporated into various mechanical parts, and the height of the probe device is increased when the resin film stands as described above. However, the probe device is used by being mounted on a prober, and since the prober cannot usually take a distance (height) from an object to be measured (an IC chip or the like) larger than a certain value, the probe device cannot be used. If the height exceeds a certain size, there is a problem that it cannot be mounted on the prober.

Further, in the case of the contact pin 3a disclosed in the above publication, when the angle of the pin axis S with respect to the pad surface Pa is small, it is difficult to obtain the amount of reflected light from the pin front surface F because of the shape of the pin front surface F. That is, when the contact pins 3a are manufactured, a mask exposure technique is used.
In that case, since it is difficult to form a fine pattern on the mask in a desired shape, the tip of the contact pin 3a, which corresponds to the end of the pattern, has a circular arc surface that is convex toward the tip in plan view. (See FIGS. 3 and 28).
For this reason, when light is irradiated on the convex curved surface F at the tip of the contact pin 3a, the reflected light travels in various directions, and it is difficult to obtain a sufficient amount of light for pin position recognition. There was a problem that was difficult.

The present invention has been made in view of the above circumstances, and when detecting the reflected light obtained by irradiating a contact pin with light and positioning the contact pin, a sufficient amount of light for the detection is detected. It is an object of the present invention to provide a contact probe obtained and a probe device having the same.

[0013]

The present invention has the following features to attain the object mentioned above. That is, in the contact probe according to the first aspect, a plurality of pattern wirings (3) are formed on the film (2, 201, 201a), and each tip of these pattern wirings (3) is connected to the film (2, 201, 201a). ) Are protruded from the contact probe (1, 3a).
200) and the contact probe (1, 20
The 0), substantially perpendicular receiving surface to the direction (Z) of contact of the contact pins (3a) (3c) are formed, the
The light receiving surface (3c) is provided at each end of the pattern wiring (3).
The one located at the end (3b) is bent.
The technology to be formed is adopted.

In this contact probe, a light receiving surface substantially perpendicular to the contact direction of the contact pins is formed. The surface is substantially vertical, and a sufficient amount of reflected light can be obtained. Thus, the position of the contact pin is accurately recognized.

[0015]

[0016] In this contact probe, said pattern wiring, for example, by prepared by collectively method disclosed in the above publication, using a precision mold, etc., only those located on the end of them each tip Since the light receiving surface may be formed by bending, it is relatively easy to manufacture the light receiving surface.

In the probe device according to the second aspect , a plurality of
Pattern wiring is formed on the film and these patterns
Each end of the wiring is arranged so as to protrude from the film and
A probe device comprising a contact probe serving as a contact pin fixed to a substrate having a terminal connected to each base end of the pattern wiring.
An inclined holding member that supports the film in a state where the film is brought into contact with the contact pin and keeps a contact pin disposed in a protruding state from the film at a predetermined inclination ;
A technique is adopted in which a light receiving surface substantially perpendicular to the direction is provided on the tip end side of the tilt holding member. The light-receiving surface in this case may be formed, for example, in a planar shape, in particular, in a mirror-like shape, or may be formed with irregularities, or provided with a mark on the light-receiving surface. Is also good. With such a configuration, it is possible to easily recognize the reflected light when irradiating the light, and to facilitate focusing.

In this probe device, there is provided a tilt holding member which supports the film in contact with the film and keeps the contact pins arranged in a protruding state from the film at a predetermined tilt. Since the light receiving surface is provided, the position of the light receiving surface is close to the position of the contact pin protruding from the distal end side of the inclined holding member, and the light irradiated toward the contact pin distal end portion naturally falls on the light receiving surface. Also hit. Therefore, when the light receiving surface position is separated from the contact pin instead of the present invention, it is necessary to direct light to a position different from the conventional position to irradiate the light receiving surface, and the light receiving surface and the contact pin position are changed. If the pins are separated, there is a problem that the possibility of occurrence of an error increases in recognition of the pin position. However, in the case of the present invention, there is an effect that these problems are eliminated.

In the contact probe according to the third aspect ,
2. The contact probe according to claim 1 , wherein a technique is employed in which a metal film is directly attached to the film.

In this contact probe, even if the film is, for example, a resin film which easily absorbs moisture and stretches, a metal film is directly attached to the film. Is suppressed. Therefore, when the light receiving surface is formed on such a contact probe, the position of the light receiving surface does not shift due to the elongation of the film,
It is possible to prevent erroneous recognition of the pin position. Further, the metal film can be used as a ground, thereby enabling impedance matching to be performed near the tip of the contact probe, and preventing adverse effects due to reflected noise even when performing a test in a high frequency range. it can. That is, if the characteristic impedance between the substrate wiring side and the contact pin does not match in the middle of the transmission line from the tester called a prober, reflected noise will occur. In this case, the longer the transmission line with a different characteristic impedance is, the larger the reflected noise will be. There is a problem that occurs.
Reflected noise causes signal distortion, and tends to cause malfunction at higher frequencies. In the present contact probe, by using the metal film as the ground, the characteristic impedance can be matched by the substrate wiring side to the vicinity of the contact pin tip, and malfunction due to reflected noise can be suppressed.

Further, in the contact probe according to the fourth aspect, in the contact probe according to the third aspect ,
The technique in which the second film is directly adhered to the metal film is employed.

In this contact probe, since the second film is directly adhered to the metal film, it is possible to obtain an effect that the contact probe serves as a cushioning material against tightening when the contact probe is assembled by the mechanical parts. Therefore, the effect of being able to reduce the damage to the wiring pattern at the time of assembling can be obtained. Further, in the case of the LCD, it is possible to prevent a short circuit between the metal film and the terminal of the TABIC.

According to a fifth aspect of the present invention, the contact probe according to any one of the first to third aspects is connected to a circuit having a terminal connected to each base end of the pattern wiring. A probe device, comprising: a ferroelastic film disposed on the film and protruding from the film shorter than the contact pins; and a contact probe clamp body for clamping the ferroelastic film and the contact probe. The technology having the following is adopted.

In this probe device, the ferroelastic film is provided, and the ferroelastic film presses the tip of the contact pin from above, so that even if the tip of the pin is curved upward, the object to be measured can be surely attached. And a uniform contact pressure can be obtained for each pin, thereby eliminating measurement errors due to poor contact. Therefore, when the light receiving surface is formed on such a probe device, the pin position can be accurately recognized by the light receiving surface, and the measurement can be performed even if some of all pins include an upwardly curved one. Since the pin position when contacting the object is corrected by the ferroelastic film and all pin positions are aligned,
After all, all pin positions can be accurately recognized.

Further, in the probe apparatus of claim 6,
The contact probe according to claim 3 or 4,
Connect to a circuit that has a terminal connected to each base end of the turn wiring.
A probe device, the probe device comprising:
Is disposed on the metal film, and is disposed in front of the metal film.
Strong elastic film protruding shorter than the contact pin
And the ferroelastic film and the contact probe
And a contact probe holding member for clamping the con
The projecting length of the tact pin from the metal film is X1,
The protruding length of the film from the metal film is X2
X1> X2 is adopted, and the film (201a) is formed of the ferroelastic film so that the ferroelastic film (400) becomes a buffer when the contact pin (3a) is pressed. A technique formed longer on the tip side than (400) is adopted.

In this probe device, the film is formed longer on the distal end side than the ferroelastic film, and the ferroelastic film acts as a cushioning material when pressing the contact pins. The contact pin is not distorted and curved due to friction with the film, and stable contact with the measurement object can be maintained. Therefore, when the light-receiving surface is formed on such a probe device, the pin position can be accurately recognized by the light-receiving surface, and in this case, the distortion of the pins and the like are suppressed by the film. The position can be accurately grasped.

[0027]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of a contact probe according to the present invention will be described below with reference to FIG. 1 and FIGS. In these figures, reference numeral 1 denotes a contact probe, 2 denotes a resin film, and 3 denotes a pattern wiring.

As shown in FIG. 3, the contact probe 1 of this embodiment has a structure in which a pattern wiring 3 made of metal is attached to one surface of a polyimide resin film 2. The tip of the pattern wiring 3 projects from the contact pin 3a. Reference numeral 4 denotes an alignment hole described later.

Of the respective ends of the pattern wiring 3, those located at both ends are bent downward, and the light receiving surface 3c substantially perpendicular to the direction (vertical direction) Z in which the contact pins 3a contact is formed. Is formed. The light receiving surface 3c is also substantially perpendicular to the direction L of light for recognizing the position of the contact pin 3a which is irradiated perpendicular to the pad surface.

Next, with reference to FIGS. 4 to 6, the steps of manufacturing the contact probe 1 will be described in the order of steps.

[Base Metal Layer Forming Step] First, as shown in FIG. 4A, a base metal layer 6 is formed on a stainless steel supporting metal plate 5 by Cu (copper) plating. [Pattern forming step] After forming a photoresist layer 7 on the base metal layer 6, as shown in FIG. 4B, the photoresist layer 7 is exposed by applying a mask 8 having a predetermined pattern, As shown in FIG. 4C, the photoresist layer 7 is developed to remove the portion that will become the pattern wiring 3, and an opening 7a is formed in the remaining photoresist layer 7.

[Electroplating Step] Then, FIG.
As shown in FIG. 4A, after a Ni or Ni alloy layer N serving as the pattern wiring 3 is formed in the opening 7a by plating, the photoresist layer 7 is formed as shown in FIG.
Is removed.

[Film Adhering Step] Next, FIG.
As shown in FIG. 2, the top of the pattern wiring 3 shown in FIG.
The resin film 2 is bonded to the portion other than the portion serving as the contact pin 3a with the adhesive 2a. [Separation Step] Then, as shown in FIG. 4 (g), after the portion composed of the resin film 2, the pattern wiring 3, and the base metal layer 6 is separated from the supporting metal plate 5, Cu etching and ultrasonic waves are performed. After the cleaning, only the pattern wiring 3 is bonded to the resin film 2.

[Gold Coating Step] Next, as shown in FIG. 4H, Au plating is applied to the exposed pattern wiring 3 to form an Au plating layer A on the surface. At this time, the Au layer A is formed on the entire surface of the contact pins 3a protruding from the resin film 2 over the entire circumference.

[Contact Pin Bending Step] Through the above steps, the contact probe 1 shown in FIG. 3 is manufactured, and thereafter, using a precision mold, one of the ends of the pattern wiring 3 located at both ends. 3b is bent downward to form a light receiving surface 3c as shown in FIG. Here, the bent portions 3b located at both ends among the respective ends of the pattern wiring 3 are not used as the contact pins 3a, and function only as the light receiving surface 3c for pin position recognition.

In the contact probe 1, the light receiving surface 3c is formed substantially perpendicular to the direction L of the light irradiated for the position recognition of the contact pin 3a, so that a sufficient amount of reflected light can be obtained. Thus, the position of the contact pin 3a is accurately recognized. Further, in this contact probe 1, after the pattern wirings 3 are collectively manufactured by, for example, the method described in the above-mentioned publication, only those 3b located at both ends of the respective tips are used using a precision mold or the like. Since the light receiving surface 3c may be formed by bending, the production of the light receiving surface 3c is relatively easy. Through the above steps, the contact probe 1 in which the pattern wiring 3 is adhered to the resin film 2 as shown in FIGS. 1 and 3 is manufactured.

FIG. 5 shows that the contact probe 1 is
FIG. 6 is a diagram showing a probe cut into a predetermined shape as a probe, and FIG. 6 is a cross-sectional view taken along line CC of FIG. 5. As shown in FIGS. 5 and 6, holes 9 for fixing the contact probe 1 are formed in the resin film 2 of the contact probe 1.
And a window 11 for transmitting a signal obtained from the pattern wiring 3 to the printed circuit board 20 (see FIG. 8) via the lead-out wiring 10.

Next, with reference to FIGS. 7 to 9, a description will be given of a configuration in which the contact probe 1 is incorporated into a mechanical part 60 to form a probe device (probe card) 70. FIG. Note that the contact probe 1 according to the present embodiment functions as a flexible substrate when incorporated into a probe device because the contact probe 1 as a whole is flexible and easily bent.

The mechanical part 60 includes a mounting base (tilt holding member) 30 and a top clamp 4.
0 and a bottom clamp 50. First, the top clamp 40 is mounted on the printed circuit board 20, and then the mounting base 30 to which the contact probe 1 is mounted is mounted on the top clamp 40 by screwing a bolt 42 into a bolt hole 41 (see FIG. 9). And
By holding down the contact probe 1 with the bottom clamp 50, the pattern wiring 3 is maintained in a constant inclined state, and the contact pin 3a located at the tip of the pattern wiring 3 is pressed against the IC chip I.

FIG. 8 shows the probe device 70 after the assembly is completed. FIG. 9 is a sectional view taken along line EE of FIG. As shown in FIG. 9, the lower surface 32 of the mounting base 30
Is gradually inclined downward toward the front end side at an angle γ of 0 ° or more and 30 ° or less with respect to the contact surface Pa. The distal end side of the resin film 2 is in contact with the lower surface 32 and is supported in a downwardly inclined state, and the contact pins 3 a are in contact with the IC chip I.

The mounting base 30 is provided with positioning pins 31 for adjusting the position of the contact probe 1, and by inserting the positioning pins 31 into the positioning holes 4 of the contact probe 1, a pattern is formed. The wiring 3 and the IC chip I can be accurately positioned. The pattern wiring 3 in the portion of the window 11 provided in the contact probe 1
Then, the elastic body 51 of the bottom clamp 50 is pressed to contact the lead wiring 10 with the electrode 21 of the printed circuit board 20, and the signal obtained from the pattern wiring 3 is applied to the electrode 21.
Can be communicated to the outside.

The probe device 70 configured as described above
When a probe test or the like of the IC chip I is performed by using the IC chip I, the probe device 70 is mounted on a prober and electrically connected to a tester, and a predetermined electric signal is transmitted from the contact pins 3a of the pattern wiring 3 to the IC on the wafer. By sending the signal to the chip I, the output signal from the IC chip I is transmitted from the contact pin 3a to the tester, and the electrical characteristics of the IC chip I are measured.

In the first embodiment, the light receiving surface 3c is formed by bending the end 3b of each end of the pattern wiring 3 which is located at both ends. As shown in FIG. 2, a light receiving surface 33 may be provided on the tip side of the mounting base 30.

According to the second embodiment shown in FIG.
Since the light receiving surface 33 is provided on the distal end side of the mounting base 30, the position of the light receiving surface 33 is determined by contact pins 3a protruding from the distal end side of the mounting base 30.
And the light emitted toward the tip of the contact pin 3a naturally hits the light receiving surface 33. Therefore, when the light receiving surface position is provided away from the contact pins 3a in place of the second embodiment, it is necessary to direct light to a position different from the conventional position for irradiating the light receiving surface, and the light receiving surface If the position of the contact pin 3a is separated from the surface, there is a problem that an error is more likely to occur in recognizing the pin position. However, the second embodiment has the effect of eliminating these problems. Can be

In the first and second embodiments, the contact probe 1 is applied to the probe device 70 as a probe card. However, the contact probe 1 may be applied to another measuring jig or the like. For example, the present invention may be applied to an IC chip test socket or the like mounted on an IC chip burn-in test device or the like for holding and protecting the IC chip inside.

Next, a third embodiment will be described with reference to FIGS. In this embodiment, the contact probe 1 (see FIG. 5) cut out into a predetermined shape for an IC probe in the first and second embodiments is cut out into a predetermined shape for an LCD probe and used instead. is there. The contact probe cut out for the LCD probe is indicated by reference numeral 200 in FIGS. 10 to 12, and 201 is a resin film.

As shown in FIG. 13, an LCD probe device (probe device) 100 has a structure in which a contact probe holding member 110 and the contact probe holding member 110 are fixed to a frame frame 120. ,
The tips of the contact pins 3a protruding from the contact probe holding body 110 come into contact with terminals (not shown) of an LCD (liquid crystal display) 90.

As shown in FIG. 12, the contact probe holding body 110 has a top clamp 111 and a bottom clamp 115. The top clamp 111 is provided with a first projection 112 for holding the tip of the contact pin 3a.
It has a second projection 113 for holding the terminal 301 on the side of the ABIC (circuit) 300 and a third projection 114 for holding the lead. The bottom clamp 115 includes an inclined plate 116, a mounting plate 117, and a bottom plate 118.

The contact probe 200 is moved to the inclined plate 116.
And the terminals 301 of the TABIC 300 are connected to the resin films 201 and 20 of the contact probe 200.
Place it so that it is located between the two. Thereafter, the top clamp 111 is mounted on the resin film 201 such that the first protrusion 112 is on the resin film 201 and the second protrusion 113 is in contact with the terminal 301, and is assembled with a bolt.

As shown in FIG. 14, the contact probe holding body 110 is manufactured by incorporating the contact probe 200 and combining the top clamp 111 and the bottom clamp 115 with the bolt 130.

The contact probe holding body 110 is
As shown in FIG.
Assembled in the CD probe device 100. In order to perform an electrical test of the LCD 90 using the LCD probe device 100, the contact pins 3 a of the LCD probe device 100 are obtained from the contact pins 3 a with the tips of the contact pins 3 a being in contact with the terminals (not shown) of the LCD 90. This is performed by taking out the output signal through the TABIC 300 to the outside.

In the above-described LCD probe device 100, the light-receiving surface substantially perpendicular to the direction in which the contact pins 3a are in contact with each other is obtained by bending one of the ends of the pattern wiring 3 located at the end. (Not shown) is formed. As a result, the light receiving surface is substantially perpendicular to the direction of the light emitted substantially parallel to the direction in which the contact pins 3a contact. Thereby, the same operation and effect as those of the first embodiment can be obtained.

Next, a fourth embodiment will be described with reference to FIGS. As shown in FIG.
The contact pin 3a of the contact probe 200 described in the third embodiment may have an upwardly curved distal end S1 or a downwardly curved distal end S2 in addition to the normal distal end S. . in this case,
As shown in FIG. 17, even if the resin film 201 is sandwiched between the first protrusion 112 and the inclined plate 116 and the contact pin 3a is pressed against the terminal of the LCD 90, the normal tip S
1 and the tip S2 curved downward contact the terminal of the LCD 90, but the tip S1 curved upward may not be able to obtain a sufficient contact pressure even if it makes contact. As a result, contact failure of the contact pins 3a with the LCD 90 may occur, and an accurate electrical test may not be performed. In addition, the pressing amount of the contact pin 3a is increased or decreased in order to obtain a desired contact pressure at the time of the test, but a large pressing amount is required to obtain a large contact pressure, but the amount is limited due to the shape of the needle. In some cases, a large contact pressure could not be obtained.

Therefore, in the fourth embodiment, as shown in FIG. 18, a resin film is used to align the tip S1 curved upward and the tip S2 curved downward of the contact pin 3a with the normal tip S. A ferroelastic film 400 made of an organic or inorganic material is overlaid on the upper side of the contact pin 3a so that the tip of the contact pin 3a projects from the resin film 201 so as to project shorter than the contact pin 3a. The contact probe holding body 110 in which the 200 and the ferroelastic film 400 are held between the first protrusion 112 of the top clamp 111 and the inclined plate 116 of the bottom clamp 115 is employed. The ferroelastic film 400 is preferably made of ceramic or polyethylene terephthalate if it is an organic material, and is preferably made of ceramic, especially an alumina film if it is an inorganic material.

The contact probe holding body 1
10 is fixed to the frame 120, and the contact pins 3
When a is pressed against the terminal of the LCD 90, the ferroelastic film 400 presses the contact pin 3a from above, so that even the tip S1 curved upward, the ferroelastic film 400 reliably contacts the terminal of the LCD 90. Thereby, a uniform contact pressure is obtained for each contact pin 3a, and measurement errors due to poor contact can be eliminated.

Further, by changing the amount of protrusion of the contact pin 3a from the ferroelastic film 400, the contact pin 3a is pressed when the contact pin 3a is pressed.
Can be changed at the time of pressing from above, and a desired contact pressure can be obtained with a desired pressing amount.

Also in the LCD probe device 100 according to the fourth embodiment, one of the ends of the pattern wiring 3 located at the end is bent,
A light receiving surface (not shown) substantially perpendicular to the direction of the light emitted for confirming the position of the contact pin 3a is formed. As a result, the pin position can be accurately recognized by the light receiving surface, and the tip S curved upward to several pins out of all the pins 3a.
Even if 1 is included, the position of the pin 3a when it comes into contact with the LCD 90 is corrected by the ferroelastic film 400, and the positions of all the pins 3a are aligned. , All pins 3a can be accurately recognized.

Next, a fifth embodiment will be described with reference to FIGS. As shown in FIG.
Since the resin film 201 of the contact probe 200 described in the third embodiment is made of, for example, a polyimide resin, it absorbs moisture and elongates,
The interval t between the contact pins 3a, 3a sometimes changed. This makes it impossible for the contact pins 3a to come into contact with the predetermined positions of the terminals of the LCD 90, and there is a problem that an accurate electrical test cannot be performed.

Therefore, in the fifth embodiment, as shown in FIG. 20, a metal film 500 is stuck on the resin film 201 so that the contact pins 3 can be formed even when the humidity changes.
The change in the interval t between the contact pins 3a and 3a is reduced, whereby the contact pins 3a are reliably brought into contact with the predetermined positions of the terminals of the LCD 90. The metal film 500
Is preferably one of Ni, a Ni alloy, Cu and a Cu alloy.

Also in the LCD probe device 100 according to the fifth embodiment, one of the ends of the pattern wiring 3 located at the end is bent,
A light receiving surface (not shown) substantially perpendicular to the direction of the light emitted for confirming the position of the contact pin 3a is formed. Thereby, the resin film 20 is formed by the metal film 500.
Since the elongation of 1 is suppressed, the position of the light receiving surface formed on the pattern wiring 3 attached to the resin film 201 does not shift, thereby preventing erroneous recognition of the pin position.

Next, a sixth embodiment will be described with reference to FIG. That is, the metal film 500 is stuck on the resin film 201 as in the fifth embodiment, and the ferroelastic film 400 is used as in the fourth embodiment. A uniform contact pressure can be obtained irrespective of the curvature of the tip of the pin 3a, and a change in the interval t between the contact pins 3a, 3a can be minimized to perform an accurate electrical test.

Also in the LCD probe device 100 according to the sixth embodiment, one of the ends of the pattern wiring 3 located at the end is bent,
A light receiving surface (not shown) substantially perpendicular to the direction of the light emitted for confirming the position of the contact pin 3a is formed. Accordingly, the same operation and effect as those of the first, fourth, and fifth embodiments can be obtained.

Next, a seventh embodiment will be described with reference to FIGS. As shown in FIG.
A configuration in which a second resin film 202 is further adhered on a metal film 500 adhered on the resin film 201 is adopted. As shown in FIG. 400 are provided. Here, unlike the sixth embodiment, the reason why the second resin film 202 is provided is that the terminal 113 of the top clamp 111 is connected to the terminal 3 so that the contact probe 200 and the terminal 301 of the TABIC 300 are connected.
01, the metal film 500 and TABI
This is to prevent a short circuit with the terminal 301 of C300.
Further, by providing the second resin film 202, the surface of the metal film 500 is covered, and the progress of oxidation in the atmosphere can be effectively suppressed.

Also in the LCD probe device 100 according to the seventh embodiment, one of the ends of the pattern wiring 3 located at the end is bent,
A light receiving surface (not shown) substantially perpendicular to the direction of the light emitted for confirming the position of the contact pin 3a is formed.

Next, an eighth embodiment will be described with reference to FIGS. 24 and 25. In the fourth, sixth and seventh embodiments, during use, the ferroelastic film 400 is in press contact with the contact pins 3a, and the friction between the ferroelastic film 400 and the contact pins 3a is repeated by repeated use. In some cases, the contact pin 3a bends right and left, and the contact point shifts.

Therefore, in the eighth embodiment, as shown in FIG. 24, the resin film 201 is made to be a wider film 201a than the conventional one and the contact pins 3a are formed.
X1> X2, where X1 is the protruding length from the metal film 500 and X2 is the protruding length of the wide resin film 201a from the metal film 500. Then, as shown in FIG.
Are used so as to project shorter than the wide resin film 201a, the ferroelastic film 400 comes into contact with the soft wide resin film 201a and the contact pins 3
Since the contact pin 3a does not come into direct contact with the contact pin 3a, the contact pin 3a can be prevented from bending left and right.

Also in the LCD probe device 100 according to the eighth embodiment, one of the ends of the pattern wiring 3 located at the end is bent,
A light receiving surface (not shown) substantially perpendicular to the direction of the light emitted for confirming the position of the contact pin 3a is formed. Accordingly, the wide resin film 201a can suppress the distortion and the bending of the contact pin 3a due to the friction with the ferroelastic film 400, so that the positions of all the pins 3a can be accurately recognized.

Next, a ninth embodiment will be described with reference to FIGS. 26 and 27. Metal film 500
In this case, if the length of the contact pins 3a protruding from the metal film 500 is X1, and the length of the wide resin film 201a protruding from the metal film 500 is X2, X1> It is configured so as to have a relationship of X2. Then, as shown in FIG. 27, the ferroelastic film 400 provided on the second resin film 202 is overlapped so as to project shorter than the wide resin film 201a.

Also in the LCD probe device 100 according to the ninth embodiment, one of the ends of the pattern wiring 3 located at the end is bent,
A light receiving surface (not shown) substantially perpendicular to the direction of the light emitted for confirming the position of the contact pin 3a is formed.

[0070]

According to the first aspect of the present invention, since the light receiving surface is formed substantially perpendicular to the contact direction of the contact pin, light is irradiated substantially parallel to the contact direction of the contact pin. Then, since the light receiving surface is substantially perpendicular to the direction of light, a sufficient amount of reflected light can be obtained.
Thereby, the position of the contact pin can be accurately recognized.

According to this contact probe,
The light receiving surface is formed by forming the pattern wirings collectively by, for example, the method described in the above publication, and then using a precision mold or the like to bend only those located at the ends of the respective tips. Therefore, the effect that the fabrication of the light receiving surface is relatively easy can be obtained.

According to the second aspect of the present invention, the probe device is provided with a tilt holding member for supporting the film in contact with the film and keeping the contact pins arranged in a protruding state from the film at a predetermined tilt. Since the light receiving surface is provided on the tip side of the holding member, the position of the light receiving surface is close to the position of the contact pin protruding from the tip side of the inclined holding member, and light emitted toward the contact pin tip is Naturally hits the light receiving surface. Therefore, when the light receiving surface position is separated from the contact pin instead of the present invention, it is necessary to direct light to a position different from the conventional position to irradiate the light receiving surface, and the light receiving surface and the contact pin position are changed. If the pins are separated, there is a problem that the possibility of occurrence of an error increases in recognition of the pin position. However, in the case of the present invention, there is an effect that these problems are eliminated.

According to the third aspect of the present invention, even if the film is, for example, a resin film which absorbs moisture and easily expands, a metal film is directly attached to the film. The metal film can suppress the elongation of the film. Therefore, when the light receiving surface is formed on such a contact probe, the position of the light receiving surface does not shift due to the elongation of the film, thereby preventing erroneous recognition of the pin position. Further, the metal film can be used as a ground, thereby enabling impedance matching to be performed near the tip of the contact probe, and preventing adverse effects due to reflected noise even when performing a test in a high frequency range. it can.

According to the contact probe of the fourth aspect , since the second film is directly adhered to the metal film, the contact probe serves as a cushioning material against tightening of the mechanical part when the contact probe is assembled. Can be obtained. Therefore, the effect of being able to reduce the damage to the wiring pattern at the time of assembling can be obtained. Also, LCD
In such a case, a short circuit between the metal film and the terminal of the TABIC can be prevented.

According to the fifth aspect of the present invention, the ferroelastic film is provided, and the ferroelastic film presses the tip of the contact pin from above, so that the pin tip may be curved upward. In addition, it is possible to reliably contact the object to be measured, and it is possible to eliminate measurement errors due to poor contact since a uniform contact pressure can be obtained for each pin. Therefore, when the light receiving surface is formed on such a probe device, the pin position can be accurately recognized by the light receiving surface, and the measurement can be performed even if some of all pins include an upwardly curved one. Since the pin positions at the time of contact with the object are corrected by the ferroelastic film and all the pin positions are aligned, it is possible to accurately recognize all the pin positions after all.

According to the probe device of the sixth aspect , the film is formed longer on the distal end side than the ferroelastic film, and the ferroelastic film serves as a cushioning material when pressing the contact pin. Even if the contact pin is not distorted and bent due to friction with the ferroelastic film, stable contact with the measurement object can be maintained. Therefore, when the light-receiving surface is formed on such a probe device, the pin position can be accurately recognized by the light-receiving surface, and in this case, the distortion of the pins and the like are suppressed by the film. The position can be accurately grasped.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a light receiving surface of a contact probe according to a first embodiment of the present invention.

FIG. 2 is a perspective view showing a light receiving surface of a probe device according to a second embodiment of the present invention.

FIG. 3 is a main part perspective view showing the contact probe in the first embodiment of the contact probe according to the present invention.

FIG. 4 is a fragmentary cross-sectional view showing a method of manufacturing the contact probe according to the first embodiment of the present invention in the order of steps.

FIG. 5 is a plan view showing a first embodiment of the contact probe according to the present invention.

FIG. 6 is a sectional view taken along line CC of FIG. 5;

FIG. 7 is an exploded perspective view showing an example of a probe device incorporating the first embodiment of the contact probe according to the present invention.

FIG. 8 is a perspective view of an essential part showing an example of a probe device incorporating the first embodiment of the contact probe according to the present invention.

FIG. 9 is a sectional view taken along line EE of FIG. 8;

FIG. 10 is a perspective view showing a contact probe in a third embodiment of the probe device according to the present invention.

11 is a sectional view taken along line AA of FIG.

FIG. 12 is an exploded perspective view showing a contact probe holding body in a third embodiment of the probe device according to the present invention.

FIG. 13 is a perspective view showing a probe device according to a third embodiment of the probe device according to the present invention.

FIG. 14 is a perspective view showing a contact probe holding body in a third embodiment of the probe device according to the present invention.

FIG. 15 is a sectional view taken along line BB of FIG.

FIG. 16 is a side view showing a conventional drawback of a contact probe regarding the fourth embodiment of the probe device according to the present invention.

FIG. 17 is a side view showing a conventional disadvantage of the probe device with respect to the fourth embodiment of the probe device according to the present invention.

FIG. 18 is a side view showing a probe device in a fourth embodiment of the probe device according to the present invention.

19 is a view in the direction of arrow D in FIG. 10 relating to the fifth embodiment of the contact probe according to the present invention.

FIG. 20 is a side view showing a contact probe in a fifth embodiment of the contact probe according to the present invention.

FIG. 21 is a side view showing a probe device in a sixth embodiment of the probe device according to the present invention.

FIG. 22 is a side view showing a contact probe in a seventh embodiment of the probe device according to the present invention.

FIG. 23 is a side view showing a probe device according to a seventh embodiment of the probe device according to the present invention.

FIG. 24 is a side view showing a contact probe in an eighth embodiment of the probe device according to the present invention.

FIG. 25 is a side view showing a probe device according to an eighth embodiment of the probe device according to the present invention.

FIG. 26 is a side view showing a contact probe in a ninth embodiment of the probe device according to the present invention.

FIG. 27 is a side view showing a probe device according to a ninth embodiment of the probe device according to the present invention.

FIG. 28 is an enlarged perspective view showing a state where light is irradiated to the tip of a contact pin.

[Explanation of symbols]

REFERENCE SIGNS LIST 1 contact probe 2 film (resin film) 3 pattern wiring 3 a contact pin 3 b one of the ends of pattern wiring located at the end 3 c light receiving surface 20 substrate (printed substrate) 21 terminal (electrode) 30 tilt holding member (mounting base) 33) Light receiving surface 70 Probe device (probe card) 100 Probe device 110 Contact probe holder 200 Contact probe 201 Film 201a Film (wide film) 202 Second film 300 Circuit (TABIC) 301 Terminal 400 Strong elastic film 500 Metal film Z Direction of contact pin contact

────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Toshinobu Ishii Techno Park 12-6, Mita City, Hyogo Mitsubishi Materials Corporation Mita Plant (56) References JP-A-6-334006 (JP, A) JP-A-4-280445 (JP, A) JP-A-4-196238 (JP, A) JP-A-7-321170 (JP, A) JP-A-5-129387 (JP, A) (58) Int.Cl. ⁷ , DB name) G01R 1/073 G01R 31/28 H01L 21/66

Claims (6)

(57) [Claims] 1. A plurality of pattern wirings (3) are formed on a film (2, 201, 201a), and each end of the pattern wirings (3) is connected to the film (2, 201, 201a).
01a) and the contact pins (3
a) The contact probe (1,200) has a light receiving surface (3c) substantially perpendicular to the contact direction (Z) of the contact pin (3a). Are formed, and the light receiving surface (3c) is provided at each end of the pattern wiring (3).
Of those, the one located at the end (3b) is bent
A contact probe characterized by being formed by: 2. A plurality of pattern wirings are formed on a film.
Each end of these pattern wiring is
Contacts that are arranged in a protruding state and become contact pins
A probe device (70) comprising a probe fixed to a substrate (20) having a terminal (21) connected to each base end of the pattern wiring (3), wherein the probe device (7)
0) a tilt holding member (30) for supporting the film (2) in contact with the film (2) and keeping the contact pins (3a) arranged in a protruding state from the film (2) at a predetermined tilt;
In the direction (Z) of contact of the contact pin (3a).
And the substantially vertical light receiving surface (33) is
A probe device provided on the front end side of (0). 3. The contact probe according to claim 1, wherein
00), wherein a metal film (500) is directly attached to the film (201, 201a). 4. The contact probe according to claim 3, wherein
00), wherein a second film (202) is directly adhered to the metal film (500). 5. A circuit (300) having a terminal (301) connected to the contact probe (200) according to any one of claims 1, 3 and 4 at each base end of the pattern wiring (3). The probe device (100) is connected to the film (201, 201a) and disposed on the film (201, 201a).
1,201a), a ferroelastic film (400) projecting shorter than the contact pin (3a), the ferroelastic film (400) and the contact probe (20).
0) and a contact probe holding body (110)
A probe device comprising: 6. A contact professional according to claim 3 or claim 4.
To each base end of the pattern wiring (3).
A circuit (300) having a terminal (301) to be connected;
A continuous probe device (100)
Moving device (100) on the metal film (500).
The contact pins (3
a) a strong elastic film (400) projecting shorter than a);
The ferroelastic film (400) and the contact probe
Probe holding body for holding the probe (200)
(110), the length of the contact pin protruding from the metal film.
X1, the protrusion of the film (201a) from the metal film.
When the projecting length is X2, a configuration where X1> X2 is adopted.
Then, the film (201a) is the ferroelastic film (4
(00) is formed longer on the tip side than the ferroelastic film (400) so as to serve as a buffer when pressing the contact pin (3a).