JP2004085241A - Contact probe, probe device and method for manufacturing contact probe - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To surely bring an electrode terminal of an object to be measured into contact with contact pins, without impairing connectivity of pattern wirings to a printed circuit board. <P>SOLUTION: The contact pins 11 are respectively fixed to the tips 13a of the pattern wirings 13, by engaging recesses 11c formed at the pins with the tips 13a of the wirings 13, with which one surface of the film 12 is covered. The tips 11a of the pins 11 are arranged so as to be brought into substantially perpendicular contact with the electrode terminal of the object to be measured. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention performs an electrical circuit test of an electronic component by bringing a contact pin into contact with a fine electrode terminal of a semiconductor chip such as an IC or an LSI or an electronic component (measurement target) such as an LCD (liquid crystal display). The present invention relates to a contact probe and a probe device used for performing the operation.
[0002]
[Prior art]
In such a probe device, a plurality of pattern wirings connected to a substrate-side electrode of a printed wiring board are attached to a surface of a film, and a tip of the pattern wiring protruding from a leading end of the film serves as a contact pin. It is known that a probe is provided so that these contact pins are arranged so as to be inclined obliquely downward, so as to be obliquely brought into contact with each electrode terminal (pad) of the object to be measured.
[0003]
[Problems to be solved by the invention]
By the way, the arrangement of each electrode terminal of the measurement object is a peripheral arrangement type in which the electrode terminals are formed only around the measurement object, and a staggered arrangement type in which the electrode terminals are formed in a zigzag around the measurement object. There are, for example, a surface arrangement type in which electrode terminals are formed in a grid pattern on the entire surface of the measurement object, and among these, the measurement object having a staggered arrangement type or a surface arrangement type electrode terminal is as described above. It is difficult to cope with such a probe device having a contact probe of a type in which the contact pins are disposed obliquely downward.
In addition, with the high integration and miniaturization of semiconductor chips and LCDs to be measured, the pitch between the electrode terminals formed on them has been narrowed, and the contact pins of the contact probe have been reduced. Since the pitch is also becoming narrower, such contact probes in which contact pins are obliquely contacted with each of the electrode terminals have such contact pins formed on a protective film formed around each of the electrode terminals. There was also a risk of interference.
[0004]
Therefore, in recent years, a probe device including a contact probe arranged so that the contact pin is vertically contacted with the electrode terminal, instead of making the contact pin obliquely contact with the electrode terminal, has become mainstream. However, the probe device provided with such a vertical type contact probe has a problem regarding the connectivity between the pattern wiring and the printed wiring board.
The present invention has been made in view of the above problems, and a contact probe capable of reliably contacting a contact pin to an electrode terminal of an object to be measured without impairing connectivity of a pattern wiring to a printed wiring board. And a method of manufacturing a probe device and a contact probe.
[0005]
[Means for Solving the Problems]
In order to solve the above problems and achieve such an object, a contact probe according to the present invention has a plurality of plate-shaped and concave portions at the tip of a pattern wiring attached to one surface of a film. The contact pin is fixed so that its concave portion is fitted into the tip of the pattern wiring. Further, a probe device according to the present invention includes the contact probe according to the present invention, and a printed wiring board to which the pattern wiring is connected. It is characterized by being arranged substantially perpendicular to the electrode terminal of the object.
In the present invention, the contact pins to be brought into contact with the electrode terminals (pads) of the object to be measured and the pattern wiring to be connected to the printed wiring board are separately formed and then connected to each other.
Therefore, the tip of the contact pin can be arranged so as to be substantially perpendicular to the electrode terminal, and it is possible to cope with various arrangements of the electrode terminal. By appropriately designing the wiring and the film, the connectivity of the pattern wiring to the printed wiring board is not impaired.
Further, the thickness direction of the plate-shaped contact pins is aligned with the arrangement direction of the contact pins, and the contact pins are manufactured at a narrow pitch, that is, even when the thickness of the plate-shaped contact pins is reduced. By increasing the width of the contact pin, it is possible to secure a large cross-sectional area, so that the strength of the contact pin does not decrease and the circuit resistance value does not increase. In addition, by forming the contact pin in a plate shape, the contact pin can be easily formed into a complicated shape, for example, by providing a spring structure for absorbing a step at the tip of the contact pin. Can also be easily performed.
[0006]
Further, in the contact probe of the present invention, a spring layer may be adhered to the film. With such a configuration, when the electrode terminal of the object to be measured is pressed against the tip of the contact pin, the spring layer is formed. Good contact properties can be obtained by the reaction force obtained by the deflection.
[0007]
In the probe device of the present invention, the contact probe may be arranged with one surface of the film on which the pattern wiring is attached facing upward, and with such a configuration, the contact pin The circuit configuration required for high-frequency device measurement can be secured on the pattern wiring located in close proximity to small electronic components such as bypass capacitors and matching circuits by directly connecting to these pattern wiring. Can be adopted, so that a probe device excellent in high-frequency characteristics can be obtained.
[0008]
Further, in the probe device of the present invention, a pressing member may be provided above the contact pin. With such a configuration, when the contact pin is brought into contact with the electrode terminal, an excessive force is applied. Even if it does, further deformation is prevented by the presence of the pressing plate, and it is possible to prevent the vicinity of the concave portion of the contact pin connected to the tip of the pattern wiring from being plastically deformed.
At this time, if an elastic body is interposed between the pressing plate and the contact pin, it is possible to reliably absorb variations in the height of each terminal electrode in the measurement object.
[0009]
The method for manufacturing a contact probe according to the present invention includes the steps of: applying a mask on a first metal layer of a material which is adhered to or bonded to a material of the contact pin formed on a support plate; Forming a second metal layer serving as a contact pin by plating, and then removing the mask and the first metal layer to form the plate-shaped contact pin having a recess; and Fixing the contact pin to the tip of the pattern wiring attached to one surface of the pattern wiring so as to fit the concave portion of the contact pin to the tip of the pattern wiring. By using the manufacturing method, a contact probe with narrower pitch and adaptability to pad layout, and good high frequency characteristics It can be produced.
[0010]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, a first embodiment of the present invention will be described with reference to FIGS.
FIG. 1 is an enlarged perspective view of a main part showing a manufacturing process of the contact probe according to the first embodiment, and FIG. 2 is an enlarged sectional view of a main part of the contact probe.
[0011]
First, the contact probe 10 according to the first embodiment will be described based on a manufacturing process.
When manufacturing the contact pins 11, a two-layer tape composed of a resin film layer of, for example, polyimide and a metal film layer (first metal layer) of Cu or the like is placed with the metal film layer facing upward.
Then, after forming a photoresist layer (either a negative type photoresist or a positive type photoresist) on the metal film layer, a photomask of a predetermined pattern is applied to the photoresist layer by a photoengraving technique. By exposing and developing the photoresist layer, an opening is formed in the remaining photoresist layer (mask) by removing a portion to be a contact pin 11 described later.
[0012]
In the present embodiment, the above-mentioned photoresist layer corresponds to a “mask” in the claims of the present application. However, the “mask” in the claims of the present application is not limited to a mask in which an opening is formed through an exposure and development process using a photomask, such as the photoresist layer of the present embodiment. Alternatively, a film or the like in which a hole is formed in advance in a portion to be plated may be used.
[0013]
Next, a Ni layer or a Ni alloy layer (second metal layer) serving as the contact pin 11 is formed in the opening formed in the photoresist layer by electrolytic plating, and then the photoresist layer is removed.
Thereafter, the contact pin 11 as shown in FIG. 1 is formed by removing the resin film layer made of polyimide or the like in the two-layer tape by laser and removing the metal film layer made of Cu or the like by etching.
[0014]
As shown in FIG. 1, the contact pin 11 thus formed is formed such that the narrow distal end 11a is continuous with the lower end of one end (lower left side in the figure) of the wide base end 11b. It has a plate shape with a thickness of about 10 to 20 μm, and further has a concave portion 11c which is recessed from the other end side (upper right side in the figure) toward one end side at the base end 11b.
[0015]
Next, as in the manufacturing process of the contact pin 11, a two-layer film is applied after forming a pattern wiring by using a photoengraving technique, as shown in FIG. One surface of the two-layer tape 12 composed of the metal film layer 12a and the metal film layer 12b of Cu or the like, that is, the surface on the resin film layer 12a side is made of, for example, Ni or a Ni alloy (which will be described later, but may be Cu). A plurality of pattern wirings 13 are adhered, and each end 13a of the pattern wiring 13 projects from the front end 12c of the film 12.
Although not shown, the film 12 has, for example, a substantially home-base shape, and the pattern wirings 13 are arranged at a wide pitch at the wide base end of the film 12, whereas The narrow tip portions 12c are arranged at a narrow pitch. At the wide base end of the film 12, a window for connecting the pattern wiring 13 to a substrate-side electrode of a printed wiring board, which will be described later, is formed with an opening.
[0016]
Then, the leading end 13a of the pattern wiring 13 protruding from the leading end portion 12c of the film 12 is fitted into the concave portion 11c formed at the base end 11b of the contact pin 11, and an adhesive means such as soldering is applied as necessary. Then, the contact pin 11 is fixed to the tip 13a of the pattern wiring 13.
As a result, the plurality of contact pins 11 are arranged and fixed in one row, and in this state, the thickness direction of the plate-shaped contact pins 11 matches the arrangement direction of these contact pins 11. The pitch between the plurality of contact pins 11 is set to 30 to 50 μm.
[0017]
Through these steps, a contact probe having a basic structure is manufactured.
At this time, the tip 11a of the contact pin 11 is disposed so as to be substantially perpendicular to the extending direction of the film 12 and the pattern wiring 13. In the first embodiment, the tip 11a of the contact pin 11 is formed. The contact pins 11 are fixed such that the contact pins 11 project from the other surface of the film 12 toward the one surface side (the direction from the metal film layer 12b to the resin film layer 12a in the film 12) (described later). In the second embodiment, the contact pins 11 are fixed such that the tips 11a of the contact pins 11 project from one surface of the film 12 toward the other surface.)
[0018]
In the first embodiment, as shown in FIG. 2, the other surface of the film 12, that is, the metal film layer 12b side is made of a spring steel such as a SUP material or the like defined in JIS G4801. A thin spring layer 14 is applied.
The spring layer 14 has a protruding portion 14a that protrudes from a front end portion 12c of the film 12 to a position facing the front end 13a of the pattern wiring 13, and is fixed to the protruding portion 14a and the front end 13a of the pattern wiring 13. An elastic body 16 such as silicon rubber, which is adhered to the upper surface of the base end 11b of the contact pin 11 with an adhesive 15, is interposed in a gap formed between the base end 11b of the contact pin 11 and the base end 11b. .
[0019]
Although not shown, a plurality of, for example, four, contact probes 10 having such a configuration are used, and the narrowed distal portions 12c of the four films 12 are directed inward, and these four distal portions are used. It is arranged and fixed in a plane so that a substantially square opening is formed between the members 12c.
Accordingly, a contact probe unit is used for a measurement object having, for example, a peripheral arrangement type electrode terminal in which the contact pin 11 has a tip 11a protruding downward at a peripheral portion of the opening.
[0020]
Such a contact probe unit is assembled integrally with a printed wiring board and other parts, and the pattern wiring 13 in each contact probe 10 is formed at the base end of the film 12 by being pressed by an electrode pressing rubber. The probe device is formed by being connected to the board-side electrodes of the printed wiring board via the window portions.
[0021]
Here, the film 12 and the pattern wiring 13 of each contact probe 10 in the contact probe unit are arranged horizontally, while the tip 11a of the contact pin 11 is located downward from the opening in the contact probe unit. It is arranged so as to protrude, and is arranged so as to be substantially perpendicularly in contact with each electrode terminal (pad) of the measurement object.
[0022]
According to the first embodiment having such a configuration, the contact pins 11 to be brought into contact with the electrode terminals of the object to be measured and the pattern wiring 13 to be connected to the substrate-side electrode of the printed wiring board are separately configured. After that, the contact pins 11 are connected to each other by fitting the contact pins 11 into the tip portions 13a of the pattern wirings 13.
[0023]
Therefore, it is possible to dispose the tip 11a of the contact pin 11 so as to be substantially perpendicular to the electrode terminal of the object to be measured. In addition to the contact probe 10 and the probe device applied to the measurement object having the electrode terminals of the type, various arrangements of the electrode terminals (for example, a staggered arrangement type and a plane arrangement) are devised by making the contact probe into a laminated structure. Type).
In addition, by appropriately designing the pattern wiring 13 connected to these contact pins 11 and the film 12 on which the pattern wiring 13 is adhered, the connectivity of the pattern wiring 13 to the substrate-side electrode of the printed wiring board is impaired. Nothing.
[0024]
Further, since the contact pins 11 are formed in a plate shape and the thickness direction thereof coincides with the arrangement direction of the contact pins 11, the contact pins 11 having a plate shape are formed at a narrow pitch of 30 to 50 μm. Even when the contact pins 11 are arranged and the thickness is reduced to 10 to 20 μm, it is possible to secure a large cross-sectional area by increasing the width of the contact pins 11, resulting in a decrease in the strength of the contact pins 11. Or increase in the circuit resistance value.
In addition, since the contact pin 11 is formed in a plate shape, it is possible to easily form the contact pin into a complicated shape. The contact pin 11 may be formed in a plate shape having a C-shaped portion, and provided with a spring structure for absorbing a step when contacting the electrode terminal.
[0025]
Further, since the spring layer 14 is adhered to the other surface of the film 12, when the electrode terminal of the object to be measured is pressed against the tip 11a of the contact pin 11, the deflection obtained by the deflection of the spring layer 14 is obtained. Good contact can be obtained with force.
In addition, since the elastic body 16 is interposed between the protruding portion 14a of the spring layer 14 and the base end 11b of the contact pin 11, variations in the heights of the individual terminal electrodes in the measurement object can be ensured. Can be absorbed.
[0026]
In the first embodiment, since the plurality of contact pins 11 and the pattern wirings 13 are formed through the above-described manufacturing process, the thickness of the contact pins 11 is reduced to 10 to 20 μm as described above. The contact pin unit 30 in which the pitch between the set and arranged contact pins 11 is set to a narrow pitch of 30 to 50 μm can be easily manufactured.
[0027]
Next, a second embodiment of the present invention will be described with reference to FIGS. 3 and 4, and the same parts as those in the above-described first embodiment will be denoted by the same reference numerals and description thereof will be omitted.
FIG. 3 is an enlarged sectional view of a main part showing a state where the contact probe according to the second embodiment is incorporated in a probe device, and FIG. 4 is a schematic perspective view showing the probe device.
[0028]
The contact probe 20 according to the second embodiment is manufactured through the same steps as those described in the first embodiment, but when the contact pin 11 is fitted into the tip 13a of the pattern wiring 13, The front and back surfaces of the film 12 are opposite to those of the first embodiment. That is, the contact pins 11 are fixed such that the tips 11a of the contact pins 11 protrude from the other surface of the film 12 toward the one surface.
On the other surface of the film 12, that is, on the metal film layer 12b side, the spring layer 14 is attached together with the block 54 as in the first embodiment, but this spring layer 14 has a protruding portion 14a. I haven't.
[0029]
As shown in FIG. 4, a plurality of, for example, four, contact probes 20 having such a configuration are used, and the narrowed distal end portions 12c of the four films 12 are directed inward, and the four It is arranged and fixed in a plane so that a substantially square opening is formed between the tip portions 12c.
Thereby, a contact probe unit 21 used for a measurement object having, for example, a peripheral arrangement type electrode terminal in which a contact pin 11 has a tip 11a protruding downward at a peripheral portion of the opening.
[0030]
As shown in FIG. 4, such a contact probe unit 21 is assembled integrally with an upper pressing plate 51, an electrode pressing rubber 52, an insulating sheet 53 and a printed wiring board 55 with a set screw 56. When the pattern wiring 13 is pressed by the electrode pressing rubber 52, the pattern wiring 13 is connected to the board-side electrode 55 a of the printed wiring board 55 through a window formed at the base end of the film 12, and the probe device is connected to the probe wiring. Is done.
[0031]
Here, the film 12 and the pattern wiring 13 of each contact probe 20 in the contact probe unit 21 are arranged horizontally, while the tip 11 a of the contact pin 11 is located below the opening in the contact probe unit 21. It is arranged so as to protrude to the side, and is arranged so as to substantially perpendicularly contact each electrode terminal (pad) of the measurement object.
[0032]
In addition, as shown in FIGS. 3 and 4, the center of the insulating sheet 53 located immediately above the contact probe unit 21, just above the contact pin 11 of each contact probe 10 constituting the contact probe unit 21. A pressing member 53a is formed so as to be opposed to the side, and a gap formed between the pressing member 53a and the base end 11b of the contact pin 11 has an upper surface of the base end 11b of the contact pin 11. An elastic body 16 made of, for example, silicon rubber and bonded with an adhesive 15 is interposed.
[0033]
Further, in each contact probe 20 of the contact probe unit 21, on the pattern wiring 13 attached to one surface of the film 12 facing upward, the electronic component M It is electrically connected to the wiring 13 and mounted. Examples of such an electronic component M include a resistance component, a capacitor, and an LC composite component.
[0034]
According to the second embodiment having such a configuration, portions having the same configuration as that of the above-described first embodiment can obtain the same effect, and can be arranged horizontally. The electronic component M is mounted on the pattern wiring 13 located in the immediate vicinity of the contact pin 11 by disposing the film 12 with the one surface on which the pattern wiring 13 is attached facing upward. Is possible.
For this reason, it is possible to mount an electronic component M such as a bypass capacitor and a matching circuit in the immediate vicinity of the contact pin 11 and take a circuit configuration necessary for measuring a device for high frequency use, and obtain a probe device excellent in high frequency characteristics. Can be
[0035]
Here, since the contact pins 11 to be brought into contact with the respective electrode terminals of the object to be measured are separate from the pattern wirings 13 constituting the circuit portion, the pattern wirings 13 are not Ni or Ni alloy, but By using Cu, the conductive properties can be improved, and the circuit configuration can be more easily impedance-matched than before by controlling the thickness of the film 12, so if such a configuration is adopted, If this is the case, it is possible to obtain a probe device having more excellent high-frequency characteristics.
[0036]
Furthermore, since the pressing member 53a is located above the contact pin 11 via the elastic body 16, the elastic member 16 ensures that the variation in the height of the individual terminal electrodes in the measurement object is ensured. In addition to being able to absorb, even when an excessive force is applied to the contact pin 11, the presence of the pressing member 53a prevents unnecessarily elastic deformation of the contact pin 11 to prevent the pattern forming the circuit portion. Since it is possible to prevent the vicinity of the concave portion 11c of the contact pin 11 connected to the wiring 13a from being plastically deformed, the circuit test can be stably continued.
[0037]
In the first and second embodiments described above, if there is a concern that the strength of the contact pins 11 in the arrangement direction is insufficient, a rubber-based adhesive or silicone rubber is provided between the adjacent contact pins 11. By filling, it is possible to increase its strength.
[0038]
【The invention's effect】
According to the present invention, a contact pin to be brought into contact with an electrode terminal of an object to be measured and a pattern wiring connected to a printed wiring board are separately formed and then connected to each other to form a contact probe. As a result, the contact pins can be arranged so that the tips of the contact pins are almost perpendicular to the electrode terminals, making it possible to respond to various electrode terminal arrangements and connecting to these contact pins. By appropriately designing the pattern wiring and the film to be formed, the connectivity of the pattern wiring to the printed wiring board is not impaired.
Further, the thickness direction of the plate-shaped contact pins is made to coincide with the arrangement direction of the contact pins, and the contact pins are manufactured at a narrow pitch, that is, even when the thickness of the plate-shaped contact pins is reduced. By increasing the width of the contact pin, a large cross-sectional area can be ensured, so that the strength of the contact pin does not decrease and the circuit resistance does not increase. Further, by forming the contact pin in a plate shape, the contact pin can be easily formed into a complicated shape. For example, a spring structure for absorbing a step can be easily provided at the tip of the contact pin.
[Brief description of the drawings]
FIG. 1 is an enlarged perspective view of a main part showing a manufacturing process of a contact probe according to a first embodiment.
FIG. 2 is an enlarged sectional view of a main part of the contact probe according to the first embodiment.
FIG. 3 is an enlarged sectional view of a main part showing a state in which the contact probe according to the second embodiment is incorporated in a probe device.
FIG. 4 is a schematic perspective view showing a state in which the contact probe according to the second embodiment is incorporated in a probe device.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 Contact probe 11 Contact pin 11a Contact pin tip 12 Film 13 Pattern wiring 13a Pattern wiring tip 14 Spring layer 16 Elastic body 53a Holding member

Claims (8)

At the tip of the pattern wiring attached to one surface of the film, a plurality of contact pins having a plate shape and having a recess are fixed so as to fit the recess into the tip of the pattern wiring. Contact probe to do. The contact probe according to claim 1,
A contact probe, wherein a spring layer is applied to the film. A probe device comprising: the contact probe according to claim 1; and a printed wiring board to which the pattern wiring is connected. The probe device according to claim 3,
A probe device, wherein a tip of the contact pin is disposed substantially perpendicular to an electrode terminal of an object to be measured. In the probe device according to claim 3 or 4,
The probe device, wherein the contact probe is arranged with one surface of the film on which the pattern wiring is attached facing upward. The probe device according to any one of claims 3 to 5,
A probe device, wherein a pressing member is provided above the contact pin. The probe device according to claim 6,
A probe device, wherein an elastic body is interposed between the holding member and the contact pin. A method for manufacturing a contact probe according to claim 1 or 2, wherein:
A mask is applied on a first metal layer made of a material that is attached to or bonded to the material of the contact pins formed on the support plate, and a second metal layer serving as the contact pins is plated on unmasked portions. Forming a contact pin having a plate shape and having a concave portion by removing the mask and the first metal layer after forming by a process;
Fixing the contact pin to the tip of the pattern wiring attached to one surface of the film so as to fit the concave portion of the contact pin into the tip of the pattern wiring. .

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