JP2003229623A5 - - Google Patents

Download PDF

Info

Publication number
JP2003229623A5
JP2003229623A5 JP2002027985A JP2002027985A JP2003229623A5 JP 2003229623 A5 JP2003229623 A5 JP 2003229623A5 JP 2002027985 A JP2002027985 A JP 2002027985A JP 2002027985 A JP2002027985 A JP 2002027985A JP 2003229623 A5 JP2003229623 A5 JP 2003229623A5
Authority
JP
Japan
Prior art keywords
crystal substrate
semiconductor crystal
nitride
region
compound semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002027985A
Other languages
English (en)
Japanese (ja)
Other versions
JP4072352B2 (ja
JP2003229623A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2002027985A priority Critical patent/JP4072352B2/ja
Priority claimed from JP2002027985A external-priority patent/JP4072352B2/ja
Publication of JP2003229623A publication Critical patent/JP2003229623A/ja
Publication of JP2003229623A5 publication Critical patent/JP2003229623A5/ja
Application granted granted Critical
Publication of JP4072352B2 publication Critical patent/JP4072352B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2002027985A 2002-02-05 2002-02-05 窒化物系化合物半導体素子及びその作製方法 Expired - Fee Related JP4072352B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002027985A JP4072352B2 (ja) 2002-02-05 2002-02-05 窒化物系化合物半導体素子及びその作製方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002027985A JP4072352B2 (ja) 2002-02-05 2002-02-05 窒化物系化合物半導体素子及びその作製方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2007323096A Division JP4786634B2 (ja) 2007-12-14 2007-12-14 窒化物系化合物半導体素子及びその作製方法

Publications (3)

Publication Number Publication Date
JP2003229623A JP2003229623A (ja) 2003-08-15
JP2003229623A5 true JP2003229623A5 (enrdf_load_stackoverflow) 2005-08-18
JP4072352B2 JP4072352B2 (ja) 2008-04-09

Family

ID=27749343

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002027985A Expired - Fee Related JP4072352B2 (ja) 2002-02-05 2002-02-05 窒化物系化合物半導体素子及びその作製方法

Country Status (1)

Country Link
JP (1) JP4072352B2 (enrdf_load_stackoverflow)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3916584B2 (ja) 2003-04-24 2007-05-16 シャープ株式会社 窒化物半導体レーザ装置
US8089093B2 (en) 2004-02-20 2012-01-03 Nichia Corporation Nitride semiconductor device including different concentrations of impurities
JP5217077B2 (ja) * 2004-02-20 2013-06-19 日亜化学工業株式会社 窒化物半導体素子及び窒化物半導体基板の製造方法、並びに窒化物半導体素子の製造方法
KR101910556B1 (ko) 2012-03-20 2018-10-22 서울반도체 주식회사 질화갈륨 기판을 갖는 발광 다이오드
US20230197486A1 (en) * 2020-04-14 2023-06-22 Kwansei Gakuin Educational Foundation Method for producing aluminum nitride substrate, aluminum nitride substrate, and method for suppressing occurrence of cracks in aluminum nitride layer
CN115398044A (zh) * 2020-04-14 2022-11-25 学校法人关西学院 半导体衬底的制造方法、半导体衬底以及抑制生长层裂纹产生的方法
JPWO2021210393A1 (enrdf_load_stackoverflow) * 2020-04-14 2021-10-21
EP4137615A4 (en) * 2020-04-14 2024-05-29 Kwansei Gakuin Educational Foundation METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR SUBSTRATE AND METHOD FOR FORMING LAYER OBTAINED BY GROWTH

Similar Documents

Publication Publication Date Title
JP7050717B2 (ja) オプトエレクトロニクス半導体エレメントとオプトエレクトロニクス半導体エレメントを製造する方法
KR101622308B1 (ko) 발광소자 및 그 제조방법
KR100616600B1 (ko) 수직구조 질화물 반도체 발광소자
JP2006310785A (ja) 横電流抑止の発光ダイオードおよびその製造方法
CN104025319A (zh) 半导体装置和制造半导体装置的方法
KR960036120A (ko) 절연게이트형 반도체장치 및 그 제조방법
US8053830B2 (en) Semiconductor device
JP2004039924A5 (enrdf_load_stackoverflow)
EP2299481A3 (en) Semiconductor power device with multiple drain structure and corresponding manufacturing process
JP2003229638A5 (enrdf_load_stackoverflow)
CN110121782A (zh) 显示装置及其制造方法
JP2003229623A5 (enrdf_load_stackoverflow)
CN102856481A (zh) 半导体发光器件封装件
WO2020035419A1 (de) Optoelektronisches halbleiterbauelement mit kontaktelementen und dessen herstellungsverfahren
JP2019091796A (ja) スイッチング素子とその製造方法
JP6204131B2 (ja) 発光素子及びその製造方法
KR20100041537A (ko) Ⅲ족 질화물 반도체의 표면 처리 방법, ⅲ족 질화물 반도체및 그의 제조 방법 및 ⅲ족 질화물 반도체 구조물
KR101984698B1 (ko) 기판 구조체, 이로부터 제조된 반도체소자 및 그 제조방법
KR101869045B1 (ko) 고전자이동도 트랜지스터 및 그 제조방법
JPH08153892A (ja) 半導体発光素子、およびその製造方法
CN102820315B (zh) 一种直接发光型微显示阵列器件及其制备方法
EP2279534A2 (de) Led-element mit dünnschicht-halbleiterbauelement auf galliumnitrid-basis
KR101171356B1 (ko) 다수의 셀이 결합된 발광 소자 및 이의 제조 방법
TWI667811B (zh) 半導體裝置及其製造方法
KR102122366B1 (ko) 질화물 반도체 박막 제조방법 및 이를 이용한 질화물 반도체 소자 제조방법