JP2003224201A - 半導体装置及びその製造方法 - Google Patents

半導体装置及びその製造方法

Info

Publication number
JP2003224201A
JP2003224201A JP2002023372A JP2002023372A JP2003224201A JP 2003224201 A JP2003224201 A JP 2003224201A JP 2002023372 A JP2002023372 A JP 2002023372A JP 2002023372 A JP2002023372 A JP 2002023372A JP 2003224201 A JP2003224201 A JP 2003224201A
Authority
JP
Japan
Prior art keywords
electrode
layer
semiconductor device
conductive layer
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002023372A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003224201A5 (enExample
Inventor
Yoshitaka Otsu
良孝 大津
Takayuki Igarashi
孝行 五十嵐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Semiconductor Engineering Corp
Mitsubishi Electric Corp
Original Assignee
Renesas Semiconductor Engineering Corp
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Semiconductor Engineering Corp, Mitsubishi Electric Corp filed Critical Renesas Semiconductor Engineering Corp
Priority to JP2002023372A priority Critical patent/JP2003224201A/ja
Priority to US10/265,747 priority patent/US6808973B2/en
Publication of JP2003224201A publication Critical patent/JP2003224201A/ja
Publication of JP2003224201A5 publication Critical patent/JP2003224201A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
    • H10D84/811—Combinations of field-effect devices and one or more diodes, capacitors or resistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
    • H10D84/811—Combinations of field-effect devices and one or more diodes, capacitors or resistors
    • H10D84/813—Combinations of field-effect devices and capacitor only

Landscapes

  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP2002023372A 2002-01-31 2002-01-31 半導体装置及びその製造方法 Pending JP2003224201A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2002023372A JP2003224201A (ja) 2002-01-31 2002-01-31 半導体装置及びその製造方法
US10/265,747 US6808973B2 (en) 2002-01-31 2002-10-08 Manufacturing method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002023372A JP2003224201A (ja) 2002-01-31 2002-01-31 半導体装置及びその製造方法

Publications (2)

Publication Number Publication Date
JP2003224201A true JP2003224201A (ja) 2003-08-08
JP2003224201A5 JP2003224201A5 (enExample) 2005-08-11

Family

ID=27606391

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002023372A Pending JP2003224201A (ja) 2002-01-31 2002-01-31 半導体装置及びその製造方法

Country Status (2)

Country Link
US (1) US6808973B2 (enExample)
JP (1) JP2003224201A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7095094B2 (en) * 2004-09-29 2006-08-22 Agere Systems Inc. Multiple doping level bipolar junctions transistors and method for forming
GB2439357C (en) * 2006-02-23 2008-08-13 Innos Ltd Integrated circuit manufacturing
US8126320B2 (en) * 2008-03-05 2012-02-28 Robertshaw Controls Company Methods for preventing a dry fire condition and a water heater incorporating same
CN106257646B (zh) * 2015-06-17 2019-06-14 北大方正集团有限公司 嵌入pip电容的cmos制作方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4419812A (en) * 1982-08-23 1983-12-13 Ncr Corporation Method of fabricating an integrated circuit voltage multiplier containing a parallel plate capacitor
US4577390A (en) * 1983-02-23 1986-03-25 Texas Instruments Incorporated Fabrication of polysilicon to polysilicon capacitors with a composite dielectric layer
JP2840488B2 (ja) 1991-09-27 1998-12-24 三洋電機株式会社 半導体集積回路とその製造方法
US5726084A (en) * 1993-06-24 1998-03-10 Northern Telecom Limited Method for forming integrated circuit structure
JP2616569B2 (ja) * 1994-09-29 1997-06-04 日本電気株式会社 半導体集積回路装置の製造方法
JPH1050941A (ja) 1996-07-31 1998-02-20 Sanyo Electric Co Ltd 半導体集積回路の製造方法
US6015732A (en) * 1996-09-06 2000-01-18 Vlsi Technology, Inc. Dual gate oxide process with increased reliability
JP3104660B2 (ja) * 1997-11-21 2000-10-30 日本電気株式会社 半導体装置およびその製造方法
JP2001185628A (ja) 1999-12-22 2001-07-06 Nec Corp 半導体装置及びその製造方法
US6271068B1 (en) * 2001-01-08 2001-08-07 Taiwan Semiconductor Manufacturing Company Method for making improved polysilicon emitters for bipolar transistors on BiCMOS integrated circuits

Also Published As

Publication number Publication date
US6808973B2 (en) 2004-10-26
US20030143799A1 (en) 2003-07-31

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