JP2003209058A5 - - Google Patents

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Publication number
JP2003209058A5
JP2003209058A5 JP2002006297A JP2002006297A JP2003209058A5 JP 2003209058 A5 JP2003209058 A5 JP 2003209058A5 JP 2002006297 A JP2002006297 A JP 2002006297A JP 2002006297 A JP2002006297 A JP 2002006297A JP 2003209058 A5 JP2003209058 A5 JP 2003209058A5
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JP
Japan
Prior art keywords
film forming
reached
manufacturing apparatus
semiconductor manufacturing
common line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002006297A
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English (en)
Japanese (ja)
Other versions
JP3854157B2 (ja
JP2003209058A (ja
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Publication date
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Priority to JP2002006297A priority Critical patent/JP3854157B2/ja
Priority claimed from JP2002006297A external-priority patent/JP3854157B2/ja
Publication of JP2003209058A publication Critical patent/JP2003209058A/ja
Publication of JP2003209058A5 publication Critical patent/JP2003209058A5/ja
Application granted granted Critical
Publication of JP3854157B2 publication Critical patent/JP3854157B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2002006297A 2002-01-15 2002-01-15 半導体製造装置及びそのクリーニング方法 Expired - Lifetime JP3854157B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002006297A JP3854157B2 (ja) 2002-01-15 2002-01-15 半導体製造装置及びそのクリーニング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002006297A JP3854157B2 (ja) 2002-01-15 2002-01-15 半導体製造装置及びそのクリーニング方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2006201246A Division JP2006313934A (ja) 2006-07-24 2006-07-24 半導体製造装置および半導体製造装置の成膜処理方法

Publications (3)

Publication Number Publication Date
JP2003209058A JP2003209058A (ja) 2003-07-25
JP2003209058A5 true JP2003209058A5 (enExample) 2005-08-04
JP3854157B2 JP3854157B2 (ja) 2006-12-06

Family

ID=27645108

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002006297A Expired - Lifetime JP3854157B2 (ja) 2002-01-15 2002-01-15 半導体製造装置及びそのクリーニング方法

Country Status (1)

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JP (1) JP3854157B2 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005216911A (ja) * 2004-01-27 2005-08-11 Komatsu Electronic Metals Co Ltd エピタキシャル成長装置の排ガス処理システム
JP4225998B2 (ja) 2004-12-09 2009-02-18 東京エレクトロン株式会社 成膜方法及び成膜装置並びに記憶媒体
JP4931381B2 (ja) * 2005-02-08 2012-05-16 東京エレクトロン株式会社 基板処理装置，基板処理装置の制御方法，プログラム
JP4823628B2 (ja) * 2005-09-26 2011-11-24 東京エレクトロン株式会社 基板処理方法および記録媒体
JP5633167B2 (ja) * 2010-03-24 2014-12-03 株式会社Sumco エピタキシャル成長システム
KR101618494B1 (ko) 2012-03-30 2016-05-04 가부시키가이샤 히다치 고쿠사이 덴키 기판 처리 장치, 기판 처리 장치의 보수 방법 및 기록 매체
TW201443984A (zh) 2013-02-05 2014-11-16 Hitachi Int Electric Inc 清洗方法、半導體裝置之製造方法、基板處理裝置、以及記錄媒體及清洗結束判定方法
JP6105436B2 (ja) * 2013-08-09 2017-03-29 東京エレクトロン株式会社 基板処理システム
US10096501B2 (en) 2013-08-27 2018-10-09 Hitachi Kokusai Electric Inc. Maintenance method of substrate processing apparatus, method for manufacturing semiconductor device, substrate processing apparatus, and storage medium capable of reading maintenance program of substrate processing apparatus
JP7076499B2 (ja) 2020-06-22 2022-05-27 株式会社Kokusai Electric 基板処理装置、半導体装置の製造方法およびプログラム
US11532525B2 (en) * 2021-03-03 2022-12-20 Applied Materials, Inc. Controlling concentration profiles for deposited films using machine learning
CN114360997B (zh) * 2021-12-09 2024-06-21 北京北方华创微电子装备有限公司 多腔室清洗方法和半导体工艺设备
CN114361075B (zh) * 2021-12-31 2025-08-26 北京北方华创微电子装备有限公司 半导体工艺方法和半导体工艺设备

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