JP2003188315A - Semiconductor device and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a structure for a highly manufacturable BGA package and a method of manufacturing the package. <P>SOLUTION: Semiconductor components, such as an IC chip 1, a substrate 2, etc., are fixed and supported by using a supporting frame 5, etc. Then the components are sealed with a resin 14. A molding tool 16, etc., uses a structure equipped with split components 60 and projecting sections 22 with a cured rubber-based resin material or a substrate 71 with release agent on which a release agent is applied to the surfaces 66 of electrodes. Since the semiconductor components are sealed with the resin 14, the reliability and heat dissipating efficiency of the BGA package are improved and the package can easily cope with pins even when the number of the pins increases. In addition, the productive efficiency of the package can be improved and the package can be produced stably, because the molding step can be automated and can be reduced in man power. Thus the highly reliable resin-sealed BGA package can be obtained at a low cost. In addition, when the molding tool structure is used, the occurrence of voids and resin burrs on the surfaces of the substrate 2 and electrodes can be prevented. <P>COPYRIGHT: (C)2003,JPO

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention
In the manufacture of packages, especially the structure of BGA packages
The present invention relates to a fixed support method and a manufacturing method for a component.
You. 2. Description of the Related Art A semiconductor package has a high-density mounting structure.
In order to reduce the size, the size and thickness have been reduced. Ma
In addition, the amount of information processing per chip also tends to increase,
The number of input / output pins per package tends to increase
is there. However, if you increase the size of the package
As the number of pins increases, each lead pin
Tend to be very narrow. Therefore, the circuit board
Advanced mounting technology is required for mounting on a board
Is the current situation. In recent years, package
The external connection form of the page is different from the conventional structure.
Grid array) or BGA (ball grid
Package with external connection structure such as
It has come to be. [0003] This BGA package has a face-up
Type and face-down type. [0004] Face-up type BGA package
Is disclosed in US Pat. No. 5,216,278.
Of the structure of the BGA is described with reference to FIGS.
I do. FIG. 49 shows a sectional view of a BGA package.
You. The IC chip 1 and the substrate 2 are fixed with an adhesive or the like.
ing. As the material of the substrate, an organic material (for example, BT
Gin). IC chip 1 and pad 1 on substrate
2 electrically connected by wire bonding 13
Have been. FIG. 50 shows a flat view when FIG. 49 is viewed from above.
FIG. Substrate connected by wire bonding 13
From the upper pad 12, the wiring 1 for communicating with the electrode 3
05 are provided, and the through holes 106 are respectively provided.
Through the back surface of the substrate. FIG. 51 shows a flat view when FIG. 49 is viewed from below.
FIG. The electrodes 3 are arranged in a grid.
Here, the metal bumps 4 are joined to complete the electric wiring. This structure
Cover the substrate surface on which the manufactured IC chip 1 is mounted with resin 14
This protects the package and completes the package shape. Productivity when molding a semiconductor package
From the point of view, multiple cavities are installed in the mold
It is usual to perform resin filling. For this reason,
With the above structure, positioning in the mold becomes difficult,
There is a problem that the product removal process becomes very complicated.
Due to these factors, production costs may increase, resulting in expensive products.
There is a problem. Also, a face-down type BGA package is used.
An example of a cage is disclosed in US Pat. No. 5,148,265.
The schematic structure of the BGA is described with reference to FIGS.
explain. FIG. 52 is a perspective view of a BGA package.
You. The configuration is such that silicon is placed on the circuit surface of the IC chip 1.
Place an insert 32 such as rubber, and place a wiring pattern
It is composed of a certain wiring film 31
You. The IC chip 1 and the wiring film 31 are wire bonded.
Ring 13. FIG. 53 shows an enlarged sectional view of the connection portion. Insertion
The container 32 is made of a flexible resin such as silicone resin.
Used. IC chip 1 and wiring film of this component
The part excluding the upper electrode 33 is made of a soft material such as silicone resin.
Completion of package shape by protecting with resin 14
It has become. At this time, the face-up type
The same problems as the solid ones can be considered. Ie production
From the viewpoint of properties, when molding, multiple
It is usual to install a cavity for resin filling
is there. For this reason, this structure makes positioning in the mold difficult.
And the process of removing molded parts becomes very complicated.
Problems. These factors increase production costs.
There is a problem that it is possible to raise the price and the product becomes expensive. On the other hand, a molding method including a substrate is described.
Usually, a board is placed between the upper mold and the lower mold, and
Filling resin into the cavity
You. Therefore, the flow path for filling the resin on the substrate
It is necessary to provide certain runners and gates,
This is a constraint in designing. In addition, unnecessary runs
In the process of removing the gate, the substrate may be damaged.
May lead to lower reliability. Further, a flow for filling the resin on the substrate is provided.
As a molding method without runners and gates,
JP-B-61-46049, JP-A-4-184944
And many other examples. Tokiko Sho 61-46049
In Japanese Patent Publication No.
The runners and gates, which are roads, are
Part is made of another plate part (called a cavity plate).
It is a method of setting and molding in a mold together with the substrate
ing. In this method, the electric circuit of the board is designed.
There are no restrictions on the product, but when making thin products,
Because the thickness of the plate is also thin, deformation and
Other problems such as removal of resin burrs generated on the board
There is fear. Furthermore, cavity play is performed for each molding.
Must be replaced, and it is difficult to automate the molding process.
There is a problem. Japanese Patent Application Laid-Open No. 4-184944 discloses a cash register.
Runners and gates, which are flow paths for filling
This part slides when the mold is opened
The mold structure is described. However, there is no
Resin easily flows into this sliding part because the resin flows
And it becomes resin burrs, causing sliding resistance and malfunction.
There is a disadvantage that it is easy to do. This malfunction is serious in production.
Can be a problem. [0015] The above-mentioned prior art is a cash register.
It is difficult to position the above parts in the molding die used for
There was a problem that was difficult. Also, make the molding process complicated.
There was a problem that it was difficult to achieve automation and labor saving. This
Due to these factors, there is a problem that the price of the product increases.
Was. In molding including a substrate, a resin flow path in a mold is provided.
There is a sliding part in the resin
Is likely to cause malfunctions and reduce production efficiency.
There was a problem. And the runners and
Make the sheet part in the molding die and make the cavity part a separate plate part
(Cavity plate) and place it in the mold with the substrate
When making thin products, mold
When the plate itself is deformed,
There was a problem. In addition, cavity play for each molding
It is difficult to automate the molding process because it is necessary to replace
There has been a problem that the efficiency is reduced and the price of the product is increased. The present invention eliminates the above-mentioned disadvantages and achieves high productivity.
And low cost BGA package structure and manufacturing method
The purpose is to provide. [0018] The present invention achieves the above object.
To secure the IC chip, substrate, or wiring film.
BGA package structure using a fixed supporting frame
And IC chip, substrate or wiring film with resin
BGA package structure to cover. More specifically, the present invention is as follows.
It becomes. According to a first aspect of the present invention, there is provided an IC chip.
And a laminated circuit board on which it is mounted and connected (hereinafter abbreviated as
Or a wiring pattern formed on an insulating substrate.
Wire film (hereinafter abbreviated as wiring film) and their electricity
Provide an electrode section for connecting circuit components to the outside, and
In a semiconductor device formed with a metal bump,
Fixing and supporting IC chips, substrates or wiring films
It has a support frame and has at least a part other than the electrode part.
A semiconductor device characterized by being sealed with equipment is provided.
You. In this case, the support frame is made of a metal material.
It is preferable to configure. The above-mentioned supporting frame is composed of an IC chip, a substrate or
It is preferable to fix and support one of the wiring films.
New According to a second aspect of the present invention, there is provided an IC chip.
And a laminated circuit board on which it is mounted and connected (hereinafter abbreviated as
Or a wiring pattern formed on an insulating substrate.
Wire film (hereinafter abbreviated as wiring film) and their electricity
Provide an electrode section for connecting circuit components to the outside, and
In a semiconductor device formed with a metal bump,
Fixing and supporting IC chips, substrates or wiring films
A semiconductor device characterized in that the supporting frame is a heat sink.
Device is provided. According to a third aspect of the present invention, there is provided an IC chip.
And a laminated circuit board on which it is mounted and connected (hereinafter abbreviated as
Or a wiring pattern formed on an insulating substrate.
Wire film (hereinafter abbreviated as wiring film) and their electricity
Provide an electrode section for connecting circuit components to the outside, and
In a semiconductor device formed with a metal bump,
Fixing and supporting IC chips, substrates or wiring films
Semiconductor characterized by removing the outer frame of the support frame
An apparatus is provided. In each of the above embodiments, the IC chip and the substrate
And the IC chip and substrate are bonded wires
It is preferable to connect with. The IC chip and the wiring film are fixedly supported.
The IC chip and the wiring film
Bonding with metal bumps or bonding with conductive resin
It is preferable to connect by joining. [0027] In the first embodiment, the organic material is sealed.
In this case, the IC chip and the substrate are bonded with bonding wires.
The connected chip mounting surface and the
Sealing or chip mounting surface for all components except poles
And sealing only to the side of the board or only the chip mounting surface
It may be sealed. In the first embodiment, sealing with an organic substance is performed.
The form to do is metal bonding IC chip and wiring film
Or an IC chip connected with conductive resin
Remove the mounting surface of the film and the external electrodes on the wiring film.
Sealing the contacted part or connecting the IC chip to the wiring film
Seals up to the mating surface or seals all components.
There may be. According to a fourth aspect of the present invention, there is provided a laminated circuit board.
Wiring on board (hereinafter abbreviated as “substrate”) or insulating substrate
The wiring film with the pattern formed and the IC chip
Mounted on a support frame, the IC chip and the substrate or
Is electrically connected to the wiring film and the IC chip
, The substrate or the wiring film, and the support frame.
And at least one of the
Part of it is filled and sealed with an organic material.
Manufacturing method of semiconductor device characterized by forming a pump
Is provided. In this case, the filling and sealing of the organic material is performed as follows.
It is preferable to use a mold. Further, the molding die includes an upper die,
Provided corresponding to the solder bump formation position,
Projection for molding the shape of the part forming the bump
And a lower mold having the organic material
Of the IC chip, which are electrically connected to each other,
And a support foil on which a board or wiring film is mounted.
The frame is sandwiched between the upper mold and the lower mold, and the molding is performed.
It may be done by pressing resin into the mold
No. According to a fifth aspect of the present invention, a semiconductor device
In the molding die used for resin molding of
And a lower mold having a cavity.
The arrangement pattern of the electrode part exposed outside the semiconductor device and
The protrusions arranged in the same pattern are
Molding dies are provided.
Is done. In this case, the lower die is provided with the protrusions.
It is preferable to have an air vent on the surface provided. The air vent is provided with the projection.
It is preferable that it is provided in the approximate center of the area
No. The lower mold is composed of a plurality of parts.
The air vent is located at the boundary between the parts.
It is preferable that the gap is formed as a gap. Further
Some of the parts protrude into the cavity
Preferably, it is configured to be possible. Also, a bullet covering the top of the protrusion is
It is preferable to further have a flexible material having properties. The flexible material may be a rubber-based resin.
No. The above-mentioned flexible material is made of silicone rubber or
It may be a polytetrafluoroethylene-based resin. The surface on which the projections are provided is
Preferably it is the bottom of the cavity. According to a sixth aspect of the present invention, there is provided a laminated circuit board.
Board (hereinafter abbreviated as “substrate”) or insulating substrate
A wiring film on which a wiring pattern is formed;
Is an IC chip electrically connected to the wiring film
And the IC chip, the substrate or the wiring film,
The supporting frame, the IC chip, and the
Between the substrate or the wiring film and the support frame
At least part of at least one of them
Through the sealed sealing material and the substrate or wiring film
And is electrically connected to the IC chip and externally
And a plurality of exposed electrode portions.
A conductor device is provided. Even if the above-mentioned electrode portions are arranged in a lattice shape,
Good. The first to third aspects will be described. If the above-mentioned means is used, the mold cavity
Positioning in the tee is easy,
I can do it. Acts as a heat sink on the support frame
In addition, the strength of the substrate can be reinforced and the warpage can be reduced. Also,
Sealing IC chip, substrate or wiring film with resin
To improve humidity resistance and warp of BGA package
Can be reduced. In addition, by using a support frame
Automation of each process is easy and productivity efficiency can be improved.
You. The fourth, fifth and sixth aspects are summarized
explain. First, a substrate or a wiring film and an IC chip
On the support frame and connect them electrically.
You. And for at least one of these,
At least a part thereof is filled and sealed with an organic material. The seal
Stop the support frame with the IC chip etc.
Hold the mold between the upper mold and the lower mold, and put resin in the mold.
This is done by pressing. In this case, the filling and sealing of the organic material is performed as follows.
This is performed using a mold (upper / lower mold). Trying to make
If the semiconductor device is of BGA type,
On the bottom surface of the cavity of the lower mold, the electrode arrangement
Provide protrusions arranged in the same pattern as the turn
Good. The protrusions shape the periphery of the electrode pad.
create. When such projections are provided, the lower die
In the case of Viti (especially the area where protrusions are provided)
The flow of organic material becomes worse compared to the mold cavity,
Air (void) tends to remain in the area where protrusions are provided.
It becomes. Therefore, the air vent is placed on the surface on which the projections are provided.
The installation of such a point prevents such
You. The air vent is provided between a plurality of parts constituting the lower mold.
If it is realized as an interval, it can be easily realized technically
(The lower mold is composed of one part, and a single hole is provided in this.
Of course, it can be realized by doing this). For BGA type,
Electrode pads are placed on the entire lower surface of the semiconductor device.
Eventually, voids also gather in the center of the lower surface
You. Therefore, the air vent is also located at the center (
(Approximately the center of the area where the protrusions are provided)
Thus, the air (void) can be reliably discharged to the end. As described above, the flow of the organic material is
The cavity is better. Therefore, during the molding,
The frame is made of an organic material that fills the cavity of the upper mold.
As a result, the state is pushed toward the protrusion. This allows
A flexible material (for example, rubber-based resin,
In particular, silicone rubber-based and polytetrafluoroethylene-based
Gap between the electrode pad and the top of the protrusion
Fill the gap. This prevents burrs from forming in the gap
it can. Some of the parts constituting the lower mold are partially
If it is possible to project into the cavity, it will help release the molded product
Can also serve as a protruding pin. After sealing with an organic material as described above, the electrode
By forming solder bumps on the pad portion, the sixth aspect and
The semiconductor device described above is completed. An embodiment of the present invention will be described with reference to FIGS.
I will tell. FIG. 1 shows a BGA package structure of the first embodiment.
It is a perspective view showing the outline of. Face-up type B
The configuration of the GA package is IC chip 1, laminated circuit board
2. External conduction electrode 3 on the board mounting surface and contact
Metal bumps 4 to be combined as external electrodes and fix them
Support frame (i) 5 for carrying out the operation.
That is, the support frame (i) 5 is fixed to the outer frame 6 and the substrate.
Frame hanging lead 7, board fixing frame 8, and tab hanging lead 9
And a tab 10. Around this tab 10
The IC chip 1 and the substrate 2 from above and below with adhesive
It will be in a more fixed state. Insulated as base material for substrate 2
Anything is good. The wiring is the pad 11 part of the IC chip 1.
And the wiring pad portion 12 of the substrate 2
They are electrically connected by wire bonding. Wire bo
From the pad 12 on the surface of the substrate 2
Wiring for obtaining conduction with the electrode 3 on the back surface of the substrate 2 (illustration
Without). These electrical wirings are insulators (not shown).
Needless to say, it is protected by zu). Back of substrate 2
What is conducted to the surface is wired to each electrode 3
I have. In this state, it is set on the molding die and
The entire part except for the electrode 3 is sealed with a resin 14.
Protect and complete the package shape. After resin sealing,
A metal bump, such as a solder ball, is joined to the
The wiring is completed and the product is completed. FIGS. 2 to 4 show the outline of the manufacturing process and the respective processes.
These schematic diagrams are also shown. Resin molding is a multi-piece
Molding is usually performed, and the manufacturing process in this case is
And will be described below. FIG. 2 shows an IC chip as a component.
1. When assembling the substrate 2, the support frame (i) 5
FIG. 3 shows the outline (a) of the process. That is, support
The frame (i) 5 is a multi-unit so that multiple moldings can be made.
Thus, a structure as shown in FIG. This multiple support frame
IC chip on each tab 10 part on the room (i) 5 (c)
1 (b) is mounted and fixed with an adhesive or the like. Next,
Plate 2 (d) from multiple support frame (i) 5 (c) from the back
Adhesive or the like to the back side of the tab 10 and to the substrate fixing frame 8
To form a three-layer structure with ten tabs interposed therebetween.
Each product is placed on the outer frame of this multiple support frame (i) 5 (c).
Guide holes (not shown) for automatically performing the manufacturing process
Is provided. Then, the pad portion on the IC chip 1 (see FIG.
(Not shown) and a pad (not shown) on the substrate 2
Wire connection to establish conduction with the substrate 2.
Completed multiple support frame 15 (e) with chip / substrate mounting
I do. FIG. 3 shows a chip / substrate mounted multiple supporting frame.
The schematic (a) of the step of resin molding using the system 15 is shown.
You. Here, epoxy resin, a thermosetting resin, is used.
The case of transfer molding will be described. Molding
Inside the cavity 17 provided in the mold (i) 16 (c)
The multiple support frame 15 (b) mounted on chip / substrate
I do. At this time, the molding die (i) 16 is made of an epoxy resin.
Is heated to a temperature at which it cures. Next, molding
Potted resin tablet (not shown) in mold
Part (not shown) and push with plunger (not shown)
Press. Resin pressed by plunger (not shown)
14 is heated and melted and flows through the runner 18 → gate 19 in the mold.
Moves into the cavity 17 and is cured by a curing reaction.
It becomes a molded product. The state inside the cavity 17 is enlarged (d).
Will be described. That is, there is a large gap between the upper mold 20 and the lower mold 21.
The chip /
Ten tabs on which the substrate is mounted are installed. At this time, tip
/ The position of the board-mounted multiple support frame 15 is
Positioning holes (not shown) provided on the
Positioning in cavity 17 by female pin (not shown)
Needless to say, Thus, the cavities
Resin flows in the state where it is installed in
To complete the resin sealing. At this time, the lower mold 21
The mounting surface side of the substrate 2 by the projections 22 provided in the cavity portion
To prevent the resin 14 from invading the three electrodes 3
The resin molding is completed with only the exposed parts. FIG. 4 shows an outline of steps from a molded product to a finished product.
(A) is shown. The molded product 23 (b) sealed with resin is
6 parts of the support frame outer frame and
Port 19 and runner 18 are cut with a cutting die 24 (c).
It is cut and separated from the molded product 23. Cutting isolated
Next, the shape 25 (d) is processed to form an external electrode portion.
Proceed to step (e). In other words, the previously exposed base
Supplying, for example, ball-shaped solder 4 to the electrodes 3 on the board mounting surface
And heat bonding to complete the final external electrode part 26
Completed the process and completed the resin-sealed BGA package (f)
To complete. In this way, the chip / substrate mounting multiple support
By using the frame 15, the resin sealing process is currently performed.
It can be produced by the general transfer molding method
Production costs can be reduced and production efficiency can be improved. In addition,
Group made of organic material by resin-sealing
In the case of a board, moisture absorption from the board can be prevented, so
It is thought that the improvement of the humidity reliability can be achieved. In addition, during operation
For products that generate a lot of chip heat and need to be cooled
Is released through the tab under the chip and the board fixing frame.
There is a feature that the heat effect is improved. In addition, high heat dissipation is required
In the case where
It can be used as a heat sink without cutting.
You. FIG. 5 shows a second embodiment of the present invention. FIG.
Is the tab suspension lead and tab in the support frame component.
BGA package composed of a support frame (ii) 27 without
It is a perspective view of a package structure. That is, the IC chip 1
And the substrate 2 are directly bonded and bonded to the support frame (ii) 27.
Is performed on the substrate 2 and the substrate fixing frame 8.
With such a structure, the package thickness can be reduced.
Which effect has. The arrangement of the pads 12 on the substrate 2 is
There are features that can be freely designed. In addition, the chip and substrate
The feature is that the wire bonding process for connection is easy.
You. The resin molding is shown in FIGS. 3 (c) and (d).
The molding die 16 has a structure of a molding die (ii) 40 shown in FIG.
Just replace it with something. Also, as shown in FIG.
It can be said that the cutting mold 24 is replaced depending on the shape of the molded product.
Not even. FIG. 6 shows a third embodiment of the present invention. this
Is bent by bending the frame-holding lead 7 for fixing the substrate.
A support for fixing and bonding the part 8 on the mounting surface side where the electrode 3 of the substrate 2 is located
BGA package structure composed of holding frame (iii) 28
It is a perspective view of a structure. With such a structure, on the substrate 2
Pads can be arranged freely, and even if there are many pads
There are features. In addition, a wire box connecting the chip and the substrate
There is a feature that the binding process is also easy. Also resin
The molding is performed with the molding die 16 shown in FIGS. 3 (c) and 3 (d).
Replace the molding die (iii) shown in FIG.
Just do it. Further, the cutting mold 24 shown in FIG.
Needless to say, replacement is performed depending on the shape of the molded product. In the first to third embodiments, the electrode 3 of the substrate 2
All parts except the part are sealed with resin.
This has the effect of ensuring the performance. This seal is made of inorganic material
Needless to say, the same effect can be obtained by using the sealing method.
Absent. Next, a package sealed with resin to the side of the substrate
The page structure will be described. FIG. 7 shows a fourth embodiment of this structure.
Show. The structure of the support frame is similar to that of the first embodiment.
It is. FIG. 8 shows a fifth embodiment. Support frame structure
The structure is similar to that of the second embodiment. In the fourth and fifth embodiments, the number of electrodes 3 on the substrate is large.
Features that can easily cope with difficult resin sealing
There is. Resin molding is performed as shown in FIGS. 3 (c) and 3 (d).
In the fourth embodiment, a molding die 16 shown in FIG.
(Iv) Molded metal shown in FIG.
What is necessary is just to replace it with the thing of type | form (v) 43 structure. Also,
The cutting mold 24 shown in FIG.
It goes without saying that it is replaced. And the key of the molding die
Production of cavity part (protrusion part of lower mold cavity is unnecessary)
There is a feature that it becomes easy and the production cost can be reduced. Next, the chip / substrate mounting surface is resin-sealed.
The package structure will be described. Sixth embodiment of this structure
Is shown in FIG. The structure of the support frame is the same as that of the first embodiment.
It is similar. FIG. 10 shows a seventh embodiment. support
The frame structure is similar to that of the second embodiment. Success
Features that make it easier to manufacture molds and reduce production costs
There is. In the sixth and seventh embodiments, the number of electrodes 3 on the substrate is large.
Features that can easily cope with difficult resin sealing
There is. Resin molding is performed as shown in FIGS. 3 (c) and 3 (d).
In the sixth embodiment, a molding die 16 shown in FIG.
(Vi) 46 structures, in the seventh embodiment, a molding metal shown in FIG.
What is necessary is just to replace with the thing of the type (vii) 47 structure. Ma
In addition, the cutting die 24 shown in FIG.
It goes without saying that they are replaced. And the mold
Of the cavity of the lower mold
), And the production cost can be reduced. The groups used in the first to seventh embodiments described above
Although the plate material has been mainly described as being composed of organic substances,
There is no problem even if inorganic substances are used according to the purpose.
Needless to say. Further, in common with the first to seventh embodiments.
What can be said is that using a support frame makes it unnecessary after molding
Damage to the substrate even when the runner and gate are cut
Can be eliminated. In other words, the resin-sealed product
The frame outer frame is connected only with the board fixing frame suspension leads.
To reduce the stress applied to the substrate during cutting.
This has the effect of improving reliability. In addition, during operation
If high heat dissipation is required due to a large amount of chip heat, turn off first.
Cut the supporting frame outer frame 6 as a heat sink without cutting it
There is a feature that can be used. The support frame used in the first to seventh embodiments
FIGS. 11 to 16 show patterns of one molded product. FIG.
Reference numeral 1 denotes a support frame used in the first, fourth, and sixth embodiments.
It was done. The outer frame 6 and the frame 8 for fixing the substrate are fixed to the substrate.
The tab 10 is connected by a frame suspension lead 7
Lead 9 connected to the frame 8 for fixing the substrate.
ing. FIG. 12 shows the supports used in the second, fifth and seventh embodiments.
It shows a holding frame. Outer frame 6 and board fixing frame
8 is a structure connected by the frame fixing lead 7 for fixing the substrate.
It has become. FIG. 13 shows a supporting member used in the third embodiment.
It shows a frame. Outer frame 6 and board fixing frame 8
Is a structure connected by a frame fixing lead 7 for fixing a substrate.
Has become. The board fixing frame hanging lead 7 is bent.
The frame 8 for fixing the substrate is located below the outer frame 6.
It has become. Here, the connection of each element is performed in four places.
The number of leads to be linked if necessary
May be increased or decreased. FIGS. 14 to 16 show the form of the frame 8 for fixing the substrate.
Rigid board fixing leads 30 that are bonded at four points
Showing one molded product part of the support frame when
It is. Even with such a support frame,
Needless to say, the same effect can be obtained. these
The support frame in FIGS. 11 to 16 is made of, for example, Fe-Ni.
A metal material such as an alloy and a Cu alloy may be used. In addition,
I mentioned that the connection of the element was performed at four places, but it was necessary
The number of leads to be connected may be increased or decreased accordingly. Then, the support flange described with reference to FIGS.
The outer frame 6 of the frame is used for positioning in each manufacturing process.
And a guide hole 29 for providing the same. Next, the eighth embodiment of the present invention will be described.
FIG. 1 is a perspective view of a down-type BGA package structure.
FIG. The configuration of the BGA package is IC chip 1,
Wiring fill with wiring pattern formed on heat-resistant insulating substrate
31 (hereinafter abbreviated as wiring film), insulating insert
32, an electrode 33 on the wiring film 31 and bonding to the electrode 33
To fix the metal bumps 4 as electrodes to the outside
Support frame (iv) 34 for
You. That is, the support frame (iv) 34 is
A tab suspension lead 9 and a tab 10 are provided.
The back side of the IC chip 1 is attached to the tab portion 10 with an adhesive or the like.
Fix more. Wiring is performed on the pad portion of the IC chip 1 (illustration
No) and the wiring pad part of the wiring film 31 (not shown)
And are electrically connected. This film 3
The wiring is connected from the pad on 1 to each external electrode 33.
ing. In this state, the external electrode 33 is set on the molding die.
And the portion of the tab 10 excluding the back surface side is
To complete the package shape. Resin
After sealing, a metal bump 4 such as a solder bump is
And the electrical wiring is completed to complete the product. The manufacturing process has been described in the first embodiment.
The components are different from those of FIG.
In resin molding, multi-cavity molding is usually performed.
Now, this case will be described. FIG. 18 shows the components.
IC chip 1, wiring film 31, insert 32, support
Outline of the process when assembling the frame (iv) 34
FIG. That is, the support frame
(Iv) 34 becomes a multiple so that a plurality of moldings can be performed.
The structure is as shown in FIG. This multiple support frame
(Iv) The IC chip 1 (d) is attached to the tab portion 10 on 34 (e).
And glue it. Next, other than the pad portion of the IC chip 1
An insulating insert 32 (c) is placed on the part and adhered. last
And a pad portion (not shown) of the wiring film 31 (b).
Align the chip pad (not shown) and insert
32 (c). This multiple support frame (iv) 3
4 (e), each manufacturing process is automatically performed on the outer frame.
Guide holes (not shown) are provided. IC chip 1
For example, the conduction between the wiring film 31 and Au
Heat bonding of gold or other metal material or conductive resin such as gold
Adhesive bonding using epoxy resin or the like containing genus powder. this
The chip / wiring film mounting multiple frame 35
(F) is completed. After that, the first embodiment will be described.
The same process as the process shown in FIGS. This process
Among them, resin molding is performed as shown in FIGS. 3 (c) and 3 (d).
The structure of the molding die (viii) 48 shown in FIG.
You just need to replace it with another one. Also, as shown in FIG.
It is not possible to replace the cutting mold 24 according to the shape of the molded product.
Needless to say. With such a structure, the back surface of the tab 10
Has a feature that high heat dissipation can be obtained
You. Furthermore, a forced cooling mechanism such as cooling fins can be easily installed.
There are features that can be attached. In addition, outside on the wiring film 31
Since the parts other than the unit electrodes 33 are sealed with resin, the moisture resistance reliability is improved.
There are features to improve. Next, the external electrodes 33 on the wiring film 31
The ninth embodiment in which all the other components are sealed with the resin 14 is shown in FIG.
Shown in Resin molding is performed as shown in FIGS. 3 (c) and 3 (d).
The molding die 16 has a structure of a molding die (ix) 49 shown in FIG.
Just replace it with something. In addition, the cutting shown in FIG.
It is not possible to replace the cutting die 24 according to the shape of the molded product.
Needless to say. High humidity reliability with this structure
Is required. Next, a tenth embodiment is shown in FIG. This
This means that only the chip / wiring film pad joints
It is sealed. The resin molding is performed as shown in FIG.
The molding die 16 shown in (d) is replaced with the molding die shown in FIG.
(X) What is necessary is just to replace it with the thing of 50 structure. Also,
The cutting mold 24 shown in FIG.
It goes without saying that they are interchanged. Such a structure
Then, it has characteristics suitable for thinning the package.
You. In this structure, the number of external electrodes increases, and
BGA package when it cannot be arranged within the chip size
The structure is shown in FIG. 21 as an eleventh embodiment. Support frame
(V) 36 extends the tab 37 from the four sides of the tab 10.
Can be extended as necessary to set the outer electrode of the chip
I have. Fold the extension tab 37 and the tab suspension lead 9
The extended wiring fill that is arranged on the IC chip 1 by bending
Height so that it is the same height as the electrode section 39 on the
Make adjustments. Thereby, the extension wiring film 38 is
The flatness when adhesively fixed is maintained. This state
In this state, resin sealing is performed to form a BGA package. Manufacture
The process is an assembling step of each component described in FIG.
3 to 4 described in the first embodiment through
It goes through the same process. In this process, resin molding
The molding die 16 shown in FIGS. 3 (c) and 3 (d) is formed as shown in FIG.
What is necessary is just to replace with the thing of the structure of the shaping | molding die (xi) 51, and to perform.
Further, the cutting die 24 shown in FIG.
Needless to say, they are replaced. in this way,
Change the shape of the expansion tab 37 of the support frame (v) 36
This makes it easy to handle a large number of electrodes.
You. Also, the flatness of the extension wiring film 38 is easily ensured.
There are features that can be done. And the tab part 10 is exposed.
Therefore, it is easy to install a cooling mechanism.
You. Furthermore, the heat radiation effect through the expansion tab portion 37 is large.
There are also features. In addition, resin sealing improves moisture resistance reliability.
Needless to say above. FIG. 22 shows the twelfth embodiment, and FIG.
An example is shown in FIG. This can be a cash register depending on product needs.
14 is a modification of the sealing portion. Resin molding
A molding die 16 shown in FIGS. 3 (c) and (d) is used in a twelfth embodiment.
Then, the structure of the molding die (xii) 52 shown in FIG.
In the thirteenth embodiment, a molding die (Xiii) 53 shown in FIG.
What is necessary is just to replace with the thing of the structure of. FIG. 4 (c)
Is replaced according to the shape of the molded product.
Needless to say. These are the first package structures
It has the same features as described in the first embodiment.
Needless to say. What can be said in common with the eighth to thirteenth embodiments
Is a run that becomes unnecessary after molding by using a support frame.
No damage to the substrate even when cutting the gate
Can be. That is, the resin-sealed product is located outside the support frame.
When cutting, the frame is connected only with tab suspension leads.
In addition, the stress applied to the chip and wiring film can be eliminated.
This has the effect of improving reliability. In addition,
If a large amount of heat is generated and high heat dissipation is required,
There is a feature that the part becomes a heat sink and the cooling efficiency is increased. Soshi
Without cutting the support frame outer frame 6
There is a feature that can be used as a heat sink. Support frame used in the eighth to thirteenth embodiments
24 and 25 summarize the pattern of one molded product part
Was. FIG. 24 shows the support frames used in the eighth to tenth embodiments.
It shows the system. Outer frame 6 and tab 10 are tab hanging
The structure is connected by a card 9. FIG. 25 shows the first
The support frame used in Examples 1 to 13 is shown.
is there. The outer frame 6 and the tab 10 are connected by a tab suspension lead 9.
The extension tabs 37 project from four sides of the tab 10.
It is made. The extension tab 37 and the tab suspension lead 9
Is bent, and the electrode portion 39 on the extended wiring film 38 is bent.
And height adjusted in advance so that they all have the same height
Has become. Here, the connection of each element was performed in four places
The number of leads that are mentioned but connected as needed
May be increased or decreased. 24 and 25.
For example, Fe-Ni alloy, Cu alloy and other metal materials
May be used. 24 and 25.
Is positioned on the outer frame 6 in each manufacturing process.
Guide hole 29 is provided. Implementation of first, second, third, eighth, ninth, eleventh and twelfth
When molding an example, it is important to avoid
Eliminating visual defects, joining solder bumps, etc.
No resin burrs on the substrate electrode surface
It is necessary to solve the problem. So, smell below
Next, a method for solving the two problems will be described. A method for solving the above problem will be described.
I will tell. First, the package of the above embodiment was molded.
The resin filling state at this time is schematically shown in FIGS.
Will be described. This is the process of void generation
This is a method for preventing the problem. FIG. 38 is a schematic view showing the state of resin filling during molding.
It is a representation. FIG. 38 (a) shows a register which has passed through the gate 19.
4 shows a process in which the cavity 14 fills the cavity. FIG.
FIG. 38B is a sectional view taken along a line II of FIG. FIG.
9 (a) and FIG. 39 (b) show the resin filling state thereafter.
It is shown. The solid line 54 indicates the resin flow in the upper mold cavity.
The tip and the broken line 54 indicate the lower mold cavity at the same time.
1 schematically shows the resin flow tip of the present invention. As can be seen from FIG. 39, the upper die cavity
The shape of the resin flow path between 56 parts and the lower mold cavity 57 parts
Are very different. For this reason, the upper die
The bitty portion 56 is significantly larger than the lower mold cavity 57
Filling is completed quickly. Lower mold cavity with complicated flow path
57 parts are charged later. Upper mold cavity 5
After the filling of 6 parts is completed, in the lower mold cavity 57 parts,
Resin filling is progressing toward the center from around four sides
Good. For this reason, as shown in FIG.
In the part 57, air (void) in the lower mold cavity
58 is in a state of being trapped due to a loss of escape. The state in which the resin filling is finally completed
Even in the state, as shown in FIG.
Air (void) 58 remains in the center, and molding is not possible.
It will be good. In the present invention, in the lower mold cavity of the molding die,
By providing air vent, molding without void 58
It prevents defects. Hereinafter, the molding die is referred to as a fourteenth embodiment.
An example will be described with reference to FIGS. FIG. 41 shows a central portion of the lower mold cavity portion 57.
It is an enlargement of the minutes. In the present embodiment, it becomes a void.
A passage for releasing air (hereinafter referred to as an air vent) 5
9 is provided in the lower mold cavity portion 57. The air vent allows only air to escape, while the resin
It must be large enough to prevent intrusion. this
It is technically difficult to form holes of such a size directly.
Therefore, in the present invention, the lower mold is divided into a plurality of
An air vent is formed at the boundary between these parts.
You. Specifically, the lower mold cavity portion 57 has a certain size.
A hole is provided, and the divided part 60 is fitted into the hole like a stopper.
Have been combined. Then, a predetermined gap is formed on the boundary surface 61 between them.
Leaving the air vent 59
You. Therefore, the void passes through the air vent 59,
This escapes in the thickness direction of the lower mold cavity 57. The lower mold cavity portion 57 has
The protrusions 22 for leaving the electrode portion are provided in a lattice shape.
Have been. Similarly, on the upper surface of the divided component 60, the projection 2
2 are provided. Further, in this embodiment, the divided part 60
The pin also serves as a protruding pin. That is, the divided part 6
0 is projected to the inside of the cavity 57 if necessary
By doing so, the release of the molded article 23 is assisted. The division
The projecting operation of the part 60 is performed by
Attached to fixed plate 63 configured to be vertically movable
It is realized by doing. Thereby, the upper and lower sides of the fixed plate 63
Part 60 is moved into the cavity
It is possible to protrude. A series of moldings using such a mold
The steps will be described with reference to FIG. FIG. 42 (a) shows a state in which it is set in a mold cavity.
Support frame 5 (here, taking the first embodiment as an example).
You. ), The center of the cavity of the substrate 2 and the IC chip 1 is expanded.
It shows a large cross section. FIG. 42B shows the process of filling the resin 14.
It was done. The trapped void 58 is
Flows in the thickness direction of the lower mold cavity through
And is discharged out of the cavity. In FIG.
The flow of No. 8 was indicated by an arrow. FIG. 42 (c) shows the state of filling the resin 14 and
The appearance of releasing the molded product after completion of heat curing was also shown.
It is. Move the fixing plate 63 so as to approach the mold,
Then, the split part 60 is in a state of protruding into the cavity.
Become. Thus, the molded product 23 is released from the mold. Ma
In addition, when the resin slightly enters the air vent 59,
The resin burrs 64 generated also cause the sliding operation of the divided component 60.
It peels off with it. Therefore, during the next molding, the air vent
５９59 returns to a normal state again. Here, when the lower mold cavity is divided into two parts,
I mentioned about the combination, but if necessary,
It goes without saying that there is no problem. Further, the shape of the divided part 60 is rectangular.
However, other shapes (rectangular, circular, etc.) are acceptable.
Needless to say. In order to facilitate removal of resin burrs,
Surface treatment, for example, polytetrafluoroethylene coating
It is safe to do other processing.
not. As described above, the air vent is provided in the lower mold cavity.
The void can be eliminated by providing. Further
Next, the components for providing the air vent (here,
By making the split part 60) also serve as an extension pin, the air vent
The resin burrs attached to the contact part can be automatically removed. So
Therefore, automation of the molding process is easy. Next, the registration on the substrate electrode surface of the above-mentioned problem is performed.
The following describes the process of occurrence of interference and the method for preventing it. Before that, the generation process of resin burrs
This will be described with reference to FIG. FIG. 43A shows a substrate electrode portion and a lower mold cavity.
2 shows a cross-sectional view in which a tee projection is enlarged. The periphery of the electrode 3 of the substrate 2 and wiring (not shown)
Is covered with an insulator 65. In the cavity, the base
Between the electrode surface 66 of the plate 2 and the projection 22 of the lower mold cavity.
The top 67 is in contact with the top 67. That is,
The body surfaces are in contact. The contact area is further expanded and
FIG. 43 (b) is a schematic drawing. Electrode surface 66
The top and the top 67 both have fine irregularities on the surface.
Therefore, a gap 68 exists at the contact portion between the two. This
When resin molding is performed with a gap 68 as shown in FIG.
The resin 14 enters the gap 68 as shown in FIG.
Then, the resin burrs 64 remain on the electrode surface 66.
You. Further, when viewed from the whole substrate,
Resin burrs also occur due to warpage and thickness variations
Conceivable. The occurrence of resin burrs caused by these factors is
As a method to prevent this, the substrate must be
A way to eliminate the gap by forcibly pressing
It is. However, in this method, the pressing force
The board may be damaged. Therefore, in the present invention
Fills this gap with a release agent or rubber-based resin.
We propose a method to prevent resin burrs. Below,
The fifteenth embodiment employs a method using a molding agent,
A method using a base resin will be described as a sixteenth embodiment. The fifteenth embodiment will be described with reference to FIGS.
explain. First, in the same pattern as the electrode 3 of the substrate 2
Dummy mold 71 with dummy projections 69 arranged
Prepare. Then, it is separated from the top of the dummy projection 69.
The mold 70 is applied (see FIG. 44A). Dummy projection
The release agent was applied to the object 69 by, for example, applying a release agent.
Easily possible by applying the dummy projection 69 to a plate, etc.
It is. As the release agent, for example, dispersed in a solvent,
Silicone resin or polytetrafluoroethylene
A resin type is preferred. Also, it is almost liquid near the molding temperature
Any wax-based material may be used as long as it is in a state. Next, the substrate 2 is placed on the dummy mold 71.
(See FIG. 44 (b)). In this case, the dummy projection 69
And the electrode 3 are aligned. This allows
Transfer the release agent 70 to the surface of the electrode 3 (electrode surface 66)
(See FIG. 44 (c)). Thus, the release agent 70 is applied to the electrode surface 66.
Is transferred into a resin molding die.
Then, the electrode surface 66 of the substrate 2 and the protrusion of the lower mold cavity are projected.
The rising part 67 of the rising part 22 is in contact with the top part 67 through the release agent 70.
(See FIG. 45A). The distance between the electrode surface 66 and the surface of the projection 22
The gap is filled with the release agent 70. As a result,
The resin is prevented from entering the gap during molding,
Can be prevented (see FIG. 45 (b)).
See). After molding, the electrode surface 66 and the top 67
Has a release agent 70 attached thereto (see FIG. 45 (c)). Subordinate
After removing this, solder bumps are formed on the electrode surface 66.
The package is completed by forming other external electrodes.
You. The sixteenth embodiment will be described with reference to FIGS.
explain. In this method, a special mold is prepared in advance.
It is needed. First, the preparation stage of the mold will be described. First, a thermosetting rubber was applied to the electrode 3 of the substrate 2.
The base resin 72 is applied (FIG. 46A). Thermosetting type
For example, silicone resins and poly-4
A fluorinated ethylene type is preferred. Coating of the rubber-based resin 72
The cloth is the same as the method of applying the release agent in Example 15.
The law is applicable. Subsequently, the substrate 2 is placed on a molding die.
(See FIG. 46 (b).)
The rubber-based resin 72 is transferred to the substrate 22 (see FIG. 46 (c)).
See). Thereafter, the rubber-based resin 72 is hardened under predetermined hardening conditions.
To make In this way, the rubber-based resin 7
2 can be manufactured. Then this gold
The state of resin molding using a mold will be described with reference to FIG.
You. When the substrate 2 is placed in the former mold, the power of the substrate 2 is
The pole surface 66 and the projection 22 of the lower mold cavity are made of rubber.
It comes into contact with the cured resin 73 (FIG. 47).
(A))). As mentioned earlier, during resin molding
Is the upper mold cavity earlier than the lower mold cavity.
Is filled with resin (see FIGS. 38 to 40). Subordinate
Therefore, resin filling in the lower mold cavity is occurring
When the resin is filled in the upper mold cavity,
Then, the substrate 2 is pressed against the protrusion 22 side of the lower mold cavity.
Have been killed. In this way, the substrate 2 is pressed down,
As a result, the electrode surface 66 and the rubber-based resin
To wear. Further, with this, the rubber-based resin cured product 73
Is elastically deformed following the surface irregularities of the projection 22,
The gap between the electrode surface 66 and the cured rubber-based resin 73 is filled.
(See FIG. 47 (b)). As a result, both
Prevents resin from entering between and causing resin burrs
be able to. If the molded product 23 is released after the completion of molding,
Rubber-based resin cured product 73 that has undergone sexual deformation is restored to its original state
(See FIG. 47 (c)). Therefore, the mold is
It can be used for the next molding. Thereafter, solder bumps are formed on the electrodes 3 of the substrate 2.
The package is completed by forming other external electrodes.
You. Effects of the fifteenth and sixteenth embodiments
The result is explained. Resin burrs are formed on the electrode surface 66
In addition, solder bumps can be formed on the electrode surface.
I can't. Therefore, here, the yield at the time of forming the solder bumps
Consider the effect based on the ball. Solder bump formation possible
The rates are shown in FIG. The data shown here is
Is an example when the number of electrodes is 400. A flexible object is provided between the substrate electrode surface and the mold projection.
In the method without the solder bump, the solder bump formation rate is about 50%.
%Met. On the other hand, a flexible material (the release agent 70
Or a rubber-based resin cured product 72) provided on a mold projection.
In Examples 15 and 16, the value is almost 100%.
Was. Therefore, as in the fifteenth and sixteenth embodiments, the substrate electrode surface
By interposing a flexible object between the surface and the mold projection,
Absorbs warpage and thickness variations of the board, and
The adhesion is also improved, and the occurrence of resin burrs can be prevented. Here, a release agent and a rubber-based cured product are used.
As described above, the same effect can be obtained if the material is deformable at the molding temperature.
It goes without saying that there is a fruit. According to the present invention, a support frame is used.
This makes it easier to improve productivity and lower prices.
You. In addition, the BGA element is sealed with resin for moisture-proof reliability.
Significant improvement in properties and the like can be achieved. In addition, implementation of the eleventh to thirteenth
As shown in the example, the number of electrodes is large and electrodes are arranged outside the chip.
Even in such a structure, the tab in the structure of the support frame
Easy to handle by changing the shape of the expansion tab to the shape of
it can. By using these support frames, normal
Automated molding process by incorporating known molding techniques
It is easy to reduce labor and labor, improve production efficiency, and achieve stable production.
It becomes possible. Voids and substrate electrodes generated during resin molding
Productive effect due to molding die structure that prevents resin burrs on the surface
The rate can be improved and stable production can be achieved.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a BGA package structure according to a first embodiment. FIG. 2 is a process chart until completion of a chip / substrate mounting multiple frame. FIG. 3 is a process chart until resin molding. FIG. 4 is a process chart from a molded article to completion. FIG. 5 is a perspective view of a BGA package structure according to a second embodiment. FIG. 6 is a perspective view of a BGA package structure according to a third embodiment. FIG. 7 is a perspective view of a BGA package structure according to a fourth embodiment. FIG. 8 is a perspective view of a BGA package structure according to a fifth embodiment. FIG. 9 is a perspective view of a BGA package structure according to a sixth embodiment. FIG. 10 is a perspective view of a BGA package structure according to a seventh embodiment. FIG. 11 is a diagram showing the shape of a support frame used in the first, fourth and sixth embodiments. FIG. 12 is a shape diagram of a support frame used in the second, fifth, and seventh embodiments. FIG. 13 is a shape diagram of a support frame used in the third embodiment. FIG. 14 is a shape diagram when the shape of the support frame is changed. FIG. 15 is a shape diagram when the shape of the support frame is changed. FIG. 16 is a shape diagram when the shape of the support frame is changed. FIG. 17 is a perspective view of a BGA package structure according to an eighth embodiment. FIG. 18 is a process chart until completion of a multiple frame mounting a chip / wiring film. FIG. 19 is a perspective view of a BGA package structure according to a ninth embodiment. FIG. 20 is a perspective view of a BGA package structure according to a tenth embodiment. FIG. 21 is a perspective view of a BGA package structure according to an eleventh embodiment. FIG. 22 is a perspective view of a BGA package structure according to a twelfth embodiment. FIG. 23 is a perspective view of a BGA package structure according to a thirteenth embodiment. FIG. 24 is a shape diagram of a support frame used in the eighth, ninth, and tenth embodiments. FIG. 25 is a diagram showing the shape of a support frame used in the eleventh, twelfth and thirteenth embodiments. FIG. 26 is a perspective view of a molding die when molding the second embodiment. FIG. 27 is a perspective view of a molding die during molding according to the third embodiment. FIG. 28 is a perspective view of a molding die during molding according to a fourth embodiment. FIG. 29 is a perspective view of a molding die during molding according to the fifth embodiment. FIG. 30 is a perspective view of a molding die during molding according to a sixth embodiment. FIG. 31 is a perspective view of a molding die during molding according to a seventh embodiment. FIG. 32 is a perspective view of a molding die during molding according to the eighth embodiment. FIG. 33 is a perspective view of a molding die during molding according to the ninth embodiment. FIG. 34 is a perspective view of a molding die when molding according to the tenth embodiment. FIG. 35 is a perspective view of a molding die when molding according to the eleventh embodiment. FIG. 36 is a perspective view of a molding die during molding according to a twelfth embodiment. FIG. 37 is a perspective view of a molding die during molding according to a thirteenth embodiment. FIG. 38 is a schematic view of a state during a resin filling process. FIG. 39 is a schematic view of a state during a resin filling process. FIG. 40 is a schematic diagram of a state at the time of completion of a resin filling process. FIG. 41 is an enlarged view of a central portion of a lower mold cavity according to Example 14 of the present invention. FIG. 42 is a schematic diagram of a center portion of a mold cavity showing an operation of the fourteenth embodiment of the present invention. FIG. 43 is a view schematically showing a contact state between a substrate electrode portion and a lower mold cavity protrusion. FIG. 44 is a view illustrating a step of applying a release agent to the surface of a substrate electrode according to Example 15 of the present invention. FIG. 45 is a view illustrating a forming process of a substrate with a release agent. FIG. 46 is a diagram illustrating a step of attaching a thermosetting rubber-based resin to the protrusion 22 according to Embodiment 16 of the present invention. 47 is a projection 2 to which a cured rubber-based resin 73 is attached.
FIG. 5 is a diagram illustrating a process of molding using a mold provided with a mold 2. FIG. 48 is a comparison diagram of a solder bump formation rate. FIG. 49 is a cross-sectional view of a conventional face-up type BGA package. FIG. 50 is a plan view of FIG. 49 as viewed from above. FIG. 51 is a plan view of FIG. 49 as viewed from below. FIG. 52 is a perspective view of a conventional face-down type BGA package. FIG. 53 is an enlarged cross-sectional view of a connection portion in FIG. 41. [Description of Signs] 1 ... IC chip, 2 ... Laminated circuit board, 4 ...
Metal bumps, 5: Support frame (i), 7: Board fixing frame, 15: Chip / board mounting multiple support frame, 27: Support frame (ii), 28: Support Frame (iii), 29: guide hole, 30: board fixing lead, 31: wiring film, 32: insulating insert, 34: support frame (iv), 35 ...
・ Chip / wiring film mounting support frame, 36 ...
Support frame (v), 37 ... expansion tab, 38 ...
Extended wiring film, 58: void, 60: split part, 62: protruding pin, 64: resin burr,
66 ... electrode surface, 69 ... dummy projection, 70
..Release agent, 71: Substrate with release agent, 72: Thermosetting rubber-based resin, 73: Cured rubber-based resin

────────────────────────────────────────────────── ───
[Procedure amendment] [Submission date] February 10, 2003 (2003.2.1
0) [Procedure amendment 1] [Document name to be amended] Specification [Item name to be amended] Claims [Correction method] Change [Contents of amendment] [Claims] 1. Manufacturing method of semiconductor device Wherein a step of bonding a frame and a base member, which is a wiring board or a wiring film, a step of electrically connecting a semiconductor chip to the base member, and a step of resin-sealing the semiconductor chip using a mold A method of manufacturing a semiconductor device, wherein in the resin sealing step, positioning is performed in the mold using the frame, and the semiconductor chip is resin-sealed. 2. The method of manufacturing a semiconductor device according to claim 1, further comprising a step of forming a solder bump on said resin-sealed semiconductor chip. 3. The method of manufacturing a semiconductor device according to claim 1, wherein said base member has an insulating base and a wiring pattern formed on both sides of said insulating base. Wherein the semiconductor chip is mounted on one surface of the base member, and a bump is formed on the opposite side of the surface on which the semiconductor chip is mounted. 4. The method for manufacturing a semiconductor device according to claim 1, wherein said frame supports a plurality of semiconductor chips. 5. The method of manufacturing a semiconductor device according to claim 4, further comprising a step of individualizing the semiconductor chip from a frame supporting the plurality of semiconductor chips. Method. 6. The method of manufacturing a semiconductor device according to claim 4, wherein the plurality of semiconductor chips fixed to the frame are transfer-molded in the resin sealing step. Production method. 7. The method of manufacturing a semiconductor device according to claim 1, wherein a material of the frame is an Fe—Ni alloy. 8. The method of manufacturing a semiconductor device according to claim 1, wherein the material of the frame is a Cu alloy. 9. The method of manufacturing a semiconductor device according to claim 1, wherein in the step of electrically connecting the semiconductor chip and the base member, the semiconductor chip and the base member are connected by wire bonding; The method for manufacturing a semiconductor device, wherein the frame is not electrically connected to the semiconductor chip and the base member. 10. A method of manufacturing a semiconductor device, comprising: a step of fixing a semiconductor chip and a base member, which is a wiring board or a wiring film, to a frame; and a step of electrically connecting the semiconductor chip and the base member. The method includes a step of sealing the semiconductor chip with a resin using a mold, and in the resin sealing step,
A method for manufacturing a semiconductor device, comprising: positioning in a mold using a frame to which the plurality of semiconductor chips are fixed, and sealing the semiconductor chip with a resin. 11. The method for manufacturing a semiconductor device according to claim 10, further comprising a step of forming a solder bump on the resin-sealed semiconductor chip. 12. The method for manufacturing a semiconductor device according to claim 10, wherein the base member has a wiring pattern formed on an insulating base, and is electrically connected to both surfaces of the base. A method for manufacturing a semiconductor device, comprising: mounting the semiconductor chip on one surface of the base member; and forming a bump on the opposite side of the surface on which the semiconductor chip is mounted. 13. The method of manufacturing a semiconductor device according to claim 10, wherein the frame supports a plurality of semiconductor chips. 14. The method of manufacturing a semiconductor device according to claim 10, further comprising a step of individualizing the semiconductor chip from a frame supporting the plurality of semiconductor chips. Method. 15. The method of manufacturing a semiconductor device according to claim 10, wherein the plurality of semiconductor chips fixed to the frame are transfer-molded in the resin sealing step. Production method. 16. The method for manufacturing a semiconductor device according to claim 10, wherein in the step of electrically connecting the semiconductor chip and the base member, the semiconductor chip and the base member are connected by wire bonding, and The method for manufacturing a semiconductor device, wherein the frame is not electrically connected to the semiconductor chip and the base member. 17. A method for manufacturing a semiconductor device, comprising: a step of fixing a semiconductor chip and a base member, which is a wiring board or a wiring film, to a frame; and a step of electrically connecting the semiconductor chip and the base member. A method for manufacturing a semiconductor device, comprising: a step of resin-sealing the semiconductor chip; and a step of forming solder bumps on the resin-sealed semiconductor chip. 18. A method for manufacturing a semiconductor device, comprising: mounting a semiconductor chip on a base member that is a wiring board or a wiring film; electrically connecting the semiconductor chip to the base member; A semiconductor device comprising: a step of bonding a member to a frame for fixing the base member; a step of resin-sealing the semiconductor chip; and a step of forming solder bumps on the resin-sealed semiconductor chip. Manufacturing method. 19. A method for manufacturing a semiconductor device, comprising: bonding a base member, which is a wiring board or a wiring film, to a frame for fixing the base member; mounting a semiconductor chip on the base member; A semiconductor device comprising: a step of electrically connecting a semiconductor chip to the base member; a step of resin-sealing the semiconductor chip; and a step of forming solder bumps on the resin-sealed semiconductor chip. Manufacturing method. 20. The method for manufacturing a semiconductor device according to claim 17, wherein in the sealing step, the positioning of the frame with a mold using a positioning hole formed in the frame and resin sealing are performed. A method for manufacturing a semiconductor device. 21. The method for manufacturing a semiconductor device according to claim 17, wherein in the sealing step, a frame to which the plurality of semiconductor chips are fixed is arranged in a mold, and some of the plurality of semiconductor chips are mounted. A method for manufacturing a semiconductor device, comprising: 22. The method of manufacturing a semiconductor device according to claim 1, wherein the base member is a laminated circuit board.

   ────────────────────────────────────────────────── ─── Continuation of front page    (72) Inventor Isamu Yoshida             292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa             Hitachi, Ltd., Production Technology Laboratory (72) Inventor Kazuya Oji             292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa             Hitachi, Ltd., Production Technology Laboratory (72) Inventor Michiharu Honda             292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa             Hitachi, Ltd., Production Technology Laboratory (72) Inventor Makoto Kitano             502 Kandate-cho, Tsuchiura-shi, Ibaraki Pref.             Inside Ritsumeikan Machinery Research Laboratory (72) Inventor Nana Yoneda             502 Kandate-cho, Tsuchiura-shi, Ibaraki Pref.             Inside Ritsumeikan Machinery Research Laboratory (72) Inventor Shuji Eguchi             7-1-1, Omika-cho, Hitachi City, Ibaraki Prefecture             Hitachi, Ltd., Hitachi Laboratory (72) Inventor Kunihiko Nishi             5-20-1, Josuihoncho, Kodaira-shi, Tokyo             Hitachi, Ltd., Semiconductor Division (72) Inventor Ichiro Yasuo             5-20-1, Josuihoncho, Kodaira-shi, Tokyo             Hitachi, Ltd., Semiconductor Division (72) Inventor Kenichi Otsuka             5-20-1, Josuihoncho, Kodaira-shi, Tokyo             Hitachi, Ltd., Semiconductor Division

Claims (1)

Claims: 1. A wiring film having a wiring pattern formed on an IC chip and a laminated circuit board (hereinafter abbreviated as a substrate) for mounting and connecting the IC chip or an insulating base material (hereinafter referred to as a wiring film). In a semiconductor device having an electrode portion for connecting these electric circuit components to the outside and forming a metal bump on the electrode portion, a supporting frame for fixing and supporting the IC chip, substrate or wiring film is provided. A semiconductor device wherein at least a part other than the electrode portion is sealed with an organic material.