JP2003179215A5 - - Google Patents

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Publication number
JP2003179215A5
JP2003179215A5 JP2002301748A JP2002301748A JP2003179215A5 JP 2003179215 A5 JP2003179215 A5 JP 2003179215A5 JP 2002301748 A JP2002301748 A JP 2002301748A JP 2002301748 A JP2002301748 A JP 2002301748A JP 2003179215 A5 JP2003179215 A5 JP 2003179215A5
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JP
Japan
Prior art keywords
tunnel junction
memory cell
insulator
resistance
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2002301748A
Other languages
English (en)
Other versions
JP2003179215A (ja
Filing date
Publication date
Priority claimed from US09/983,404 external-priority patent/US6473337B1/en
Application filed filed Critical
Publication of JP2003179215A publication Critical patent/JP2003179215A/ja
Publication of JP2003179215A5 publication Critical patent/JP2003179215A5/ja
Withdrawn legal-status Critical Current

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Claims (10)

  1. メモリ・セルであって、
    第1のトンネル接合と、
    前記第1のトンネル接合に直列の第2のトンネル接合と、を有し、
    前記第1のトンネル接合を、第1の抵抗状態から第2の抵抗状態に変化させることができ、前記第1のトンネル接合は、前記第2のトンネル接合とは異なる抵抗−電圧特性を有する、メモリ・セル。
  2. 前記第1のトンネル接合の抵抗は、前記メモリ・セルの両端に電圧が生じたときに前記第2のトンネル接合の抵抗よりも緩やかに減少する、請求項1に記載のメモリ・セル。
  3. 前記第1のトンネル接合が、
    2つの磁性層と、
    前記磁性層の間に配置された絶縁体と、
    を有する、請求項1に記載のメモリ・セル。
  4. 前記第2のトンネル接合が前記第1のトンネル接合に直列の絶縁体を有する、請求項3に記載のメモリ・セル。
  5. 前記第2のトンネル接合が2つの導体を有し、該2つの導体は前記絶縁体の両側にそれぞれ配置される、請求項4に記載のメモリ・セル。
  6. 前記第2のトンネル接合は、前記第1のトンネル接合の前記磁性層のうちの1つを共用する、請求項4に記載のメモリ・セル。
  7. 前記第2のトンネル接合が導体を有し、前記絶縁体は該導体と前記共有される磁性層との間に配置される、請求項6に記載のメモリ・セル。
  8. 前記磁性層が強磁性体である、請求項3に記載のメモリ・セル。
  9. メモリ・セルであって、
    2つの強磁性層と、該2つの強磁性層の間に配置された絶縁体と、を含む第1のトンネル接合と、
    絶縁体と、該絶縁体に隣接する少なくとも1つの導体と、を含む第2のトンネル接合と、を有し、
    前記第2のトンネル接合は前記第1のトンネル接合に直列である、メモリ・セル。
  10. 前記第1のトンネル接合の抵抗は、前記メモリ・セルの両端に電圧が生じたときに前記第2のトンネル接合の抵抗よりも緩やかに減少する、請求項9に記載のメモリ・セル。
JP2002301748A 2001-10-24 2002-10-16 トンネル接合に直列の磁気トンネル接合を備えたメモリ・セル Withdrawn JP2003179215A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/983,404 2001-10-24
US09/983,404 US6473337B1 (en) 2001-10-24 2001-10-24 Memory device having memory cells with magnetic tunnel junction and tunnel junction in series

Publications (2)

Publication Number Publication Date
JP2003179215A JP2003179215A (ja) 2003-06-27
JP2003179215A5 true JP2003179215A5 (ja) 2005-06-16

Family

ID=25529936

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002301748A Withdrawn JP2003179215A (ja) 2001-10-24 2002-10-16 トンネル接合に直列の磁気トンネル接合を備えたメモリ・セル

Country Status (6)

Country Link
US (1) US6473337B1 (ja)
EP (1) EP1306850A3 (ja)
JP (1) JP2003179215A (ja)
KR (1) KR20030034026A (ja)
CN (1) CN1414559A (ja)
TW (1) TW567492B (ja)

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FR2832542B1 (fr) * 2001-11-16 2005-05-06 Commissariat Energie Atomique Dispositif magnetique a jonction tunnel magnetique, memoire et procedes d'ecriture et de lecture utilisant ce dispositif
US6778421B2 (en) * 2002-03-14 2004-08-17 Hewlett-Packard Development Company, Lp. Memory device array having a pair of magnetic bits sharing a common conductor line
US6751149B2 (en) * 2002-03-22 2004-06-15 Micron Technology, Inc. Magnetic tunneling junction antifuse device
US6826077B2 (en) * 2002-05-15 2004-11-30 Hewlett-Packard Development Company, L.P. Magnetic random access memory with reduced parasitic currents
US6667897B1 (en) * 2002-06-28 2003-12-23 International Business Machines Corporation Magnetic tunnel junction containing a ferrimagnetic layer and anti-parallel layer
US6714444B2 (en) * 2002-08-06 2004-03-30 Grandis, Inc. Magnetic element utilizing spin transfer and an MRAM device using the magnetic element
US6847547B2 (en) * 2003-02-28 2005-01-25 Grandis, Inc. Magnetostatically coupled magnetic elements utilizing spin transfer and an MRAM device using the magnetic element
US6768150B1 (en) * 2003-04-17 2004-07-27 Infineon Technologies Aktiengesellschaft Magnetic memory
US20050073878A1 (en) * 2003-10-03 2005-04-07 Taiwan Semiconductor Manufacturing Co., Ltd. Multi-sensing level MRAM structure with different magnetoresistance ratios
US6947333B2 (en) * 2003-10-30 2005-09-20 Hewlett-Packard Development Company, L.P. Memory device
KR100669363B1 (ko) * 2004-10-26 2007-01-16 삼성전자주식회사 메모리 장치의 읽기 방법
US7777261B2 (en) * 2005-09-20 2010-08-17 Grandis Inc. Magnetic device having stabilized free ferromagnetic layer
JP2009509346A (ja) * 2005-09-20 2009-03-05 フリースケール セミコンダクター インコーポレイテッド スピン依存トンネルセルおよびその形成方法
KR100881181B1 (ko) * 2006-11-13 2009-02-05 삼성전자주식회사 반도체 메모리 소자 및 그 제조 방법
US7894248B2 (en) * 2008-09-12 2011-02-22 Grandis Inc. Programmable and redundant circuitry based on magnetic tunnel junction (MTJ)
US8363460B2 (en) * 2010-04-07 2013-01-29 Avalanche Technology, Inc. Method and apparatus for programming a magnetic tunnel junction (MTJ)
KR101676821B1 (ko) 2010-03-18 2016-11-17 삼성전자주식회사 자기 메모리 소자 및 그 형성방법
US9093149B2 (en) * 2012-09-04 2015-07-28 Qualcomm Incorporated Low cost programmable multi-state device
KR101986335B1 (ko) * 2012-10-08 2019-06-05 삼성전자주식회사 보상 저항성 소자를 포함하는 저항성 메모리 장치
US20150103586A1 (en) * 2013-10-16 2015-04-16 Qualcomm Incorporated Write driver and program driver for otp (one-time programmable) memory with magnetic tunneling junction cells
CN103545339B (zh) * 2013-11-08 2015-12-02 北京航空航天大学 一种可高速计算、大容量存储的存储单元
US10347691B2 (en) 2014-05-21 2019-07-09 Avalanche Technology, Inc. Magnetic memory element with multilayered seed structure
US10438997B2 (en) 2014-05-21 2019-10-08 Avalanche Technology, Inc. Multilayered seed structure for magnetic memory element including a CoFeB seed layer
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