JP2003171530A - Epoxy resin composition and semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in resistance to soldering heat and good in flame retardancy and a semiconductor device using the same. <P>SOLUTION: The epoxy resin composition comprises (A) an epoxy resin described by the formula, (B) a phenol resin, (C) an inorganic filler, and (D) an amino-based silane coupling agent and the semiconductor device manufactured by using the same is provided. In the formula, n is an integer of zero, one, or greater. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to an epoxy resin composition used as a sealing resin material for electronic parts such as semiconductors, and a semiconductor device using the same.

[0002]

2. Description of the Related Art Conventionally, it has been widely practiced to seal electronic parts such as semiconductors with a thermosetting resin. For such encapsulating resin material, a composition in which a curing agent, a curing accelerator, and an inorganic filler or pigment such as silica powder are added to an epoxy resin as a base, has a high reliability and moldability. , Is generally used in terms of price.

By the way, in recent years, in the field of semiconductor integrated circuits, along with the high integration of chips, the chip size has become larger and the number of poles has increased. On the other hand, the package design is also a conventional pin insertion type DIP (Dual-In Line). Packag
e), surface mount type SOP (Small Outline Packag)
e), QFP (Quad Flat Package), SOJ (Small Ou)
tline J-lead Package), TSOP (Thin SOP),
LQFP (Large QFP), TQFP (Thin QFP)
And so on.

With such a change in the mounting method, cracks occur in the sealing resin portion of the package during mounting (solder process), or peeling occurs between the chip and the sealing resin or between the substrate and the sealing resin. The problem is occurring. This is because in the surface mount type package, the entire package is directly immersed in a high temperature (230 to 270 ℃) solder bath during mounting, so the sealing resin material has more severe solder heat resistance than the pin insertion type. Is required. That is, the conventional epoxy resin composition was slightly insufficient in solder heat resistance to be applied to the surface mount type package.

Therefore, there is a demand for the development of an epoxy resin composition having excellent solder heat resistance which does not cause cracks or peeling as described above even when applied to a surface mount type package.

On the other hand, this type of sealing resin material is required to have flame retardancy according to the UL standard from the viewpoint of safety.

Conventionally, in an epoxy resin composition, it is common to use a flame retardant containing a halogen element such as chlorine or bromine in combination with an antimony compound (usually antimony trioxide). However, these halogen-based flame retardants and antimony compounds have a problem of reducing the reliability of electronic parts. In addition, recently
These environmental impacts are beginning to be pointed out.

For this reason, development of flame retardant technology not containing a halogen flame retardant and an antimony compound, such as the combined use of a phosphorus flame retardant and a metal hydrate, is underway. However, conventional halogen flame retardants and antimony are not used. There is a problem that long-term moisture resistance reliability is reduced as compared with the combined use of compounds.

[0009]

As described above, there is a demand for an epoxy resin composition having excellent soldering heat resistance as the mounting method is changed from the pin insertion type to the surface mounting type. Further, in such an epoxy resin composition, development of a highly reliable flame retardant technique which is an alternative to the combined use of a halogen-based flame retardant and an antimony compound has been demanded in consideration of the environment.

The present invention has been made in view of the above conventional circumstances, and an epoxy resin composition having excellent solder heat resistance which does not cause cracking or peeling even when applied to a surface mount type package. Another object of the present invention is to provide a semiconductor device using the same. Another object of the present invention is to provide an epoxy resin composition which is excellent in flame retardancy, and which retains good moisture resistance for a long period of time and has no environmental problem, and a semiconductor device using the same. To do.

[0011]

Means for Solving the Problems As a result of intensive studies to achieve the above object, the present inventors have found that an epoxy resin having a specific structure can be used in combination with an epoxy silane coupling agent to form an epoxy resin. The inventors have found that the solder heat resistance of the resin composition can be improved, and at the same time, excellent flame retardancy can be imparted to the epoxy resin composition without using a flame retardant, and the present invention has been completed.

That is, the epoxy resin composition of the present invention comprises (A) the following general formula

[Chemical 3] (Wherein, n represents 0 or an integer of 1 or more), (B) a phenol resin, (C) an inorganic filler and (D) an amino-based silane coupling agent. It has a feature.

In the epoxy resin composition having the above structure, by using an amino-based silane coupling agent in combination with an epoxy resin having a specific structure, excellent solder heat resistance that can be sufficiently applied to a surface mounting type package is obtained. Prepare,
Moreover, it also has excellent flame retardancy.

The component (B) is represented by the following general formula

[Chemical 4] (However, in the formula, n represents 0 or an integer of 1 or more).

Further, the content of the inorganic filler of the component (D) is
From the viewpoint of moldability, it is preferably 65 to 93% by weight.

The epoxy resin composition of the present invention is characterized in that the epoxy resin composition of the above invention contains substantially no flame retardant.

Since such an epoxy resin composition does not substantially contain a flame retardant, it is possible to reduce the deterioration of moisture resistance reliability and the influence on the environment due to the use of the flame retardant.

The semiconductor device of the present invention is characterized in that a semiconductor chip is sealed with a cured product of the epoxy resin composition of the present invention.

In the semiconductor device of the present invention, since the semiconductor chip is sealed by the cured product of the epoxy resin composition having excellent solder heat resistance, highly reliable mounting is possible by any mounting method. Become.

[0020]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below. The epoxy resin composition of the present invention comprises (A) the following general formula:

[Chemical 5] (However, in the formula, n represents 0 or an integer of 1 or more), an epoxy resin (B), a phenol resin, (C) an inorganic filler and (D) an amino silane coupling agent are essential components. It is a thing.

As the epoxy resin (A), those having an epoxy equivalent of 200 to 350 are preferable, and those having an epoxy equivalent of 250 to 320 are more preferable. Also,
The softening temperature is preferably in the range of 40 to 100 ° C, and more preferably the softening temperature is in the range of 50 to 75 ° C. Furthermore, I
The melt viscosity (150 ° C.) measured by a CI viscometer (cone & plate type) is preferably in the range of 0.1 to 3.0 poise. Specifically, NC-3000P manufactured by Nippon Kayaku Co., Ltd.
(Trade name; epoxy equivalent 273, softening temperature 57 ° C., melt viscosity (150 ° C.) 0.7 poise) and the like are preferably used. These epoxy resins may be used alone or in combination of two or more.

In the present invention, other epoxy resins can be used in combination, if necessary. Epoxy resins used in combination include novolac type epoxy resin, cresol novolac type epoxy resin, triphenol methane type epoxy resin, biphenyl type epoxy resin, heterocyclic type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, stilbene type epoxy resin. Epoxy resin,
Examples thereof include fused ring aromatic hydrocarbon-modified epoxy resins. These may be used alone or in combination of two or more. When another epoxy resin is used in combination, it is preferable to add the epoxy resin in an amount of 60% by weight or less based on the total weight of the epoxy resin. A more preferable range is 50% by weight or less based on the total weight of the epoxy resin.

The phenol resin (B) is blended as a curing agent, and if it has two or more phenolic hydroxyl groups capable of reacting with the epoxy groups of the epoxy resin (A) in the molecule, Used without particular limitation, for example, phenol novolac resin, cresol novolac resin, dicyclopentadiene modified phenol resin, para-xylene modified phenol resin, condensates of phenols and benzaldehyde, naphthyl aldehyde, triphenol methane compound, Examples include polyfunctional phenolic resins. These may be used alone or in combination of two or more.

In the present invention, the aralkyl type phenolic resin represented by the following general formula [II] is preferred, and the phenolic hydroxyl group equivalent thereof is particularly in the range of 130 to 250, preferably 160 to 190, or softened. Temperature is 40
It is preferably in the range of to 100 ° C, preferably 55 to 90 ° C. Specifically, XL-225-3L manufactured by Mitsui Chemicals, Inc.
(Hydroxyl equivalent 174, softening temperature 70 ° C), XLC-LL (hydroxyl equivalent 176, softening temperature 79 ° C), XLC-3L (hydroxyl equivalent 172, softening temperature 72 ° C), XLC-4L (hydroxyl equivalent 1)
67, softening temperature 63 ° C), MEH-7800 manufactured by Meiwa Kasei Co., Ltd.
M (hydroxyl group equivalent 175, softening temperature 80 ° C), MEH-780
0S (hydroxyl equivalent 175, softening temperature 75 ° C), MEH-78
00SS (hydroxyl group equivalent 175, softening temperature 65 ° C), HE100C-10 (hydroxyl group equivalent 168, softening temperature 68 ° C) manufactured by Sumikin Chemical Co., HE100C-15 (hydroxyl group equivalent 170, softening temperature 75 ° C), HE100C-30 (hydroxyl group) Equivalent 170,
A softening temperature of 80 ° C.) (all of which are trade names) are preferably used.

[0025]

[Chemical 6] From the viewpoint of reducing unreacted components, the phenol resin (B) has an epoxy group (equivalent ratio) of a hydroxyl group / (A) epoxy resin (including other epoxy resins when used in combination). The amount is preferably 0.5 to 1.5, and more preferably 0.7 to 1.1.

The inorganic filler (C) is added for the purpose of improving or improving the properties such as the thermal expansion coefficient, thermal conductivity, water absorption and elastic modulus of the cured product. Fused silica, crystalline silica Powder of alumina, talc, calcium carbonate, titanium white, red iron oxide, silicon carbide, boron nitride, etc.
Examples thereof include spherical beads, single crystal fibers, and glass fibers. These can be used alone or in combination of two or more. In the present invention, among these, the maximum particle size is 100 μm or less and the average particle size is 1 to 50 μm.
The powdery form is suitable, and it is more preferable that the maximum particle size is 75 μm or less and the average particle size is 5 to 30 μm. If the maximum particle size exceeds 100 μm or the average particle size exceeds 50 μm, it becomes difficult not only to fill the narrow portion but also the dispersibility decreases and the molded product becomes non-uniform. Also, if the average particle size is
If it is less than 1 μm, the viscosity increases and the moldability becomes poor.
Further, it is more preferable that the shape of these powders be as spherical as possible from the viewpoint of fluidity, moldability, mold abrasion resistance, and the like. Fused silica is suitable for applications requiring low thermal expansion, and crystalline silica or alumina is suitable for applications requiring high thermal conductivity.

The content of the inorganic filler (C) is preferably in the range of 65 to 93% by weight of the total composition, and 70 to 92% by weight.
Is more preferable, and the range of 81 to 91% by weight is even more preferable. If the blending amount is less than 65% by weight, the effect of improving or improving the properties such as the above-mentioned thermal expansion coefficient is small, and if the blending amount exceeds 93% by weight, the fluidity of the composition is lowered and the moldability is deteriorated. It becomes defective and practically difficult.

As the amino-based silane coupling agent (D), N-β- (aminoethyl) -γ-aminopropyltrimethoxysilane, N-β- (aminoethyl) -γ-aminopropylmethyldimethoxysilane, Examples thereof include γ-aminopropyltrimethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane and γ-ureidopropyltriethoxysilane. These can be used alone or in combination of two or more. Of these, N-phenyl-γ-aminopropyltrimethoxysilane and γ-ureidopropyltriethoxysilane are preferable in the present invention.

In the present invention, other silane coupling agents can be used in combination, if necessary. As the silane coupling agent used in combination, γ- (methacrylopropyl) trimethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxy Examples thereof include propylmethyldiethoxysilane, γ-mercaptopropyltrimethoxysilane, methyltrimethoxysilane, methyltriethoxysilane, vinyltrimethoxysilane, γ-mercaptopropylmethyldimethoxysilane, imidazolesilane and vinyltriacetoxysilane. These may be used alone or in combination of two or more. When another silane coupling agent is used in combination, its content is preferably 50% by weight or less based on the total weight of the silane coupling agent. A more preferred range is 25% by weight or less based on the total weight of the silane coupling agent.

In the epoxy resin composition of the present invention, in addition to the above-mentioned respective components, a curing accelerator, antimony trioxide and phosphorus which are generally blended in the composition of this type within a range not impairing the effects of the present invention. Compounds, flame retardants such as brominated epoxy compounds, colorants such as carbon black and cobalt blue,
Surface treatment agent such as alkyl titanate, synthetic wax,
A release agent such as natural wax, a halogen trap agent, a low-stressing agent such as silicone oil or silicone rubber, and the like can be added as necessary.

As the curing accelerator, 1,8-diazabicyclo
[5,4,0] Undecene-7 (DBU), triethylenediamine, benzyldimethylamine, triethanolamine,
Tertiary amines such as dimethylaminoethanol, tris (dimethylaminomethyl) phenol, imidazoles such as 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, tributylphosphine, diphenylphosphine, triphenylphosphine Examples thereof include organic phosphines, tetraphenylphosphonium tetraphenylborate, tetraphenylboron salts such as triphenylphosphine tetraphenylborate, and the like. These can be used alone or in combination of two or more.

When the epoxy resin composition of the present invention is prepared as a sealing material, the above components are thoroughly mixed (dry blended) with a mixer or the like, melted and kneaded with a hot roll or a kneader, and cooled and then pulverized. You can do it.

The semiconductor device of the present invention can be manufactured by sealing a semiconductor chip with the above-mentioned sealing material. Examples of semiconductor chips include integrated circuits, large-scale integrated circuits, transistors, thyristors, diodes, and the like. As a sealing method, a low-pressure transfer method is generally used, but sealing by injection molding, compression molding, casting or the like is also possible. After sealing with the sealing material, it is heated and cured, and finally a semiconductor device sealed with the cured product is obtained. The heating temperature for post-curing is
It is preferably 150 ° C. or higher. Furthermore, examples of the substrate on which the semiconductor chip is mounted include a ceramic substrate, a plastic substrate, a polyimide film, and a lead frame, but the substrate is not particularly limited to these.

[0034]

EXAMPLES Next, the present invention will be described in more detail by way of examples, but the present invention is not limited to these examples.

Example 1 NC-3000, an epoxy resin represented by the general formula [I]
P (trade name of Nippon Kayaku Co., Ltd.), cresol novolac epoxy resin EOCN-1020 (trade name of Nippon Kayaku Co., Ltd.), novolac type phenolic resin THE-1000
(Meiwa Kasei's trade name), N-phenyl-γ-aminopropyltrimethoxysilane KBM-573 (Shin-Etsu Chemical Co., Ltd. trade name), triphenylphosphine, carnauba wax, carbon black and fused spherical silica powder (max. Particle diameters of 75 μm and average particle diameter of 14 μm) were mixed at a mixing ratio shown in Table 1 at room temperature and then kneaded by heating at 70 to 100 ° C. After cooling, it was pulverized to an appropriate size to obtain an epoxy resin composition.

Example 2 NC-3000 which is an epoxy resin represented by the general formula [I]
P, the novolac type phenolic resin THE-1000,
K of N-phenyl-γ-aminopropyltrimethoxysilane
BM-573, triphenylphosphine, carnauba wax, carbon black and fused spherical silica powder (maximum particle size 75 μm average particle size 14 μm) were mixed at room temperature in the mixing ratio shown in Table 1, and then heated at 70 to 100 ° C. Kneaded After cooling, it was pulverized to an appropriate size to obtain an epoxy resin composition.

Example 3 NC-3000 which is an epoxy resin represented by the general formula [I]
P, the novolac type phenolic resin THE-1000,
γ-ureidopropyltriethoxysilane AY43-
031 (trade name of Toray Dow Corning Silicone Co., Ltd.), triphenylphosphine, carnauba wax, carbon black and fused spherical silica powder (maximum particle size 75
μm average particle diameter 14 μm) were mixed at a mixing ratio shown in Table 1 at room temperature, and then kneaded by heating at 70 to 100 ° C. After cooling, it was pulverized to an appropriate size to obtain an epoxy resin composition.

Example 4 NC-3000 which is an epoxy resin represented by the general formula [I]
P, the novolac type phenolic resin THE-1000,
A-1222-N-β- (aminoethyl) -γ-aminopropyltrimethoxysilane (trade name of Nippon Unicar Co., Ltd.),
Triphenylphosphine, carnauba wax, carbon black and fused spherical silica powder (maximum particle size 75 μm
The average particle size of 14 μm) was mixed at a mixing ratio shown in Table 1 at room temperature and then kneaded by heating at 70 to 100 ° C. After cooling, it was pulverized to an appropriate size to obtain an epoxy resin composition.

Example 5 NC-3000 which is an epoxy resin represented by the general formula [I]
P, MEH-7800M which is an aralkyl type phenol resin represented by the general formula [II], KBM-573 which is N-phenyl-γ-aminopropyltrimethoxysilane, triphenylphosphine, carnauba wax, carbon black and fused spherical silica powder ( Maximum particle size 75μm Average particle size 14μ
m) are mixed at a room temperature at a mixing ratio shown in Table 1, and then,
The mixture was heated and kneaded at 70 to 100 ° C. After cooling, it was pulverized to an appropriate size to obtain an epoxy resin composition.

Example 6 NC-3000 which is an epoxy resin represented by the general formula [I]
P, cresol novolac type epoxy resin EOCN-
1020, MEH-7800M which is an aralkyl type phenol resin represented by the general formula [II], KBM-573 which is N-phenyl-γ-aminopropyltrimethoxysilane, triphenylphosphine, carnauba wax, carbon black and fused spherical silica powder ( The maximum particle size of 75 μm and the average particle size of 14 μm) were mixed at a mixing ratio shown in Table 1 at room temperature and then kneaded by heating at 70 to 100 ° C. After cooling, it was pulverized to an appropriate size to obtain an epoxy resin composition.

Example 7 NC-3000, an epoxy resin represented by the general formula [I]
P, biphenyl type epoxy resin YX-4000H (trade name of Japan Epoxy Resin Co., Ltd.), aralkyl type phenol resin MEH-780 represented by the general formula [II].
0M, N-phenyl-γ-aminopropyltrimethoxysilane KBM-573, triphenylphosphine, carnauba wax, carbon black and fused spherical silica powder (maximum particle size 75 μm average particle size 14 μm) At room temperature and then kneaded by heating at 70-100 ° C. After cooling, it was pulverized to an appropriate size to obtain an epoxy resin composition.

Example 8 NC-3000 which is an epoxy resin represented by the general formula [I]
P, novolac type phenolic resin THE-1085
(Meiwa Kasei product name), N-phenyl-γ-aminopropyltrimethoxysilane KBM-573, triphenylphosphine, carnauba wax, carbon black and fused spherical silica powder (maximum particle size 75 μm average particle size 14 μm
m) are mixed at a room temperature at a mixing ratio shown in Table 1, and then,
The mixture was heated and kneaded at 70 to 100 ° C. After cooling, it was pulverized to an appropriate size to obtain an epoxy resin composition.

Example 9 NC-3000 which is an epoxy resin represented by the general formula [I]
P, novolac type phenolic resin THE-1085,
K of N-phenyl-γ-aminopropyltrimethoxysilane
BM-573, triphenylphosphine, carnauba wax, carbon black and fused spherical silica powder (maximum particle size 75 μm average particle size 14 μm) were mixed at room temperature in the mixing ratio shown in Table 1, and then heated at 70 to 100 ° C. Kneaded After cooling, it was pulverized to an appropriate size to obtain an epoxy resin composition.

Example 10 NC-3000 which is an epoxy resin represented by the general formula [I]
P, novolac type phenolic resin THE-1085,
γ-ureidopropyltriethoxysilane AY43-
031, triphenylphosphine, carnauba wax,
Carbon black and fused spherical silica powder (maximum particle size
75 μm average particle diameter 14 μm) were mixed at a mixing ratio shown in Table 1 at room temperature, and then kneaded by heating at 70 to 100 ° C. After cooling, it was pulverized to an appropriate size to obtain an epoxy resin composition.

Example 11 NC-3000 which is an epoxy resin represented by the general formula [I]
P, FPI of condensed ring aromatic hydrocarbon modified phenolic resin
-5167 (trade name of Kashima Oil Co., Ltd.), N-phenyl-γ-
Aminopropyltrimethoxysilane KBM-573,
Triphenylphosphine, carnauba wax, carbon black and fused spherical silica powder (maximum particle size 75 μm
The average particle size of 14 μm) was mixed at a mixing ratio shown in Table 1 at room temperature and then kneaded by heating at 70 to 100 ° C. After cooling, it was pulverized to an appropriate size to obtain an epoxy resin composition.

Example 12 NC-3000, an epoxy resin represented by the general formula [I]
P, FPI of condensed aromatic hydrocarbon modified phenolic resin
-5167, aralkyl-type phenol resin MEH-7800S (trade name, manufactured by Meiwa Kasei Co., Ltd.) represented by the general formula [II], N-phenyl-γ-aminopropyltrimethoxysilane KBM-573, triphenylphosphine, carnauba wax. , Carbon black and fused spherical silica powder (maximum particle size: 75 μm, average particle size: 14 μm) were mixed at a mixing ratio shown in Table 1 at room temperature, and then heated and kneaded at 70 to 100 ° C. After cooling, it was pulverized to an appropriate size to obtain an epoxy resin composition.

Example 13 NC-3000 which is an epoxy resin represented by the general formula [I]
P, FPI of condensed aromatic hydrocarbon modified phenolic resin
-5167, novolac type phenolic resin THE-1
085, N-phenyl-γ-aminopropyltrimethoxysilane KBM-573, triphenylphosphine, carnauba wax, carbon black and fused spherical silica powder (maximum particle size 75 μm average particle size 14 μm) At room temperature and then kneaded by heating at 70-100 ° C. After cooling, it was pulverized to an appropriate size to obtain an epoxy resin composition.

Example 14 NC-3000 which is an epoxy resin represented by the general formula [I]
P, aralkyl type phenolic resin MEH-7800SS represented by the general formula [II], N-β- (aminoethyl) -γ-
Aminopropyltrimethoxysilane A-1122, triphenylphosphine, carnauba wax, carbon black and fused spherical silica powder (maximum particle size 75 μm average particle size 14 μm) were mixed at a mixing ratio shown in Table 1 at room temperature, and then, The mixture was heated and kneaded at 70 to 100 ° C. After cooling, it was pulverized to an appropriate size to obtain an epoxy resin composition.

Example 15 NC-3000 which is an epoxy resin represented by the general formula [I]
P, aralkyl type phenolic resin MEH-7800SS represented by the general formula [II], N-phenyl-γ-aminopropyltrimethoxysilane KBM-573, triphenylphosphine, carnauba wax, carbon black and fused spherical silica powder ( Maximum particle size 75 μm Average particle size 14
μm) was mixed at a mixing ratio shown in Table 1 at room temperature, and then kneaded by heating at 70 to 100 ° C. After cooling, it was pulverized to an appropriate size to obtain an epoxy resin composition.

Example 16 NC-3000 which is an epoxy resin represented by the general formula [I]
P, aralkyl type phenolic resin MEH-7800SS represented by the general formula [II], γ-ureidopropyltriethoxysilane AY43-031, triphenylphosphine, carnauba wax, carbon black and fused spherical silica powder (maximum particle size 75 μm (Average particle size 14 μm)
Are mixed at a mixing ratio shown in Table 1 at room temperature, and then 70-
The mixture was heated and kneaded at 100 ° C. After cooling, it was pulverized to an appropriate size to obtain an epoxy resin composition.

Example 17 NC-3000 which is an epoxy resin represented by the general formula [I]
P, cresol novolac type epoxy resin EOCN-
1020, MEH-7800SS which is an aralkyl type phenol resin represented by the general formula [II], KBM-573 which is N-phenyl-γ-aminopropyltrimethoxysilane, triphenylphosphine, carnauba wax, carbon black and fused spherical silica powder ( The maximum particle size of 75 μm and the average particle size of 14 μm) were mixed in the mixing ratio shown in Table 1 at room temperature,
Then, the mixture was heated and kneaded at 70 to 100 ° C. After cooling, it was pulverized to an appropriate size to obtain an epoxy resin composition.

Example 18 NC-3000 which is an epoxy resin represented by the general formula [I]
P, cresol novolac type epoxy resin EOCN-
1020, MEH-7800SS which is an aralkyl type phenol resin represented by the general formula [II], and A-11 which is N-β- (aminoethyl) -γ-aminopropyltrimethoxysilane.
22, triphenylphosphine, carnauba wax, carbon black and fused spherical silica powder (maximum particle size 75
μm average particle diameter 14 μm) were mixed at a mixing ratio shown in Table 1 at room temperature, and then kneaded by heating at 70 to 100 ° C. After cooling, it was pulverized to an appropriate size to obtain an epoxy resin composition.

Example 19 NC-3000 which is an epoxy resin represented by the general formula [I]
P, novolac type phenolic resin THE-1085,
K of N-phenyl-γ-aminopropyltrimethoxysilane
BM-573, triphenylphosphine, carnauba wax, carbon black and fused spherical silica powder (maximum particle size 75 μm average particle size 14 μm) were mixed at room temperature in the mixing ratio shown in Table 1, and then heated at 70 to 100 ° C. Kneaded After cooling, it was pulverized to an appropriate size to obtain an epoxy resin composition.

Comparative Example 1 cresol novolak type epoxy resin EOCN-10
20, novolac type phenolic resin THE-100
0, K of γ-glycidoxypropyltrimethoxysilane
BM-403 (trade name of Shin-Etsu Chemical Co., Ltd.), triphenylphosphine, carnauba wax, carbon black, antimony trioxide, bisphenol A type brominated epoxy resin EPICLON165 (trade name of Dainippon Ink and Chemicals Co., Ltd.) and fused spheres Silica powder (maximum particle size
75 μm average particle diameter 18 μm) were mixed at a mixing ratio shown in Table 2 at room temperature and then kneaded by heating at 70 to 100 ° C. After cooling, it was pulverized to an appropriate size to obtain an epoxy resin composition.

Comparative Example 2 cresol novolac type epoxy resin EOCN-10
20, novolac type phenolic resin THE-100
0, N-phenyl-γ-aminopropyltrimethoxysilane KBM-573, triphenylphosphine, carnauba wax, carbon black, antimony trioxide, bisphenol A type brominated epoxy resin EPICLON1
65 and fused spherical silica powder (maximum particle size 75 μm average particle size 18 μm) were mixed at a mixing ratio shown in Table 2 at room temperature,
Then, the mixture was heated and kneaded at 70 to 100 ° C. After cooling, it was pulverized to an appropriate size to obtain an epoxy resin composition.

Comparative Example 3 NC-3000 which is an epoxy resin represented by the general formula [I]
P, the novolac type phenolic resin THE-1000,
KBM of γ-glycidoxypropyltrimethoxysilane
-403 (trade name of Shin-Etsu Chemical Co., Ltd.), triphenylphosphine, carnauba wax, carbon black, antimony trioxide, bisphenol A type brominated epoxy resin EPICLON 165 and fused spherical silica powder (maximum particle size 75 μm average particle size 14 μm) Were mixed at a mixing ratio shown in Table 2 at room temperature, and then heated and kneaded at 70 to 100 ° C. After cooling, it was pulverized to an appropriate size to obtain an epoxy resin composition.

Comparative Example 4 cresol novolac type epoxy resin EOCN-10
20, MEH-7800SS of aralkyl type phenol resin represented by the general formula [II], KBM-573 of N-phenyl-γ-aminopropyltrimethoxysilane, triphenylphosphine, carnauba wax, carbon black, antimony trioxide, bisphenol A type Brominated epoxy resin EPICLON 165 and fused spherical silica powder (maximum particle size: 75 μm, average particle size: 18 μm) were mixed at a mixing ratio shown in Table 2 at room temperature, and then heated and kneaded at 70 to 100 ° C. After cooling, it was pulverized to an appropriate size to obtain an epoxy resin composition.

Comparative Example 5 An epoxy resin NC-3000 represented by the general formula [I].
P, the novolac type phenolic resin THE-1000,
KBM of γ-glycidoxypropyltrimethoxysilane
-403 (trade name of Shin-Etsu Chemical Co., Ltd.), triphenylphosphine, carnauba wax, carbon black, antimony trioxide, bisphenol A type brominated epoxy resin EPICLON 165 and fused spherical silica powder (maximum particle size 75 μm average particle size 14 μm) Were mixed at a mixing ratio shown in Table 2 at room temperature, and then heated and kneaded at 70 to 100 ° C. After cooling, it was pulverized to an appropriate size to obtain an epoxy resin composition.

Comparative Example 6 cresol novolac type epoxy resin EOCN-10
20, novolac type phenolic resin THE-100
0, K of γ-glycidoxypropyltrimethoxysilane
BM-403, triphenylphosphine, carnauba wax, carbon black, and fused spherical silica powder (maximum particle size 75 μm average particle size 18 μm) were mixed at a mixing ratio shown in Table 2 at room temperature, and then heated at 70 to 100 ° C. Kneaded After cooling, it was pulverized to an appropriate size to obtain an epoxy resin composition.

Comparative Example 7 NC-3000, an epoxy resin represented by the general formula [I].
P, the novolac type phenolic resin THE-1000,
KBM of γ-glycidoxypropyltrimethoxysilane
-403, triphenylphosphine, carnauba wax, carbon black and fused spherical silica powder (maximum particle size 75 μm average particle size 14 μm) were mixed at room temperature in the mixing ratio shown in Table 2, and then heat kneaded at 70 to 100 ° C. did.
After cooling, it was pulverized to an appropriate size to obtain an epoxy resin composition.

Comparative Example 8 cresol novolac type epoxy resin EOCN-10
20, MEH-7800SS of aralkyl type phenol resin represented by the general formula [II], KBM-403 of γ-glycidoxypropyltrimethoxysilane, triphenylphosphine, carnauba wax, carbon black and fused spherical silica powder (maximum particles Diameter 75μm Average particle diameter 18μ
m) are mixed at a mixing ratio shown in Table 2 at room temperature, and then,
The mixture was heated and kneaded at 70 to 100 ° C. After cooling, it was pulverized to an appropriate size to obtain an epoxy resin composition.

Comparative Example 9 cresol novolac type epoxy resin EOCN-10
20, aralkyl type phenolic resin MEH-7800SS represented by the general formula [II], N-phenyl-γ-aminopropyltrimethoxysilane KBM-573, triphenylphosphine, carnauba wax, carbon black and fused spherical silica powder ( Maximum particle size 75 μm Average particle size
18 μm) were mixed at a mixing ratio shown in Table 2 at room temperature and then kneaded by heating at 70 to 100 ° C. After cooling, it was pulverized to an appropriate size to obtain an epoxy resin composition.

Comparative Example 10 NC-3000 which is an epoxy resin represented by the general formula [I]
P, aralkyl-type phenol resin MEH-7800SS represented by the general formula [II], γ-glycidoxypropyltrimethoxysilane KBM-403, triphenylphosphine, carnauba wax, carbon black and fused spherical silica powder (maximum particles Diameter 75 μm Average particle diameter 18 μm)
Are mixed at a mixing ratio shown in Table 2 at room temperature, and then 70-
The mixture was heated and kneaded at 100 ° C. After cooling, it was pulverized to an appropriate size to obtain an epoxy resin composition.

Comparative Example 11 Biphenyl type epoxy resin YX-4000H and aralkyl type phenol resin MEH represented by the general formula [II].
-7800SS, γ-glycidoxypropyltrimethoxysilane KBM-403, triphenylphosphine,
Carnauba wax, carbon black and fused spherical silica powder (maximum particle size 75 μm average particle size 18 μm) are shown in Table 2.
The mixture was mixed at room temperature in the mixing ratio shown in, and then kneaded by heating at 70 to 100 ° C. After cooling, it was pulverized to an appropriate size to obtain an epoxy resin composition.

Comparative Example 12 YX-4000H which is a biphenyl type epoxy resin and MEH which is an aralkyl type phenol resin represented by the general formula [II].
-7800SS, N-phenyl-γ-aminopropyltrimethoxysilane KBM-573, triphenylphosphine, carnauba wax, carbon black and fused spherical silica powder (maximum particle size 75 μm average particle size 18 μm),
Mix in the mixing ratio shown in Table 2 at room temperature, then 70 to 100
The mixture was kneaded by heating at ℃. After cooling, it was pulverized to an appropriate size to obtain an epoxy resin composition.

The characteristics of the epoxy resin compositions obtained in the above Examples and Comparative Examples were measured as follows.

That is, regarding the water absorption, the epoxy resin composition was transfer-molded under the conditions of 175 ° C. for 90 seconds, and then post-cured at 175 ° C. for 8 hours to cure a disc-shaped resin having a diameter of 50 mm and a thickness of 3 mm. The product was obtained and allowed to stand in saturated steam at 127 ° C. and 2.5 atm for 24 hours, and the increased weight was determined.

The Barcol hardness is the same as that of the epoxy resin composition.
Transfer molding was performed into a disk shape having a diameter of 50 mm and a thickness of 3 mm under the conditions of 175 ° C. for 90 seconds, and the mold was measured with a Barcol hardness meter immediately after opening.

Moisture resistance is measured by using an epoxy resin composition to obtain a silicon chip having two aluminum wirings.
2 Adhesion to an alloy frame, transfer molding at 175 ° C for 90 seconds and post-curing at 175 ° C for 8 hours, then the resulting molded product was tested for humidity resistance (PCT) in saturated steam at 127 ° C and 2.5 atmospheres. ) Was performed, and the time until 50% disconnection failure due to aluminum corrosion occurred was measured and evaluated.

The reflow resistance is measured by using an epoxy resin composition at 175 ° C. for 90 seconds in transfer molding and at 175 ° C.
QFA package (14mm × 14mm ×
1.0mm, chip size: 6.0mm x 6.0mm) was prepared, and this package was subjected to moisture absorption treatment at 85 ° C, 60% RH, 48, 72, 96, 168 hours, and then IR reflow at 240 ° C. The test was performed 3 times, and after cooling, the presence or absence of cracks was observed with an ultrasonic flaw detector to examine the occurrence rate.

The flame retardancy is obtained by using an epoxy resin composition at 175 ° C., 9
Transfer molding for 0 seconds, then 175 ℃, 8
120mm × 12mm × 0.8mm and 120mm after post-curing
A cured product of × 12 mm × 3.2 mm was obtained, and a combustion test based on UL-94 flame resistance test standard was performed.

The results are shown in Tables 3 and 4.

[Table 1]

[Table 2]

[Table 3]

[Table 4]

[0073]

As described above, according to the present invention,
It is possible to obtain an epoxy resin composition having excellent solder heat resistance that does not cause cracking or peeling even when applied to a surface mount package, and a semiconductor device using the same.

Further, according to the present invention, it is possible to obtain an epoxy resin composition which is excellent in flame retardancy, has good moisture resistance for a long period of time, and has no environmental problem, and a semiconductor device using the same. You can

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H01L 23/31 (72) Inventor Toshihiro Hosoi 5-14-25 Ryoke, Kawaguchi City, Saitama Toshiba Chemical Co., Ltd. Kawaguchi Factory F-term (reference) 4J002 CC032 CD031 CD041 CE002 EX016 EX036 EX076 EX086 FD14 FD146 GQ05 4J036 AE05 DD08 FB07 GA28 JA07 4M109 AA01 CA21 EA02 EB03 EB04 EB06 EB13 EC05

Claims (5)

[Claims] 1. (A) The following general formula: (Wherein, n represents 0 or an integer of 1 or more), (B) a phenol resin, (C) an inorganic filler and (D) an amino-based silane coupling agent. A characteristic epoxy resin composition. 2. The component (B) has the following general formula: (However, in formula, n represents 0 or an integer greater than or equal to 1), The epoxy resin composition of Claim 1 characterized by the above-mentioned. 3. The content of the inorganic filler as the component (C) is 65 to
It is 93 weight%, The epoxy resin composition of Claim 1 or 2 characterized by the above-mentioned. 4. The epoxy resin composition according to claim 1, which is substantially free of a flame retardant. 5. A semiconductor device in which a semiconductor chip is sealed with the cured product of the epoxy resin composition according to any one of claims 1 to 4.