JP2003168767A - Ic chip sealing part and ic chip mounted media having ic chip sealing part - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC chip sealing part which can seal an IC chip firmly by means of sealing agent and an IC chip mounted media having the IC chip sealing part. <P>SOLUTION: In an IC chip sealing part, a number of projection parts are formed in a sealing surface of an IC chip by means of sealing agent. If sealing agent is applied thereon for sealing an IC chip, a contact area between sealing agent, and a base material and a projection part is enlarged, thus enabling firm sealing of an IC chip by means of sealing agent. If the member forming a conductive circuit conductively connected to an IC chip and a member forming the projection part are the same member, labor can be saved and the cost can be reduced, which is preferable for manufacturing. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC chip sealing part and an IC chip mounting medium having an IC chip sealing part, and more particularly to a thin information transmission / reception type recording medium such as a non-contact IC tag. RF-I such as
D (RadioFrequency IDentify
The present invention relates to an IC chip encapsulation part applied to media, paper computers, disposable electric products and the like, and an IC chip mounting media having the IC chip encapsulation part.

[0002]

2. Description of the Related Art A conventional IC chip sealing portion and an IC chip mounting medium having an IC chip sealing portion will be described. 5 to 7, the structure of the antenna circuit body is divided into an IC chip mounting interposer and an antenna holder, and the IC chip mounting interposer and the antenna holder are formed in advance, and the antenna circuit body is formed using them. The case will be described.

FIG. 5 shows a process of forming one of the IC chip mounting interposers. First, a base material 1 having a predetermined size is prepared so as to extend over a terminal portion of an antenna holder, which will be described later (a). Using conductive ink or the like as the material 1
A pair of conductive patterns 4 in which the C-chip mounting conductive portion 2 and the conductive connecting portion 3 are continuous are provided (B). After that, the IC chip 5 is mounted so as to straddle the conductive portion 2 for mounting the IC chip, and the sealant 20 made of a thermosetting insulating paste such as a phenol resin, a polyester resin, or an epoxy resin is used for the IC chip. 5 is sealed to form the IC chip mounting interposer A (C), and at least the conductive connection portion 3 (scheduled bonding portion) on which the IC chip 5 is mounted is covered with powdery gold, nickel, silver, A conductive adhesive containing a conductive substance such as aluminum is applied to form the adhesive portion 6 (d).

FIG. 6 shows a process of forming the other antenna holder B, in which a base material 7 having a predetermined size is prepared (a), and a conductive ink or the like is used on the base material 7 to form an antenna conductive portion 8. A conductive pattern 10 consisting of a conductive connection portion 9 (a portion to be joined), which is a terminal portion, is provided at the end of the antenna conductive portion 8 (b), and the antenna holder B is formed by this. The conductive connecting portion 9 is provided so as to correspond to the conductive connecting portion 3 of the IC chip mounting interposer A. Reference numeral 11 is an insulating portion.

The IC chip mounting interposer A
And the antenna holder B are overlapped so that the conductive connecting portions 3 and 9 face each other via the adhesive portion 6, and the conductive connecting portions 3 and 9 are bonded via the adhesive portion 6 and electrically. By connecting the IC chip mounting interposer A and the antenna holder B to each other for conduction, the RF-
ID medium C is obtained.

[0006]

However, according to this method, since the contact area between the sealant 20 and the base material 1 is small, the adhesive force between the sealant 20 and the base material 1 is small and the IC chip 5 is sealed. There was a problem that the stop was not enough. The purpose of the present invention is to
It is an object of the present invention to provide an IC chip mounting medium having an IC chip encapsulation part capable of strongly encapsulating an IC chip with an encapsulant and an IC chip encapsulation part such as an RF-ID medium, which solves conventional problems.

[0007]

As a result of intensive studies to solve the above-mentioned problems, the present inventor has found that a large number of convex portions are formed on the sealing surface of the IC chip of the base material, and They have found that IC chips can be strongly sealed, and have completed the present invention.

That is, the IC chip sealing portion according to the first aspect of the present invention is characterized in that a large number of convex portions are formed on the sealing surface of the IC chip by the sealing agent.

According to a second aspect of the present invention, there is provided an IC chip encapsulating portion, wherein in the IC chip encapsulating portion according to the first aspect, a member forming a conductive circuit electrically conductively connected to the IC chip and the convex portion are formed. The member to be used is the same member.

A third aspect of the present invention is an IC chip mounting medium having the IC chip sealing portion according to the first or second aspect.

In the present invention, since a large number of convex portions are formed on the sealing surface of the IC chip by the sealing agent, if the sealing agent is applied on the convex portions to seal the IC chip, the sealing is performed. The contact area between the stopper and the base material and the convex portion is increased, and as a result, the IC chip can be strongly sealed by the sealant.

If the member forming the conductive circuit for conductively connecting to the IC chip and the member forming the convex portion are the same member, the conductive portion for mounting the IC chip and the conductive portion are formed by using conductive ink on the base material. When providing a conductive pattern having continuous connecting portions and the like, the convex portion can be formed by using the same conductive ink, so that the process is simplified, labor is saved, and cost can be reduced. Since the IC chip mounting medium having the IC chip sealing portion of the present invention has the IC chip strongly sealed by the sealing agent, the performance is stably maintained for a long time and the reliability is high.

[0013]

DETAILED DESCRIPTION OF THE INVENTION An embodiment of the present invention will be described below with reference to the drawings. 1 (a) to 1 (d) show I of the present invention.
It is explanatory drawing which shows the formation process of the IC chip mounting interposer which has a C chip sealing part. First, a base material 1 having a predetermined size is prepared so as to extend over a terminal portion of an antenna holder, which will be described later (a), and the conductive portion 2 for IC chip mounting and the conductive connection portion are formed on the base material 1 by using conductive ink or the like. A pair of conductive patterns 4 that are continuous with each other are provided, and the same conductive ink or the like is used to form a large number of substantially the same thickness as the IC chip mounting conductive portion 2 on the sealing surface of the IC chip 5 of the base material 1. Is provided (an example of the IC chip sealing portion of the present invention) (b). After that, the IC chip 5 is mounted so as to straddle the conductive portion 2 for mounting the IC chip, and the IC chip 5 is formed by using a sealing agent 20 made of a thermosetting insulating paste such as phenol resin, polyester resin, or epoxy resin. 5 is sealed to form the IC chip mounting interposer A (C). Then, a conductive adhesive is applied onto at least the conductive connecting portion 3 (scheduled joining portion) on which the IC chip 5 is mounted to form the adhesive portion 6 (d).

The method of forming the convex portion 30 is not limited to the above-described method, and may be formed by a printing method using an insulating paste made of resin or rubber, or by etching a metal foil. You can also Since many convex portions 30 are present on the sealing surface of the IC chip 5 of the base material 1, the sealing agent 2
The contact area between 0 and the base material 1 or the convex portion 30 is increased, and as a result, strong sealing of the IC chip 5 with the sealing agent 20 can be achieved.

FIG. 2 shows a process of forming the antenna holder B. A base material 7 having a predetermined size is prepared (a), and the antenna conductive portion 8 and the antenna conductive portion 8 are formed on the base material 7 by using conductive ink or the like. A conductive pattern 10 including a conductive connection portion 9 (a portion to be joined) that is a terminal portion is provided at the end of the antenna conductive portion 8 (b), and the antenna holder B is formed by this. Reference numeral 11 is an insulating portion.

Then, the IC chip mounting interposer A and the antenna holder B are superposed so that the respective conductive connecting portions 3 and 9 face each other via the adhesive portion 6, and the conductive connecting portions 3 and 9 are bonded together. IC for electrical continuity
By joining the chip mounting interposer A and the antenna holder B to each other, the RF-ID medium C (an example of the IC chip mounting medium having the IC chip sealing portion of the present invention) shown in FIG. 3 can be obtained. In the RF-ID medium C, since the IC chip 5 is strongly sealed by the sealing agent 20,
The performance is stable over a long period of time and highly reliable.

FIGS. 4A to 4F are explanatory views for explaining another example of the IC chip sealing portion of the present invention in which a large number of convex portions are formed on the IC chip sealing surface of the base material. Is. Figure 4 (a)
In the example, a pair of conductive patterns in which the IC chip mounting conductive portion 2 and the conductive connection portion 3 are continuous are provided by using conductive ink on the base material, and the same conductive ink is used by the IC chip 5 of the base material. A large number of fine line-shaped convex portions 30 are provided on the sealing surface of the IC chip 5 (another example of the IC chip sealing portion of the present invention), and the IC chip 5 is mounted so as to extend over the IC chip mounting conductive portion 2. An IC chip mounting interposer A is formed by mounting and sealing the IC chip 5 with a sealing agent 20 made of a thermosetting insulating paste such as phenol resin, polyester resin, or epoxy resin. Since a large number of convex portions 30 are present on the sealing surface of the IC chip 5 of the base material, the contact area between the sealing agent 20 and the base material and the convex portions 30 becomes large. Strong encapsulation of the chip 5 can be achieved.

In the example of FIG. 4B, an IC chip including a large number of linear convex portions 31 (another example of the IC chip sealing portion of the present invention) which are electrically connected to each other by using a conductive ink as a base material. A pair of conductive patterns in which the mounting conductive portion 2 and the conductive connecting portion 3 are continuous are provided, and a large number of fine line-shaped convex portions 30 are formed on the sealing surface of the IC chip 5 of the base material using the same conductive ink.
Is provided (another example of the IC chip sealing portion of the present invention),
The IC chip 5 is mounted so as to straddle the conductive portion 2 for mounting the IC chip, and a phenol resin, a polyester resin,
An IC chip mounting interposer A is formed by sealing the IC chip 5 with a sealing agent 20 made of a thermosetting insulating paste such as an epoxy resin. Since a large number of convex portions 30 are present on the sealing surface of the IC chip 5 of the base material, the contact area between the sealing agent 20 and the base material and the convex portions 30 becomes large. Strong sealing of the chip 5 can be achieved, the contact area between the sealing agent 20 and the base material and the convex portion 31 is increased, the conductive portion 2 for mounting the IC chip is strongly adhered, and conduction is ensured. It does not peel off and the reliability is improved.

In the example of FIG. 4C, an IC chip including a large number of linear convex portions 31 (another example of the IC chip sealing portion of the present invention) which are electrically connected to each other by using a conductive ink as a base material. A pair of conductive patterns in which the mounting conductive portion 2 and the conductive connecting portion 3 are continuous are provided, and a large number of fine line-shaped projections are formed on a part of the sealing surface of the base IC chip 5 using the same conductive ink. The IC chip 5 is mounted so as to straddle the conductive portion 2 for mounting the IC chip, and the phenol resin, the polyester resin, the epoxy resin is provided. IC chip 5 is sealed by using a sealing agent 20 made of a thermosetting insulating paste such as
A chip mounting interposer A is formed. Since many convex portions 30 are present on a part of the sealing surface of the IC chip 5 of the base material, the contact area between the sealing agent 20 and the base material and the convex portions 30 becomes large, and as a result, the sealing agent 20 can achieve strong sealing of the IC chip 5, the contact area between the sealant 20 and the base material and the convex portion 31 is increased, and the conductive portion 2 for mounting the IC chip is strongly bonded, and Continuity is ensured and peeling does not occur, improving reliability.

In the example of FIG. 4D, FIG. 4A except that a large number of convex portions 30 are formed in a concentric pattern.
The same effect as the example of FIG. 4A can be obtained.

The example shown in FIG. 4 (e) is the same as the example shown in FIG. 4 (a) except that a large number of round convex portions 30 are formed. The same effect is obtained.

The example shown in FIG. 4F is the same as the example shown in FIG. 4A except that a large number of square-shaped convex portions 30 are formed. The same effect is obtained.

As described above, the shape of the convex portions 30 and 31 is not limited to a thin line or a line, and may be a pattern of circles, squares, radials, concentric circles, or the like. Also, the convex portion 30
The members (materials), widths, thicknesses, lengths, and the like of 31 and 31 are not particularly limited. However, it is preferable that the members of the convex portions 30 and 31 are the same members as the members forming the conductive circuit (the conductive portion 2 for mounting the IC chip, the conductive connecting portion 3, etc.) for conductively connecting to the IC chip. When the conductive pattern 4 in which the conductive parts 2 for IC chip mounting, the conductive connection parts 3 and the like are continuous is provided on the base material using conductive ink or the like, the convex parts 30 and 31 are formed using the same conductive ink or the like. Therefore, the process can be simplified, the labor can be saved, and the cost can be reduced.

The method of conductively connecting the opposing conductive connecting portions of the IC chip mounting interposer and the conductive connecting portion of the antenna holder is not particularly limited. For example, after the conductive connecting portions are aligned with each other, thermocompression bonding and pressing are performed. It can be performed by a known method such as crimping with a wire, a method using light, an electromagnetic wave, an electron beam or the like, a method combining these methods, a method of sandwiching with an ultrasonic welding tool and conducting conductive connection with ultrasonic waves, etc. .

In the above-described embodiment, an example in which the adhesive portion 6 is formed on the conductive connecting portion 3 of the IC chip mounting interposer A is shown. However, the adhesive portion layer 6 is a corresponding portion on the side of the antenna holder B (scheduled joining portion). Or on both the IC chip mounting interposer A side and the antenna holder B side.

The adhesive portion 6 may be formed on the entire surface on the IC chip mounting interposer A side or on the entire surface on the antenna holder B side. Also, the adhesive portion 6
May be formed in a pattern such as a line, a dot, a lattice, or a comb.

Using a sealant (CRP-X4322, manufactured by Sumitomo Bakelite Co., Ltd., thickness: 200 μm), a paper substrate provided with copper fine line etching patterns (line width: 0.05 to 0.5 mm) was used. Laminating (0.4 MPa, 2
The adhesive strength was measured by T peel (00 ° C., 10 seconds) (peel condition width 1 cm, speed 300 mm / min). Table 1 shows the relationship between the distance between the lines and the adhesive strength.

[0028]

[Table 1]

From Table 1, in the case of thin wires, the distance between the wires is 0.3 m.
It is understood that m or less is preferable.

The material of the base material 1 or the base material 7 used in the present invention is a woven cloth, a non-woven cloth, a mat, a paper or a combination thereof made of an inorganic or organic fiber such as glass fiber, alumina fiber, polyester fiber or polyamide fiber. Or a composite substrate formed by impregnating these with resin varnish, a polyamide resin substrate, a polyester resin substrate, a polyolefin resin substrate, a polyimide resin substrate, an ethylene / vinyl alcohol copolymer group Material,
Polyvinyl alcohol resin substrate, polyvinyl chloride resin substrate, polyvinylidene chloride resin substrate, polystyrene resin substrate, polycarbonate resin substrate, acrylonitrile butadiene styrene copolymer resin substrate, polyether sulfone resin Select from known plastic substrates such as substrates, or those that have undergone surface treatment such as corona discharge treatment, plasma treatment, ultraviolet irradiation treatment, electron beam irradiation treatment, flame plasma treatment and ozone treatment. Can be used.

The IC chip mounting interposer and the antenna carrier may be formed of the same base material or different base materials. Further, the IC chip mounting interposer and the antenna carrier may not be formed one by one, but may be formed in plural (and may be of the same kind or different kinds).

The formation of the conductive pattern 4 on the IC chip mounting interposer, the formation of the conductive pattern 10 on the antenna holder, and the formation of the convex portions 30 and 31 can be performed by known methods. For example, a method in which a conductive paste is printed by screen printing or inkjet printing to be dried and fixed, attachment of a coated or uncoated metal wire, etching, dispersion, metal foil attachment, direct vapor deposition of metal, metal vapor deposition film transfer, Examples thereof include formation of a conductive polymer layer, but are not limited thereto. The convex portions 30 and 31 are formed by printing an insulating paste made of resin, rubber, or the like by screen printing or ink jet printing to dry and fix it, attaching an insulating polymer film, etching, or the like. You can also Insulating powders such as silica, alumina, glass, talc and various rubbers, and known additives such as fillers, pigments and dyes can be added to the conductive paste and the insulating paste, if necessary.

Further, in the antenna holder, the conductive pattern 10 is not necessarily limited to one side, but may be formed on the back side as well as on the inner layer as long as the connection which finally functions as an antenna is guaranteed. Further, it may be an antenna in which they are multiplexed. Further, it may be a pattern in which other lines are crossed by jumper lines as needed. It may be coated to protect the formed antenna.

The mounting of the IC chip in the process of forming the IC chip mounting interposer includes wire bonding (WB) and anisotropic conductive film (AC).
F), conductive paste (ACP), insulating resin (NCP),
The connection can be made by a known method such as using an insulating film (NCF) or a cream solder ball. If necessary, the connection portion may be protected and reinforced with a known underfill material or potting material.

The adhesive used in the present invention is not particularly limited, and specifically, for example, hot melt adhesive, pressure sensitive adhesive, thermoplastic resin adhesive or thermosetting resin adhesive, ultraviolet ray, electron beam. Examples of the adhesive include an adhesive that is cured by the above, a natural rubber adhesive, a synthetic rubber adhesive, and the like, or an adhesive that is a combination thereof. In addition, a conductive adhesive in which a conductive substance such as gold, nickel, silver, or aluminum in powder form is mixed with these adhesives to impart conductivity is also usable. Adhesives include natural rubber and synthetic rubber, tackifiers (rosin and rosin derivatives, polyterbene resins, terpene phenol resins, petroleum resins), softeners (liquid polybutene, mineral oil,
Liquid polyisobutylene, liquid polyacrylic acid ester), a rubber system mixed with known additives such as an anti-aging agent, an acrylic resin obtained by copolymerizing a plurality of acrylic acid esters having different glass transition temperatures and other functional monomers. A system, a silicone system composed of a silicone rubber and a resin, a polyether system or a polyurethane system adhesive can be preferably used. These adhesives and adhesives are not only solution type dissolved in solution,
Aqueous emulsion type, hot melt type which is solidified by cooling after heating and melting application, after applying liquid oligomer and monomer,
Some of them can be cured by heating or irradiation with radiation such as ultraviolet rays and electron beams, and any of them can be used.

If necessary, the adhesive used in the present invention may be
Insulating powders such as silica, alumina, glass, talc and various rubbers, or known additives such as release agents, surface treatment agents, fillers, pigments and dyes can be added.

The conductive connecting portions for the IC chip mounting interposer, the antenna holder, the IC chip mounting, etc. may be formed by any method that is easy to design and manufacture, and it is required to be as precise as the conductive portion for mounting the IC chip. It is possible to use a structure with high processing tolerance.

In the above embodiment, the RF-type used in a thin information transmission / reception type recording medium such as a non-contact IC tag.
Although the ID medium has been described, it can be applied to, for example, a paper computer, a disposable electric product, or the like.

The above description of the embodiments is for explaining the present invention and does not limit the invention described in the claims or reduce the scope thereof. Further, the configuration of each part of the present invention is not limited to the above embodiment, and various modifications can be made within the technical scope described in the claims.

[0040]

In the IC chip encapsulating portion according to claim 1 of the present invention, since a large number of convex portions are formed on the encapsulating surface of the IC chip by the encapsulating agent, the encapsulating agent is formed on the convex portion. Apply and IC
When the chip is sealed, the contact area of the sealant with the base material and the convex portion is increased, and the IC chip can be strongly sealed with the sealant, which is a remarkable effect.

According to a second aspect of the present invention, there is provided the IC chip encapsulating portion, wherein the IC chip encapsulating portion according to the first aspect includes a member for forming a conductive circuit electrically conductively connected to the IC chip and the convex portion. The member to be formed is the same member, so that
While exhibiting the same effect as the described IC chip sealing part,
When forming a conductive pattern in which conductive parts for IC chip mounting and conductive connection parts are continuous using conductive ink on the substrate, convex parts can be formed using the same conductive ink, so the process is simple It is possible to achieve further remarkable effects such as reduction in cost, cost reduction, and cost reduction.

Since the IC chip mounting medium according to claim 3 of the present invention is the IC chip mounting medium having the IC chip sealing portion according to claim 1 or 2, the IC chip is strongly strengthened by the sealing agent. Since it is sealed, the performance is stably maintained for a long period of time, and the remarkable effect of high reliability is exhibited.

[Brief description of drawings]

1A to 1D are explanatory views showing a process of forming an IC chip mounting interposer having an IC chip sealing portion of the present invention.

2A to 2B are explanatory views showing a process of forming an antenna holder.

FIG. 3 is an I of the present invention having an IC chip sealing portion of the present invention.
It is explanatory drawing which shows C chip mounting media.

4A to 4F are explanatory views illustrating another example of the IC chip sealing portion of the present invention in which a large number of convex portions are formed on the IC chip sealing surface of the base material. is there.

5A to 5D are explanatory views showing a process of forming a conventional IC chip mounting interposer.

6A to 6B are explanatory views showing a process of forming a conventional antenna holder.

FIG. 7 is an explanatory diagram showing a conventional RF-ID medium.

[Explanation of symbols]

1 base material 2 IC chip mounting conductive part 3 Conductive connection 4 Conductive pattern 5 IC chip 6 Adhesive part 7 Base material 8 Antenna conductive part 9 Conductive connection 10 Conductive pattern 11 Insulation part 20 Sealant 30, 31 Convex part A IC chip mounting interposer B Antenna holder C RF-ID media

   ─────────────────────────────────────────────────── ─── Continued front page    F-term (reference) 2C005 MA19 MB06 NA09 RA22                 4M109 AA01 BA04 CA04 DA07 DB16                 5B035 BA03 BB09 CA01 CA23

Claims (3)

[Claims] 1. An IC chip encapsulation part, wherein a large number of convex parts are formed on an IC chip encapsulation surface of an encapsulant. 2. The IC chip encapsulation portion according to claim 1, wherein a member forming a conductive circuit that is conductively connected to the IC chip and a member forming the convex portion are the same member. 3. An IC chip mounting medium having the IC chip sealing portion according to claim 1 or 2.