JP2003258528A - Ic chip mount body - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC chip mount body capable of preventing an IC chip from being destroyed by uniformizing and increasing the adhesive strength between the IC chip and antenna terminals and maintaining the parallelism between a base and the IC chip. <P>SOLUTION: This invention provides the IC chip mount wherein the IC chip is mounted on a prescribed part of a face of the base and the IC chip is mounted via an IC chip support formed on the face of the base. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC chip mounting body, and more particularly to an RF-I such as a thin information transmission / reception type recording medium such as a non-contact IC tag.
D (RadioFrequency IDentify
The present invention relates to an IC chip package applicable to media, paper computers, disposable electric products, and the like.

[0002]

2. Description of the Related Art Conventionally, a non-contact type data transmitter / receiver such as a non-contact type IC tag which is used for an RF-ID medium capable of recording / erasing data by transmitting / receiving data in a non-contact state. Has a structure in which an antenna is arranged on a film-shaped or sheet-shaped substrate and an IC chip is mounted on the antenna. The antenna of this non-contact type data transmitter / receiver is formed by printing with conductive ink, and in the case of an IC chip, it sticks into a pair of terminal portions of the antenna located at the chip mounting portion of the base material. The one that has bumps for electrical continuity is adopted.

For example, conventionally, as shown in FIG. 3, an NCF (Non-type) is formed on a terminal portion 3 of an antenna 2 formed by printing a conductive ink on a film-shaped or sheet-shaped substrate 1.
Conductive Film or NCP (No
n-Conductive Paste (insulating paste) (insulating adhesive) or ACF (Anisotropic Conductive Film)
, Anisotropic conductive film) or ACP (Anisotropic)
Conductive Paste (anisotropic conductive paste) (conductive adhesive) 4 is arranged and pressed from above by a hot press (flip chip bonder) to pierce the bump 5 of the IC chip, and then heated and cured. The bump 5 and the terminal portion 3 of the antenna 2 are electrically connected to each other to mount the IC chip.

However, in many IC chips for RF-ID applications such as mifare and I-code, two bumps 5 are diagonally arranged on the IC chip 6 as shown in FIG. Since there are two contact points between the second terminal portion 3 and the terminal portion 3, there is a gap d between the bottom portion of the IC chip 6 and the base material 1 in the other diagonal direction, as shown in FIG. Due to these factors, there is a problem that the adhesive strength between the IC chip 6 and the terminal portion 3 is low and there is variation. If such a gap d exists, for example, as shown in FIG.
As shown in, the IC chip 6 is tilted due to the fluidization of the resin when it is pressed or heated to cure, and the parallelism between the base material 1 and the IC chip 6 is broken, and the IC chip 6 is destroyed. There was a problem.

[0005]

SUMMARY OF THE INVENTION Therefore, the object of the present invention is to solve the problems of the prior art, to make the adhesive strength between the IC chip 6 and the terminal portion 3 uniform and large, and to make the base material 1 and the IC chip 6 together. It is an object of the present invention to provide an IC chip mounting body in which the IC chip 6 is prevented from being broken by maintaining its parallel with.

[0006]

Claim 1 of the present invention has been made in consideration of the above problems, and an IC is provided on a predetermined portion of the surface of a base material.
It is an IC chip mounting body in which a chip is mounted, wherein the IC chip is mounted via an IC chip support body formed on the surface of the base material.

An IC chip package according to a second aspect of the present invention is the IC chip package according to the first aspect, wherein
It is characterized in that the C-chip support is made of conductive ink or insulating ink.

An IC chip package according to claim 3 of the present invention is the IC chip package according to claim 1, wherein
The C chip support is made of an adhesive tape.

The IC chip mounting body of the present invention is an IC chip mounting body in which an IC chip is mounted on a predetermined portion of a base material surface, and the IC chip support is formed on the base material surface. Since the chip is mounted, the IC chip is supported by this IC chip support, and as a result, the parallelism between the base material and the IC chip is maintained, so that the adhesive strength between the IC chip and the terminal is also uniform. growing.

[0010]

The present invention will be described in detail below.
One embodiment of an IC chip package of the present invention is shown in FIG.
An explanation will be given using (C). As shown in FIG. 1 (a), two bumps 5 are arranged diagonally on the IC chip 6 of the IC chip mounting body of the present invention.
Adhesion and conduction are achieved at the points, and on the surface of the base material 1 corresponding to the vicinity of other diagonal corners of the IC chip 6,
Two IC chip supports 7 for supporting the IC chip 6 are formed slightly outside the corners of the IC chip 6 and printed with conductive ink or insulating ink to be dried and cured, or an adhesive tape. Is formed by pasting.

As shown in FIG. 1B, there is no gap d as shown in FIG. 4B between the bottom of the IC chip 6 and the IC chip support 7, or there is a gap. As shown in FIG. 1C, the IC chip 6 is supported by the IC chip support 7 even if the resin is fluidized when the resin is pressurized or heated to be cured. Therefore, there is no inclination, or even if there is very little, the base material 1 and the IC chip 6 can be maintained in parallel, and the IC chip 6 is not broken. Since the base material 1 and the IC chip 6 are kept parallel to each other, the adhesive strength between the IC chip and the terminal portion is also uniform and large.

FIGS. 2A to 2C are explanatory views for explaining another embodiment of the IC chip mounting body of the present invention. Figure 2
In the case of the embodiment (a), two bumps 5 are diagonally arranged on the IC chip 6 of the IC chip mounting body of the present invention, and adhesion and conduction are achieved at two positions with the terminal portion 3 of the antenna. At the same time, the two IC chip supports 7 for supporting the IC chip 6 print conductive ink or insulating ink on the surface of the base material 1 corresponding to the vicinity of other diagonal corners of the IC chip 6. Then, it is formed by being dried, cured, or attached with an adhesive tape.

In the case of the embodiment shown in FIG. 2B, I of the present invention is used.
Two bumps 5 are diagonally arranged on the IC chip 6 of the C chip mounting body, and are bonded and conducted at two points with the terminal portion 3 of the antenna, and in the other diagonal direction of the IC chip 6. A plurality of substrates for supporting the IC chips 6 (total 6
The individual IC chip supports 7 are formed by printing conductive ink or insulating ink, drying and curing, or sticking an adhesive tape.

In the case of the embodiment shown in FIG. 2C, I of the present invention is used.
Two bumps 5 are diagonally arranged on the IC chip 6 of the C chip mounting body, and are bonded and conducted at two points with the terminal portion 3 of the antenna, and in the other diagonal direction of the IC chip 6. Two L-shaped IC chip supports 7 for supporting the IC chip 6 are printed with conductive ink or insulating ink, dried and cured on the surface of the base material 1 corresponding to the corners to the sides. Or, it is formed by attaching an adhesive tape.

In the case of the embodiment shown in FIG. 2D, I of the present invention is used.
Two bumps 5 are diagonally arranged on the IC chip 6 of the C chip mounting body, and the IC terminal 6 excluding the antenna terminal portion 3 is bonded and conducted at two points with the antenna terminal portion 3. An IC for supporting an IC chip 6 slightly larger than the IC chip 6 on the surface of the base material 1 corresponding to the chip 6.
The chip support 7 is formed by printing a conductive ink or an insulating ink, drying and curing it, or sticking an adhesive tape.

In the case of the embodiment shown in FIG. 2 (e), I of the present invention is used.
Two bumps 5 are diagonally arranged on the IC chip 6 of the C chip mounting body, and are bonded and conducted at two points with the antenna terminal portion 3, and also including the antenna terminal portion 3. I for supporting the IC chip 6 slightly larger than the IC chip 6 on the surface of the base material 1 corresponding to the IC chip 6.
The C-chip support 7 is formed by printing an insulating ink, drying and curing it, or adhering an adhesive tape.

In any of the cases shown in FIGS. 2A to 2E, I
There is no gap between the bottom of the C chip 6 and the IC chip support 7, or even if there is a very small gap, the resin may be fluidized when it is cured by pressurization or heating. Also, since the IC chip 6 is supported by the IC chip support 7, the IC chip 6 does not tilt or has a very small amount, and the base 1 and the IC chip 6 can be kept parallel to each other.
The C chip 6 is not destroyed. Since the base material 1 and the IC chip 6 are kept parallel to each other, the adhesive strength between the IC chip and the terminal portion is also uniform and large.

The material of the substrate 1 used in the present invention is a woven fabric, a non-woven fabric, a mat, a paper made of inorganic or organic fibers such as glass fiber, alumina fiber, polyester fiber and polyamide fiber, or a combination thereof, or Composite base material formed by impregnating these with resin varnish, polyamide-based resin base material, polyester-based resin base material,
Polyolefin resin substrate, polyimide resin substrate, ethylene / vinyl alcohol copolymer substrate, polyvinyl alcohol resin substrate, polyvinyl chloride resin substrate, polyvinylidene chloride resin substrate, polystyrene resin substrate ,
Plastic base materials such as polycarbonate resin base materials, acrylonitrile butadiene styrene copolymer resin base materials, and polyether sulfone base resin base materials, or corona discharge treatment, plasma treatment, ultraviolet irradiation treatment, electron beam irradiation treatment, flame plasma It is possible to select and use from known ones such as those subjected to surface treatment such as treatment and ozone treatment.

The antenna 2 and its terminal portion 3 can be formed by a known method. For example, a method of printing conductive ink or paste by screen printing or inkjet printing to dry and fix it, attachment of coated or uncoated metal wire, etching, dispensation, attachment of metal foil, direct metal vapor deposition, metal vapor deposition film Examples include, but are not limited to, transfer and conductive polymer layer formation. The IC chip support 7 can be formed by the same known method as that for forming the antenna 2 and the terminal portion 3 thereof. For example, it can be formed by printing a conductive ink or an insulating ink, drying and curing, or sticking an adhesive tape. When conductive ink is used, it can be performed simultaneously with the formation of the antenna 2 and its terminal portion 3, which has advantages such as high positional accuracy and no increase in steps. The use of the insulating ink has the advantages that even if the resist layer under the IC chip is destroyed, the conductive circuit is not destroyed and a large area can be applied. The use of adhesive tape has the advantage that the work is easy.

The shape, area, size, number, and location of the IC chip support 7 are not particularly limited. However, as in the above-described embodiment, it is preferable to dispose on a corner portion where the bump 5 is absent or in the vicinity thereof, or a side which is continuous with the corner portion where the bump 5 is not present.

Known IC chips can be used. The shape of the bump is not particularly limited, and any of stud bump, plating, solder, resin bump and the like can be used.

The mounting of IC chips includes wire bonding (WB) and anisotropic conductive film (AC).
F), conductive paste (ACP), insulating resin (NCP),
The connection can be made by a known method such as using an insulating film (NCF) or a cream solder ball. If necessary, the connection portion may be protected and reinforced with a known underfill material or potting material. In the present invention, after mounting the IC chip on the base material, in order to protect the IC mounting portion from physical or chemical impact, the entire mounting portion or a part thereof is covered and protected with a glove top material or an underfill material. May be.

The vehicle component of the conductive ink or the insulating ink used in the present invention is not particularly limited, and specifically, a thermoplastic resin, a thermosetting resin, a resin curable by ultraviolet rays, an electron beam or the like, There may be mentioned natural rubber, synthetic rubber, etc., or a combination thereof. As the conductive ink, it is also possible to use those obtained by blending these resins with silver, aluminum or the like to impart conductivity, or conductive polymers. Conductive ink or insulating ink used in the present invention, if necessary, silica, alumina, glass, talc, insulating powder such as various rubber, or a release agent, surface treatment agent, filler, pigment,
Known additives such as dyes can be added.

The above description of the embodiments is for explaining the present invention and does not limit the invention described in the claims or reduce the scope thereof. Further, the configuration of each part of the present invention is not limited to the above embodiment, and various modifications can be made within the technical scope described in the claims. For example, in the above description of the embodiment, the example in which the IC chip support 7 is provided in advance on the surface of the base material 1 is shown. However, the IC chip support 7 is provided on the IC chip 6 side, and the IC chip 6 is provided.
The IC chip support 7 may be fixed and installed on the surface of the base material 1 at the time of mounting.

[0025]

The present invention will be described in more detail with reference to the following examples, but the present invention is not limited to these examples. (Example 1) Conductive ink (LS415C-
Antenna (15μ, manufactured by Asahi Chemical Laboratory)
m thickness) and its terminal portion (15 to 20 μm thickness) and I
Print a C-chip support (15-20 μm thick), 150
Heated at 30 ° C for 30 minutes. 2 stud bumps (length 30
200 μm thick IC chip with adhesive (Chemite TNP0100, manufactured by Toshiba Chemical Co.) (30-
70 μm thick) at 230 ° C., 800 g / cm ² , 5
It was mounted as shown in FIG. 1A under the condition of sec to manufacture the IC chip mounting body of the present invention.

Example 2 An insulating ink (CR
P-X4322, manufactured by Sumitomo Bakelite Co., Ltd.
An IC chip package of the present invention was made in the same manner as in Example 1 except that the C chip support was printed and heated at 150 ° C. for 30 minutes.

(Example 3) A thermal adhesive tape (M5
250, manufactured by Nitto Denko Co., Ltd.) was used to prepare an IC chip package of the present invention in the same manner as in Example 1 except that the IC chip support was formed.

Comparative Example 1 An IC chip mounting body for comparison was prepared in the same manner as in Example 1 except that the IC chip support was not formed.

After mounting the IC chip, the IC chip was pressed to test the withstand voltage until the IC chip could not exhibit its performance. As a result, the IC chip support was not provided (Comparative Example 1).
Was 4.8 MPa, but when an IC chip support formed of a conductive ink was provided (Example 1), 5.5
5. MPa, when an IC chip support formed of an insulating ink is provided (Example 2), 6.0 MPa, when an IC chip support 7 formed of an adhesive tape is provided (Example 3), 6. It was 0 MPa.

Further, as a result of measuring the adhesive strength of the IC chip after mounting the IC chip, when the IC chip support was not provided (Comparative Example 1), there was variation in 3.5 N, but the conductive ink was used. When the IC chip support formed in (1) is provided (Example 1), there is no variation at 4.5 N, and when the IC chip support formed of the insulating ink is provided (Example 2), 6.0 N is obtained. When the IC chip support formed by the adhesive tape was provided (Example 3), there was no variation at 6.0 N.

After mounting the IC chip, the IC chip is pressed to measure how much the IC chip is distorted.
When the chip support was not provided (Comparative Example 1), about 1
While a distortion of 5 μm and about 7.5% was observed, an IC chip support formed of a conductive ink (Example 1), an insulating ink (Example 2) or an adhesive tape (Example 3) was used. When provided, the substrate hardly distorted and the parallelism between the base material and the IC chip was maintained.

[0032]

The IC chip mounting body according to claim 1 of the present invention is an IC in which an IC chip is mounted on a predetermined portion of the base material surface.
Since it is a chip mounting body, and the IC chip is mounted via the IC chip support formed on the base material surface,
The IC chip is supported by this IC chip support,
As a result, pressure resistance is improved, parallelism between the base material and the IC chip is maintained, and the adhesive strength between the IC chip and the terminal portion becomes uniform and increased, which is a remarkable effect.

The IC chip package according to claim 2 of the present invention is the IC chip package according to claim 1, wherein
Since the C chip support is formed of conductive ink or insulating ink, the same effect as the IC chip mounting body according to claim 1 can be obtained, and when the conductive ink is used, the antenna and its terminal portion are formed at the same time. It is also possible to perform it, the position accuracy is high, the number of steps is not increased, and even if the insulating layer is used, even if the resist layer under the IC chip is destroyed, the conductive circuit is not destroyed. Has a remarkable effect.

An IC chip package according to claim 3 of the present invention is the IC chip package according to claim 1, wherein
Since the C chip support is made of an adhesive tape, the same effect as that of the IC chip mounting body according to the first aspect can be obtained, and further a remarkable effect that the work is easy can be obtained.

[Brief description of drawings]

FIG. 1A is a plan view for explaining a state in which an IC chip of an IC chip mounting body of the present invention is mounted, and FIG.
FIG. 4C is a cross-sectional explanatory view thereof, and FIG. 7C is a cross-sectional explanatory view illustrating a state in which the IC chip is supported by the IC chip support.

FIG. 2 is an explanatory plan view illustrating a state in which an IC chip of another IC chip mounting body of the present invention is mounted.

FIG. 3 is a cross-sectional explanatory diagram illustrating a state in which bumps of the IC chip are pierced into the terminal portions of the antenna when the IC chip is mounted.

FIG. 4A is a plan explanatory view illustrating a state in which an IC chip of a conventional IC chip mounting body is mounted, FIG. 4B is a cross-sectional explanatory view thereof, and FIG. It is sectional explanatory drawing explaining the distorted state.

[Explanation of symbols]

1 base material 2 antenna 3 terminals 4 adhesive 5 bumps 6 IC chip 7 IC chip support

Continued front page    F-term (reference) 2C005 MA10 MA31 MA32 MB01 MB10                       NA08 NB03 NB06 NB10 PA17                       PA27 PA31 RA17                 5B035 AA08 BA03 BB09 CA01 CA08                       CA23                 5J046 AA02 AA09 AA10 AB13 PA07                 5J047 AA02 AA09 AA10 AB13 EF04                       EF05

Claims (3)

[Claims] 1. An IC chip mounting body in which an IC chip is mounted on a predetermined portion of a base material surface, wherein the IC chip is mounted via an IC chip support formed on the base material surface. An IC chip package characterized by the following. 2. The IC chip mounting body according to claim 1, wherein the IC chip support is formed of a conductive ink or an insulating ink. 3. The IC chip mounting body according to claim 1, wherein the IC chip support is made of an adhesive tape.