JP2003060333A - Method for connecting electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the connecting method of electronic components, which can easily conduct electrical connection of high connection reliability in short time, without the leakage of an adjacent electrode, at connecting of fine electrodes to which the electronic components face. SOLUTION: In the connecting method of the electronic components for connecting the electrode components of the multiple electronic components, a conductive connection film where fine grains are arranged is used. In the conductive connection film where the fine grains are arranged, the conductive fine grains are arranged in a through-hole made in an adhesive film. The conductive fine grains are arranged, only at positions which correspond to the electrode parts of the confronted electronic components.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for connecting electronic parts, which is capable of easily making electrical connection with high reliability in connection in a short time when connecting fine electrodes facing each other in an electronic part without leakage of adjacent electrodes. Regarding

[0002]

2. Description of the Related Art In electronic products such as liquid crystal displays, personal computers, and portable communication devices, among the methods for electrically connecting small components such as semiconductor elements and chips to a board or electrically connecting the boards to each other,
As a method of connecting the fine electrodes facing each other, a method of using metal bumps or the like for connection with solder or a conductive paste, or a method of directly pressure bonding the metal bumps or the like is used.

In the case of connecting such fine electrodes facing each other, it is usually necessary to seal the periphery of the connecting portion with resin due to the problem that the strength of each connecting portion is weak. Usually, this sealing is performed by injecting a sealing resin into the connecting portion after connecting the electrodes. However, the minute counter electrode has a problem that it is difficult to uniformly inject the sealing resin in a short time because the distance between the connecting portions is short.

As a method for solving this problem, an anisotropic conductive adhesive is devised in which conductive fine particles are mixed with an insulating binder resin to form a film or paste,
For example, JP-A-63-231889 and JP-A-4-
259766, JP-A-3-291807,
It is disclosed in JP-A-5-75250.

However, since the anisotropic conductive adhesive is one in which conductive particles are randomly dispersed in a binder resin, the conductive particles are connected in the binder, or the conductive particles not present on the counter electrode during thermocompression bonding. Since the conductive fine particles flow and connect with each other, there is a possibility that a leak may occur at the adjacent electrode. Further, even when the conductive fine particles are pressed onto the electrodes or the bumps by thermocompression bonding, a thin layer of the insulating material is likely to remain between the electrodes and the conductive fine particles, so that there is a problem that the connection reliability is lowered.

[0006]

SUMMARY OF THE INVENTION In view of the above situation, the present invention provides an easy electrical connection in a short time when connecting fine electrodes facing each other of an electronic component, which is free from leakage of adjacent electrodes. It is an object of the present invention to provide a method of connecting electronic components that can be performed.

[0007]

SUMMARY OF THE INVENTION The present invention is a method for connecting electronic components in which a plurality of electronic components are connected using a fine particle-arranged conductive connection film, wherein the fine particle-arranged conductive connection film is provided on an adhesive film. Conductive fine particles are arranged in the through holes, and the conductive fine particles are a method of connecting electronic components arranged only at positions corresponding to the electrode portions of the electronic components facing each other. The present invention is described in detail below.

The present invention is a method of connecting electronic parts, in which a plurality of electronic parts are connected using a fine particle-arranged conductive connection film. The above-mentioned fine particle-arranged conductive connection film is one in which conductive fine particles are arranged in through holes provided in the adhesive film.

The adhesive film is not particularly limited as long as it has adhesiveness, but a high molecular weight compound or a composite thereof is preferable from the viewpoint that a film having appropriate elasticity, flexibility and recoverability can be easily obtained. Examples of materials other than the high molecular weight compound of the above composite include inorganic materials such as ceramics and low molecular weight compounds.

Examples of the high molecular weight polymer include phenol resin, amino resin, acrylic resin, ethylene-vinyl acetate resin, styrene-butadiene block copolymer,
Thermoplastic resins such as polyester resins, urea resins, melamine resins, alkyd resins, polyimide resins, urethane resins and epoxy resins; curable resins, crosslinked resins, organic-inorganic hybrid polymers and the like can be mentioned. Of these, epoxy resins are preferable because they have few impurities and are easily obtained in a wide range of physical properties. Here, it is assumed that the epoxy resin includes a mixture of an uncured epoxy resin and the other resin described above, and a semi-cured epoxy resin. In addition, the high molecular weight body may include an inorganic filler such as glass fiber or alumina particles, if necessary.

The above-mentioned adhesive film is preferably one which can be cured and adhered to an adherend by pressing and heating. Thus, if the electrodes of the element and the substrate are aligned with the conductive fine particles of the film, the connection can be made only by pressing and heating, and the reliability of the connection can be dramatically improved. These functions of curing and adhesion can also be obtained by applying a curable adhesive separately, but in the present invention, since the film itself has this function, it is possible to connect electronic parts very easily. .

The above adhesive film preferably has a high thermal conductivity. Thereby, even if the connection is made only by pressing and heating, the connection can be surely made. The method of increasing the thermal conductivity of the adhesive film is not particularly limited, but a method of dispersing an insulating filler having a high thermal conductivity in the film is suitable. Examples of the filler include boron nitride, silicon nitride, aluminum nitride, silicon carbide and the like. These fillers may be used alone or in combination of two or more. The amount of the filler added is preferably 10 to 80% by volume of the entire adhesive film. 10% by volume
When it is less than 80%, the effect of improving the thermal conductivity is low, and it is 80% by volume.
When it exceeds, it becomes difficult to maintain the adhesiveness and shape of the adhesive film. It is more preferably 20 to 60% by volume.

The thickness of the adhesive film is preferably 1/2 to 2 times the average particle size of the conductive fine particles. 1
When it is less than / 2 times, it is difficult to support the substrate with the adhesive film portion, and when it exceeds 2 times, the conductive fine particles may not reach the electrode, which may cause connection failure. It is more preferably 2/3 to 1.5 times, still more preferably 3/4 to
1.3 times, particularly preferably 0.8 to 1.2 times,
If it is 0.9 to 1.1 times, the effect is remarkably enhanced. In particular,
When bumps are present on the electrodes of the element and the substrate, the thickness of the film is preferably 1 time or more the average particle diameter of the conductive fine particles, and conversely, when there is no bump, it is less than 1 time. It is preferable.

The above-mentioned adhesive film preferably has a linear expansion coefficient of 10 to 200 ppm at room temperature after curing. When the content is less than 10 ppm, the difference in linear expansion from the conductive fine particles is large, and therefore, when the conductive connection structure to which the electronic component is connected by the method for connecting the electronic component of the present invention is subjected to a heat cycle or the like, the conductivity is reduced. The adhesive film may not be able to follow the elongation of the fine particles and the electrical connection may become unstable. If it exceeds 200 ppm, when the conductive connection structure is subjected to a thermal cycle etc., the space between the electrodes becomes too wide. However, the conductive fine particles may separate from the electrodes and cause a connection failure. It is more preferably 20 to 150 ppm, and further preferably 30 to 100 ppm.

The conductive fine particles include, for example, metals, inorganic substances such as carbon, and conductive polymers.
Alternatively, a high molecular weight material, an inorganic material such as silica, alumina, a metal, carbon, etc., a core having a low molecular weight compound, etc. and a conductive layer provided by a method such as plating on the surface of the core can be used. From the viewpoint of recoverability and spherical shape, it is preferable that the conductive layer is formed on the surface of the core made of a high molecular weight material.

Examples of the above-mentioned high molecular weight polymer include phenol resin, amino resin, acrylic resin, ethylene-vinyl acetate resin, styrene-butadiene block copolymer,
Thermoplastic resins such as polyester resins, urea resins, melamine resins, alkyd resins, polyimide resins, urethane resins and epoxy resins; curable resins, crosslinked resins, organic-inorganic hybrid polymers and the like can be mentioned. Of these, crosslinked resins are preferable from the viewpoint of heat resistance. In addition, the high molecular weight material may include a filler, if necessary.

A coating layer made of metal is preferably used as the conductive layer. The metal is not particularly limited, but one containing nickel or gold is preferable. The metal coating layer may be either a single layer or a multilayer, but it is preferable that the surface layer is gold from the viewpoint that contact resistance with electrodes, conductivity and oxidative deterioration do not occur. It is preferable to provide a barrier layer for improving the adhesion and a nickel layer for improving the adhesion between the core and the metal.

The thickness of the above-mentioned conductive layer is set to 0 in order to obtain sufficient conduction and to obtain a film strength that prevents peeling.
It is preferably 3 μm or more. More preferably 1μ
m or more, and more preferably 2 μm or more. Further, the thickness of the conductive layer is preferably ⅕ times or less of the average particle diameter of the conductive fine particles so that the characteristics of the core are not lost.

The conductive fine particles have an average particle size of 10-8.
It is preferably 00 μm. If the thickness is less than 10 μm, the conductive fine particles may not come into contact with the electrodes due to the problem of the accuracy of the smoothness of the electrodes or the substrate, which may result in poor conduction.
If it exceeds 00 μm, it may not be possible to cope with electrodes having a fine pitch, and a short circuit may occur at the adjacent electrode. It is more preferably 15 to 300 μm, and further preferably 20 to 15 μm.
It is 0 μm, and particularly preferably 40 to 80 μm.
The average particle size is a value obtained by measuring the particle size of 100 arbitrary conductive particles with a microscope and averaging the values.

The aspect ratio, which is a value obtained by dividing the average major axis of the particles by the average minor axis, of the conductive fine particles is preferably less than 1.3. If it is 1.3 or more, the particles become uneven, and the short diameter portion may not reach the electrode, which may cause connection failure. It is more preferably less than 1.1, and particularly preferably less than 1.05. Although the fine particles usually have a high aspect ratio depending on the manufacturing method, the conductive fine particles used in the present invention are sphered by a spheroidizing treatment such as by utilizing surface tension in a deformable state. It is preferable.

The conductive fine particles preferably have a CV value of 5% or less. If it exceeds 5%, the particle diameters are not uniform, so that small conductive fine particles may not reach the electrodes, which may cause connection failure. It is more preferably 2% or less, still more preferably 1% or less. The above CV
The value is calculated by the following formula. CV value (%) = (σ / Dn) × 100 In the formula, σ represents the standard deviation of the particle size, and Dn represents the average particle size. Since ordinary fine particles have a large CV value, it is necessary to make the conductive fine particles used in the present invention uniform in particle size by classification or the like. In particular, it is difficult to accurately classify fine particles having an average particle size of 200 μm or less, so it is preferable to combine sieves, airflow classification, wet classification, and the like.

Regarding the conductive resistance of the above-mentioned conductive fine particles, when 10% of the average particle diameter is compressed, it is preferable that the conductive resistance of the single particles, that is, the resistance value is 1Ω or less. If it exceeds 1 Ω, a sufficient current value may not be secured, or a large voltage may not be withstood and the element may not operate normally. The resistance is more preferably 0.3 Ω or less, further preferably 0.05 Ω or less, and if it is 0.01 Ω or less, the effect can be remarkably enhanced, for example, even a current-driven element can be dealt with while maintaining high reliability.

The conductive fine particles have a K value of 400 to 15
000 N / mm²Is preferred. 400 N / m
m²If it is less than, the conductive fine particles are sufficient for the opposing electrodes.
The electrode surface is not oxidized because it cannot penetrate.
When there is a problem such as when the
Communication reliability may decrease, 15000 N / mm²To
If it exceeds, the electrode will be locally overloaded when sandwiched by the counter electrodes.
Pressure is applied to the device to destroy it,
The gap between the electrodes is determined only by the conductive particles.
Conductive particles with small particle size do not reach the electrode
It may be a cause. More preferably 1000 to 10,000 N
/ Mm²And more preferably 2000 to 8000N.
/ Mm²And particularly preferably 3000-6000N
/ Mm²Is. The above K value is calculated by the following formula.
To be K value (N / mm²) = (3 / √2) ・ F ・ S^-3/2・ R
^-1/2 In the formula, F is the load value at 20 ° C and 10% compression deformation
(N), S is compression displacement (mm), R is radius
(Mm) is represented.

The conductive fine particles preferably have a recovery rate of 5% or more at 20 ° C. and 10% compression deformation.
If it is less than 5%, it is impossible to follow the momentary expansion between the opposing electrodes due to impact or the like, and the electrical connection may be momentarily unstable. It is more preferably at least 20%, even more preferably at least 50%,
It is particularly preferably 80% or more.

The conductive fine particles preferably have a coefficient of linear expansion of 10 to 200 ppm at room temperature. 10 pp
When it is less than m, the difference in linear expansion from the adhesive film is large, and therefore the elongation of the adhesive film cannot be followed when the conductive connection structure is subjected to a thermal cycle, etc. If it exceeds 200 ppm, it may become unstable, and when the adhesive film is adhered to the substrate due to the excessive spread of the electrodes when a thermal cycle is applied,
The bonded part is destroyed and stress concentrates on the connection part of the electrode,
It may cause connection failure. More preferably 20
To 150 ppm, more preferably 30 to 100 p
pm.

The above-mentioned fine particle-arranged conductive connection film can be obtained by forming a through hole at an arbitrary position of the adhesive film, disposing the conductive fine particle in the through hole, and fixing the conductive fine particle. In the through-hole of the adhesive film, the conductive fine particles are disposed, the method of fixing is not particularly limited, a method of sucking the conductive fine particles through the through-hole of the adhesive film, or the conductive fine particles on the through-hole The method of pressing with is preferable. Thereby, it can be fixed in a more stable state. When the conductive fine particles are arranged by suction, the average hole diameter, aspect ratio, and CV value of the through holes of the adhesive film described below are values in the sucked state.

The average hole diameter of the through holes is preferably 1/2 to 2 times the average particle diameter of the conductive fine particles. If it is out of this range, the adhered conductive fine particles are easily displaced from the through holes. It is more preferably 2/3 to 1.3 times, still more preferably 4/5 to 1.2 times, particularly preferably 0.9 to 1.1 times, and 0.95 to 1.05.
When doubled, the effect is significantly increased.

The aspect ratio, which is the value obtained by dividing the average major axis of the hole diameters by the average minor axis of the through holes, is preferably less than 2. When it is 2 or more, the adhered conductive fine particles are easily displaced from the through hole. It is more preferably 1.5 or less, still more preferably 1.3 or less, and particularly preferably 1.1 or less.

The CV value of the through hole is preferably 10% or less. If it exceeds 10%, the hole diameters become irregular and the adhered conductive fine particles are easily displaced from the through holes.
It is more preferably 5% or less, further preferably 2% or less, and particularly 1% or less, the effect is remarkably enhanced. The CV value of the through hole is calculated by the following formula. CV value (%) = (σ2 / Dn2) × 100 In the formula, σ2 represents the standard deviation of the hole diameter, and Dn2 represents the average hole diameter.

The through holes are preferably tapered or stepwise in the thickness direction from the front surface to the back surface. As a result, the fixed conductive fine particles are more stably arranged and are less likely to be displaced.

The method of forming the through holes in the adhesive film is not particularly limited, but drilling using a laser is preferable. In the mechanical boring process using a drill or the like, it may be difficult to obtain desired dimensional accuracy, and the process may take a long time. As the laser for drilling, for example, carbon dioxide gas laser, YAG laser,
An excimer laser etc. are mentioned. The type of laser may be determined in consideration of the required dimensional accuracy and cost.

The center of gravity of the conductive fine particles placed is preferably in the adhesive film. When it is in the adhesive film, it is remarkably stable as compared with the case where the center of gravity is outside the surface of the adhesive film, and there is no loss due to misalignment or the like.

In the above-mentioned fine particle-arranged conductive connection film, the conductive fine particles are arranged only at the positions corresponding to the electrode portions of the electronic parts facing each other. As a result, a reliable connection can be made and no leak occurs at the adjacent electrode.

The present invention is a method of connecting a plurality of electronic parts using a fine particle-arranged conductive connection film. The electronic component is not particularly limited, for example,
Examples include small parts such as liquid crystal displays, personal computers, mobile communication devices, chips, substrates, and the like.

The chip is not particularly limited, and examples thereof include active parts such as semiconductors such as IC and LSI; passive parts such as capacitors and crystal oscillators; bare chips. The substrate is roughly classified into a flexible substrate and a rigid substrate. Examples of the flexible substrate include a resin sheet made of polyimide, polyamide, polyester, polysulfone, or the like having a thickness of 50 to 500 μm. The rigid substrate is divided into resin and ceramic ones, and examples of the resin substrate include those made of glass fiber reinforced epoxy resin, phenol resin, cellulose fiber reinforced phenol resin and the like. Examples of the ceramic material include those made of silicon dioxide, alumina, and the like. The substrate may be a single-layer substrate, or in order to increase the number of electrodes per unit area, a plurality of layers are formed by means of, for example, through hole formation, and electrically connected to each other. It may be a multi-layer substrate.

Electrodes are formed on the surfaces of the chip, the substrate and the like. Examples of the material of the electrode include gold,
Examples thereof include silver, copper, nickel, palladium, carbon, aluminum and ITO. In order to reduce the contact resistance, copper, nickel or the like coated with gold may be used. The shape of the electrode is not particularly limited, and examples thereof include a stripe shape, a dot shape, and an arbitrary shape. The thickness of the electrode is preferably 0.1 to 100 μm. The width of the electrode is preferably 1 to 500 μm.

In the method of connecting electronic components according to the present invention, particularly at least one of the electronic components is a memory IC or a logic I.
It is suitable when it is C or CCD.

The memory IC has a function of storing information. Normally, the memory IC is stored only when the power is on, and the stored contents are lost when the power is turned off. It is also roughly divided into non-volatile memory that keeps storing. Volatile memory is called RAM, and includes DRAM, which is a write / read memory that requires a memory holding operation, and SRAM, which keeps storing information as long as the power is on. On the other hand, non-volatile memory is called ROM. Of these, the MROM is a memory whose stored contents are fixed at the time of manufacturing the IC, and thereafter performs only the read operation. In addition, EPROM, EEPROM or flash memory,
This is a type of memory that is blank when the IC is completed and that can electrically store and write information.

The logic IC is a CPU used in a microcomputer or the like, that is, an IC classified into a central processing unit. Of these, the MPU is a single IC that has only the function of the CPU, which is the heart of a computer, etc.
It incorporates the function of C. In addition, ASIC
It is an IC whose purpose is dedicated.

The CCD has a structure in which a large number of MOS capacitors are arranged in a row and has a one-dimensional structure and a two-dimensional structure. In the two-dimensional CCD, small photodiodes are arranged in a matrix in the vertical and horizontal directions in the image pickup area, and each photodiode has a hemispherical microlens.
On the other hand, the one-dimensional CCD has an elongated shape arranged in a straight line.

The electronic component connecting method of the present invention is suitable for connecting bare chips. Usually, when connecting bare chips by flip chips, bumps are required, but when the above-mentioned fine particle-arranged conductive connection film is used, bumps can be connected because the conductive fine particles serve as bumps. There is a great merit that a complicated process in manufacturing can be omitted. In the case of bumpless connection, if conductive fine particles are present in a place other than the electrode to be arranged, problems such as destruction of the protective film of the chip occur, but the fine particle-arranged conductive connection film used in the present invention Then, such a problem does not occur. In addition, the conductive fine particles have preferable K value and CV as described above.
When the value is a value or the like, an electrode that is easily oxidized, such as an aluminum electrode, can be broken by connecting its oxide film.

Examples of the method of connecting the electronic parts of the present invention include the following methods. Place the substrate or part with the electrode formed on the surface so that the electrode is on top, and place the fine particle-arranged conductive connection film on it so that the conductive fine particles come to the position of the electrode, and then the other electrode surface The substrate or component having is placed so that the electrodes are on the lower side and the positions of the electrodes are aligned, and they are connected by heating, pressurizing, or the like. For the heating and pressing, a crimping machine equipped with a heater, a bonding machine, or the like is used.

According to the present invention, it is possible to connect minute opposing electrodes of an electronic component with high connection reliability without leakage of adjacent electrodes. Further, by using the electronic component connecting method of the present invention, it is possible to obtain a conductive connection structure in which a plurality of electronic components are connected.

[0044]

The present invention will be described in more detail below with reference to examples, but the present invention is not limited to these examples.

Example 1 The divinylbenzene-based copolymer obtained by seed polymerization was classified by a sieve and wet classification to obtain fine particles. A 0.2 μm thick nickel layer was applied to the fine particles by electroless plating, and a 2.3 μm thick gold layer was further applied by electroplating. The plated fine particles are classified to have an average particle diameter of 150 μm and an aspect ratio of 1.0.
3, CV value 1%, K value 4000N / mm ² , recovery rate 60
%, Linear expansion coefficient at room temperature 50ppm, resistance value 0.01Ω
The conductive fine particles of

On the other hand, with a thickness of 140 μm, a 1 cm square, semi-cured epoxy film containing 50% by weight of acrylic rubber, a pitch of about 400 μm per side of the chip so as to be aligned with the electrodes of the memory IC chip. 2 holes with 6 holes about 4mm apart, surface 150μm with CO ₂ laser
The back surface was tapered so that the hole had a CV value of 2% and an aspect ratio of 1.04.

On the back side of this film, apply a mouthpiece having a diameter of 8 mm so as to cover all the holes and prevent leakage.
While conducting suction at a vacuum degree of 50 kPa, the conductive fine particles were brought close to and the conductive fine particles were adsorbed. At this time, a SUS mesh having an opening of 50 μm was attached to the mouthpiece for supporting the film. In about a few seconds, one conductive fine particle was placed in each hole of the film without excess or deficiency. During this period, static electricity was removed so that the conductive fine particles did not adhere. Also, although almost no extra adhered particles were seen, the surface was swept with a soft brush to remove foreign matter, just in case. After the conductive fine particles were adsorbed and arranged, the vacuum was released, and the film was sandwiched between glass plates and lightly pressed to stabilize the conductive fine particles. The center of gravity of the conductive fine particles was inside the film, and the conductive fine particles were not separated from the holes even when the film was vibrated.

The conductive connecting film thus obtained was placed on a film substrate having a thickness of 50 μm on which an electrode pattern was drawn so that the positions of the electrodes were aligned with each other, and lightly pressed to temporarily press-bond it. Next, the aluminum electrodes of the memory IC chip and the conductive fine particles were aligned with each other and thermocompression bonded, the epoxy resin was cured, and flip chip connection was performed. The linear expansion coefficient of the cured epoxy resin at room temperature was 40 ppm.

The conductive connection structure obtained had stable conduction in all electrodes and operated normally without leakage in adjacent electrodes, and was subjected to a thermal cycle test of -40 ° C to + 125 ° C for 1 time.
The test was performed 000 times, but no increase in the resistance value of the connection part or abnormal operation was observed at both low and high temperatures.

(Example 2) Flip-chip connection was performed in the same manner as in Example 1 except that the memory IC chip was a logic IC chip. The obtained connection structure worked normally without any leakage in adjacent electrodes and had no leakage in adjacent electrodes, and was subjected to a thermal cycle test of -40 ° C to + 125 ° C 1000 times. Even at that time, no abnormality was observed in the resistance value increase or the operation of the connection part.

(Embodiment 3) A memory IC chip is replaced by a CC
Flip-chip connection was performed in the same manner as in Example 1 except that D was used. The resulting connection structure operates normally without any leakage in adjacent electrodes and stable conduction in all electrodes, and is subjected to a thermal cycle test of -40 ° C to + 125 ° C for 1 time.
The test was performed 000 times, but no increase in the resistance value of the connection part or abnormal operation was observed at both low and high temperatures.

(Comparative Example 1) The procedure of Examples 1, 2 and 3 was repeated except that an anisotropic conductive adhesive in which conductive fine particles were randomly dispersed in an epoxy film was prepared and used. Flip-chip connection of a memory IC, a logic IC and a CCD was performed. However, in any of the obtained connection structures, a leak occurred in the adjacent electrode.

[0053]

According to the present invention, when connecting fine electrodes facing each other of an electronic component, an electronic component connecting method can be easily performed in a short time without causing leakage of adjacent electrodes and having high connection reliability. Can be provided.

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) C09J 163/00 C09J 163/00 F term (reference) 4J004 AA05 AA07 AA09 AA10 AA12 AA13 AA15 AA18 BA02 BA06 BA07 FA05 4J040 DA051 DE031 DF001 EB031 EB091 EB131 EC001 ED001 EF001 HA026 HA066 JA09 KA32 KA42 LA09 NA19 5E319 AA03 BB11 BB16 BB20 CC61 CD25 5F044 KK01 LL09 5G307 HA02 HB01 HB03 HC01

Claims (4)

[Claims] 1. A method of connecting electronic components, which comprises connecting a plurality of electronic components by using a fine particle-arranged conductive connecting film,
The fine particle-arranged conductive connection film is one in which conductive fine particles are arranged in through holes provided in an adhesive film, and the conductive fine particles are arranged only at positions corresponding to the electrode parts of the electronic parts facing each other. A method of connecting electronic components, characterized in that 2. The electronic component connecting method according to claim 1, wherein at least one of the electronic components is a memory IC. 3. The method of connecting electronic components according to claim 1, wherein at least one of the electronic components is a logic IC. 4. The method of connecting electronic components according to claim 1, wherein at least one of the electronic components is a CCD.