JP2003031281A - Conductively connecting film with disposed particles, its manufacturing method and conductively connecting structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an conductively connecting film with disposed particles, capable of easily carrying out electrical connection having no leakage of adjacent electrodes and high connection reliability in a short time when conductively connecting fine electrodes facing each other in plural electronic components, in a conductively connecting structure, a method for manufacturing it, and the conductively connecting structure. SOLUTION: In this conductively connecting film with disposed particles, the conductive particles are disposed in through holes opened in an adhesive film. The conductive particles are at least partially exposed from the adhesive film, and are disposed only at positions corresponding to the electrode parts facing each other in an electronic component.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive connection structure in which a plurality of electronic components facing each other are conductively connected to each other. The present invention relates to a fine particle-arranged conductive connection film, a method for manufacturing a fine particle-arranged conductive connection film, and a conductive connection structure that can be easily performed.

[0002]

2. Description of the Related Art In electronic products such as liquid crystal displays, personal computers, and portable communication devices, among the methods for electrically connecting small components such as semiconductor elements and chips to a board or electrically connecting the boards to each other,
As a method of connecting the fine electrodes facing each other, a method of using metal bumps or the like for connection with solder or a conductive paste, or a method of directly pressure bonding the metal bumps or the like is used.

In the case of connecting such fine electrodes facing each other, it is usually necessary to seal the periphery of the connecting portion with resin due to the problem that the strength of each connecting portion is weak. Usually, this sealing is performed by injecting a sealing resin into the connecting portion after connecting the electrodes. However, there is a problem that it is difficult to uniformly inject the sealing resin in a short time because the minute counter electrode may have a short distance between the connecting portions.

As a method for solving this problem, an anisotropic conductive adhesive is devised in which conductive fine particles are mixed with an insulating binder resin to form a film or paste,
For example, JP-A-63-231889 and JP-A-4-
259766, JP-A-3-291807,
It is disclosed in JP-A-5-75250.

However, in the anisotropic conductive adhesive, since the conductive fine particles are randomly dispersed in the binder resin, the conductive fine particles are connected in the binder, or the conductive conductive particles not present on the counter electrode at the time of thermocompression bonding. Since the conductive fine particles flow and connect with each other, there is a possibility that a leak may occur at the adjacent electrode. Further, even when the conductive fine particles are pressed onto the electrodes or the bumps by thermocompression bonding, a thin layer of the insulating material is likely to remain between the electrodes and the conductive fine particles, so that there is a problem that the connection reliability is lowered.

[0006]

SUMMARY OF THE INVENTION In view of the above situation, the present invention has a high connection reliability without leak of adjacent electrodes when conductively connecting minute electrodes facing each other in a plurality of electronic components in a conductive connection structure. It is an object of the present invention to provide a fine particle-arranged conductive connection film, a method for producing a fine particle-arranged conductive connection film, and a conductive connection structure that can easily make an electrical connection in a short time.

[0007]

The present invention is a fine particle-arranged conductive connection film in which conductive fine particles are arranged in through holes formed in an adhesive film, wherein the conductive fine particles are at least partially formed. It is a fine particle-arranged conductive connection film which is exposed from the adhesive film and is arranged only at a position corresponding to an electrode portion of an electronic component facing the adhesive film. The present invention is described in detail below.

The fine particle-arranged conductive connecting film of the present invention comprises:
The conductive fine particles are arranged in through holes formed in the adhesive film. The adhesive film is not particularly limited as long as it has adhesiveness, but it is preferable to use a high molecular weight compound or a composite thereof from the viewpoint of easily obtaining a film having appropriate elasticity, flexibility, and recoverability. . Examples of materials other than the high molecular weight compound of the above composite include inorganic materials such as ceramics and low molecular weight compounds.

Examples of the above-mentioned high molecular weight polymer include phenol resin, amino resin, acrylic resin, ethylene-vinyl acetate resin, styrene-butadiene block copolymer,
Thermoplastic resins such as polyester resins, urea resins, melamine resins, alkyd resins, polyimide resins, urethane resins and epoxy resins; curable resins, crosslinked resins, organic-inorganic hybrid polymers and the like can be mentioned. Of these, the epoxy resin is preferable because it has few impurities and is easily obtained in a wide range of physical properties. Here, it is assumed that the epoxy resin includes a mixture of an uncured epoxy resin and the other resin described above, and a semi-cured epoxy resin. In addition, the high molecular weight body may include an inorganic filler such as glass fiber or alumina particles, if necessary.

The above-mentioned adhesive film is preferably one that can be cured and adhered to an adherend by pressing and heating. Thus, if the electrodes of the element and the substrate are aligned with the conductive fine particles of the film, the connection can be made only by pressing and heating, and the reliability of the connection can be dramatically improved. These functions of curing and adhesion can be obtained by applying a curable adhesive separately, but since the film itself has this function, conductive connection using the fine particle-arranged conductive connection film of the present invention is very simple. Can be converted.

It is preferable that the adhesive film has a high thermal conductivity. Thereby, even if the connection is made only by pressing and heating, the connection can be surely made. The method of increasing the thermal conductivity of the adhesive film is not particularly limited, but a method of dispersing an insulating filler having a high thermal conductivity in the adhesive film is preferable. Examples of the filler include boron nitride, silicon nitride, aluminum nitride, silicon carbide and the like. These fillers may be used alone or in combination of two or more. The amount of the filler added is preferably 10 to 80% by volume of the entire adhesive film. 10% by volume
When it is less than 80%, the effect of improving the thermal conductivity is low, and it is 80% by volume.
When it exceeds, it becomes difficult to maintain the adhesiveness and shape of the adhesive film. It is more preferably 20 to 60% by volume.

The thickness of the adhesive film is preferably 1/2 to 2 times the average particle size of the conductive fine particles. 1
When it is less than / 2 times, it is difficult to support the substrate with the adhesive film portion, and when it exceeds 2 times, the conductive fine particles may not reach the electrode, which may cause connection failure. It is more preferably 2/3 to 1.5 times, still more preferably 3/4 to
1.3 times, particularly preferably 0.8 to 1.2 times,
If it is 0.9 to 1.1 times, the effect is remarkably enhanced. In particular,
When there are bumps on the electrodes of the element and the substrate, the thickness of the film is preferably 1 time or more of the average particle size of the conductive fine particles, and conversely, when there is no bump, it is 1 time or less. Is preferred.

The above-mentioned adhesive film preferably has a coefficient of linear expansion of 10 to 200 ppm at room temperature after curing. When the content is less than 10 ppm, the difference in linear expansion from the conductive fine particles is large, and therefore, when the conductive connection structure conductively connected using the fine particle-arranged conductive connection film of the present invention is subjected to heat cycle or the like, the conductive fine particles are obtained. The adhesive film can not follow the elongation of the, electrical connection may become unstable, and when the conductive connection structure is subjected to a thermal cycle or the like, if it exceeds 200 ppm, the distance between the electrodes becomes too wide, The conductive fine particles may separate from the electrodes and cause a connection failure. It is more preferably 20 to 150 ppm, and further preferably 30 to 100 ppm.

The conductive fine particles include, for example, metals, inorganic substances such as carbon, and conductive polymers.
Alternatively, a high molecular weight material, an inorganic material such as silica, alumina, a metal, carbon, etc., a core having a low molecular weight compound, etc. and a conductive layer provided by a method such as plating on the surface of the core can be used. From the viewpoint of recoverability and spherical shape, it is preferable that the conductive layer is formed on the surface of the core made of a high molecular weight material.

Examples of the above-mentioned high molecular weight polymer include phenol resin, amino resin, acrylic resin, ethylene-vinyl acetate resin, styrene-butadiene block copolymer,
Thermoplastic resins such as polyester resin, urea resin, melamine resin, alkyd resin, polyimide resin, urethane resin, and epoxy resin; curable resins, crosslinked resins, organic-inorganic hybrid polymers, and the like. Of these, crosslinked resins are preferable from the viewpoint of heat resistance. In addition, the high molecular weight material may include a filler, if necessary.

A coating layer made of metal is preferably used as the conductive layer. The metal is not particularly limited, but one containing nickel or gold is preferable. The metal coating layer may be either a single layer or a multilayer, but it is preferable that the surface layer is gold from the viewpoint that contact resistance with electrodes, conductivity and oxidative deterioration do not occur. It is preferable to provide a barrier layer for improving the adhesion and a nickel layer for improving the adhesion between the core and the metal.

The thickness of the above-mentioned conductive layer is set to 0 in order to obtain sufficient conduction and to obtain a film strength that does not peel off.
It is preferably 3 μm or more. When it is less than 0.3 μm, the conductive layer may be peeled off when handling the conductive fine particles, and when the fine particle-arranged conductive connection film of the present invention is pressed for conductive connection, the conductive layer is removed. May be damaged and cause a connection failure. The thickness is more preferably 1 μm or more, further preferably 2 μm or more. The thickness of the conductive layer is preferably ⅕ or less of the diameter of the conductive fine particles so that the characteristics of the core are not lost.

The conductive fine particles have an average particle size of 10-8.
It is preferably 00 μm. If the thickness is less than 10 μm, the conductive fine particles may not come into contact with the electrodes due to the problem of the accuracy of the smoothness of the electrodes or the substrate, which may result in poor conduction.
If it exceeds 00 μm, it may not be possible to cope with electrodes having a fine pitch, and a short circuit may occur at the adjacent electrode. More preferably 15 to 300 μm, still more preferably 20 to 150 μm.
And particularly preferably 40 to 80 μm. In addition,
The average particle size is a value obtained by measuring the particle size of 100 arbitrary conductive fine particles with a microscope and averaging the values.

The aspect ratio, which is a value obtained by dividing the average major axis of the particles by the average minor axis, of the conductive fine particles is preferably less than 1.3. If it is 1.3 or more, the particles become uneven, and the short diameter portion may not reach the electrode, which may cause connection failure. It is more preferably less than 1.1, and particularly preferably less than 1.05. Although the fine particles usually have a high aspect ratio depending on the manufacturing method, the conductive fine particles used in the present invention are spheroidized by a method such as utilizing the surface expansion force in a deformable state. Preferably.

The conductive fine particles preferably have a CV value of 5% or less. If it exceeds 5%, the particle diameters are not uniform, so that small conductive fine particles may not reach the electrodes, which may cause connection failure. It is more preferably 2% or less, still more preferably 1% or less. The above CV
The value is calculated by the following formula. CV value (%) = (σ / Dn) × 100 In the formula, σ represents the standard deviation of the particle size, and Dn represents the number average particle size. Since ordinary fine particles have a large CV value, it is necessary to make the conductive fine particles used in the present invention uniform in particle size by classification or the like. In particular, it is difficult to accurately classify fine particles having an average particle size of 200 μm or less, so it is preferable to combine sieves, airflow classification, wet classification, and the like.

Regarding the conductive resistance of the above-mentioned conductive fine particles, when 10% of the average particle diameter is compressed, the conductive resistance of the single particles, that is, the resistance value is preferably 1Ω or less. If it exceeds 1Ω, a sufficient current value may not be secured, or the device may not withstand a large voltage and the device may not operate normally. It is more preferably 0.3Ω or less, still more preferably 0.
If it is less than 0.01 Ω, even if it is a current-driven element, it is possible to cope with it while maintaining high reliability.

The K value of the conductive fine particles is 400 to 15
It is preferably 000 N / mm ² . 400 N / m
If it is less than m ² , conductive fine particles cannot sufficiently dig into the opposing electrodes, so that conduction may not be achieved when the electrode surface is oxidized, or contact resistance may be large and conduction reliability may deteriorate. When it exceeds 15,000 N / mm ² , excessive pressure is locally applied to the electrodes when sandwiched by the opposing electrodes, the element is destroyed, or the gap between the electrodes is determined only by the conductive fine particles having a large particle size. Conductive fine particles with a small diameter do not reach the electrodes, which may cause connection failure. More preferably 1000 to 10,000 N
/ Mm ² , more preferably 2000 to 8000N
/ Mm ² , and particularly preferably 3000 to 6000 N
/ Mm ² . The K value is calculated by the following formula. K value (N / mm ² ) = (3 / √2) ・ F ・ S ^-3/2・ R
^{In the -1/2} formula, F represents a load value (N) at 20 ° C and 10% compression deformation, S represents a compression displacement (mm), and R represents a radius (mm).

The conductive fine particles preferably have a recovery rate of 5% or more at 20 ° C. and 10% compression deformation.
If it is less than 5%, it may not be possible to follow the momentary expansion between the opposing electrodes due to impact or the like, and the electrical connection may be momentarily unstable. More preferably 20
% Or more, more preferably 50% or more, and particularly preferably 80% or more.

The conductive fine particles preferably have a linear expansion coefficient at room temperature of 10 to 200 ppm. 10 pp
When it is less than m, the difference in linear expansion from the adhesive film is large, and therefore the elongation of the adhesive film cannot be followed when the conductive connection structure is subjected to a thermal cycle, etc. If it exceeds 200 ppm, it may become unstable, and when the adhesive film is adhered to the substrate due to the excessive spread of the electrodes when a thermal cycle is applied,
The bonded part is destroyed and stress concentrates on the connection part of the electrode,
It may cause connection failure. More preferably 20
To 150 ppm, more preferably 30 to 100 p
pm.

The fine particle-arranged conductive connecting film of the present invention comprises
It can be obtained by forming a through hole at an arbitrary position of the adhesive film, disposing the conductive fine particles in the through hole, and fixing the conductive fine particles. A method for producing such a fine particle-arranged conductive connection film is also one aspect of the present invention.

The average hole diameter of the through holes is preferably 1/2 to 2 times the average particle diameter of the conductive fine particles. If it is out of this range, the adhered conductive fine particles are easily displaced from the through holes. It is more preferably 2/3 to 1.3 times, still more preferably 4/5 to 1.2 times, particularly preferably 0.9 to 1.1 times, and 0.95 to 1.05.
When doubled, the effect is significantly increased.

The aspect ratio, which is the value obtained by dividing the average major axis of the hole diameters by the average minor axis of the through holes, is preferably less than 2. When it is 2 or more, the adhered conductive fine particles are easily displaced from the through hole. It is more preferably 1.5 or less, still more preferably 1.3 or less, and particularly preferably 1.1 or less.

The CV value of the through hole is preferably 10% or less. If it exceeds 10%, the hole diameters become irregular and the adhered conductive fine particles are easily displaced from the through holes.
It is more preferably 5% or less, further preferably 2% or less, and particularly 1% or less, the effect is remarkably enhanced. The CV value of the through hole is calculated by the following formula. CV value (%) = (σ2 / Dn2) × 100 In the formula, σ2 represents the standard deviation of the hole diameter, and Dn2 represents the average hole diameter.

The through holes are preferably tapered or stepwise in the thickness direction from the front surface to the back surface. As a result, the fixed conductive fine particles are more stably arranged and are less likely to be displaced.

The method of providing the above through holes in the adhesive film is not particularly limited, but drilling using a laser is preferable. In the mechanical boring process using a drill or the like, it may be difficult to obtain desired dimensional accuracy, and the process may take a long time. Examples of the drilling laser include carbon dioxide gas laser, YAG laser, excimer laser, and the like. The type of laser may be determined in consideration of the required dimensional accuracy and cost.

The method of disposing and fixing the conductive fine particles in the through holes of the adhesive film is not particularly limited, but a method of sucking the conductive fine particles through the through holes of the adhesive film, or a method of depositing the conductive fine particles A method of pressing on the through hole is preferable. Thereby, it can be fixed in a more stable state. When the conductive fine particles are arranged by suction, the average hole diameter of the through holes, the aspect ratio, and the CV value of the above-mentioned adhesive film are the values in the sucked state.

At least a part of the arranged conductive fine particles is exposed from the adhesive film. Thereby, more reliable connection can be achieved when conducting conductive connection using the fine particle-arranged conductive connection film of the present invention.

The center of gravity of the arranged conductive fine particles is preferably in the adhesive film. When it is in the adhesive film, it is remarkably stable as compared with the case where the center of gravity is outside the surface of the adhesive film, and there is no loss due to misalignment or the like.

In the fine particle-arranged conductive connection film of the present invention, the conductive fine particles are arranged only at the positions corresponding to the electrode portions of the electronic parts facing each other. As a result, a reliable connection can be made and no leak occurs at the adjacent electrode.

In the fine particle-arranged conductive connection film of the present invention, the conductive fine particles are preferably arranged in the peripheral portion of the adhesive film. Further, it is preferable that the conductive fine particles are arranged in a lattice pattern on the adhesive film. Thus, the external terminals are used for connection of the peripheral type package in which peripheral terminals are arranged on the package surface and the area array type package in which external terminals are arranged in a lattice pattern on the package surface, which enables high-density mounting.

The fine particle-arranged conductive connecting film of the present invention comprises
It is preferably used for conductively connecting a plurality of electronic components in a conductive connection structure. For example, in electronic products such as liquid crystal displays, personal computers, and mobile communication devices, small components such as semiconductor elements and chips are electrically connected to a substrate. It is preferably used when connecting fine electrodes to each other among the methods of electrically connecting substrates to each other or electrically connecting the substrates to each other.

The above-mentioned chip is not particularly limited, and examples thereof include active components such as semiconductors such as IC and LSI; passive components such as capacitors and crystal oscillators; bare chips. The substrate is roughly classified into a flexible substrate and a rigid substrate. Examples of the flexible substrate include a resin sheet made of polyimide, polyamide, polyester, polysulfone, or the like having a thickness of 50 to 500 μm. The rigid substrate is divided into resin and ceramic ones, and examples of the resin substrate include those made of glass fiber reinforced epoxy resin, phenol resin, cellulose fiber reinforced phenol resin and the like. Examples of the ceramic material include those made of silicon dioxide, alumina, and the like. The substrate may be a single-layer substrate, or in order to increase the number of electrodes per unit area, a plurality of layers are formed by means of, for example, through hole formation, and electrically connected to each other. It may be a multi-layer substrate.

Electrodes are formed on the surfaces of the chip, the substrate and the like. Examples of the material of the electrode include gold,
Examples thereof include silver, copper, nickel, palladium, carbon, aluminum and ITO. In order to reduce the contact resistance, copper, nickel or the like coated with gold may be used. The shape of the electrode is not particularly limited, and examples thereof include a stripe shape, a dot shape, and an arbitrary shape. The thickness of the electrode is preferably 0.1 to 100 μm. The width of the electrode is preferably 1 to 500 μm.

The fine particle-arranged conductive connecting film of the present invention comprises:
In particular, it is suitable for joining bare chips. Normally, bumps are required when bonding bare chips with flip chips, but when the fine particle-arranged conductive connection film of the present invention is used, conductive fine particles serve as bumps, so bumpless connection is possible. However, there is a great merit that a complicated process for manufacturing bumps can be omitted. When conductive fine particles are present in a place other than the electrode to be arranged when bumpless connection is made, problems such as destruction of the protective film of the chip occur, but in the fine particle arranged conductive connecting film of the present invention Such a problem does not occur. Further, when the conductive fine particles have the preferable K value or CV value as described above, an electrode which is easily oxidized, such as an aluminum electrode, can be broken and connected.

Examples of the method for conductively connecting a substrate, a component and the like using the fine particle-arranged conductive connecting film of the present invention include the following methods. A substrate or part having an electrode formed on the surface is placed so that the electrode faces upward, and the fine particle-arranged conductive connecting film of the present invention is placed thereon so that the conductive fine particles come to the position of the electrode, and then the other The substrate or part having the electrode surface is placed so that the electrodes are on the lower side and the positions of the electrodes are aligned, and they are connected by heating, pressurizing or the like. For the heating and pressing, a crimping machine equipped with a heater, a bonding machine, or the like is used. A conductive connection structure such as a substrate or a component connected by using the fine particle-arranged conductive connection film of the present invention is also one aspect of the present invention.

The conductive connecting structure connected by using the fine particle-arranged conductive connecting film of the present invention has a peripheral portion around the fine particle-arranged conductive connecting film so as to prevent a defect due to infiltration of moisture or the like from the connection end face of the fine particle-arranged conductive connecting film. It is preferably sealed. The above-mentioned sealing method is not particularly limited, and examples thereof include a method using a generally used sealing resin.

[0042]

The present invention will be described in more detail below with reference to examples, but the present invention is not limited to these examples.

(Example 1) The divinylbenzene copolymer obtained by seed polymerization was classified by a sieve and wet classification to obtain fine particles. A 0.2 μm thick nickel layer was applied to the fine particles by electroless plating, and a 2.3 μm thick gold layer was further applied by electroplating. The plated fine particles are classified to have an average particle diameter of 150 μm and an aspect ratio of 1.0.
3, CV value 1%, K value 4000N / mm ² , recovery rate 60
%, Linear expansion coefficient at room temperature 50ppm, resistance value 0.01Ω
The conductive fine particles of

On the other hand, a thickness of 140 μm, a 1 cm square, a semi-cured epoxy film containing 50% by weight of acrylic rubber, and a pitch of about 400 μm per side of the power type IC chip so as to be aligned with the electrodes of the power type IC chip. 6 holes on the four sides of the chip, that is, in the shape of a square, and with a CO ₂ laser, the front surface 150 μm and the back surface 125 μm are tapered and the holes C
It was opened so that the V value was 2% and the aspect ratio was 1.04.

On the back side of this film, apply a mouthpiece having a diameter of 8 mm so as to cover all the holes and prevent leakage.
While conducting suction at a vacuum degree of 50 kPa, the conductive fine particles were brought close to and the conductive fine particles were adsorbed. At this time, a SUS mesh having an opening of 50 μm was attached to the mouthpiece for supporting the film. In about a few seconds, one conductive fine particle was placed in each hole of the film without excess or deficiency. During this period, static electricity was removed so that the conductive fine particles did not adhere. Also, although almost no extra adhered particles were seen, the surface was swept with a soft brush to remove foreign matter, just in case. After the conductive fine particles were adsorbed and arranged, the film was sandwiched between glass plates and lightly pressed to release the vacuum and stabilize the conductive fine particles. The center of gravity of the conductive fine particles was inside the adhesive film, and the conductive fine particles were not separated from the holes even when the adhesive film was vibrated.

The fine particle-arranged conductive connecting film thus obtained was placed on a film substrate having a thickness of 50 μm on which an electrode pattern was drawn so that the positions of the electrodes and the conductive fine particles were aligned and lightly pressed. After temporary pressure bonding, the position of the aluminum electrode of the chip and the position of the conductive fine particles were aligned and heat-bonded, and the epoxy resin was cured to perform flip chip bonding. The linear expansion coefficient of the cured epoxy resin at room temperature is 4
It was 0 ppm.

The conductive connection structure obtained had stable conduction in all the electrodes and operated normally without leaks in the adjacent electrodes, and was subjected to a thermal cycle test at -40 to + 125 ° C. for 10 times.
The test was performed 00 times, but no increase in the resistance value of the connection part or abnormal operation was observed at both low and high temperatures.

(Embodiment 2) In order to align the epoxy film with the electrodes of the IC chip, 6 holes with a pitch of about 400 μm are formed in 6 rows at a distance of 1.5 mm, that is, in a grid pattern. _{2 The same} procedure as in Example 1 was repeated except that a taper having a surface of 150 μm and a back surface of 125 μm and having a hole CV value of 2% and an aspect ratio of 1.04 was used. A conductive connection structure was obtained. The resulting connection structure operates normally without any leakage in adjacent electrodes with stable conduction in all electrodes, and subjected to a thermal cycle test of −40 to + 125 ° C. for 1000 times.
The test was repeated, but no increase in the resistance value of the connection part or abnormal operation was observed at both low and high temperatures.

(Comparative Example 1) Flip chip bonding was carried out in the same manner as in Example 1 except that an anisotropic conductive adhesive in which conductive fine particles were randomly dispersed in an epoxy film was prepared and used. However, the filler interfered with the conductive connection and could not achieve good conduction.

(Comparative Example 2) Flip-chip bonding was carried out in the same manner as in Example 2 except that an anisotropic conductive adhesive in which conductive fine particles were randomly dispersed in an epoxy film was prepared and used. However, there was a leak between the adjacent electrodes and the operation was not normal.

[0051]

EFFECTS OF THE INVENTION According to the present invention, when connecting fine electrodes facing each other, a fine particle-arranged conductive connection film and a fine particle-arranged conductive film can be easily formed in a short time without causing leakage of adjacent electrodes and having high connection reliability. A manufacturing method of a connection film and a conductive connection structure can be provided.

Front page continuation (51) Int.Cl. ⁷ Identification code FI theme code (reference) H01B 5/00 H01B 5/00 H 5E344 5/16 5/16 5G307 13/00 501 13/00 501P H01R 43/00 H01R 43/00 H H05K 3/32 H05K 3/32 B 3/36 3/36 A F term (reference) 4F100 AK53 AL05 AN02 BA02 DC11A DE01B GB41 JB13A JG01B JL11A YY00B 4J004 AA02 AA05 AA09 AA12 AA13 AA14 A18 A05 AA17 AA15 AA17 AA17 AA17 FA08 GA01 4J040 AA01 DA051 DE031 DF001 DM011 EB031 EB091 EB111 EB131 EC001 ED001 ED151 EF001 EH001 HA026 HA066 HA341 KA03 KA32 LA09 NA19 5E051 CA03 5E319 AA03 AB05 AC01 BB11 CC61 GG01 HA01 DD01A02 AB06 AC02 BB11 CC61 GG01 5E03 A05

Claims (10)

[Claims] 1. A fine particle-arranged conductive connection film in which conductive fine particles are arranged in through holes formed in an adhesive film, wherein the conductive fine particles are at least partially exposed from the adhesive film. And a fine particle-arranged conductive connecting film, which is arranged only at a position corresponding to an electrode portion of an electronic component facing each other. 2. The fine particle-arranged conductive connection film according to claim 1, wherein the conductive fine particles are arranged in the peripheral portion of the adhesive film. 3. The fine particle-arranged conductive connection film according to claim 1 or 2, wherein the conductive fine particles are arranged in a grid on the adhesive film. 4. The conductive fine particles have an average particle size of 10 to 80.
The fine particle-arranged conductive connection film according to claim 1, 2 or 3, wherein the conductive connection film has a thickness of 0 μm, an aspect ratio of less than 1.3, and a CV value of 5% or less. 5. The conductive fine particles have a conductive layer formed on the surface of a core made of a high molecular weight material, and the conductive layer has a thickness of 0.3 μm or more. The fine particle-arranged conductive connecting film according to 1, 2, 3 or 4. 6. The fine particle-arranged conductive connection film according to claim 1, wherein the adhesive film is cured and adhered to an adherend by pressing and heating. 7. The method for producing a fine particle-arranged conductive connection film according to claim 1, 2, 3, 4, 5, or 6, wherein a through hole is formed at an arbitrary position of the adhesive film, and the through hole is electrically conductive. A method for producing a fine particle-arranged conductive connecting film, which comprises disposing and fixing conductive fine particles. 8. The method for producing a fine particle-arranged conductive connection film according to claim 7, wherein the conductive fine particles are arranged and fixed by suction or pressing. 9. A conductive connection structure, which is conductively connected by using the fine particle-arranged conductive connection film according to claim 1. Description: 10. The conductive connection structure according to claim 9, wherein the periphery of the fine particle-arranged conductive connection film is sealed.