JP2016046347A - Method of manufacturing through-electrode substrate, pressure sensitive adhesive sheet and electrolytic plating method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To simplify a step that uses electrolytic plating processing.SOLUTION: A method of manufacturing a through-electrode substrate includes: disposing a pressure sensitive adhesive layer which is conductive and of which the pressure sensitive adhesive strength is reduced by applying stimulation thereto, and a second substrate that supports a first substrate via the pressure sensitive adhesive layer, on a first surface of a first substrate in which a bottomed hole open to the first surface side is disposed; forming a through-hole formed by thinning the first substrate from a second surface that confronts the first surface, thereby opening a bottom of the bottomed hole; growing a conductive layer from the pressure sensitive adhesive layer to the through-hole by the electrolytic plating processing in which a current is supplied via the pressure sensitive adhesive layer; applying the stimulation to the pressure sensitive adhesive layer; and peeling the pressure sensitive adhesive layer and the second substrate from the first substrate.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a method for manufacturing a through electrode substrate.

  In the electrolytic plating process, a seed layer for growing the conductive layer is formed. The electrolytic plating process is used for various applications. As an example, it is used when forming a through electrode for electrically connecting both surfaces of a substrate (through electrode substrate) (for example, Patent Document 1). Further, the through electrode substrate has been made thinner to reduce the size of the package. As the film is thinned, there may be a problem that the substrate is warped in the manufacturing process. In such a case, in order to support this board | substrate in a manufacturing process, a support substrate is bonded together to this board | substrate using an adhesive sheet.

JP 2006-147971 A

  According to the technique disclosed in Patent Document 1, an electrolytic plating process is used when filling the through hole with an electrode. In this example, the seed layer is formed on one side of the substrate. A conductive layer grows from this seed layer and fills the inside of the through hole, but also grows from the surface provided with the seed layer. Therefore, the conductive layer grown on the surface provided with the seed layer must be finally removed together with the seed layer. As described above, the electrolytic plating process is excellent in filling the through hole with the conductive layer, but the manufacturing process may be complicated, for example, by removing the layer once formed.

  An object of this invention is to simplify the process using an electrolytic plating process.

  According to one embodiment of the present invention, the first surface of the first substrate on which the bottomed hole that opens on the first surface side is disposed, the adhesive layer that has conductivity and decreases in adhesive strength by application of a stimulus, And arranging a second substrate that supports the first substrate through the adhesive layer, and thinning the first substrate from a second surface facing the first surface, thereby reducing the bottom of the bottomed hole. An electroplating process in which an open through hole is formed and an electric current is supplied through the adhesive layer, a conductive layer is grown from the adhesive layer to the through hole, the stimulus is applied to the adhesive layer, There is provided a method for manufacturing a through electrode substrate including peeling an adhesive layer and the second substrate from the first substrate. According to this, the process using an electrolytic plating process can be simplified.

  Further, according to one embodiment of the present invention, the first substrate on which the through-hole is disposed has conductivity on one surface on which the opening of the through-hole is disposed, and the adhesion is reduced by applying a stimulus. A conductive layer is grown from the adhesive layer to the through-hole by an electrolytic plating process in which a current is supplied through the adhesive layer, the stimulus is applied to the adhesive layer, and the adhesive layer is A method of manufacturing a through electrode substrate including peeling from a first substrate is provided. According to this, the process using an electrolytic plating process can be simplified.

  The adhesive layer may have a peripheral portion that extends outward from an end portion of the first substrate, and the power source that supplies the current may be electrically connected to the peripheral portion. According to this, it is possible to easily connect the power source that supplies the current used for the electrolytic plating process and the adhesive layer.

  The second substrate may have conductivity at least on the adhesive layer side. According to this, the in-plane distribution of the growth rate of the conductive layer by the electrolytic plating process can be reduced. In addition, even if the adhesive layer has low conductivity (high sheet resistance), this in-plane distribution can be reduced. Therefore, by increasing the material for reducing the adhesiveness by applying a stimulus, The adhesive layer can be easily peeled off, or the material for improving the adhesiveness before applying the stimulus can be increased.

  The adhesive layer may have a conductivity in the thickness direction higher than the conductivity in any direction in the plane. According to this, the quantity of the electroconductive material disperse | distributed to the adhesion layer can be reduced.

  In addition, according to an embodiment of the present invention, the adhesive layer that includes an opening on the first surface of the first substrate in which the bottomed hole that opens on the first surface side is disposed, and the adhesive strength is reduced by applying a stimulus. And a second substrate that includes the conductive region exposed by the opening and supports the first substrate through the adhesive layer, and thins the first substrate from the second surface facing the first surface. By forming a through hole in which the bottom of the bottomed hole is opened, a conductive layer is grown from the conductive region to the through hole by an electrolytic plating process in which a current is supplied through the conductive region. There is provided a method of manufacturing a through electrode substrate, which includes applying the stimulus to the adhesive layer and peeling the adhesive layer and the second substrate from the first substrate. According to this, the process using an electrolytic plating process can be simplified.

  In addition, according to an embodiment of the present invention, an adhesive layer that includes an opening on one surface of the first substrate on which the through-hole is arranged and on which the opening of the through-hole is arranged and whose adhesive strength is reduced by applying a stimulus. And a second substrate that includes the conductive region exposed by the opening and supports the first substrate through the adhesive layer, and an electroplating process in which a current is supplied through the conductive region, There is provided a method of manufacturing a through electrode substrate including growing a conductive layer from a conductive region to the through hole, applying the stimulus to the adhesive layer, and peeling the adhesive layer and the second substrate from the first substrate. The According to this, the process using an electrolytic plating process can be simplified.

  The second substrate may include a peripheral portion that is electrically connected to the conductive region that extends outward from an end portion of the first substrate, and the power source that supplies the current may be electrically connected to the peripheral portion. . According to this, it is possible to easily connect the power source that supplies the current used for the electrolytic plating process and the adhesive layer.

  Further, according to an embodiment of the present invention, the base material, the adhesive layer disposed on the base material, the adhesive force of which decreases when applied with a stimulus, and the adhesive on the side opposite to the surface in contact with the base material And a conductive material dispersed in the adhesive layer so that the sheet resistance of the surface of the layer is 0.1Ω / □ or more and 100Ω / □ or less. According to this, the process using an electrolytic plating process can be simplified.

  The conductive material may be dispersed in the adhesive layer so that the sheet resistance is 0.1Ω / □ or more and 10Ω / □ or less. According to this, the in-plane distribution in the electrolytic plating process can be further reduced.

  Also, according to one embodiment of the present invention, the base material, the adhesive layer disposed on the base material, the adhesive force of which decreases when applied with a stimulus, and the adhesive so as to increase in density as the distance from the base material increases. An adhesive sheet is provided that includes a conductive material dispersed in a layer. According to this, the process using an electrolytic plating process can be simplified.

  Further, according to an embodiment of the present invention, a base material including a conductive region having conductivity on at least a part of a surface thereof, an adhesive layer that is disposed in the conductive region and has an adhesive force that is reduced by application of a stimulus, There is provided a pressure-sensitive adhesive sheet including a conductive material dispersed in the pressure-sensitive adhesive layer so that the conductivity in the thickness direction of the pressure-sensitive adhesive layer is higher than the conductivity in any direction in the plane. According to this, the process using an electrolytic plating process can be simplified.

  Further, according to one embodiment of the present invention, the adhesive layer is disposed on the substrate, the adhesive layer is reduced in adhesive strength by applying a stimulus, and the adhesive layer has a distribution of density in a plane. An adhesive sheet is provided that includes a conductive material dispersed therein. According to this, the process using an electrolytic plating process can be simplified.

  The region having a high density of the conductive material may form a lattice-like region in the plane. According to this, the area | region which arrange | positions the component which reduces adhesive force by irritation | stimulation by irritation | stimulation can be ensured large.

  Capsules that cause foaming in the adhesive layer due to the stimulus are dispersed in the adhesive layer, and the shell of the capsule may be formed of a resin containing a conductive material. According to this, the electroconductivity in the adhesion layer can be improved.

  The capsule may enclose a solvent containing a conductive material inside. According to this, the electroconductivity in an adhesion layer can be improved more.

  According to one embodiment of the present invention, the substrate includes a base including a conductive region having conductivity on at least a part of the surface, and an opening exposing at least a part of the conductive region. There is provided an adhesive sheet comprising a pressure-sensitive adhesive layer in which the resistance is lowered. According to this, the process using an electrolytic plating process can be simplified.

  Capsules that foam by the stimulation may be dispersed in at least a portion of the conductive region exposed by the adhesive layer. According to this, the conductive layer grown by the electrolytic plating process in the conductive region can be easily peeled off.

  The substrate may be a film, and may further include a second adhesive layer disposed on a surface of the substrate opposite to the surface on which the adhesive layer is disposed. According to this, another support substrate can be bonded together.

  Moreover, according to one Embodiment of this invention, the 1st adhesion layer which is arrange | positioned on the said base material and which is arrange | positioned on the said base material, and adhesive force falls by application of a stimulus, The said adhesion layer of the said base material is A second adhesive layer disposed on a surface opposite to the disposed surface; and a conductive material dispersed in the first adhesive layer and the second adhesive layer, the base material and the first The pressure-sensitive adhesive sheet has conductivity, and the sheet resistance measured from the first pressure-sensitive adhesive layer side and the sheet resistance measured from the second pressure-sensitive adhesive layer side are both 100Ω / □ or less. The According to this, the process using an electrolytic plating process can be simplified. Moreover, the in-plane distribution of an electrolytic plating process can be improved more by affixing the support substrate which has electroconductivity on an adhesive sheet.

  The base material may include a glass substrate, a silicon substrate, or a stainless steel substrate. According to this, another support substrate can be dispensed with in a process that requires a support substrate.

  Also, according to one embodiment of the present invention, the adhesive layer that has conductivity and has reduced adhesive strength due to the application of a stimulus is provided on one surface of the substrate on which the through hole is disposed. An electroplating method including immersing the through hole in a plating solution in a state of being attached, supplying a current to the adhesive layer, applying the stimulus to the adhesive layer, and peeling the adhesive layer from the substrate. Provided. According to this, the process using an electrolytic plating process can be simplified.

  According to one embodiment of the present invention, an adhesive layer that includes an opening on one surface of the substrate on which the through-hole is disposed and on which the opening of the through-hole is disposed, and whose adhesive strength is reduced by applying a stimulus, and In a state where a layer including a conductive region exposed by the opening is disposed, the through hole is immersed in a plating solution, current is supplied to the layer including the conductive region, and the stimulus is applied to the adhesive layer, There is provided an electrolytic plating method including peeling the adhesive layer from the substrate. According to this, the process using an electrolytic plating process can be simplified.

  According to the present invention, a process using an electrolytic plating process can be simplified.

It is a top view explaining the penetration electrode substrate in a 1st embodiment of the present invention. It is a figure explaining the cross-sectional structure (cross-sectional structure of the cross-sectional line A-A 'in FIG. 1) of the penetration electrode substrate in 1st Embodiment of this invention. It is a figure explaining the manufacturing method of the penetration electrode substrate in a 1st embodiment of the present invention. It is a figure explaining the manufacturing method of the penetration electrode substrate following FIG. It is a figure explaining the manufacturing method of the penetration electrode substrate following FIG. It is a figure explaining the manufacturing method of the penetration electrode substrate following FIG. It is a figure explaining the structure of the adhesive sheet in 1st Embodiment of this invention. It is a figure explaining the structure of the adhesive sheet in 2nd Embodiment of this invention. It is a figure explaining the structure of the adhesive sheet in 3rd Embodiment of this invention. It is a figure explaining the structure of the support substrate with the adhesion layer in 4th Embodiment of this invention. It is a figure explaining the structure of the support substrate with the adhesion layer in 5th Embodiment of this invention. It is a figure explaining the structure of the support substrate with the adhesion layer in 6th Embodiment of this invention. It is a figure explaining the manufacturing method of the penetration electrode substrate at the time of using the support substrate with the adhesion layer in a 6th embodiment of the present invention. It is a figure explaining the manufacturing method of the penetration electrode substrate following FIG. It is a figure explaining distribution of the conductive layer which grows in a penetration hole when the resistance of an adhesive sheet is low. It is a figure explaining distribution of the conductive layer which grows in a through-hole in case the resistance of an adhesive sheet is high. It is a figure which shows the semiconductor device which concerns on 8th Embodiment of this invention. It is a figure which shows another example of the semiconductor device which concerns on 8th Embodiment of this invention. It is a figure which shows another example of the semiconductor device which concerns on 8th Embodiment of this invention. It is a figure which shows the electronic device using the semiconductor device which concerns on 8th Embodiment of this invention.

  Hereinafter, a through electrode substrate according to each embodiment of the present invention and a wiring substrate using the same will be described in detail with reference to the drawings. In addition, each embodiment shown below is an example of embodiment of this invention, Comprising: This invention is limited to these embodiment and is not interpreted. Note that in the drawings referred to in the present embodiment, the same portion or a portion having a similar function is denoted by the same reference symbol or a similar reference symbol (a reference symbol simply including A, B, etc. after a number) and repeated. The description of may be omitted. In addition, the dimensional ratio in the drawing may be different from the actual ratio for convenience of explanation, or a part of the configuration may be omitted from the drawing.

<First Embodiment>
[Configuration of Through Electrode Substrate 10]
FIG. 1 is a top view illustrating a through electrode substrate according to the first embodiment of the present invention. FIG. 2 is a view for explaining a cross-sectional structure (cross-sectional structure taken along the cross-sectional line AA ′ in FIG. 1) of the through electrode substrate according to the first embodiment of the present invention. The through electrode substrate 10 includes a substrate 100, through electrodes 161 and 162, insulating layers 210 and 220, and wirings 311, 312, 321 and 322. In the substrate 100, holes (through holes 151 and 152) penetrating the first surface 101 side and the second surface 102 side are formed.

  The through electrode 161 is disposed inside the through hole 151 disposed in the substrate 100. The through electrode 162 is disposed inside the through hole 152 disposed in the substrate 100. The through electrodes 161 and 162 electrically connect the first surface 101 side and the second surface 102 side of the substrate 100. The through electrodes 161 and 162 are conductive layers formed by electrolytic plating. In this example, the electrode through which an electric current is passed during the electrolytic plating process is not a seed layer formed on the substrate 100 but an electrode sheet provided with conductivity to support the substrate. The description of the electrolytic plating process using the adhesive sheet will be described later.

  Openings 211 and 212 are formed in the insulating layer 210. Openings 221 and 222 are formed in the insulating layer 220.

  The wiring 311 is connected to the through electrode 161 through the opening 211. The wiring 321 is connected to the through electrode 161 through the opening 221. Therefore, the wiring 311 and the wiring 321 are electrically connected through the through electrode 161. The wiring 312 is connected to the through electrode 162 through the opening 212. The wiring 322 is connected to the through electrode 162 through the opening 222. Therefore, the wiring 312 and the wiring 322 are electrically connected through the through electrode 162.

[Method for Manufacturing Penetration Electrode Substrate 10]
Next, a method for manufacturing the through electrode substrate 10 will be described with reference to FIGS.

  FIG. 3 is a diagram illustrating a method for manufacturing the through electrode substrate according to the first embodiment of the present invention. FIG. 4 is a diagram for explaining a method for manufacturing the through electrode substrate subsequent to FIG. 3. FIG. 5 is a diagram for explaining a method for manufacturing the through electrode substrate subsequent to FIG. 4. FIG. 6 is a diagram for explaining a method for manufacturing the through electrode substrate subsequent to FIG. 5.

  First, the substrate 100 having the first surface 101 and the second surface 102 is prepared (FIG. 3A). The substrate 100 is, for example, a glass substrate. The substrate 100 is not limited to a glass substrate, and may be an insulating substrate such as sapphire or a semiconductor substrate such as silicon.

  Subsequently, a bottomed hole 150 is formed in the first surface 101 of the substrate 100 (FIG. 3B). The bottomed hole 150 opens on the first surface 101 side of the substrate 100, and the bottom thereof does not reach the second surface 102.

  The bottomed hole 150 is formed by forming a mask on the surface of the substrate 100 and performing any one of dry etching such as RIE (Reactive Ion Etching) and DRIE (Deep Reactive Ion Etching), wet etching etching, sand blasting, and laser processing. Or a combination of two or more processing methods.

  When the substrate 100 is not a glass substrate but a semiconductor substrate or the like and has insufficient insulation, the surface of the substrate 100 having the shape shown in FIG. 3B (including the surface of the bottomed hole 150) is used. An insulating layer may be formed. Even if the substrate 100 is a glass substrate as in the present embodiment, an insulating layer or other additional layers may be formed.

  Subsequently, a support substrate 610 is attached to the first surface 101 side of the substrate 100 using an adhesive sheet 510 (FIG. 3C). In this example, the pressure-sensitive adhesive sheet 510 is formed as a laminate in which pressure-sensitive adhesive layers are disposed on both sides with a member interposed therebetween. Of the adhesive layers of the adhesive sheet 510, the adhesive layer on the substrate 100 side has electrical conductivity, and the adhesive strength is reduced by application of a stimulus (heat of a predetermined temperature or higher in this example). The stimulus is not limited to heat above a predetermined temperature, and may be light. In the following description, this adhesive layer having conductivity may be referred to as a conductive adhesive layer. The pressure-sensitive adhesive layer on the support substrate 610 side (hereinafter sometimes referred to as a support pressure-sensitive adhesive layer) is, for example, a pressure-sensitive pressure-sensitive adhesive, and may or may not have conductivity. In addition, the adhesive pressure of the support adhesive layer hardly decreases at least in the degree of stimulation that reduces the adhesive strength of the conductive adhesive layer. The detailed structure of the adhesive sheet 510 will be described later.

  The support substrate 610 is an insulating substrate such as a glass substrate. Note that the support substrate 610 may be another insulating substrate such as a sapphire substrate, a semiconductor substrate such as a silicon substrate, or a conductive substrate such as a stainless steel substrate.

  The positional relationship between the support substrate 610 and the substrate 100 is fixed by the adhesive layers provided on both surfaces of the adhesive sheet 510. Accordingly, the support substrate 610 supports the substrate 100 from the first surface 101 side via the adhesive sheet 510. Further, the first surface 101 of the substrate 100 and the adhesive sheet 510 are in contact with each other, and the openings of the through holes 151 and 152 are covered with the adhesive sheet 510.

  Further, as shown in FIG. 3C, the adhesive sheet 510 has a portion (outer peripheral portion 550) that extends outward from the end portion of the substrate 100. The outer peripheral portion 550 is in a state where the surface 511 of the conductive adhesive layer is exposed, and is used as an electrode for supplying current from a power source when performing electrolytic plating.

  Subsequently, the substrate 100 is thinned from the second surface 102 side of the substrate 100 to open the bottom of the bottomed hole 150, thereby forming the through holes 151 and 152 (FIG. 4A). At this time, opening the bottom portion of the bottomed hole 150 by thinning the substrate 100 means at least performing thinning until the bottom portion is opened. A mode in which the bottom of the bottom hole 150 is opened or a mode in which a portion corresponding to the bottom of the bottomed hole 150 is selectively removed after being thinned is also included. For the thinning of the substrate 100, for example, CMP (Chemical Mechanical Polishing) or wet etching is used. In the case of using wet etching, for example, a mixed liquid of hydrofluoric acid and ammonium fluoride is used as a liquid that can etch the substrate 100. At this time, since the first surface 101 side is covered with the adhesive sheet 510, etching is performed from the second surface 102 side. Note that since the substrate 100 is supported by the support substrate 610, even when the substrate 100 is thinned, warpage of the substrate 100 is suppressed, and strength during the manufacturing process can be maintained.

  As shown in FIG. 4A, when the pressure-sensitive adhesive sheet 510 is viewed from the second surface 102 side, the conductive pressure-sensitive adhesive layer is exposed in the above-described outer peripheral portion 550, through-hole 151, and through-hole 152 portions.

  Subsequently, an electrolytic plating process is performed on the substrate 100 to grow a conductive layer inside the through holes 151 and 152, thereby forming the through electrodes 161 and 162 (FIG. 4B). In this example, since a conductive adhesive layer is used as a cathode for electrolytic plating, a power source that supplies current is connected at the peripheral portion 550. Since current is supplied through the conductive adhesive layer, a conductive layer can be formed by electrolytic plating from the conductive adhesive layer exposed at the opening on the first surface 101 side of the through holes 151 and 152. . Therefore, it is not necessary to form a seed layer for an electrode for electrolytic plating. Note that a seed layer may be formed in a part between the substrate 100 and the adhesive sheet 510. For example, the seed layer may be formed only around the openings of the through holes 151 and 152, and current may be supplied from the conductive adhesive layer to the seed layer.

  In the example shown in FIG. 4B, the through holes 151 and 152 are immersed in the plating solution, while the peripheral portion 550 is not immersed in the plating solution. The material of the conductive layer is selected from, for example, metals such as copper, gold, silver, platinum, rhodium, tin, aluminum, nickel, and chromium, or alloys using these.

  In the example of FIG. 4B, the end portions on the second surface 102 side of the through electrodes 161 and 162 are aligned with the position of the second surface 102 of the substrate 100, but may protrude from the second surface 102. It may be recessed from the second surface 102. Note that the through electrodes 161 and 162 may include voids as long as the first surface 101 side and the second surface 102 side can be electrically connected.

  Subsequently, an insulating layer 220 is formed on the second surface 102 side of the substrate 100. The insulating layer 220 is, for example, a photosensitive resin layer, and is formed by a laminating apparatus using a dry film resist. Then, through the exposure and development, openings 221 and 222 exposing a part of the surface of the through electrodes 161 and 162 are formed (FIG. 4C). The openings 221 and 222 are preferably formed so as to expose a part of the through electrodes 161 and 162 in a state of covering the boundary portions between the through electrodes 161 and 162 and the substrate 100.

  After forming the openings 221 and 222, the conductive layer 320 is formed so as to cover the insulating layer 220 (FIG. 5A). The conductive layer 320 is a single layer film or a laminated film of a metal such as copper, titanium, tantalum, tungsten, or aluminum, or an alloy using these, and is formed by a PVD method, a CVD method, or the like. When the conductive layer 320 is patterned by photolithography, wirings 321 and 322 are formed (FIG. 5B). Note that the wiring may be formed by a plating method. In this case, a seed layer may be formed, a resist pattern may be formed in a portion other than a portion where wiring is to be formed, and plating may be performed. Then, a general plating method can be used in which the resist is peeled off and the seed layer is removed. In addition to this, the wiring may be formed by any known method.

  After the wirings 321 and 322 are formed, a heat treatment at a predetermined temperature or higher is performed on the adhesive sheet 510 to reduce the adhesive strength of the conductive adhesive layer. Then, the adhesive sheet 510 and the support substrate 610 are peeled off from the substrate 100 (FIG. 5C). As described above, the conductive pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet 510 can be used as an electrode for electrolytic plating treatment. When the pressure-sensitive adhesive sheet is peeled off, the electrode is also removed. Therefore, it is not necessary to separately form the seed layer and remove it after the electrolytic plating process, and the manufacturing process can be simplified.

  Note that an insulating layer and a wiring layer may be stacked over the wirings 321 and 322 so that the wiring has a multilayer structure. In this case, the process of peeling the adhesive sheet 510 and the support substrate 610 from the substrate 100 may be performed after the multilayer structure of the target wiring is completed, or may be performed in a process in the middle of forming the multilayer structure. Also good.

If the adhesive strength of the adhesive sheet 510 is reduced, the through electrodes 161 and 162 formed by the electrolytic plating process and the adhesive sheet 510 can be easily separated. In order to make the separation between the through electrodes 161 and 162 and the adhesive sheet 510 easier, the adhesion between the through electrodes 161 and 162 and the through holes 151 and 152 may be improved. In order to improve the adhesion, for example, the shape of the through holes 151 and 152 is reduced on the central side in the thickness direction of the substrate 100, and the diameter on the first surface 101 side and the second surface 102 side. May be increased. Further, the diameter may be decreased on the first surface 101 side on the side where the adhesive sheet 510 is attached, and the diameter may be increased toward the second surface 102 side. Further, the side walls of the through holes 151 and 152 may have an uneven shape. In order to make the sidewalls of the through holes 151 and 152 have an uneven shape, for example, when the bottomed hole 150 is formed, the etching conditions and the like may be adjusted using dry etching.

  Subsequently, a support substrate 620 is attached to the second surface 102 side of the substrate 100 using an adhesive sheet 520. The pressure-sensitive adhesive sheet 520 has the same configuration as that of the pressure-sensitive adhesive sheet 510. However, since the electroplating process is not performed, the pressure-sensitive adhesive sheet 520 may not have conductivity. Also for the adhesive sheet 520, the adhesive force of the adhesive layer on the substrate 100 side is reduced by the application of a stimulus. Even if the substrate 100 is thinned, the adhesive sheet 520 and the support substrate 620 are not necessarily used as long as the manufacturing process described later can be performed.

  As shown in FIG. 6A, the adhesive sheet 510 and the support substrate 610 may be peeled off from the substrate 100 after the support substrate 620 is attached using the adhesive sheet 520. In the case where the adhesive sheet 520 is to reduce the adhesive force by heat, after preliminarily applying heat treatment to the adhesive sheet 510 to reduce the adhesive force, the support substrate 620 is pasted using the adhesive sheet 520, and then The adhesive sheet 510 and the support substrate 610 may be peeled off from the substrate 100. If a part of the conductive adhesive layer remains on the substrate 100 after the adhesive sheet 510 is peeled off from the substrate 100, a process of removing this may be performed. As a process for removing the remaining conductive adhesive layer, it may be removed by CMP, or wet or dry etching may be used. In addition, when the seed layer is formed, it may be removed in the same manner as the conductive adhesive layer.

  Subsequently, an insulating layer 210 is provided, openings 211 and 212 are formed, and wirings 311 and 312 are formed (FIG. 6B). The insulating layer 210 is formed in the same manner as the insulating layer 220 described above. The wirings 311 and 312 are formed by the same method as the wirings 321 and 322.

  After the wirings 311 and 312 are formed, the adhesive sheet 520 is subjected to heat treatment at a predetermined temperature or more to reduce the adhesive force, and the adhesive sheet 520 and the support substrate 620 are peeled from the substrate 100 (FIG. 6C). In this way, the through electrode substrate 10 is manufactured. The above is the manufacturing method of the through electrode substrate 10.

[Configuration of Adhesive Sheet 510]
FIG. 7 is a diagram illustrating the structure of the pressure-sensitive adhesive sheet according to the first embodiment of the present invention. The pressure-sensitive adhesive sheet 510 includes a film 515 serving as a base material, a conductive pressure-sensitive adhesive layer 512 and a support pressure-sensitive adhesive layer 514. A conductive adhesive layer 512 is disposed on one surface of the film 515, and a support adhesive layer 514 is disposed on the other surface. In the example of the method for manufacturing the through electrode substrate 10, the substrate 100 is bonded to the conductive adhesive layer 512, and the support substrate 610 is bonded to the support adhesive layer 514. In addition, before the adhesive sheet 510 is used, separators (release liners) may be disposed on both surfaces of the adhesive sheet 510.

  In this example, the film 515 is a plastic film such as PET having flexibility. The film 515 may not have a single-layer structure, but may have a laminated structure in which a plurality of materials are combined. In this example, the support adhesive layer 514 is formed of a pressure-sensitive adhesive. In addition, you may form so that adhesive force may decline with predetermined | prescribed irritation | stimulation.

  The conductive pressure-sensitive adhesive layer 512 is a layer formed of a pressure-sensitive adhesive whose adhesive strength decreases when a predetermined stimulus is applied, and is typically a layer used as a seed layer during electroplating. In this example, the predetermined stimulus is heat equal to or higher than a predetermined temperature. The pressure-sensitive adhesive may be a known pressure-sensitive adhesive, for example. In this pressure-sensitive adhesive, heat-foamable microcapsules for reducing the pressure-sensitive adhesive force by applying heat at a predetermined temperature or higher are dispersed. This microcapsule is formed, for example, from a material (for example, a solvent such as isobutane or propane) that is gasified by heating and expands with a resin (for example, a low-viscosity resin such as polyvinyl alcohol, polyvinyl butyral, or polymethyl methacrylate). It is enclosed by a shell that has been made. When this material expands greatly, the microcapsule expands and further bursts and foams, reducing the adhesive strength of the adhesive. Therefore, parameters such as the material to be enclosed in the microcapsule and the strength of the microcapsule may be determined according to the temperature at which the adhesive force is desired to be reduced. In addition, the microcapsule itself may not be ruptured, and the gasified internal material may permeate and foam the shell thinned by expansion. In any case, this microcapsule causes foaming of the conductive adhesive layer 512 by heating, and reduces the adhesive strength of the conductive adhesive layer 512.

  Further, the conductive adhesive layer 512 has a sheet resistance of 0.1Ω / □ to 100Ω / □, preferably 1Ω / □ to 10Ω / □, and the like. The conductive material is dispersed. If the sheet resistance is too high, the growth rate of the conductive layer varies greatly as described later depending on the position of the through hole in the substrate 100 in the electrolytic plating process, which affects the subsequent steps. On the other hand, when the sheet resistance of the conductive adhesive layer 512 itself is too low, the density of the conductive material must be increased. As a result, the density of the microcapsules decreases, and even if the microcapsules are foamed, the amount of decrease in the adhesive strength is reduced, and it becomes difficult to peel the adhesive sheet 510 from the substrate 100.

  The sheet resistance is measured in a state before the microcapsule is foamed. After the microcapsule is foamed, the conductive material network is cut and the resistivity is increased, so that the sheet resistance is also increased.

  Further, the above-described microcapsules may be formed of a conductive material. In this case, the conductive material may be dispersed not only outside the microcapsule but also inside the microcapsule. In the case where the microcapsule is formed of a conductive material, a resin in which a conductive material is dispersed in a resin forming the shell may be used. Further, the conductive material may be dispersed together with the solvent in the microcapsule.

  Further, in the conductive adhesive layer 512, the conductive material may be dispersed at a higher density as the distance from the film 515 (closer to the surface of the conductive adhesive layer 512). At this time, in the region where the density of the conductive material is high, the density of the microcapsules may be relatively low.

  In addition, the distribution in the surface may exist instead of the distribution in the thickness direction of the conductive adhesive layer 512. In this case, it is desirable that a portion having a high density of the conductive material does not exist in isolation, but continuously exists to form a conductive network. For example, a conductive network may be formed by forming a portion having a high density of conductive material in a lattice shape. In the region surrounded by the lattice, the density of the microcapsules may be high.

Second Embodiment
FIG. 8 is a diagram illustrating the structure of the pressure-sensitive adhesive sheet according to the second embodiment of the present invention. In the adhesive sheet 510A in the second embodiment, a conductive layer 513A is formed between the conductive adhesive layer 512A and the film 515. The conductive layer 513A is, for example, a metal foil such as aluminum or copper. The conductive layer 513A is not limited to being formed on the entire surface of the film 515, and may be formed on a part thereof. That is, the conductive region may be formed on at least a part of the surface of the film 515, but it is desirable to reduce the region where the conductive region exists in isolation, including the region corresponding to the peripheral portion 550 described above. .

  Note that the film 515 and the conductive layer 513A may be integrally formed to form a conductive film. If the film 515 is formed of a conductive material such as a metal foil such as aluminum or copper, the same effect can be obtained even if the conductive layer 513A is not present. Furthermore, like the conductive adhesive layer 512A, the support adhesive layer 514 may also have conductivity. In this case, resistance can be further reduced by using a support substrate attached to the support adhesive layer 514 as a metal substrate such as a stainless steel plate. Thus, when the whole adhesive sheet is comprised with the material which has electroconductivity, it is desirable for the sheet resistance (sheet resistance including the front and back) of an adhesive sheet to be 100 ohms / square or less. In other words, the sheet resistance measured from the conductive adhesive layer 512A side of the adhesive sheet and the sheet resistance measured from the support adhesive layer 514 side are both preferably 100Ω / □ or less.

  Since the in-plane conductive network is formed by the conductive layer 513A, it is important that the conductive adhesive layer 512A has conductivity in the thickness direction. Therefore, the density of the conductive material in the conductive adhesive layer 512A may be lower than the density in the first embodiment. At this time, in the conductive adhesive layer 512A, the conductive material may be dispersed so that the conductivity in the thickness direction is higher than the conductivity in any direction in the plane.

<Third Embodiment>
FIG. 9 is a diagram illustrating the structure of the pressure-sensitive adhesive sheet according to the third embodiment of the present invention. An adhesive sheet 510B in the third embodiment includes an adhesive layer 512B on which a pattern is formed. In this example, the adhesive layer 512B has an opening EA. In the opening EA, the conductive layer 513B is exposed. Although not shown, the conductive layer 513B is exposed in the region corresponding to the peripheral portion 550 as well. Note that unlike the conductive adhesive layer described above, the adhesive layer 512B is not dispersed with a conductive material.

  In this adhesive sheet 510B, a conductive layer by plating grows from the conductive layer 513B exposed in the opening EA in the electrolytic plating process. Therefore, the substrate 100 and the adhesive sheet 510B are bonded together so that the through holes 151 and 152 are located in the region of the opening EA.

<Fourth embodiment>
FIG. 10 is a diagram illustrating the structure of the support substrate with an adhesive layer in the fourth embodiment of the present invention. The support substrate 600 with an adhesive layer in this example is obtained by replacing the base material (film 515) in the adhesive sheet 510 in the first embodiment with a support substrate 610 such as a glass substrate, and can be said to be an example of an adhesive sheet.

  According to the support substrate 600 with the adhesive layer, since the substrate 100 can be supported by the support substrate 610, a separate support substrate is not required. Therefore, in this example, the support adhesive layer 514 does not exist. Such a support substrate 600 with an adhesive layer may be used in the manufacturing process of the through electrode substrate 10. The same applies to the following fifth and sixth embodiments.

<Fifth Embodiment>
FIG. 11 is a diagram illustrating the structure of the support substrate with an adhesive layer in the fifth embodiment of the present invention. A support substrate 600A with an adhesive layer in this example is obtained by replacing the base material (film 515) in the adhesive sheet 510A in the second embodiment with a support substrate 610 such as a glass substrate, and can be said to be an example of an adhesive sheet. If the support substrate 610 is not a glass substrate but a substrate formed of a conductive material such as a stainless steel substrate, the same effect can be obtained even if the conductive layer 513A is not present.

<Sixth Embodiment>
FIG. 12 is a view for explaining the structure of the support substrate with an adhesive layer in the sixth embodiment of the present invention. The support substrate 600B with an adhesive layer in this example is obtained by replacing the base material (film 515) in the adhesive sheet 510B in the third embodiment with a support substrate 610 such as a glass substrate, and can be said to be an example of an adhesive sheet. Hereinafter, the manufacturing method of the penetration electrode substrate using support substrate 600B with an adhesion layer in a 6th embodiment is explained.

  FIG. 13 is a diagram for explaining a method for manufacturing a through electrode substrate when the support substrate with an adhesive layer in the sixth embodiment of the present invention is used. FIG. 14 is a view for explaining a method for manufacturing the through electrode substrate subsequent to FIG. 13. FIGS. 13A, 13B, and 13C are processes corresponding to FIGS. 3C, 4A, and 4B in the first embodiment, respectively.

  When the support substrate 600B with the adhesive layer in the sixth embodiment is attached to the substrate of FIG. 3B in the first embodiment, a space 560 is formed in a portion corresponding to the opening EA as shown in FIG. Is done. Then, it is thinned from the second surface 102 side of the substrate 100 using CMP to open the bottom of the bottomed hole 150 (FIG. 13B). As a result, the conductive layer 513B is exposed through the opening on the first surface 101 side of the formed through holes 151 and 152.

  Subsequently, electrolytic plating is performed on the substrate 100 to grow a conductive layer 160 inside the through holes 151 and 152 (FIG. 13C). In this example, the conductive layer 513B is used as a cathode for electrolytic plating. In order to supply current through the conductive layer 513B, the conductive layer 160 is also formed in the space 560. When the adhesive layer 512 </ b> B is very thin, the opening is blocked by the conductive layer 160 grown in the through holes 151 and 152, and the conductive layer 160 may not be formed to fill the space 560.

  As in the first embodiment, an insulating layer and wiring are formed on the second surface 102 side of the substrate 100, and the support substrate 620 is attached using the adhesive sheet 520. Thereafter, heat treatment at a predetermined temperature or higher is applied to the adhesive layer 512B to reduce the adhesive force, and the adhesive layer 512B, the conductive layer 513B, and the support substrate 610 are peeled off from the substrate 100 (FIG. 14A). In FIG. 14A, the conductive layer 160 is peeled off at the interface between the conductive layer 513B, but at least a part of the conductive layer 513B may be peeled off from the support substrate 610 while attached to the conductive layer 160.

  Note that the conductive layer 513B may include the thermally foamable microcapsules as described above so that the support substrate 610 and the conductive layer 160 can be easily separated. In this case, the conductive layer 513B may be an organic layer in which a conductive material is dispersed instead of a metal foil. Further, as described above, in order to improve the adhesion between the through holes 151 and 152 and the conductive layer 160, the diameter of the through holes 151 and 152 is reduced on the center side in the thickness direction of the substrate 100, On the first surface 101 side and the second surface 102 side, the diameter is increased, the diameter is decreased on the first surface 101 side on the side where the adhesive sheet 510 is attached, and the diameter is increased toward the second surface 102 side. Alternatively, the side wall may have an uneven shape.

  Subsequently, the portion of the conductive layer 160 that protrudes from the first surface 101 of the substrate 100 is removed using CMP to form the through electrodes 161 and 162 (FIG. 14B). In the electroplating process, if the conductive layer 160 is not formed to fill the space 560, the through electrodes 161 and 162 may already be separated. In this case, it may not be necessary to remove a portion of the conductive layer 160 that protrudes from the first surface 101 of the substrate 100. Since the subsequent steps are the same as the steps of FIGS. 6B and 6C described in the first embodiment, description thereof will be omitted.

<Influence of adhesive sheet resistance>
Subsequently, the pressure-sensitive adhesive sheet described in each of the above embodiments not only supplies a necessary current but also reduces the distribution of the growth rate of the conductive layer in order to provide the function of the seed layer of the electrolytic plating process. It is necessary to reduce the sheet resistance.

  FIG. 15 is a diagram for explaining the distribution of the conductive layer growing in the through hole when the resistance of the adhesive sheet is low. FIG. 16 is a diagram for explaining the distribution of the conductive layer growing in the through hole when the resistance of the adhesive sheet is high. In the example shown in FIGS. 15 and 16, through holes 151 to 157 are formed in the substrate 100. As an electrode for the electrolytic plating treatment, an electrode 5130 and a conductive adhesive layer 512A or 512Z are used.

  In the example shown in FIG. 15, the support substrate 600A (adhesive sheet) with the adhesive layer of the fifth embodiment shown in FIG. 11 is used. In this example, there is little difference in the growth rate of the conductive layer 160 between the through hole 157 near the terminal portion (corresponding to the peripheral portion 550) that is a power receiving unit to which the power source DC is connected and the through hole 151 far from the terminal portion. . Therefore, the time until the conductive layer 160 reaches the second surface 102 is almost the same. This is because the presence of the conductive layer 513A reduces the sheet resistance of the adhesive sheet on the substrate 100 side and reduces the influence of a voltage drop from the terminal portion to the through hole 151.

  On the other hand, in the example shown in FIG. 16, the adhesive layer 512Z having a high sheet resistance is used. In this case, the influence of the voltage drop from the terminal portion to the through hole 151 becomes large, and a large difference occurs in the growth rate of the conductive layer 160. Therefore, the time until the conductive layer 160 reaches the second surface 102 is greatly different. If this difference becomes too large, the conductive layer 160 of the through hole 157 greatly protrudes from the second surface 102 while the conductive layer 160 of the through hole 151 reaches the second surface, which adversely affects subsequent processes. Or may be in electrical contact with the adjacent through-holes 156. Therefore, the electrode 5130 must have a special shape, a shielding plate, or other conditions must be adjusted to suppress the difference in the growth rate of the conductive layer 160.

  In addition, even if it is an adhesive sheet using a conductive adhesive layer without using a conductive layer in order to give conductivity, a sheet of the conductive adhesive layer so that the growth rate of the conductive layer 160 is kept within a predetermined distribution. What is necessary is just to adjust resistance. Even if the growth rate of the conductive layer 160 does not fall within a predetermined distribution, other conditions (electrode shape, use of a shielding plate) may be adjusted. Further, if the size of the substrate is small, the distribution of the growth rate may not have a great influence.

  In addition, even if the growth rate of the conductive layer 160 does not fall within a predetermined distribution, a step of removing unnecessary portions from the portion protruding from the second surface 102 and growing may be added. As the process, for example, the protruding portion may be cut using a fly cutter, or the protruding portion may be polished by CMP. Thus, the in-plane distribution caused by the difference in growth rate may be improved afterwards by another process. Thus, the example shown in FIG. 15 does not indicate that a conductive layer such as a metal foil is an essential element in the adhesive sheet. Moreover, the pressure-sensitive adhesive sheet having the conditions illustrated in FIG. 16 is not impossible as an embodiment of the present invention, and it is not an essential element that the sheet resistance of the pressure-sensitive adhesive sheet is not more than a predetermined value.

  Here, according to the example of the prior art that does not use the adhesive sheet described in each of the above embodiments, a seed layer for electrolytic plating is formed, but in order to improve the in-plane distribution. For this, the resistance of the seed layer must be reduced. For this purpose, the seed layer is made thick. However, when the seed layer is made thicker, the formation time for forming the seed layer becomes longer, and the time for etching the portion of the seed layer that becomes unnecessary after the electrolytic plating process also becomes longer. End up. Note that, if the seed layer is thin, it is difficult to reduce the resistance. Therefore, the seed layer must be further etched after polishing unnecessary portions as described above.

  In addition, when the time for etching the seed layer becomes longer, a part of the plating layer that is desired to remain is also etched, and there may be a problem that, for example, a portion filled as a through electrode is depressed. . On the other hand, if the electroplating process is performed using the adhesive sheet described in each of the above embodiments, the electroconductive adhesive layer corresponding to the seed layer is also detached from the substrate by peeling the adhesive sheet from the substrate after the electrolytic plating process. Due to the detachment, the problems caused in the prior art do not occur.

<Seventh embodiment>
In the first embodiment, the bottomed hole 150 before the through holes 151 and 152 are formed is formed in the substrate 100 before the adhesive sheet 510 is attached. And after sticking the adhesive sheet 510 and the support substrate 610, the board | substrate 100 was thinned, the bottom part of the bottomed hole 150 was opened, and the through-holes 151 and 152 were formed. As a result, the conductive adhesive layer of the adhesive sheet 510 was exposed through the through holes 151 and 152.

  In 7th Embodiment, the adhesive sheet 510 is affixed on the board | substrate with which the through-holes 151 and 152 are formed. By this step, the structure is the same as that shown in FIG. 4A, and the adhesive sheet 510 is exposed at the openings of the through holes 151 and 152 without the substrate 100 being thinned. As described above, the adhesive sheet 510 and the support substrate 610 may be used to form an electrode for electrolytic plating treatment when the substrate 100 is not thinned. Note that the support substrate 610 is not necessarily used as long as it is used only as an electrode for electrolytic plating. In this case, the support adhesive layer 514 may not exist in the adhesive sheet 510.

<Eighth Embodiment>
In the eighth embodiment, a semiconductor device manufactured using the above-described through electrode substrate 10 will be described.

  FIG. 17 is a diagram showing a semiconductor device according to the eighth embodiment of the present invention. In the semiconductor device 1000, three substrates 60 (60-1, 60-2 and 60-3) are stacked and connected to an LSI (Large Scale Integration) substrate 70. The substrates 60-1 and 60-2 are the through electrode substrate 10 described above. Any one of them may be a through electrode substrate manufactured by a manufacturing method different from the first embodiment, instead of the through electrode substrate 10 described above. When there is a through electrode substrate using a semiconductor substrate such as a silicon substrate among these substrates 60, a semiconductor element such as a DRAM may be formed on the through electrode substrate.

  Connection terminals for connecting to the bumps are disposed on the respective substrates 60-1, 60-2, 60-3. The connection terminal is connected to the wiring arranged on the same substrate. The connection terminal 81-1 of the substrate 60-1 is connected to the connection terminal 80 of the LSI substrate 70 by the bump 90-1. The connection terminal 82-1 of the substrate 60-1 is connected to the connection terminal 81-2 of the substrate 60-2 by the bump 90-2. The connection terminals 82-2 of the substrate 60-2 and the connection terminals 83-1 of the substrate 60-3 are also connected by the bumps 90-3. For example, a metal such as indium, copper, or gold is used for the bumps 90-1, 90-2, and 90-3.

  In addition, when laminating | stacking the board | substrate 60, not only three layers but two layers may be sufficient, and also four or more layers may be sufficient. In addition, the connection between the substrate 60 and another substrate is not limited to using bumps, and other bonding techniques such as eutectic bonding may be used. Alternatively, polyimide, an epoxy resin, or the like may be applied and baked to bond the substrate 60 and another substrate.

  FIG. 18 is a diagram showing another example of the semiconductor device according to the eighth embodiment of the present invention. A semiconductor device 1000 illustrated in FIG. 17 includes semiconductor chips (LSI chips) 71-1 and 71-2 such as MEMS devices, CPUs, and memories that are stacked and connected to the LSI substrate 70.

  A substrate 60 is disposed between the semiconductor chip 71-1 and the semiconductor chip 71-2, and is connected by bumps 90-1 and 90-2. The substrate 60 is the above-described through electrode substrate 10.

  A semiconductor chip 71-1 is mounted on the LSI substrate 70. The LSI substrate 70 and the semiconductor chip 71-2 are connected by a wire 95. In this example, the substrate 60 is also used as an interposer for stacking a plurality of semiconductor chips and mounting them three-dimensionally, and manufacturing a multifunctional semiconductor device by stacking a plurality of semiconductor chips having different functions. be able to. For example, by using the semiconductor chip 71-1 as a three-axis acceleration sensor and the semiconductor chip 71-2 as a two-axis magnetic sensor, a semiconductor device in which a five-axis motion sensor is realized with one module can be manufactured.

  When the semiconductor chip is a sensor formed by a MEMS device, the sensing result may be output as an analog signal. In this case, a low-pass filter, an amplifier and the like may be formed on the semiconductor chip.

  FIG. 19 is a diagram showing still another example of the semiconductor device according to the eighth embodiment of the present invention. The above two examples (FIGS. 17 and 18) are three-dimensional mounting, but in this example, the example is applied to 2.5-dimensional mounting. In the example shown in FIG. 19, six substrates 60 (60-1 to 60-6) are stacked and connected to the LSI substrate 70. However, all the substrates 60 are not only stacked and arranged, but are also arranged side by side in the in-plane direction of the substrate. At least one of the substrates 60 is the through electrode substrate 10 described above.

  In the example of FIG. 19, the substrates 60-1 and 60-5 are connected to the LSI substrate 70, the substrates 60-2 and 60-4 are connected to the substrate 60-1, and the substrate 60- 3 is connected, and the substrate 60-6 is connected on the substrate 60-5. Note that 2.5-dimensional mounting is possible even when the substrate 60 is used as an interposer for connecting a plurality of semiconductor chips as in the example shown in FIG. For example, the substrates 60-3, 60-4, 60-6, etc. may be replaced with semiconductor chips.

  The semiconductor device 1000 manufactured as described above includes various devices such as mobile terminals (mobile phones, smartphones, notebook personal computers, etc.), information processing devices (desktop personal computers, servers, car navigation systems, etc.), home appliances, and the like. Installed in electrical equipment.

FIG. 20 is a diagram showing an electronic apparatus using the semiconductor device according to the seventh embodiment of the present invention.
As an example of an electric device in which the semiconductor device 1000 is mounted, a smartphone 5000 is illustrated in FIG. 20A and a notebook personal computer 6000 is illustrated in FIG. These electric devices have a control unit 1100 configured by a CPU or the like that implements various functions by executing application programs. The various functions include a function using an output signal from the semiconductor device 1000.

DESCRIPTION OF SYMBOLS 10 ... Through-electrode board | substrate, 60 ... Board | substrate, 70 ... LSI board | substrate, 71 ... Semiconductor chip, 80, 81, 82 ... Connection terminal, 90 ... Bump, 95 ... Wire, 100 ... Board | substrate, 101 ... 1st surface, 102 ... 1st Two surfaces, 150 ... bottomed holes, 151-157 ... through holes, 160 ... conductive layers, 161, 162 ... through electrodes, 210, 220 ... insulating layers, 211, 212, 221, 222 ... openings, 311, 312, 321, 322... Wiring, 320... Conductive layer, 510, 510 A, 510 B, 520... Adhesive sheet, 511. ... conductive layer, 514 ... support adhesive layer, 515 ... film, 550 ... peripheral part, 560 ... space, 600, 600A, 600B ... support substrate with adhesive layer, 610, 620 Support substrate, 1000 ... semiconductor device, 1100 ... control unit, 5000 ... smartphone, 6000 ... laptop computer

Claims (23)

On the first surface of the first substrate on which the bottomed hole that opens on the first surface side is disposed, the adhesive layer that is conductive and has reduced adhesive strength when applied with a stimulus, and the first layer through the adhesive layer Placing a second substrate to support one substrate,
By thinning the first substrate from the second surface facing the first surface, a through hole is formed in which the bottom of the bottomed hole is opened,
By conducting an electroplating process in which current is supplied through the adhesive layer, a conductive layer is grown from the adhesive layer to the through hole,
Applying the stimulus to the adhesive layer;
Peeling the adhesive layer and the second substrate from the first substrate. A method of manufacturing a through electrode substrate. On one surface of the first substrate on which the through-hole is disposed, the opening of the through-hole is disposed, and an adhesive layer that is conductive and has reduced adhesive strength by applying a stimulus is disposed.
By conducting an electroplating process in which current is supplied through the adhesive layer, a conductive layer is grown from the adhesive layer to the through hole,
Applying the stimulus to the adhesive layer;
A method for producing a through electrode substrate, comprising: peeling off the adhesive layer from the first substrate. The adhesive layer has a peripheral portion that extends outward from an end portion of the first substrate,
The method of manufacturing a through electrode substrate according to claim 1, wherein a power source that supplies the current and the peripheral portion are electrically connected.   The method for manufacturing a through electrode substrate according to claim 1, wherein the second substrate has conductivity at least on the adhesive layer side.   5. The method for manufacturing a through electrode substrate according to claim 4, wherein the adhesive layer has a conductivity in a thickness direction higher than a conductivity in any direction in the plane. On the first surface of the first substrate on which a bottomed hole that opens on the first surface side is disposed, an adhesive layer that includes an opening and whose adhesive strength is reduced by applying a stimulus, and a conductive region exposed by the opening A second substrate that supports the first substrate via the adhesive layer,
By thinning the first substrate from the second surface facing the first surface, a through hole is formed in which the bottom of the bottomed hole is opened,
By an electroplating process in which current is supplied through the conductive region, a conductive layer is grown from the conductive region to the through hole,
Applying the stimulus to the adhesive layer;
Peeling the adhesive layer and the second substrate from the first substrate. A method of manufacturing a through electrode substrate. On one surface of the first substrate on which the through hole is disposed, the adhesive layer that includes the opening and whose adhesive strength is reduced by applying a stimulus is provided on one surface of the first substrate on which the opening is disposed, and the conductive region exposed by the opening A second substrate that supports the first substrate via the adhesive layer,
By an electroplating process in which current is supplied through the conductive region, a conductive layer is grown from the conductive region to the through hole,
Applying the stimulus to the adhesive layer;
Peeling the adhesive layer and the second substrate from the first substrate. A method of manufacturing a through electrode substrate. The second substrate has a peripheral portion that is electrically connected to the conductive region extending outward from an end portion of the first substrate;
The method for manufacturing a through electrode substrate according to claim 6 or 7, wherein the power supply for supplying the current and the peripheral portion are electrically connected. A substrate;
An adhesive layer that is disposed on the substrate and has an adhesive force that is reduced by application of a stimulus,
A conductive material dispersed in the adhesive layer such that the sheet resistance of the surface of the adhesive layer opposite to the surface with which the substrate is in contact is 0.1Ω / □ or more and 100Ω / □ or less,
Adhesive sheet containing.   The pressure-sensitive adhesive sheet according to claim 9, wherein the conductive material is dispersed in the pressure-sensitive adhesive layer so that the sheet resistance is 0.1Ω / □ or more and 10Ω / □ or less. A substrate;
An adhesive layer that is disposed on the substrate and has an adhesive force that is reduced by application of a stimulus,
A conductive material dispersed in the adhesive layer so as to become denser as it gets away from the substrate;
Adhesive sheet containing. A substrate including a conductive region having conductivity in at least a part of the surface;
An adhesive layer that is disposed in the conductive region and has reduced adhesive strength upon application of a stimulus;
A conductive material dispersed in the adhesive layer such that the electrical conductivity in the thickness direction of the adhesive layer is higher than the electrical conductivity in any direction in the plane;
Adhesive sheet containing. A substrate;
An adhesive layer that is disposed on the substrate and has an adhesive force that is reduced by application of a stimulus,
A conductive material dispersed in the adhesive layer so as to have a density distribution in the plane;
Adhesive sheet containing.   The pressure-sensitive adhesive sheet according to claim 13, wherein the region having a high density of the conductive material forms a lattice-like region in a plane. In the adhesive layer, capsules that cause foaming in the adhesive layer by the stimulation are dispersed,
The pressure-sensitive adhesive sheet according to claim 9, wherein the capsule shell is formed of a resin containing a conductive material.   The pressure-sensitive adhesive sheet according to claim 15, wherein the capsule encloses a solvent containing a conductive material therein. A substrate including a conductive region having conductivity in at least a part of the surface;
An adhesive layer that includes an opening that exposes at least a portion of the conductive region;
Adhesive sheet containing.   The pressure-sensitive adhesive sheet according to claim 17, wherein capsules that are foamed by the stimulus are dispersed in at least a portion of the conductive region exposed by the pressure-sensitive adhesive layer. The substrate is a film;
The pressure-sensitive adhesive sheet according to any one of claims 9 to 18, further comprising a second pressure-sensitive adhesive layer disposed on a surface opposite to the surface on which the pressure-sensitive adhesive layer of the base material is disposed. A conductive substrate;
A first adhesive layer disposed on the base material, the adhesive strength of which decreases when applied with a stimulus;
A second adhesive layer disposed on the surface of the substrate opposite to the surface on which the adhesive layer is disposed;
A conductive material dispersed in the first adhesive layer and the second adhesive layer;
Including
The base material and the second adhesive layer have conductivity,
The sheet resistance measured from the first adhesive layer side and the sheet resistance measured from the second adhesive layer side are both 100 Ω / □ or less.   The pressure-sensitive adhesive sheet according to any one of claims 9 to 18, wherein the base material includes a glass substrate, a silicon substrate, or a stainless steel substrate. The through hole is plated in a state in which an adhesive layer that has conductivity and lowers adhesive strength when applied with a stimulus is attached to one surface of the substrate on which the through hole is disposed. Soak in the liquid,
Supplying an electric current to the adhesive layer;
Applying the stimulus to the adhesive layer;
Removing the adhesive layer from the substrate. On one surface of the substrate on which the through-hole is disposed, the opening of the through-hole is disposed, and includes an adhesive layer that includes the opening and whose adhesive strength decreases when a stimulus is applied, and a conductive region that is exposed by the opening. In the state where the layer is arranged, the through hole is immersed in a plating solution,
Supplying a current to the layer including the conductive region;
Applying the stimulus to the adhesive layer;
Removing the adhesive layer from the substrate.

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