JP2003078239A - Device and method for sticking double-sided tape - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a device and method for sticking double-sided tape by which a double-sided tape can be stuck to a plurality of positions by means of a compact inexpensive facility. SOLUTION: The device transports an ACF bonded to one surface of a base tape 6 along a tape transporting route, cuts off pieces having a prescribed length from the ACF, and sticks the cut pieces to a substrate 4. The device cuts off a plurality of ACF tape pieces 7 having the prescribed length from the ACF by means of a double-sided tape cutting mechanism 13, and bonds some of the pieces 7 to the substrate 4 by means of a first bonding head 15 positioned along the tape transporting route on the downstream side. For the pieces 7 which are not bonded by means of the bonding head 15, but transported to the downstream side, the device bonds the pieces 7 to the substrate 4 by means of a second bonding head 16. Consequently, the device can simultaneously bond the ACF tape pieces 7 to a plurality of sticking positions by supplying the pieces 7 to the bonding heads 15 and 16 by means of one tape supply mechanism 11.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a double-sided tape sticking device and sticking method for sticking a double-sided tape, which is used for bonding electronic parts, to a work by pressing it with a pressure bonding head.

[0002]

2. Description of the Related Art As a method for mounting an electronic component on a substrate or the like, a method is known in which a tape-shaped anisotropic conductor is attached to an electrode of a work such as the substrate and a chip is pressure-bonded thereon. Anisotropic conductors (hereinafter referred to as "ACF") are supplied in the form of double-sided tape with adhesive on both sides, and the ACF tape with one side attached to the base tape is wound around the supply reel and stored, and the tape is attached. Supplied to the device. The tape applying device includes a tape feeding means for pulling out the ACF tape from the supply tape and feeding it to the downstream side, a cutting means for making a cut only in the ACF of the ACF tape, and a pressure bonding head for sticking the cut ACF to the work. And so on.

By the way, the ACF mounting is also applied to the case where a large number of electronic components are mounted on the same work such as a memory module. Conventionally, the ACF sticking in such a case is a crimping tool for each mounting position. It was done by the method of pasting individually. In the case where it is necessary to attach ACFs at a large number of places due to the demand for productivity improvement in recent years, instead of the conventional method of individually attaching one by one, a pasting device equipped with a plurality of crimping heads is used. There is a demand for a method of simultaneously applying ACF to a plurality of locations.

[0004]

[Problems to be Solved by the Invention] However, the ACF
Conventionally, the pasting device of (1) has to be provided with a supply reel for supplying the ACF tape for each one crimping head, ancillary mechanisms such as the above-mentioned tape conveying means and cutting means, and a plurality of crimping heads are provided in one pasting device. In this case, there is a problem that the equipment becomes complicated and it is difficult to make it compact, and the equipment cost increases.

Therefore, it is an object of the present invention to provide a double-sided tape sticking apparatus and a double-sided tape sticking method capable of sticking a double-sided tape to a plurality of positions with compact and inexpensive equipment.

[0006]

According to another aspect of the present invention, there is provided a double-sided tape sticking device, wherein a double-sided tape supplied in a state of being stuck to one side of a base tape is carried along a tape carrying path to a predetermined length. A double-sided tape sticking device for cutting and sticking to a work, wherein a plurality of double-sided tape pieces having a predetermined length are formed on a base tape by making cuts in the double-sided tape on the tape transport path at a predetermined pitch. A tape cutting unit; and a plurality of pressure bonding heads including at least a first pressure bonding head and a second pressure bonding head, which are sequentially arranged from the upstream side along a tape transport path downstream of the double-sided tape cutting unit, The first pressure bonding head presses one of the plurality of double-sided tape pieces against the work from the side of the base tape to press the work, and the second pressure bonding head. Head is configured to crimp a workpiece by pressing the workpiece double-sided tape pieces are conveyed to the downstream side without being crimped by the first bonding head from said base tape side.

A double-sided tape sticking device according to a second aspect is the double-sided tape sticking device according to the first aspect,
By transporting the tape along the tape transport path, one of the plurality of double-sided tape pieces is positioned at the first pressure-bonding position by the first pressure-bonding head, and another double-sided tape piece is positioned at the first pressure-bonding position. And a double-sided tape conveying means for positioning the second pressure bonding head at the second pressure bonding position.

A double-sided tape sticking apparatus according to a third aspect is the double-sided tape sticking apparatus according to the first aspect,
When one of the plurality of double-sided tape pieces is positioned at the first pressure-bonding position by the first pressure-bonding head, another double-sided tape piece is positioned at the second pressure-bonding position by the second pressure-bonding head. The head-to-head tape length adjusting means for adjusting the head-to-head tape length between the first pressure bonding head and the second pressure bonding head is provided so as to be positioned.

A double-sided tape sticking device according to a fourth aspect is the double-sided tape sticking device according to the first aspect.
Positioning a work holding part for holding the work, and a first attaching position of the work and a double-sided tape piece to be crimped by the first crimping head by moving the work holding part relative to the tape transport path. In addition to the alignment, the second attachment position of the work and the alignment means for aligning the double-sided tape piece pressure-bonded by the second pressure-bonding head are provided.

A double-sided tape sticking device according to a fifth aspect is the double-sided tape sticking device according to the first aspect.
A work holding unit that holds a plurality of works, and by moving the work holding unit relative to the tape transport path, one work of the plurality of works is crimped by a first crimping head. Positioning means is provided for aligning the double-sided tape piece and for aligning the other work of the plurality of works with the double-sided tape piece to be crimped by the second crimping head.

A double-sided tape sticking apparatus according to a sixth aspect is the double-sided tape sticking apparatus according to the first aspect,
A first work holding part for holding the work; and a work held by the first work holding part by moving the first work holding part relative to the tape transport path. First alignment means for aligning a double-sided tape piece crimped by a crimping head, a second work holding portion for holding a work, and the second work holding portion relative to the tape transport path. Second alignment means for aligning the work held by the second work holding portion and the double-sided tape piece pressure-bonded by the second pressure-bonding head by mechanically moving the work.

According to a seventh aspect of the present invention, in the double-sided tape attaching method, the double-sided tape supplied in a state of being attached to one side of the base tape is conveyed along a tape conveying path and cut into a predetermined length to form a work. A method for applying a double-sided tape, wherein the double-sided tape cutting step comprises forming a plurality of double-sided tape pieces of a predetermined length on the base tape by making cuts in the double-sided tape on the tape transport path at a predetermined pitch. A plurality of pressure bonding heads including at least a first pressure bonding head and a second pressure bonding head, which are sequentially arranged from the upstream side along the tape transportation path downstream of the double-sided tape cutting means by transporting the tape downstream. A double-sided tape positioning step of respectively positioning one of the plurality of double-sided tape pieces at respective pressure-bonding positions according to And a crimping step of crimping the workpiece by a double-sided tape strips positioned in the crimping position of the respective crimping heads by the second bonding head is pressed against the workpiece from the base tape side.

The method for applying the double-sided tape according to claim 8 is the method for applying the double-sided tape according to claim 7,
The pressure bonding of the double-sided tape by the first pressure bonding head and the pressure bonding of the double-sided tape by the second pressure bonding head are simultaneously performed.

The method of applying the double-sided tape according to claim 9 is the method of applying the double-sided tape according to claim 7 or 8, wherein the double-sided tape piece is pressure-bonded to the first bonding position of the work by the first pressure bonding head. Then, the double-sided tape piece is pressure-bonded to the second attachment position of the work by the second pressure-bonding head.

According to the present invention, the double-sided tape cutting means for forming a plurality of double-sided tape pieces of a predetermined length on the base tape by making a cut in the double-sided tape on the tape transport path, and the tape transport path downstream thereof. A plurality of pressure-bonding heads including a first pressure-bonding head and a second pressure-bonding head that are sequentially arranged along the upstream side, and one of the plurality of double-sided tape pieces is used as a work by the first pressure-bonding head. By pressing the double-sided tape piece, which has been conveyed to the downstream side without being pressed by the first pressure-bonding head by the second pressure-bonding head, to the work, the double-sided tape piece can be moved to a plurality of positions by one tape supply means. It can be pasted.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS (Embodiment 1) FIG. 1 is a front view of a double-sided tape sticking apparatus according to Embodiment 1 of the present invention.
4 is a plan view of a substrate to which the double-sided tape according to Embodiment 1 of the present invention is attached; FIG. 3 is a block diagram showing a configuration of a control system of the double-sided tape attaching apparatus according to Embodiment 1 of the present invention;
5, FIG. 6, FIG. 7, and FIG. 8 are process explanatory diagrams of the double-sided tape attaching method according to the first embodiment of the present invention.

First, the structure of a double-sided tape sticking device will be described with reference to FIG. This double-sided tape sticking device is an adhesive layer for bonding electronic parts, that is, a tape-shaped AC.
F (anisotropic conductor) is attached to the substrate. Figure 1
In FIG. 1, the substrate positioning unit 1 is configured by placing the substrate holding table 3 on the XY table 2. The substrate holding table 3 holds a substrate 4 to which a tape-shaped ACF (hereinafter referred to as an ACF tape) is attached.

The board 4 is of a type in which a large number of electronic components are mounted on a single-sided board such as a memory module.
As shown in FIG. 4, the substrate 4 is provided with a plurality of ACF tape attachment positions 4a (numbered like A1 to A9 and B1 to B9 to distinguish the positions).
The size of the attachment position 4a is defined by the type of electronic component, and the length b of the ACF tape is determined based on this size.

Here, all the pasting positions 4a are set at equal intervals, and the interval D between the two pasting positions 4a is the same for any two pasting positions. As a result, as will be described later, it is possible to simultaneously perform the pressure bonding with respect to the two bonding positions 4a by the two pressure bonding heads.

A double-sided tape sticking unit 10 is arranged above the board positioning portion 1. The double-sided tape sticking unit 10 includes a vertical frame 10a,
A double-sided tape supply mechanism 11, a double-sided tape transport mechanism 12, a double-sided tape cutting mechanism 13 (double-sided tape cutting means), a tape peeling mechanism 14, a first pressure bonding head 15 and a second pressure bonding head 16 are arranged on the frame 10a. Has been done.

The double-sided tape supply mechanism 11 is equipped with a supply reel 11a in which a laminated tape 5 having an ACF tape attached to one surface of a base tape is housed in a rolled state, and the laminated tape 5 is fed from the supply reel 11a to the downstream side. Supply to the side. The tension roller 18 applies a predetermined tension to the fed laminated tape 5. The double-sided tape feeding mechanism 12 (double-sided tape feeding means) feeds the base tape 6 after the ACF tape is adhered and removed by the tape feeding drive roller 40 and the driven roller 41 to the downstream side, so that the supply reel 11a is removed. The laminated tape 5 is pulled out and conveyed along the conveying path.

The double-sided tape cutting mechanism 13 uses the laminated tape 5
Cutting blade unit 23 having a cutting blade that moves back and forth with respect to
Is arranged so that it can be moved up and down by a moving mechanism including a motor 20, a feed screw 21, and a nut 22. By driving the cutting blade unit 23 with the laminated tape 5 hanging from the tension roller 18 along the cutting guide portion 24, the notch 5a is formed in the ACF of the laminated tape 5. A plurality of ACF tape pieces (double-sided tape pieces) 7 having a predetermined length are formed by successively making the notches 5a at a predetermined pitch while the laminated tape 5 is being conveyed.

At this time, by driving the motor 20 to move the cutting blade unit 23 in the vertical direction, the ACF tape piece 7 having a desired length can be obtained. Here, the length of the ACF tape piece 7 is set to the length dimension b according to the size of the attachment position 4a shown in FIG.

Guide rollers 25a, 25b and 25c, 25d are horizontally arranged at the lower end of the frame 10a. ACF by the double-sided tape cutting mechanism 13
The laminated tape 5 on which the tape piece 7 is formed and which is pulled out to the downstream side is provided with the guide rollers 25a, 25b, 25c,
The tape is conveyed to the downstream side along the tape conveying path that circulates on the lower surface side of 25d. In this tape transport path, a first pressure bonding head 15 is arranged between the upstream guide rollers 25a and 25b, and a second pressure bonding head 16 is arranged between the downstream guide rollers 25c and 25d. There is. A guide member other than the guide roller may be used as the guide means for guiding the conveyance of the laminated tape 5 along the tape conveyance path.

The first crimping head 15 and the second crimping head 16 are provided with crimping tools 15a and 16a, respectively, and the laminated tape 5 on which the ACF tape piece 7 is formed is guided by the guide rollers 25a, 25b, 25c and 25d. The ACF tape piece 7 is pressed against the upper surface of the substrate 4 from the side of the base tape 6 by lowering the pressure bonding tools 15a and 16a while being circulated to the lower surface side. It is pressure-bonded to the attachment position 4a. Here, the second pressure-bonding head 16 pressure-bonds the ACF tape piece 7 which is not pressure-bonded by the first pressure-bonding head 15 and is conveyed to the downstream side, to the substrate 4.

At this time, the double-sided tape transport mechanism 12 transports the laminated tape 5 along the tape transport path so that one of the plurality of ACF tape pieces 7 is moved by the pressure bonding tool 15a of the first pressure bonding head 15. The ACF tape piece 7 can be positioned not only at the crimping position (first crimping position) but also at the crimping position (second crimping position) by the crimping tool 16a of the second crimping head 16. As a result, the ACF tape piece 7 can be simultaneously pressure-bonded to the two bonding positions (first bonding position and second bonding position) 4a of the substrate 4 by the first pressure bonding head 15 and the second pressure bonding head 16. It is possible.

Here, the width dimension B1 of the crimping tool 15a of the first crimping head 15 is set to be equal to the length dimension b of the ACF tape piece 7 to be crimped, and the second crimping head 15a. Width dimension B of 16 crimping tools 16a
2 is set to be larger than the length dimension b of the ACF tape piece 7. That is, the second pressure bonding head 1
In crimping by 6, the ACF tape piece 7 to be crimped
Since the ACF tape piece 7 is not already crimped upstream in both the upstream side and the downstream side, there is no inconvenience even if the width dimension B2 of the crimping tool 16a is larger than the length dimension b of the ACF tape piece 7. .

As a result, even when a plurality of types of substrates 4 with different pitches of the bonding positions set on the substrate 4 and the intervals D shown in FIG. It is not necessary to change the interval between the second pressure bonding heads 16 to match the pitch of the sticking positions 4a accurately, and the same sticking device can be used.

A tape peeling mechanism 14 is arranged between the first pressure bonding head 15 and the second pressure bonding head 16.
The tape peeling mechanism 14 has a configuration in which guide rollers 25b and 25c and a revolving roller 32 are arranged on an elevating plate 30 that moves up and down along the frame 10a. The laminated tape 5 that has passed below the first pressure bonding head 15 is guided by the guide roller 2
The lower surface of 5b, the upper surface of the revolving roller 32, and the lower surface of the guide roller 25c are sequentially circulated, and are fed below the second pressure bonding head 16 on the downstream side.

The elevating plate 30 is connected to an elevating mechanism 35 via a connecting member 36. The lifting mechanism 35 is a motor 39,
The motor 3 includes a feed screw 38 and a nut 37.
By driving 9 to rotate, the elevating plate 30 coupled to the nut 37 via the connecting member 36 moves up and down. As will be described later, when the ACF tape piece 7 is pressure-bonded to the substrate 4, the elevating plate 30 is raised so that the guide rollers 25b and 25c are both raised, whereby only the base tape 6 is lifted and the substrate 4 is moved. It is peeled off from the ACF tape piece 7 attached to.

The plate 3 holding the orbiting roller 32
1 is vertically movable relative to the lift plate 30, and the vertical position of the plate 31 can be finely adjusted by the feed screw 33 and the micrometer head 34. By rotating the micrometer head 34 to adjust the vertical position of the orbiting roller 32, the orbiting length of the laminated tape 5 orbiting the guide roller 25b, the orbiting roller 32, and the guide roller 25c is adjusted.

As a result, the first pressure bonding head 15 and the second pressure bonding head 15
Of the plurality of ACF tape pieces 7 formed on the laminated tape 5 by the double-sided tape transport mechanism 12 can be adjusted in length (tape length between heads) of the laminated tape 5 interposed between the laminated tape 5 and the pressure bonding head 16. When one of them is located at the first crimping position by the crimping tool 15a of the first crimping head 15, the other ACF tape piece 7 is located at the second crimping position by the second crimping head 16. Thus, the head-to-head tape length between the first pressure bonding head 15 and the second pressure bonding head 16 can be adjusted. That is, the feed screw 33, the micrometer head 34, and the orbiting roller 3
2 is a head-to-head tape length adjusting means.

The base tape 6 after the ACF tape piece 7 is pressure-bonded by the second pressure-bonding head 16 is circulated around the guide roller 25d and is fed upward, and is passed through the tape feeding drive roller 40 of the double-sided tape feeding mechanism 12. The tape collecting unit 42 is vacuum-sucked and collected.

Next, the structure of the control system of the double-sided tape sticking device will be described with reference to FIG. The control unit 43 includes a double-sided tape supply mechanism 11, a double-sided tape transport mechanism 12, a double-sided tape cutting mechanism 13, a tape peeling mechanism 14, an XY table 2,
The operations of the first crimping head 15 and the second crimping head 16 are controlled. The operation input unit 44 includes a control command input for controlling the operation of each unit, various data inputs, etc.
Input operation to 3. The display monitor 45 displays a guide screen at the time of operation input and various notification screens.

Next, a method of attaching the double-sided tape will be described with reference to FIGS. FIG. 4 shows a state where the ACF tape piece 7 has already been attached to the two attachment positions A-7 and B-7 in the process of attaching the ACF tape piece 7 to the substrate 4 shown in FIG. There is.
At this time, the double-sided tape cutting mechanism 13 makes cuts 5a at a predetermined pitch in the ACF of the laminated tape 5 on the upstream side of the first pressure bonding head 15, and the ACF tape piece 7 is formed.
Are formed.

The laminated tape 5 between the first pressure bonding head 15 and the second pressure bonding head 16 has a range in which the ACF tape piece 7 has already been pressure bonded and only the base tape 6 and AC.
There is one area where the F tape piece 7 remains attached and one area is skipped. On the downstream side of the second pressure bonding head 16, all the ACF tape pieces 7 are already pressure bonded to the substrate 4 and do not exist, but only the base tape 6 is present.

Here, the pasting position A- to be pasted next time
4 and B-4 respectively drive the XY table 2 to align the substrate 4 with the first pressure bonding head 15,
It is located directly below the second crimping head 16 and has an AC
The F tape pieces 7 are also aligned with the crimping tool 15a and the crimping tool 16a, respectively. Then, in this state, as shown in FIG. 5, the crimping tool 15a, the crimping tool 1
6a is lowered and the ACF tape piece 7 is pressed against the upper surface of the substrate 4 from the base tape 6 side. As a result, AC
The F tape piece 7 is pressure-bonded to the attachment positions A-4 and B-4 of the substrate 4.

Next, tape peeling is performed. That is, as shown in FIG. 6, after the crimping tools 15a, 16a of the first crimping head 15 and the second crimping head 16 are respectively raised, the motor 39 of the elevating mechanism 35 is driven to drive the tape peeling mechanism 14. The lift plate 30 is raised. As a result, both the guide rollers 25b, 25c and the orbiting roller 32 connected to the lift plate 30 ascend, and the first pressure bonding head 15
And the laminated tape 5 located between the second pressure bonding head 16 and the second pressure bonding head 16. As a result, the attachment positions A-4, B of the substrate 4
Only the base tape 6 is peeled off from the upper surface of the ACF tape piece 7 attached to -4.

Next, tape feeding and double-sided tape cutting are performed. As shown in FIG. 7, first, the motor 39 is driven to lower the lifting plate 30 of the tape peeling mechanism 14 to the normal position. Then, the tape feed drive roller 40 of the double-sided tape transport mechanism 12 is driven to move the base tape 6 to the downstream side.
The sheet is conveyed by a predetermined length corresponding to the pitch. Then, the cutting blade unit 23 of the double-sided tape cutting mechanism 13 is advanced and retracted with respect to the laminated tape 5 to form the cut 5a, and only the ACF tape is cut. As a result, only one new ACF tape piece 7 is formed.

Two bonding positions 4a are formed by the two pressure bonding heads of the first pressure bonding head 15 and the second pressure bonding head 16.
In the crimping method in which crimping is simultaneously performed on
Two ACF tape pieces 7 are consumed for each attachment operation. Therefore, in the double-sided tape cutting process, it is always necessary to continuously form the two ACF tape pieces 7.

That is, from the state shown in FIG. 7, as shown in FIG. 8, the double-sided tape transport mechanism 12 further transports the base tape 6 by one pitch downstream, and the double-sided tape cutting mechanism 13 makes a new cut 5a. Insert, AC
Another piece of F tape 7 is formed. Further, along with this operation, the XY table 2 is driven to move the substrate 4, and the new attaching positions A-1 and B-1 are set to the first pressure bonding head 15,
It is aligned below the second crimp head 16.

As a result, the laminated tape 5 in the tape transport path from the supply reel 11a to the tape collecting section 42.
The state of is similar to that shown in FIG. Then, from this state, the ACF tape piece 7 is newly attached continuously, and the same process is repeated, so that the ACF tape piece 7 is pressure-bonded to all the attachment positions 4a of the substrate 4.

That is, the above-mentioned double-sided tape attaching method is a double-sided tape cutting step of forming a plurality of ACF tape pieces 7 of a predetermined length on the base tape 6 by cutting the ACF tape on the tape transport path at a predetermined pitch. And a first pressure-bonding head 15 and a second pressure-bonding head 16 which are sequentially arranged from the upstream side along the tape transport path downstream of the double-sided tape cutting mechanism 13 by transporting the base tape 6 downstream. A double-sided tape positioning step of positioning one of the plurality of ACF tape pieces 7 at the positions of the respective pressure bonding tools, and the first pressure bonding head 15
And a pressure-bonding step of pressure-bonding the ACF tape piece 7 positioned at the pressure-bonding position of each pressure-bonding head by the second pressure-bonding head 16 against the substrate 4 from the side of the base tape 6 to pressure-bond the substrate 4. Has become.

Then, the AC by the first pressure bonding head 15
Pressure bonding of the F tape piece 7 and AC by the second pressure bonding head 16
Simultaneously press-bonding the F tape piece, and the first press-bonding head 1
The ACF tape piece 7 is attached to the first attachment position of the substrate 4 by
And the second crimping head 16 is used to
The ACF tape piece 7 is pressure-bonded to the attachment position.

As a result, AC is applied to a large number of places on one substrate.
When it is necessary to apply F, it is possible to supply ACF tape pieces to a plurality of pressure bonding heads using a single double-sided tape supplying means and perform a bonding process at a plurality of positions at the same time, which is a compact and inexpensive double-sided tape. A pasting device is realized.

(Second Embodiment) FIG. 9 is a front view of a double-sided tape sticking apparatus according to a second embodiment of the present invention. In FIG. 9, a board positioning portion 1A is arranged below a double-sided tape sticking unit 10 similar to that shown in the first embodiment. The board positioning unit 1A is used for the XY table 2.
A substrate holding table 3A, which is a work holding unit, is placed on A.

The substrate holding table 3A holds a plurality of substrates 4A (workpieces) each provided with an ACF tape attachment position (see attachment position 4a shown in FIG. 2) which is a double-sided tape. The substrate holding table 3A moves by driving the XY table 2A, and the plurality of substrates 4A move relative to the tape transport path of the double-sided tape sticking unit 10. By relatively moving the substrate 4A in this manner, the two substrates 4A are aligned with the positions of the two ACF tape pieces 7 to be respectively crimped by the first pressure bonding head 15 and the second pressure bonding head 16. You can

That is, in the double-sided tape sticking apparatus according to the second embodiment, the substrate holding table 3A for holding the plurality of substrates 4A and the substrate holding table 3A are moved relative to the tape transport path. Multiple substrates 4
One substrate 4A of A and the ACF tape piece 7 to be pressure-bonded by the first pressure bonding head 15 are aligned, and the other substrate 4A and the ACF tape piece 7 to be pressure-bonded by the second pressure bonding head 16 are It is configured to include an XY table 2A which is a positioning means for positioning the. Also in this Embodiment 2, ACF tape pieces can be supplied to a plurality of pressure bonding heads by one double-sided tape supplying means, so that ACF tapes can be attached to a plurality of positions efficiently with inexpensive equipment. Has become.

(Third Embodiment) FIG. 10 is a front view of a double-sided tape sticking apparatus according to a third embodiment of the present invention. Figure 1
0, the board positioning portion 1B is provided below the double-sided tape sticking unit 10 similar to that shown in the first embodiment.
Is provided. The board positioning portion 1B is the first XY
On the table 2B-1 and the second XY table 2B-2,
A first substrate holding table 3B-1 (first work holding unit) and a second substrate holding table 3B-2 (second work holding unit) are placed on the respective substrates.

The first substrate holding table 3B-1 and the second substrate holding table 3B-2 each have an AC double-sided tape.
A plurality of substrates 4B (workpieces) each provided with an F tape attaching position (see attaching position 4a shown in FIG. 2) are held. The first substrate holding table 3B-1 and the second substrate holding table 3B are driven by driving the first XY table 2B-1 and the second XY table 2B-2.
-2 moves, and the plurality of substrates 4B held by these move relative to the tape transport path of the double-sided tape sticking unit 10.

By relatively moving the substrate 4B in this manner, the substrate 4B held on the first substrate holding table 3B-1 is aligned with the ACF tape piece 7 to be pressure-bonded by the first pressure bonding head 15. At the same time, the second substrate 4B held on the second substrate holding table 3B-2 is
ACF tape piece 7 to be crimped by the crimping head 16 of
Can be aligned with.

That is, in the double-sided tape sticking apparatus according to the third embodiment, the first substrate holding table 3B-1 holding the substrate 4B and the substrate holding table 3B-1 are relatively arranged with respect to the tape transport path. By moving the substrate 4B held on the substrate holding table 3B-1 relative to the tape transport path, the substrate 4B held on the substrate holding table 3B-1 is moved to the first pressure bonding head. A first XY table 2B-1 which is a first alignment means for aligning the ACF tape piece 7 to be pressed by 15; a second substrate holding table 3B-2 which holds the substrate 4B; and a substrate holding By moving the table 3B-2 relative to the tape transport path, the substrate 4B held by the substrate holding table 3B-2 is moved relative to the tape transport path. The second alignment means for aligning the substrate 4B held by the substrate holding table 3B-2 with the ACF tape piece 7 to be pressure-bonded by the second pressure-bonding head 16 by moving the pair 4 XY
The table 2B-2 is provided.

(Fourth Embodiment) FIG. 11 is a front view of a double-sided tape sticking apparatus according to a fourth embodiment of the present invention. Figure 1
1, the double-sided tape sticking unit 10 ′ includes a double-sided tape supply mechanism 11, a double-sided tape transport mechanism 12, a double-sided tape cutting mechanism 13, a tape peeling mechanism 14, and three pressure bonding heads 17. Double-sided tape feeding mechanism 1
1, double-sided tape transport mechanism 12, double-sided tape cutting mechanism 1
3. The tape peeling mechanism 14 has the same configuration as that of the first embodiment, and the pressure bonding head 17 is the same as the first pressure bonding head 15 of the first embodiment.

Below the double-sided tape sticking unit 10 ', a board positioning portion 1C constituted by placing a board holding table 3C on an XY table 2C is arranged.
The substrate 4C is held on the substrate holding table 3C. The board 4C has a larger number of attachment positions than the board 4 shown in the first embodiment. Then, the pressure bonding of the ACF tape pieces for these bonding positions is performed simultaneously by the three pressure bonding heads 17.

Also in this case, the ACF tape pieces can be supplied to a plurality of pressure bonding heads by one double-sided tape supplying means, so that the ACF tapes can be attached to a plurality of positions efficiently with inexpensive equipment. Has become. In Embodiment 1, an anisotropic conductor is used as an example of the double-sided tape, but the double-sided tape can be applied to the case where another double-sided tape is attached.

[0056]

According to the present invention, a double-sided tape cutting means for forming a plurality of double-sided tape pieces of a predetermined length on the base tape by making a cut in the double-sided tape on the tape transport path, and the tape transport downstream thereof. A plurality of pressure-bonding heads including a first pressure-bonding head and a second pressure-bonding head, which are sequentially arranged along the path from the upstream side, are provided, and one of the plurality of double-sided tape pieces is used by the first pressure-bonding head. Double-sided tape to a plurality of positions by one tape supply means by pressure-bonding to the work and pressure-bonding the double-sided tape piece conveyed downstream without being pressure-bonded to the first pressure-bonding head by the second pressure-bonding head to the work. A piece can be attached.

[Brief description of drawings]

FIG. 1 is a front view of a double-sided tape sticking device according to a first embodiment of the present invention.

FIG. 2 is a plan view of a substrate to which the double-sided tape according to the first embodiment of the present invention is attached.

FIG. 3 is a block diagram showing a configuration of a control system of the double-sided tape sticking device according to the first embodiment of the present invention.

FIG. 4 is a process explanatory view of the method for sticking the double-sided tape according to the first embodiment of the present invention.

FIG. 5 is a process explanatory view of the method for sticking the double-sided tape according to the first embodiment of the present invention.

FIG. 6 is a process explanatory view of the method for sticking the double-sided tape according to the first embodiment of the present invention.

FIG. 7 is a process explanatory view of the method for sticking the double-sided tape according to the first embodiment of the present invention.

FIG. 8 is a process explanatory view of the method for sticking the double-sided tape according to the first embodiment of the present invention.

FIG. 9 is a front view of a double-sided tape sticking device according to a second embodiment of the present invention.

FIG. 10 is a front view of a double-sided tape sticking device according to a third embodiment of the present invention.

FIG. 11 is a front view of a double-sided tape sticking device according to a fourth embodiment of the present invention.

[Explanation of symbols]

1 PCB positioning part 2 XY table 3 substrate holding table 4 substrates 4a Attachment position 5 laminated tape 6 base tape 7 ACF tape piece 10 Double-sided tape sticking unit 11 Double-sided tape supply mechanism 12 Double-sided tape transport mechanism 13 Double-sided tape cutting mechanism 14 Tape peeling mechanism 15 First crimping head 16 Second crimping head

Claims (9)

[Claims] 1. A double-sided tape supplied in a state of being attached to one surface of a base tape is conveyed along a tape conveying path,
A double-sided tape sticking device, which is cut to a predetermined length and stuck to a work, wherein a plurality of double-sided tape pieces of a predetermined length are formed on a base tape by cutting the double-sided tape on the tape transport path at a predetermined pitch. A double-sided tape cutting means to be formed, and a plurality of pressure-bonding heads including at least a first pressure-bonding head and a second pressure-bonding head, which are sequentially arranged from the upstream side along a tape transport path downstream of the double-sided tape cutting means. The first pressure-bonding head pressure-bonds one of the plurality of double-sided tape pieces to the work from the side of the base tape, and the second pressure-bonding head compresses the work. By pressing the double-sided tape piece, which has been conveyed to the downstream side without being pressure-bonded by the pressure-bonding head, from the base tape side to the workpiece, the double-sided tape piece is pressure-bonded to the workpiece. Joining apparatus sided tape, characterized by being made. 2. One of the plurality of double-sided tape pieces is positioned at a first pressure-bonding position by the first pressure-bonding head by transporting the tape along the tape transport path, and the other double-sided tape is positioned. The double-sided tape sticking device according to claim 1, further comprising: a double-sided tape transporting unit that positions the tape piece at a second pressure-bonding position by the second pressure-bonding head. 3. When one of the plurality of double-sided tape pieces is positioned at a first pressure-bonding position by the first pressure-bonding head, another double-sided tape piece is moved by the second pressure-bonding head. The head-to-head tape length adjusting means for adjusting the head-to-head tape length between the first pressure-bonding head and the second pressure-bonding head is provided so as to be located at the second pressure-bonding position. Item 1. A double-sided tape sticking device according to Item 1. 4. A work holding part for holding a work, and both surfaces to be crimped by a first attaching position of the work and a first crimping head by moving the work holding part relative to a tape transport path. The alignment means for aligning the tape piece and the second attachment position of the work and the double-sided tape piece crimped by the second crimping head are provided. Adhesive device for double-sided tape. 5. A work holding part for holding a plurality of works,
By moving the work holding portion relative to the tape transport path, one work of the plurality of works and the double-sided tape piece crimped by the first crimping head are aligned, and The double-sided tape sticking device according to claim 1, further comprising: a positioning unit configured to position another work of the plurality of works and a double-sided tape piece crimped by the second crimping head. 6. A first work holding part for holding a work,
By moving the first work holder relative to the tape transport path, the work held by the first work holder and the double-sided tape piece crimped by the first crimp head are positioned. First aligning means for aligning, second work holding part for holding the work, and second work holding part by moving the second work holding part relative to the tape transport path. 2. The double-sided tape sticking device according to claim 1, further comprising a second alignment means for aligning the work held by the section and the double-sided tape piece crimped by the second crimping head. 7. A double-sided tape supplied in a state of being attached to one surface of a base tape is conveyed along a tape conveying path,
A method for applying a double-sided tape, which is cut to a predetermined length and attached to a work, wherein a plurality of double-sided tape pieces having a predetermined length are formed on a base tape by cutting the double-sided tape on the tape transport path at a predetermined pitch. A double-sided tape cutting step for forming, and by transporting the base tape to the downstream side, at least a first pressure-bonding head and a second pressure-bonding head which are sequentially arranged from the upstream side along a tape transport path downstream of the double-sided tape cutting means. One of the plurality of double-sided tape pieces at each crimping position by a plurality of crimping heads including a crimping head
Double-sided tape positioning step to position each one,
A pressure-bonding step of pressure-bonding the double-sided tape pieces positioned at the pressure-bonding positions of the respective pressure-bonding heads by the first pressure-bonding head and the second pressure-bonding head to the work by pressing it from the side of the base tape. A method for applying a double-sided tape, which is characterized in that 8. The double-sided tape sticking method according to claim 7, wherein the double-sided tape is pressed by the first pressure-bonding head and the double-sided tape is pressure-bonded by the second pressure-bonding head at the same time. 9. The double-sided adhesive tape piece is pressure-bonded to the first attachment position of the work by the first pressure-bonding head, and the double-sided tape piece is pressure-bonded to the second attachment position of the work by the second pressure-bonding head. The method for applying the double-sided tape according to claim 7 or 8.