JP2003137474A - Cutting and sticking device of two-sided adhesive tape - Google Patents

Abstract

PROBLEM TO BE SOLVED: To securely cut a two-sided adhesive tape in pressing by a pressing and attaching means when a half cut cutting is formed on the two-sided adhesive tape with a base film by a cutter and then the two-sided adhesive tape is pressed and is stuck on a stuck object from a side of the base film by the pressing and attaching means. SOLUTION: Two cuttings C1, C2 are formed on the two-sided adhesive tape 1 by the cutter with at least two blades when the half-cut cutting is formed by the cutter on the two-sided adhesive tape (for example an ACF) with the base film 3 conveyed to a sticking stage S with the stuck object P (for example a liquid crystal display panel) placed, and then the two-sided adhesive tape 1 is pressed and is stuck on the stuck object from the side of the base film 3 by a pressing and attaching head 31.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a double-sided pressure-sensitive adhesive tape cutting / sticking device for making a cut in a double-sided pressure-sensitive adhesive tape that is continuously or intermittently fed, peeling it off from a base film and sticking it to an object to be bonded. INDUSTRIAL APPLICABILITY The present invention is used particularly when an anisotropic conductive film is attached to a terminal portion of a liquid crystal display panel.

[0002]

2. Description of the Related Art For example, TC is used for a terminal portion of a liquid crystal display panel.
When connecting a P substrate or a flexible wiring board or mounting an IC chip, a thermosetting anisotropic conductive film (ACF; a)
Nisotropic conductive fill
m) is often used. The anisotropic conductive film is a film formed by mixing conductive particles into a thermosetting binder resin.
By heating and pressurizing between the two conductors, the conductive particles establish conduction between the conductors, and the binder resin holds the connection between the conductors.

FIG. 5 is a schematic view showing an example of an anisotropic conductive film cutting / sticking device used in the actual manufacturing process of a liquid crystal display panel. Since the binder resin of the anisotropic conductive film 1 has adhesiveness even at room temperature, the anisotropic conductive film 1 is carried on the base film 2 and covered with the cover film 3 in the actual production process. Supplied as T and processed automatically.

That is, the tape body T is formed by the transport roller 1
1, the liquid crystal display panel (object to be adhered) P is conveyed toward the adhesion stage S on which it is mounted. Cover film 3
Is peeled off by the peeling roller 12 before reaching the attachment stage S. A cutter 21 and its pedestal 23 are provided on the upstream side of the attachment stage S.

The cutter 21 has one blade 21a, and the blade 21a cuts the anisotropic conductive film 1. The break is not a full cut that cuts the entire film, but a half cut that leaves an uncut portion in a part of the film. If this is a full cut, when the blade 21a descends, the edge of the film is
This is because there is a case where it adheres to 1a and is peeled off from the base film 2.

The sticking stage S is provided with a temporary pressure bonding head 31 for pressing the anisotropic conductive film 1 from the side of the base film 2 to the terminal portion of the liquid crystal display panel P. After the anisotropic conductive film 1 is cut by the cutter 21, it is temporarily pressure-bonded to the terminal portion of the liquid crystal display panel P by the temporary pressure-bonding head 31 and separated from the base film 2. Although not shown, for example, a TCP substrate is then placed on the anisotropic conductive film 1, and the binder resin is hardened by thermocompression bonding with a heater bar to perform main compression bonding.

[0007]

In this way, the anisotropic conductive film 1 is attached to the terminal portion of each liquid crystal display panel P. However, this has the following problems to be solved. It was

As illustrated in FIG. 6, since the cut C by the blade 21a is a half cut, if the depth thereof is not sufficient, the anisotropic conductive film 1 is well cut from the cut C even if the temporary pressure bonding head 31 is pressed. It may not be cut and sticking may occur.

Further, as shown in FIG.
The cut C may enter below the temporary pressure bonding head 31 due to variations in the feed amount of the
The part including the part may be crimped, resulting in defective cutting.

[0010]

In order to solve the above-mentioned problems, the present invention relates to a tape conveying means for conveying a double-sided adhesive tape with a base film toward an attaching stage on which an adherend is placed, and the above-mentioned. A cutter arranged on the upstream side of the sticking stage for making a cut in the double-sided adhesive tape, and a cutter arranged on the sticking stage for pressing the double-sided adhesive tape from the base film side to the adherend. In a double-sided pressure-sensitive adhesive tape cutting / sticking device including a pressure-bonding means for wearing, the cutter has at least two blades, first and second blades, which are arranged on an upstream side and a downstream side in the tape transport direction. It is characterized by having.

The distance between the first blade and the second blade is preferably in the range of 1 to 2 mm in view of the general pasting position accuracy required for this kind of pasting machine. Note that the number of blades may be three or more if necessary.

The present invention can be applied to all tapes having adhesiveness on both sides such as double-sided adhesive tape, but is particularly suitable for attaching an anisotropic conductive film to a terminal portion of a liquid crystal display panel.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION Next, an embodiment of the present invention will be described. This embodiment also relates to a case where the anisotropic conductive film 1 is attached to the terminal portion of the liquid crystal display panel P while being cut, as in the case of the prior art described above. Only the cutter 21 which is a part is shown, and regarding the other components such as the transport roller 11 and the temporary pressure bonding head 31, refer to FIG. 5 described above.

According to the invention, the cutter 21 comprises two blades 21a, 21b. In this embodiment,
One blade 21a is located upstream in the transport direction of the tape body T, and the other 21b is located downstream in the transport direction.
Both the blades 21a and 21b are arranged parallel to each other so as to be orthogonal to the transport direction of the tape body T. The blade interval may be set arbitrarily, but is preferably set within the range of 1 to 2 mm.

In this embodiment, the blades 21a, 21b
Is provided on the lifting table 22, and a receiving table 23 is arranged so as to face the lifting table 22. The pedestal 23 can also be moved up and down, and the operation of the pedestal 22 and the pedestal 23 will be described with reference to FIG.

When the lift table 22 is raised and the half-cuts are made in the anisotropic conductive film 1 by the blades 21a and 21b,
In synchronization with this, the pedestal 23 descends and presses the base film 3 side. When the elevating table 22 descends after making the break, the pedestal 23 ascends in synchronization with this and releases the base film 3 side.

In this way, the anisotropic conductive film 1 is provided with the two cuts C1 and C2 at adjacent positions and is sent to the bonding stage S. Tape body T by the transport roller 11
Is controlled so that the cut C2 on the downstream side stops before the temporary pressure bonding head 31.

Referring to FIG. 3, when the temporary pressure bonding head 31 descends to attach the anisotropic conductive film 2 to the terminal portion of the liquid crystal display panel, the anisotropic conductive film 2 has two cuts C1 and C2. Therefore, even if the depth of one half cut is insufficient, if the depth of the other half cut is sufficient, the anisotropic conductive film 2 is cut and the liquid crystal display panel It is attached to the terminal part. In addition, two breaks C
The probability that the half cut amounts of 1 and C2 are both insufficient is lower than that in the case where there is only one cut, so the rate of defective cutting is also low.

Next, even if the crimping position shifts due to excessive feeding of the tape body T, and the downstream cut C2 enters under the temporary pressure bonding head 31, as shown in FIG. 4, the upstream cut C1 remains. If it is outside the temporary pressure bonding head 31, the anisotropic conductive film 2 is cut from the cut C1.

Since the feeding accuracy in this type of tape feeding control system is usually about 1 mm, by setting the interval between the blades 21a and 21b within the range of 1 to 2 mm as described above, both the blades 21a and 21b can be moved. The probability of entering under the temporary pressure bonding head 31 can be made almost zero.

Incidentally, the anisotropic conductive film 1 has a cut C on the upstream side.
When cut at 1, the anisotropic conductive film 1 attached to the terminal portion of the liquid crystal display panel P includes a cut C2 on the downstream side, and the cut C2 is located between conductors to be connected. This may cause poor continuity. To avoid this,
The distance between the blades 21a and 21b is preferably as narrow as possible within the above range.

[0022]

As described above, according to the present invention,
After making a half-cut break with a cutter on the double-sided adhesive tape carried on the base film, when pressing the double-sided adhesive tape from the base film side to the adherend with the pressure bonding means, at least to the cutter By having two blades and making a plurality of cuts in the double-sided pressure-sensitive adhesive tape, the double-sided pressure-sensitive adhesive tape can be reliably cut when pressed by the pressure bonding means.

Further, since the cutting is performed satisfactorily, when the double-sided pressure-sensitive adhesive tape is an anisotropic conductive film, the cutting load on the binder resin containing conductive particles is reduced, so that an electrical connection is made. The reliability of is also improved.

[Brief description of drawings]

FIG. 1 is a schematic view showing an embodiment of a cutter that is a main part of the present invention.

FIG. 2 is an operation explanatory view of the cutter.

FIG. 3 is an explanatory diagram showing a first cut state during pressure bonding of an anisotropic conductive film according to the embodiment of the present invention.

FIG. 4 is an explanatory diagram showing a second cut state of the anisotropic conductive film during pressure bonding according to the embodiment of the present invention.

FIG. 5 is a schematic diagram of an anisotropic conductive film cutting / sticking device shown as an example of a conventional technique.

FIG. 6 is an explanatory view showing a cut state of the anisotropic conductive film when pressure-bonded by the conventional device.

FIG. 7 is an explanatory view showing a state in which the anisotropic conductive film cannot be cut at the time of pressure bonding with the conventional device.

[Explanation of symbols]

1 Anisotropic conductive film 2 base film 3 cover film 11 Conveyor roller 21 cutter 21a, 21b blades 22 Lifting platform 23 cradle 31 Temporary pressure bonding head P liquid crystal display panel S sticking stage T tape body

   ─────────────────────────────────────────────────── ─── Continued front page    F term (reference) 3F062 AA12 AB04 BF11 BG02 BG09                       DA08                 4J004 EA05 FA05 FA08 GA02                 4J040 JA09 LA09 NA20 PA23 PB16                       PB17

Claims (3)

[Claims] 1. A tape transport means for transporting a double-sided adhesive tape with a base film toward an attachment stage on which an adherend is placed, and a double-sided adhesive tape which is arranged upstream of the attachment stage. Cutting and pasting of a double-sided adhesive tape, which includes a cutter for making a slit and a pressure-bonding means which is arranged on the pasting stage and presses the double-sided adhesive tape from the side of the base film to the article to be pasted In the apparatus, the cutter comprises at least two blades, a first and a second blade, which are arranged on the upstream side and the downstream side in the tape transport direction, respectively.
Sticking device. 2. The distance between the first blade and the second blade is 1-2.
mm of the double-sided adhesive tape according to claim 1,
Sticking device. 3. The cutting / sticking device for a double-sided adhesive tape according to claim 1, wherein the double-sided adhesive tape is an anisotropic conductive film.