JP2003078177A - 熱電装置 - Google Patents

熱電装置

Info

Publication number
JP2003078177A
JP2003078177A JP2001264391A JP2001264391A JP2003078177A JP 2003078177 A JP2003078177 A JP 2003078177A JP 2001264391 A JP2001264391 A JP 2001264391A JP 2001264391 A JP2001264391 A JP 2001264391A JP 2003078177 A JP2003078177 A JP 2003078177A
Authority
JP
Japan
Prior art keywords
thermoelectric
substrate
electrode
lower electrode
thermoelectric device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2001264391A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003078177A5 (enExample
Inventor
Katsuhiko Onoe
勝彦 尾上
Toshiharu Hoshi
星　　俊治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Corp
Original Assignee
Yamaha Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaha Corp filed Critical Yamaha Corp
Priority to JP2001264391A priority Critical patent/JP2003078177A/ja
Publication of JP2003078177A publication Critical patent/JP2003078177A/ja
Publication of JP2003078177A5 publication Critical patent/JP2003078177A5/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2001264391A 2001-08-31 2001-08-31 熱電装置 Withdrawn JP2003078177A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001264391A JP2003078177A (ja) 2001-08-31 2001-08-31 熱電装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001264391A JP2003078177A (ja) 2001-08-31 2001-08-31 熱電装置

Publications (2)

Publication Number Publication Date
JP2003078177A true JP2003078177A (ja) 2003-03-14
JP2003078177A5 JP2003078177A5 (enExample) 2005-06-16

Family

ID=19090996

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001264391A Withdrawn JP2003078177A (ja) 2001-08-31 2001-08-31 熱電装置

Country Status (1)

Country Link
JP (1) JP2003078177A (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014204123A (ja) * 2013-04-09 2014-10-27 ハーマン ベッカー オートモーティブ システムズ ゲーエムベーハー 印刷回路基板一体型熱電冷却器／加熱器
WO2020262803A1 (ko) * 2019-06-26 2020-12-30 엘지전자 주식회사 열전 모듈 및 이를 구비한 냉장고
CN112599654A (zh) * 2020-12-22 2021-04-02 杭州大和热磁电子有限公司 一种带导电通孔的热电模块
JPWO2021079732A1 (enExample) * 2019-10-25 2021-04-29
JPWO2021079733A1 (enExample) * 2019-10-25 2021-04-29
CN113035802A (zh) * 2021-02-02 2021-06-25 日月光半导体制造股份有限公司 半导体封装结构及其形成方法
WO2025037154A1 (en) * 2023-08-11 2025-02-20 Botanic Energy Limited Heat pump, heat transfer arrangement, cooling module, turbomachine, method of pumping heat

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014204123A (ja) * 2013-04-09 2014-10-27 ハーマン ベッカー オートモーティブ システムズ ゲーエムベーハー 印刷回路基板一体型熱電冷却器／加熱器
CN113490820A (zh) * 2019-06-26 2021-10-08 Lg电子株式会社 热电模块及包括其的冰箱
WO2020262803A1 (ko) * 2019-06-26 2020-12-30 엘지전자 주식회사 열전 모듈 및 이를 구비한 냉장고
EP3933305A4 (en) * 2019-06-26 2022-11-16 LG Electronics Inc. THERMOELECTRIC MODULE AND REFRIGERATOR INCLUDING IT
CN114556602A (zh) * 2019-10-25 2022-05-27 松下知识产权经营株式会社 热电转换装置、热电转换装置的控制方法、使用热电转换装置冷却和/或加热对象物的方法及电子装置
EP4050671A4 (en) * 2019-10-25 2022-12-21 Panasonic Intellectual Property Management Co., Ltd. Thermoelectric conversion device, method for controlling thermoelectric conversion device, and method and electronic device for cooling and/or heating object using thermoelectric conversion device
JP7656866B2 (ja) 2019-10-25 2025-04-04 パナソニックＩｐマネジメント株式会社 熱電変換装置、熱電変換装置の制御方法、熱電変換装置を用いて対象物を冷却及び／又は加熱する方法及び電子デバイス
JPWO2021079733A1 (enExample) * 2019-10-25 2021-04-29
JPWO2021079732A1 (enExample) * 2019-10-25 2021-04-29
JP7656867B2 (ja) 2019-10-25 2025-04-04 パナソニックＩｐマネジメント株式会社 熱電変換装置、熱電変換装置の制御方法、熱電変換装置を用いて対象物を冷却及び／又は加熱する方法及び電子デバイス
US12167691B2 (en) 2019-10-25 2024-12-10 Panasonic Intellectual Property Management Co., Ltd. Thermoelectric conversion device, method for controlling thermoelectric conversion device, method for cooling and/or heating object by using thermoelectric conversion device, and electronic device
WO2021079732A1 (ja) * 2019-10-25 2021-04-29 パナソニックＩｐマネジメント株式会社 熱電変換装置、熱電変換装置の制御方法、熱電変換装置を用いて対象物を冷却及び／又は加熱する方法及び電子デバイス
CN112599654A (zh) * 2020-12-22 2021-04-02 杭州大和热磁电子有限公司 一种带导电通孔的热电模块
CN112599654B (zh) * 2020-12-22 2022-10-25 杭州大和热磁电子有限公司 一种带导电通孔的热电模块
CN113035802A (zh) * 2021-02-02 2021-06-25 日月光半导体制造股份有限公司 半导体封装结构及其形成方法
CN113035802B (zh) * 2021-02-02 2025-10-28 日月光半导体制造股份有限公司 半导体封装结构及其形成方法
WO2025037154A1 (en) * 2023-08-11 2025-02-20 Botanic Energy Limited Heat pump, heat transfer arrangement, cooling module, turbomachine, method of pumping heat
GB2633003A (en) * 2023-08-11 2025-03-05 Botanic Energy Ltd Heat pump, heat transfer arrangement, cooling module, turbomachine, method of pumping heat

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