JP2003078177A5 - - Google Patents

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Publication number
JP2003078177A5
JP2003078177A5 JP2001264391A JP2001264391A JP2003078177A5 JP 2003078177 A5 JP2003078177 A5 JP 2003078177A5 JP 2001264391 A JP2001264391 A JP 2001264391A JP 2001264391 A JP2001264391 A JP 2001264391A JP 2003078177 A5 JP2003078177 A5 JP 2003078177A5
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JP
Japan
Prior art keywords
substrate
thermoelectric
pair
lowermost
substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2001264391A
Other languages
English (en)
Japanese (ja)
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JP2003078177A (ja
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Publication date
Application filed filed Critical
Priority to JP2001264391A priority Critical patent/JP2003078177A/ja
Priority claimed from JP2001264391A external-priority patent/JP2003078177A/ja
Publication of JP2003078177A publication Critical patent/JP2003078177A/ja
Publication of JP2003078177A5 publication Critical patent/JP2003078177A5/ja
Withdrawn legal-status Critical Current

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JP2001264391A 2001-08-31 2001-08-31 熱電装置 Withdrawn JP2003078177A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001264391A JP2003078177A (ja) 2001-08-31 2001-08-31 熱電装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001264391A JP2003078177A (ja) 2001-08-31 2001-08-31 熱電装置

Publications (2)

Publication Number Publication Date
JP2003078177A JP2003078177A (ja) 2003-03-14
JP2003078177A5 true JP2003078177A5 (enExample) 2005-06-16

Family

ID=19090996

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001264391A Withdrawn JP2003078177A (ja) 2001-08-31 2001-08-31 熱電装置

Country Status (1)

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JP (1) JP2003078177A (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2790474B1 (en) * 2013-04-09 2016-03-16 Harman Becker Automotive Systems GmbH Thermoelectric cooler/heater integrated in printed circuit board
KR20210001074A (ko) * 2019-06-26 2021-01-06 엘지전자 주식회사 열전 모듈 및 이를 구비한 냉장고
WO2021079732A1 (ja) * 2019-10-25 2021-04-29 パナソニックＩｐマネジメント株式会社 熱電変換装置、熱電変換装置の制御方法、熱電変換装置を用いて対象物を冷却及び／又は加熱する方法及び電子デバイス
JP7656867B2 (ja) * 2019-10-25 2025-04-04 パナソニックＩｐマネジメント株式会社 熱電変換装置、熱電変換装置の制御方法、熱電変換装置を用いて対象物を冷却及び／又は加熱する方法及び電子デバイス
CN112599654B (zh) * 2020-12-22 2022-10-25 杭州大和热磁电子有限公司 一种带导电通孔的热电模块
CN113035802B (zh) * 2021-02-02 2025-10-28 日月光半导体制造股份有限公司 半导体封装结构及其形成方法
GB2633003A (en) * 2023-08-11 2025-03-05 Botanic Energy Ltd Heat pump, heat transfer arrangement, cooling module, turbomachine, method of pumping heat

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