JP2003051110A - 導体を磁気的にパターニングする方法 - Google Patents

導体を磁気的にパターニングする方法

Info

Publication number
JP2003051110A
JP2003051110A JP2002114676A JP2002114676A JP2003051110A JP 2003051110 A JP2003051110 A JP 2003051110A JP 2002114676 A JP2002114676 A JP 2002114676A JP 2002114676 A JP2002114676 A JP 2002114676A JP 2003051110 A JP2003051110 A JP 2003051110A
Authority
JP
Japan
Prior art keywords
magnetic material
magnetic
pattern
conductor
substance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002114676A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003051110A5 (https=
Inventor
Richard H Henze
リチャード・エイチ・ヘンズ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of JP2003051110A publication Critical patent/JP2003051110A/ja
Publication of JP2003051110A5 publication Critical patent/JP2003051110A5/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F4/00—Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/065—Etching masks applied by electrographic, electrophotographic or magnetographic methods
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Magnetic Heads (AREA)
  • Thin Magnetic Films (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2002114676A 2001-04-26 2002-04-17 導体を磁気的にパターニングする方法 Pending JP2003051110A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/843,484 US6676843B2 (en) 2001-04-26 2001-04-26 Magnetically patterning conductors
US09/843484 2001-04-26

Publications (2)

Publication Number Publication Date
JP2003051110A true JP2003051110A (ja) 2003-02-21
JP2003051110A5 JP2003051110A5 (https=) 2005-09-22

Family

ID=25290118

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002114676A Pending JP2003051110A (ja) 2001-04-26 2002-04-17 導体を磁気的にパターニングする方法

Country Status (6)

Country Link
US (1) US6676843B2 (https=)
EP (1) EP1267396A3 (https=)
JP (1) JP2003051110A (https=)
KR (1) KR20020083146A (https=)
CN (1) CN1383202A (https=)
TW (1) TW527634B (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106551501B (zh) * 2015-09-25 2018-09-14 富泰华工业（深圳）有限公司 用于生成图像的磁性扫描装置及磁性扫描方法
TWI584970B (zh) 2015-09-25 2017-06-01 鴻海精密工業股份有限公司 用於生成圖像的磁性掃描裝置及磁性掃描方法
CN111376634A (zh) * 2018-12-31 2020-07-07 大连良华科技有限公司 一种冰雕景观造型方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5990806A (ja) * 1982-11-16 1984-05-25 Canon Inc 微細パタ−ンの加工方法
US4684547A (en) * 1985-12-27 1987-08-04 International Business Machines Corporation Format patterning method for magnetic recording media
JP2913936B2 (ja) * 1991-10-08 1999-06-28 日本電気株式会社 半導体装置の製造方法
US5221417A (en) * 1992-02-20 1993-06-22 At&T Bell Laboratories Conductive adhesive film techniques
US5804487A (en) * 1996-07-10 1998-09-08 Trw Inc. Method of fabricating high βHBT devices
US6174449B1 (en) * 1998-05-14 2001-01-16 Micron Technology, Inc. Magnetically patterned etch mask
US6433944B1 (en) * 1998-09-25 2002-08-13 Fuji Photo Film Co., Ltd. Master carrier for magnetic transfer and method for transfer
US6238582B1 (en) * 1999-03-30 2001-05-29 Veeco Instruments, Inc. Reactive ion beam etching method and a thin film head fabricated using the method
JP2001084554A (ja) * 1999-09-14 2001-03-30 Fuji Photo Film Co Ltd 磁気記録媒体

Also Published As

Publication number Publication date
EP1267396A3 (en) 2003-11-12
US6676843B2 (en) 2004-01-13
EP1267396A2 (en) 2002-12-18
US20020158044A1 (en) 2002-10-31
TW527634B (en) 2003-04-11
CN1383202A (zh) 2002-12-04
KR20020083146A (ko) 2002-11-01

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