JP2003046230A5 - - Google Patents

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Publication number
JP2003046230A5
JP2003046230A5 JP2001235353A JP2001235353A JP2003046230A5 JP 2003046230 A5 JP2003046230 A5 JP 2003046230A5 JP 2001235353 A JP2001235353 A JP 2001235353A JP 2001235353 A JP2001235353 A JP 2001235353A JP 2003046230 A5 JP2003046230 A5 JP 2003046230A5
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JP
Japan
Prior art keywords
base material
circuit board
semiconductor chip
hole
mounting method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001235353A
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English (en)
Japanese (ja)
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JP2003046230A (ja
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Publication date
Application filed filed Critical
Priority to JP2001235353A priority Critical patent/JP2003046230A/ja
Priority claimed from JP2001235353A external-priority patent/JP2003046230A/ja
Publication of JP2003046230A publication Critical patent/JP2003046230A/ja
Publication of JP2003046230A5 publication Critical patent/JP2003046230A5/ja
Pending legal-status Critical Current

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JP2001235353A 2001-08-02 2001-08-02 構造体及びこの構造体を用いた実装方法 Pending JP2003046230A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001235353A JP2003046230A (ja) 2001-08-02 2001-08-02 構造体及びこの構造体を用いた実装方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001235353A JP2003046230A (ja) 2001-08-02 2001-08-02 構造体及びこの構造体を用いた実装方法

Publications (2)

Publication Number Publication Date
JP2003046230A JP2003046230A (ja) 2003-02-14
JP2003046230A5 true JP2003046230A5 (enrdf_load_stackoverflow) 2005-07-07

Family

ID=19066811

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001235353A Pending JP2003046230A (ja) 2001-08-02 2001-08-02 構造体及びこの構造体を用いた実装方法

Country Status (1)

Country Link
JP (1) JP2003046230A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006173460A (ja) * 2004-12-17 2006-06-29 Renesas Technology Corp 半導体装置の製造方法
JP5442990B2 (ja) 2008-12-24 2014-03-19 京セラ株式会社 回路装置の製造方法及び電子機器の製造方法
CN111757611B (zh) * 2020-06-05 2021-12-31 深圳市隆利科技股份有限公司 一种应用于miniLED的安装结构及其制作方法

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