JP2003017859A - Manufacturing method of printed circuit board and printed circuit board formed thereby - Google Patents
Manufacturing method of printed circuit board and printed circuit board formed therebyInfo
- Publication number
- JP2003017859A JP2003017859A JP2001204023A JP2001204023A JP2003017859A JP 2003017859 A JP2003017859 A JP 2003017859A JP 2001204023 A JP2001204023 A JP 2001204023A JP 2001204023 A JP2001204023 A JP 2001204023A JP 2003017859 A JP2003017859 A JP 2003017859A
- Authority
- JP
- Japan
- Prior art keywords
- sheet member
- resin film
- electric element
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、絶縁基材内に電気
素子が内蔵されたプリント基板の製造方法およびその製
造方法によって形成されるプリント基板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a printed board in which an electric element is incorporated in an insulating base material and a printed board formed by the method.
【０００２】[0002]
【従来の技術】従来から、電気素子の高密度実装化に対
応して電気素子を絶縁基材中に内蔵したプリント基板が
知られている。2. Description of the Related Art Conventionally, there has been known a printed circuit board in which an electric element is built in an insulating base material in response to high density mounting of the electric element.
【０００３】例えば特開平４−３５６９９８号公報に開
示された技術がある。この技術は、例えば、まず、多層
基板の内層基板となる両面基板の絶縁基材に座ぐりによ
り凹部を形成し、その凹部内に電気素子を配置して半田
付けを行なう。しかる後に、電気素子を半田付けした両
面基板の両面にプリプレグ等を積層プレスして多層化し
ていき、電気素子を内蔵したプリント基板を製造するも
のである。For example, there is a technique disclosed in Japanese Patent Laid-Open No. 4-356998. In this technique, for example, first, a recess is formed by spot facing in an insulating base material of a double-sided board that is an inner layer board of a multilayer board, and an electric element is placed in the recess to perform soldering. After that, a prepreg or the like is laminated and pressed on both surfaces of the double-sided board to which the electric element is soldered to form a multilayer, thereby manufacturing a printed board having the electric element built therein.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、上記の
従来技術では、内蔵される電気素子を半田付けした両面
基板に順次プリプレグ等を積層していくものであるた
め、製造工程が複雑であり、加工工数が大きくなるとい
う問題がある。However, in the above-mentioned prior art, since the prepreg and the like are sequentially laminated on the double-sided board to which the built-in electric element is soldered, the manufacturing process is complicated and There is a problem that man-hours increase.
【０００５】本発明は上記点に鑑みてなされたもので、
絶縁基材中に電気素子を内蔵するプリント基板であって
も、製造工程を簡素化することが可能なプリント基板の
製造方法およびその製造方法によって形成されるプリン
ト基板を提供することを目的とする。The present invention has been made in view of the above points,
An object of the present invention is to provide a printed circuit board manufacturing method that can simplify the manufacturing process and a printed circuit board formed by the manufacturing method even if the printed circuit board contains an electric element in an insulating base material. .
【０００６】[0006]
【課題を解決するための手段】上記目的を達成するた
め、請求項１に記載の発明のプリント基板の製造方法で
は、熱可塑性樹脂からなり、絶縁基材（３９）となる樹
脂フィルム（２３）を積層する積層工程と、積層された
樹脂フィルム（２３）の外側面、もしくは積層された樹
脂フィルム（２３）の間に、熱可塑性樹脂からなり、樹
脂フィルム（２３）とともに絶縁基材となるシート部材
（８１）を配置する配置工程と、シート部材（８１）に
形成された凹部（８２）もしくは貫通孔（９２）に電気
素子（４１）を挿設する挿設工程と、積層工程、配置工
程および挿設工程の後に、積層された樹脂フィルム（２
３）およびシート部材（８１）の積層体の両面から加圧
しつつ加熱することにより、各樹脂フィルム（２３）お
よびシート部材（８１）相互を接着する接着工程とを備
え、電気素子（４１）を、樹脂フィルム（２３）および
シート部材（８１）により形成された絶縁基材（３９）
内に封止することを特徴としている。In order to achieve the above object, in the method for producing a printed circuit board according to the present invention as set forth in claim 1, a resin film (23) which is made of a thermoplastic resin and serves as an insulating substrate (39). A sheet which is made of a thermoplastic resin and serves as an insulating base material together with the resin film (23) between the laminating step of laminating the resin film (23) and the outer surface of the laminated resin film (23) or between the laminated resin film (23). An arrangement step of arranging the member (81), an insertion step of inserting the electric element (41) into the recess (82) or the through hole (92) formed in the sheet member (81), a laminating step and an arrangement step. And the resin film (2
3) and a bonding step of bonding each resin film (23) and the sheet member (81) to each other by heating while applying pressure from both sides of the laminate of the sheet member (81) and the electric element (41). Insulating substrate (39) formed of resin film (23) and sheet member (81)
It is characterized by being sealed inside.
【０００７】これによると、接着工程において加圧しつ
つ加熱することにより、絶縁基材（３９）となる各樹脂
フィルム（２３）およびシート部材（８１）相互の接着
を一括して行なうとともに、電気素子（４１）が挿設さ
れた凹部（８２）もしくは貫通孔（９２）方向に樹脂フ
ィルム（２３）およびシート部材（８１）を塑性変形さ
せ電気素子（４１）を封止して、絶縁基材（３９）中に
電気素子（４１）を内蔵したプリント基板を製造するこ
とができる。従って、製造工程を簡素化することが可能
である。According to this method, the resin film (23) to be the insulating base material (39) and the sheet member (81) are collectively bonded together by heating while applying pressure in the bonding step, and at the same time, the electric element is formed. The resin film (23) and the sheet member (81) are plastically deformed in the direction of the recess (82) or the through hole (92) in which (41) is inserted to seal the electric element (41), and the insulating base material ( It is possible to manufacture a printed board in which the electric element (41) is incorporated in (39). Therefore, the manufacturing process can be simplified.
【０００８】また、請求項２に記載の発明のプリント基
板の製造方法では、シート部材（８１）に形成された凹
部（８２）もしくは貫通孔（９２）の寸法は、凹部（８
２）もしくは貫通孔（９２）に挿設される電気素子（４
１）の外形寸法と略同一であることを特徴としている。In the method of manufacturing a printed circuit board according to the second aspect of the present invention, the size of the recess (82) or the through hole (92) formed in the sheet member (81) is the recess (8).
2) or the electric element (4) inserted into the through hole (92)
It is characterized in that it is substantially the same as the external dimensions of 1).
【０００９】これによると、電気素子（４１）は、シー
ト部材（８１）に形成された電気素子（４１）の外形と
略同一寸法の凹部（８２）もしくは貫通孔（９２）によ
り位置決め保持される。従って、絶縁基材（３９）に対
する電気素子（４１）の位置決めが容易である。According to this, the electric element (41) is positioned and held by the recess (82) or the through hole (92) having substantially the same size as the outer shape of the electric element (41) formed on the sheet member (81). . Therefore, the positioning of the electric element (41) with respect to the insulating base material (39) is easy.
【００１０】また、請求項３に記載の発明のプリント基
板の製造方法では、シート部材（８１）に形成された凹
部（８２）もしくは貫通孔（９２）の深さは、凹部（８
２）もしくは貫通孔（９２）内に挿設される電気素子
（４１）の厚さに対し略同等以下であることを特徴とし
ている。In the method of manufacturing a printed circuit board according to the third aspect of the invention, the depth of the recess (82) or the through hole (92) formed in the sheet member (81) is the recess (8).
2) or the thickness of the electric element (41) inserted in the through hole (92) is substantially equal to or less than the thickness.
【００１１】これによると、プリント基板（１００）に
内蔵した電気素子（４１）の上下方向（樹脂フィルム等
の積層方向）の絶縁基材（３９）との界面（４１ａ）に
おいて、電気素子（４１）と絶縁基材（３９）との剥離
が発生し難い。According to this, at the interface (41a) of the electric element (41) built in the printed circuit board (100) with the insulating base material (39) in the vertical direction (the laminating direction of the resin film or the like), the electric element (41). ) And the insulating base material (39) are not easily peeled off.
【００１２】また、請求項４に記載の発明のプリント基
板の製造方法では、電気素子（４１）には、樹脂フィル
ム（２３）およびシート部材（８１）の積層方向に電極
（４２）が形成され、樹脂フィルム（２３）には、積層
工程を行なう前に、シート部材（８１）の凹部（８２）
もしくは貫通孔（９２）に挿設される電気素子（４１）
の電極（４２）の位置に対応して、接続材料（５０）が
充填されるとともに導体パターン（２２）を底部とする
有底ビアホール（２４）が形成され、接着工程において
加圧しつつ加熱することにより、接続材料（５０）を介
して、電気素子（４１）の電極（４２）と導体パターン
（２２）とを電気的に接続することを特徴としている。In the method for manufacturing a printed circuit board according to the fourth aspect of the invention, the electrode (42) is formed on the electric element (41) in the laminating direction of the resin film (23) and the sheet member (81). , The resin film (23) has a recess (82) in the sheet member (81) before the laminating step.
Alternatively, the electric element (41) inserted into the through hole (92)
Corresponding to the position of the electrode (42) of the above, a bottomed via hole (24) whose bottom is the conductor pattern (22) is filled with the connecting material (50), and heating is performed while applying pressure in the bonding step. Is characterized in that the electrode (42) of the electric element (41) and the conductor pattern (22) are electrically connected via the connection material (50).
【００１３】これによると、接着工程で加圧しつつ加熱
することによって絶縁基材（３９）となる各樹脂フィル
ム（２３）およびシート部材（８１）相互の接着を行な
いプリント基板（１００）を形成するときに、内蔵され
る電気素子（４１）と導体パターン（２２）との電気的
接続を行なうことができる。従って、内蔵される電気素
子（４１）と導体パターン（２２）との電気的接続を接
着工程前に行なう必要がないので、製造工程を一層簡素
化することが可能である。According to this, the resin film (23) serving as the insulating base material (39) and the sheet member (81) are bonded to each other by heating while applying pressure in the bonding step to form the printed circuit board (100). At times, it is possible to electrically connect the built-in electric element (41) and the conductor pattern (22). Therefore, since it is not necessary to electrically connect the built-in electric element (41) and the conductor pattern (22) before the bonding step, the manufacturing process can be further simplified.
【００１４】また、請求項５に記載の発明のプリント基
板の製造方法では、樹脂フィルム（２３）およびシート
部材（８１）は、同一の材料からなることを特徴として
いる。In the method for manufacturing a printed circuit board according to the fifth aspect of the invention, the resin film (23) and the sheet member (81) are made of the same material.
【００１５】これによると、各樹脂フィルム（２３）お
よびシート部材（８１）相互を接着し易い。従って、各
樹脂フィルム（２３）およびシート部材（８１）間を確
実に接着した絶縁基材（３９）を備えるプリント基板を
得ることができる。According to this, each resin film (23) and the sheet member (81) are easily bonded to each other. Therefore, it is possible to obtain a printed board provided with the insulating base material (39) in which the resin film (23) and the sheet member (81) are securely bonded.
【００１６】また、請求項６に記載の発明のプリント基
板の製造方法では、接着工程において、樹脂フィルム
（２３）およびシート部材（８１）の弾性率が１〜１０
００ＭＰａとなる温度で加熱することを特徴としてい
る。In the method for manufacturing a printed circuit board according to the sixth aspect of the present invention, the elastic modulus of the resin film (23) and the sheet member (81) is 1 to 10 in the bonding step.
It is characterized by heating at a temperature of 00 MPa.
【００１７】これによると、接着工程において、樹脂フ
ィルム（２３）およびシート部材（８１）の弾性率をと
もに１〜１０００ＭＰａと充分に低下させた状態で加圧
することにより各樹脂フィルム（２３）およびシート部
材（８１）相互を確実に接着することができる。また、
電気素子（４１）が挿設された凹部（８２）もしくは貫
通孔（９２）方向に樹脂フィルム（２３）およびシート
部材（８１）を容易に塑性変形させ、電気素子（４１）
を確実に封止することができる。According to this, in the adhering step, the resin film (23) and the sheet member (81) are pressed with both the elastic moduli sufficiently reduced to 1 to 1000 MPa, whereby the resin film (23) and the sheet member (81) are pressed. The members (81) can be reliably bonded to each other. Also,
By easily plastically deforming the resin film (23) and the sheet member (81) in the direction of the recess (82) or the through hole (92) in which the electric element (41) is inserted, the electric element (41)
Can be reliably sealed.
【００１８】また、請求項７に記載の発明のプリント基
板の製造方法では、積層された樹脂フィルム（２３）お
よびシート部材（８１）の積層体において、最も外側に
位置する樹脂フィルム（２３）もしくはシート部材（８
１）の外側面に放熱部材（４６）を形成する放熱部材形
成工程を備えることを特徴としている。Further, in the method for manufacturing a printed circuit board according to the invention of claim 7, in the laminated body of the laminated resin film (23) and the sheet member (81), the outermost resin film (23) or Seat member (8
It is characterized by including a heat dissipation member forming step of forming a heat dissipation member (46) on the outer surface of 1).
【００１９】これによると、最外面に放熱部材（４６）
を備えるプリント基板（１００）を得ることができる。
プリント基板の表面に放熱部材を設ける必要がある場合
には、放熱部材を設けた部分には電気素子を表面に実装
することができず、実装可能な面積が減少する。従っ
て、高密度実装化に対応するために電気素子（４１）を
内蔵するとともに、最外面に放熱部材（４６）を備える
プリント基板が得られる効果は大きい。According to this, the heat dissipation member (46) is provided on the outermost surface.
It is possible to obtain a printed circuit board (100) including
When it is necessary to provide a heat dissipation member on the surface of the printed circuit board, the electric element cannot be mounted on the surface where the heat dissipation member is provided, and the mountable area is reduced. Therefore, the printed circuit board having the electric element (41) built-in for high-density mounting and the heat dissipation member (46) on the outermost surface can be effectively obtained.
【００２０】また、請求項８に記載の発明のプリント基
板の製造方法では、積層工程、配置工程、挿設工程およ
び放熱部材形成工程後に、樹脂フィルム（２３）、シー
ト部材（８１）および放熱部材（４６）の積層体を両面
から加圧しつつ加熱することにより、各樹脂フィルム
（２３）、シート部材（８１）および放熱部材（４６）
相互の接着を行なうことを特徴としている。Further, in the printed circuit board manufacturing method according to the present invention, the resin film (23), the sheet member (81) and the heat radiating member are formed after the laminating step, the arranging step, the inserting step and the heat radiating member forming step. By heating the laminate of (46) while applying pressure from both sides, each resin film (23), sheet member (81) and heat dissipation member (46).
It is characterized by performing mutual adhesion.
【００２１】これによると、各樹脂フィルム（２３）、
シート部材（８１）および放熱部材（４６）の接着を一
括して行なうことができる。従って、放熱部材（４６）
を備えるプリント基板（１００）であっても、製造工程
を簡素化することが可能である。According to this, each resin film (23),
The sheet member (81) and the heat dissipation member (46) can be bonded together. Therefore, the heat dissipation member (46)
Even in the printed circuit board (100) provided with, it is possible to simplify the manufacturing process.
【００２２】また、請求項１〜４に記載のプリント基板
の製造方法によって、請求項９に記載の発明のように、
熱可塑性樹脂からなる樹脂フィルム（２３）と熱可塑性
樹脂からなるシート部材（８１）とを積層後加圧しつつ
加熱して相互に接着した絶縁基材（３９）と、シート部
材（８１）に凹部（８２）もしくは貫通孔（９２）を設
けることによって絶縁基材（３９）中に形成された空間
部（３６）に配置されるとともに、樹脂フィルム（２
３）およびシート部材（８１）の積層方向に形成された
電極（４２）がビア（２４、５１）を介して導体パター
ン（２２）と接続した電気素子（４１）とを備え、この
電気素子（４１）は、加圧しつつ加熱されることにより
空間部（３６）方向に押し出された樹脂フィルム（２
３）およびシート部材（８１）により封止され、電気素
子（４１）を絶縁基材（３９）中に内蔵していることを
特徴とするプリント基板（１００）が形成できる。According to the method of manufacturing a printed circuit board according to any one of claims 1 to 4, as in the invention according to claim 9,
An insulating base material (39) in which a resin film (23) made of a thermoplastic resin and a sheet member (81) made of a thermoplastic resin are laminated and then heated while being pressed and bonded to each other, and a recess is formed in the sheet member (81). (82) or through holes (92) are provided in the space (36) formed in the insulating base material (39) and the resin film (2) is provided.
3) and an electrode (42) formed in the stacking direction of the sheet member (81) and an electric element (41) connected to the conductor pattern (22) through vias (24, 51). 41) is a resin film (2) extruded toward the space (36) by being heated while being pressurized.
3) and the sheet member (81) are sealed, and the printed circuit board (100) characterized by including the electric element (41) in the insulating base material (39) can be formed.
【００２３】これは、内蔵された電気素子（４１）が、
各樹脂フィルム（２３）およびシート部材（８１）相互
が確実に接着して形成された絶縁基材（３９）中に封止
されるとともに、導体パターン（２２）と確実に電気的
接続されたプリント基板（１００）である。This is because the built-in electric element (41) is
A print in which each resin film (23) and sheet member (81) are sealed in an insulating base material (39) formed by surely adhering to each other and electrically connected to a conductor pattern (22). The substrate (100).
【００２４】また、請求項１０に記載の発明のプリント
基板では、樹脂フィルム（２３）およびシート部材（８
１）は、同一の材料からなることを特徴としている。According to the tenth aspect of the printed circuit board of the present invention, the resin film (23) and the sheet member (8) are provided.
1) is characterized by being made of the same material.
【００２５】これによると、各樹脂フィルム（２３）お
よびシート部材（８１）相互が確実に接着した絶縁基材
（３９）を備えるプリント基板とすることができる。According to this, the printed board can be provided with the insulating base material (39) in which the respective resin films (23) and the sheet member (81) are securely adhered to each other.
【００２６】また、請求項１１に記載の発明のプリント
基板では、絶縁基材（３９）の表面に放熱部材（４６）
が接着されていることを特徴としている。In the printed circuit board according to the eleventh aspect of the present invention, the heat dissipation member (46) is provided on the surface of the insulating base material (39).
Is characterized by being adhered.
【００２７】プリント基板の表面に放熱部材を設ける必
要がある場合には、放熱部材を設けた部分には電気素子
を表面に実装することができず、実装可能な面積が減少
する。従って、本発明のように、高密度実装化に対応す
るために電気素子（４１）を内蔵するとともに、表面に
放熱部材（４６）を備える効果は大きい。When it is necessary to provide a heat dissipation member on the surface of the printed circuit board, the electric element cannot be mounted on the surface where the heat dissipation member is provided, and the mountable area is reduced. Therefore, as in the present invention, the effect of incorporating the electric element (41) in order to cope with high-density mounting and providing the heat dissipation member (46) on the surface is great.
【００２８】なお、上記各手段に付した括弧内の符号
は、後述する実施形態記載の具体的手段との対応関係を
示す。The reference numerals in parentheses attached to the above-mentioned means indicate the correspondence with the concrete means described in the embodiments described later.
【００２９】[0029]
【発明の実施の形態】以下、本発明の実施の形態を図に
基づいて説明する。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.
【００３０】図１は、本実施形態におけるプリント基板
の製造工程を示す工程別断面図である。FIG. 1 is a cross-sectional view for each step showing the manufacturing process of the printed circuit board in this embodiment.
【００３１】図１（ａ）において、２１は樹脂フィルム
２３の片面に貼着された導体箔（本例では厚さ１８μｍ
の銅箔）をエッチングによりパターン形成した導体パタ
ーン２２を有する片面導体パターンフィルムである。本
例では、樹脂フィルム２３としてポリエーテルエーテル
ケトン樹脂６５〜３５重量％とポリエーテルイミド樹脂
３５〜６５重量％とからなる厚さ２５〜７５μｍの熱可
塑性樹脂フィルムを用いている。In FIG. 1A, 21 is a conductor foil (thickness 18 μm in this example) attached to one surface of a resin film 23.
Is a single-sided conductor pattern film having a conductor pattern 22 formed by etching a copper foil). In this example, as the resin film 23, a thermoplastic resin film having a thickness of 25 to 75 μm and made of 65 to 35% by weight of polyetheretherketone resin and 35 to 65% by weight of polyetherimide resin is used.
【００３２】図１（ａ）に示すように、導体パターン２
２の形成が完了すると、次に、図１（ｂ）に示すよう
に、樹脂フィルム２３側から炭酸ガスレーザを照射し
て、導体パターン２２を底面とする有底ビアホールであ
るビアホール２４を形成する。ビアホールの形成は、炭
酸ガスレーザの出力と照射時間等を調整することで、導
体パターン２２に穴を開けないようにしている。As shown in FIG. 1A, the conductor pattern 2
When the formation of 2 is completed, next, as shown in FIG. 1B, a carbon dioxide laser is irradiated from the resin film 23 side to form a via hole 24 which is a bottomed via hole having the conductor pattern 22 as a bottom surface. The via holes are formed by adjusting the output of the carbon dioxide gas laser, the irradiation time, and the like so that holes are not formed in the conductor pattern 22.
【００３３】ビアホール２４の形成には、炭酸ガスレー
ザ以外にエキシマレーザ等が使用可能である。レーザ以
外のドリル加工等のビアホール形成方法も可能である
が、レーザビームで穴あけ加工すると、微細な径で穴あ
けでき、導体パターン２２にダメージを与えることが少
ないため好ましい。In order to form the via hole 24, an excimer laser or the like can be used in addition to the carbon dioxide gas laser. A via hole forming method such as drilling other than laser is also possible, but drilling with a laser beam is preferable because the hole can be formed with a fine diameter and the conductor pattern 22 is less damaged.
【００３４】図１（ｂ）に示すように、ビアホール２４
の形成が完了すると、次に、図１（ｃ）に示すように、
ビアホール２４内に電気的な接続材料である導電ペース
ト５０を充填する。導電ペースト５０は、平均粒径５μ
ｍ、比表面積０．５ｍ2／ｇの錫粒子３００ｇと、平均
粒径１μｍ、比表面積１．２ｍ2／ｇの銀粒子３００ｇ
とに、有機溶剤であるテルピネオール６０ｇにエチルセ
ルロース樹脂６ｇを溶解したものを加え、これをミキサ
ーによって混練しペースト化したものである。As shown in FIG. 1B, the via hole 24
When the formation of is completed, next, as shown in FIG.
The via hole 24 is filled with a conductive paste 50 which is an electrical connection material. The conductive paste 50 has an average particle size of 5μ.
m, 300 g of tin particles having a specific surface area of 0.5 m 2 / g, and 300 g of silver particles having an average particle diameter of 1 μm and a specific surface area of 1.2 m 2 / g.
In addition, a solution prepared by dissolving 6 g of ethyl cellulose resin in 60 g of terpineol, which is an organic solvent, was added and kneaded with a mixer to form a paste.
【００３５】ここで、エチルセルロース樹脂は、導電ペ
ースト５０に保形性を付与するために添加されており、
保形性付与剤としてはアクリル樹脂等を採用することも
できる。Here, the ethyl cellulose resin is added to the conductive paste 50 in order to impart shape retention,
An acrylic resin or the like can be used as the shape-retaining agent.
【００３６】導電ペースト５０は、メタルマスクを用い
たスクリーン印刷機により、片面導体パターンフィルム
２１のビアホール２４内に印刷充填された後、１４０〜
１６０℃で約３０分間テルピネオールを乾燥させる。ビ
アホール２４内への導電ペースト５０の充填は、本例で
はスクリーン印刷機を用いたが、確実に充填ができるの
であれば、ディスペンサ等を用いる他の方法も可能であ
る。The conductive paste 50 is printed and filled in the via holes 24 of the single-sided conductor pattern film 21 by a screen printing machine using a metal mask, and then 140 to
Dry the terpineol at 160 ° C. for about 30 minutes. The conductive paste 50 is filled in the via holes 24 by using a screen printing machine in this example, but other methods using a dispenser or the like are also possible as long as the filling can be surely performed.
【００３７】ここで、ペースト化のために添加する有機
溶剤として、テルピネオール以外を用いることも可能で
あるが、沸点が１５０〜３００℃の有機溶剤を用いるこ
とが好ましい。沸点が１５０℃未満の有機溶剤では、導
電ペースト５０の粘度の経時変化が大きくなるという不
具合を発生し易い。一方、沸点が３００℃を超える有機
溶剤では、乾燥に要する時間が長くなり好ましくない。It is possible to use other than terpineol as the organic solvent added for forming the paste, but it is preferable to use an organic solvent having a boiling point of 150 to 300 ° C. An organic solvent having a boiling point of lower than 150 ° C. is likely to cause a problem that the viscosity of the conductive paste 50 changes greatly with time. On the other hand, an organic solvent having a boiling point of higher than 300 ° C. is not preferable because it takes a long time to dry.
【００３８】また、本例では、導電ペースト５０を構成
する金属粒子として、平均粒径５μｍ、比表面積０．５
ｍ2／ｇの錫粒子と、平均粒径１μｍ、比表面積１．２
ｍ2／ｇの銀粒子とを用いたが、これらの金属粒子は、
平均粒径が０．５〜２０μｍであるとともに、比表面積
が０．１〜１．５ｍ2／ｇであることが好ましい。In this example, the metal particles forming the conductive paste 50 have an average particle size of 5 μm and a specific surface area of 0.5.
m 2 / g tin particles, average particle size 1 μm, specific surface area 1.2
m 2 / g of silver particles were used.
It is preferable that the average particle size is 0.5 to 20 μm and the specific surface area is 0.1 to 1.5 m 2 / g.
【００３９】金属粒子の平均粒径が０．５μｍ未満であ
ったり、比表面積が１．５ｍ2／ｇを超える場合には、
ビアホール充填に適した粘度にペースト化するために多
量の有機溶剤を必要とする。多量の有機溶剤を含んだ導
電ペーストは乾燥に時間を要し、乾燥が不充分である
と、層間接続時の加熱により多量のガスを発生するた
め、ビアホール２４内にボイドが発生し易く、層間接続
信頼性を低下させる。When the average particle size of the metal particles is less than 0.5 μm or the specific surface area exceeds 1.5 m 2 / g,
A large amount of organic solvent is required to form a paste having a viscosity suitable for filling via holes. A conductive paste containing a large amount of an organic solvent requires a long time to dry, and if the drying is insufficient, a large amount of gas is generated by heating during interlayer connection, so that voids are easily generated in the via hole 24, and Reduce connection reliability.
【００４０】一方、金属粒子の平均粒径が２０μｍを超
えたり、比表面積が０．１ｍ2／ｇ未満の場合には、ビ
アホール２４内に充填し難くなるとともに、金属粒子が
偏在し易くなり、加熱しても均一な合金からなる後述す
る導電性組成物５１を形成し難く、層間接続信頼性を確
保し難いという問題があり好ましくない。On the other hand, when the average particle size of the metal particles exceeds 20 μm or the specific surface area is less than 0.1 m 2 / g, it becomes difficult to fill the via holes 24 and the metal particles are apt to be unevenly distributed. There is a problem that it is difficult to form a conductive composition 51, which will be described later, made of a uniform alloy even when heated, and it is difficult to secure interlayer connection reliability, which is not preferable.
【００４１】また、ビアホール２４内へ導電ペースト５
０を充填する前に、導体パターン２２のビアホール２４
に面する部位を薄くエッチング処理したり還元処理して
もよい。これによると、後述するビア接続が一層良好に
行なわれる。Further, the conductive paste 5 is placed in the via hole 24.
Before filling 0 with the via hole 24 of the conductor pattern 22.
The part facing the surface may be thinly etched or reduced. According to this, the via connection described later is more favorably performed.
【００４２】一方、図１（ｄ）において、８１はシート
部材であり、本例では、シート部材８１として、樹脂フ
ィルム２３と同じ熱可塑性樹脂であるポリエーテルエー
テルケトン樹脂６５〜３５重量％とポリエーテルイミド
樹脂３５〜６５重量％とからなる厚さ１ｍｍの熱可塑性
樹脂シートを用いている。On the other hand, in FIG. 1D, 81 is a sheet member. In this example, as the sheet member 81, 65% to 35% by weight of polyether ether ketone resin, which is the same thermoplastic resin as the resin film 23, and poly A 1 mm thick thermoplastic resin sheet composed of 35 to 65% by weight of ether imide resin is used.
【００４３】シート部材８１は、図１（ｄ）に示すよう
に、後述する内蔵される電気素子４１の配置位置に対応
した位置に、熱プレス成形加工により形成した、電気素
子４１の外形と略同一寸法の凹部８２を備えている。凹
部８２の内周面の寸法は、凹部８２内に電気素子４１を
挿設したときに、電気素子４１と、シート部材８１の凹
部８２の内周面とのクリアランスが、電気素子４１の全
周に渡って２０μｍ以上でかつ凹部８２の深さ（本例で
は０．８５ｍｍ）以下となる寸法であることが好まし
い。As shown in FIG. 1 (d), the sheet member 81 has a shape substantially the same as the outer shape of the electric element 41 formed by hot press molding at a position corresponding to the arrangement position of the electric element 41 incorporated therein, which will be described later. A recess 82 having the same size is provided. The size of the inner peripheral surface of the recess 82 is such that when the electric element 41 is inserted into the recess 82, the clearance between the electric element 41 and the inner peripheral surface of the recess 82 of the sheet member 81 is the entire circumference of the electric element 41. It is preferable that the dimension is not less than 20 μm and not more than the depth of the concave portion 82 (0.85 mm in this example).
【００４４】また、凹部８２の深さは、後述する電気素
子４１の厚さに対し略同等以下となるように形成するこ
とが好ましい。本例では、電気素子４１の厚さが０．９
ｍｍであるため、凹部８２の深さが０．８５ｍｍとなる
ように成形した。なお、凹部８２を備えるシート部材８
１の成形は、熱プレス成形加工により行なったが、射出
成形加工等により行なうことも可能である。The depth of the recess 82 is preferably formed so as to be substantially equal to or less than the thickness of the electric element 41 described later. In this example, the electric element 41 has a thickness of 0.9.
Since the thickness is mm, the recess 82 was molded so that the depth thereof was 0.85 mm. The sheet member 8 having the recess 82
The molding of No. 1 was performed by hot press molding, but it can also be performed by injection molding or the like.
【００４５】凹部８２を備えるシート部材８１の成形
と、片面導体パターンフィルム２１のビアホール２４内
への導電ペースト５０の充填および乾燥とが完了する
と、図１（ｅ）に示すように、片面導体パターンフィル
ム２１を複数枚（本例では３枚）積層するとともに、積
層された片面導体パターンフィルム２１の下方側にシー
ト部材８１を積層配置する。When the formation of the sheet member 81 having the recesses 82, the filling of the conductive paste 50 into the via holes 24 of the one-sided conductor pattern film 21 and the drying are completed, as shown in FIG. 1 (e), the one-sided conductor pattern is formed. A plurality of films 21 (three in this example) are laminated, and a sheet member 81 is laminated and arranged below the laminated single-sided conductor pattern film 21.
【００４６】このとき、片面導体パターンフィルム２１
は導体パターン２２が設けられた側を上側として積層す
る。すなわち、片面導体パターンフィルム２１は、導体
パターン２２が形成された面と導体パターン２２が形成
されていない面とが向かい合うように積層する。そして
さらに、積層された片面導体パターンフィルム２１の導
体パターン２２が形成されていない面と、シート部材８
１の凹部８２が形成された面とが向かい合うように、シ
ート部材８１を積層する。At this time, the single-sided conductor pattern film 21
Is stacked with the side provided with the conductor pattern 22 as the upper side. That is, the single-sided conductor pattern film 21 is laminated so that the surface on which the conductor pattern 22 is formed faces the surface on which the conductor pattern 22 is not formed. Furthermore, the surface of the laminated single-sided conductor pattern film 21 on which the conductor pattern 22 is not formed, and the sheet member 8
The sheet member 81 is laminated so that the surface on which the first concave portion 82 is formed faces.
【００４７】また、片面導体パターンフィルム２１とシ
ート部材８１とを積層するときに、凹部８２により形成
される空間部８３内には、例えば、抵抗体、コンデン
サ、フィルタ、ＩＣ等の電気素子４１が挿設される。電
気素子４１には、片面導体パターンフィルム２１および
シート部材８１の積層方向の面を含む両端部に電極４２
が形成されている。When the single-sided conductor pattern film 21 and the sheet member 81 are laminated, an electric element 41 such as a resistor, a capacitor, a filter or an IC is provided in the space 83 formed by the recess 82. It is inserted. In the electric element 41, the electrodes 42 are provided at both ends including the surface of the single-sided conductor pattern film 21 and the sheet member 81 in the stacking direction.
Are formed.
【００４８】そして、電気素子４１が挿設される空間部
８３の上側に積層配置される片面導体パターンフィルム
２１には、導体パターン２２と電極４２とを電気的に接
続できる位置に、導電ペースト５０が充填されたビアホ
ール２４が配置されている。Then, in the single-sided conductor pattern film 21 laminated on the upper side of the space 83 into which the electric element 41 is inserted, the conductive paste 50 is provided at a position where the conductor pattern 22 and the electrode 42 can be electrically connected. A via hole 24 filled with is arranged.
【００４９】そしてさらに、図１（ｅ）に示すように、
積層された複数層の片面導体パターンフィルム２１およ
びシート部材８１の下方側には、アルミニウム製のヒー
トシンク４６を積層する。ヒートシンク４６は本実施形
態における放熱部材である。Further, as shown in FIG. 1 (e),
A heat sink 46 made of aluminum is laminated on the lower side of the laminated single-sided conductor pattern film 21 and the sheet member 81. The heat sink 46 is the heat dissipation member in this embodiment.
【００５０】図１（ｅ）に示すように片面導体パターン
フィルム２１、シート部材８１およびヒートシンク４６
を積層したら、これらの上下両面から真空加熱プレス機
により加熱しながら加圧する。本例では、２５０〜３５
０℃の温度に加熱し１〜１０ＭＰａの圧力で１０〜２０
分間加圧した。As shown in FIG. 1E, the single-sided conductor pattern film 21, the sheet member 81 and the heat sink 46 are formed.
After being laminated, pressure is applied while heating from above and below with a vacuum heating press machine. In this example, 250-35
10 to 20 at a pressure of 1 to 10 MPa by heating to a temperature of 0 ° C
Pressurized for minutes.
【００５１】これにより、図１（ｆ）に示すように、各
片面導体フィルムパターン２１、シート部材８１および
ヒートシンク４６相互が接着される。樹脂フィルム２３
およびシート部材８１は全て同じ熱可塑性樹脂材料によ
って形成されているので、容易に熱融着して一体化した
絶縁基材３９となる。As a result, as shown in FIG. 1F, the single-sided conductor film patterns 21, the sheet member 81 and the heat sink 46 are adhered to each other. Resin film 23
Since the sheet member 81 and the sheet member 81 are all made of the same thermoplastic resin material, the insulating base material 39 is easily heat-sealed and integrated.
【００５２】さらに、ビアホール２４内の導電ペースト
５０が焼結して一体化した導電性組成物５１により隣接
する導体パターン２２の層間接続が行なわれるととも
に、電気素子４１の電極４２と導体パターン２２との接
続が行なわれ、電気素子４１を内蔵した多層のプリント
基板１００が得られる。ここで、導電性組成物５１は電
気的な接続材料であり、ビアホール２４と導電性組成物
５１とで、本実施形態のビアを構成している。Further, the conductive paste 50 in the via hole 24 is sintered to form an integrated conductive composition 51, whereby interlayer connection between adjacent conductor patterns 22 is performed, and at the same time, the electrodes 42 of the electric element 41 and the conductor pattern 22 are connected. Are connected, and a multilayer printed circuit board 100 having the electric element 41 built therein is obtained. Here, the conductive composition 51 is an electrical connection material, and the via hole 24 and the conductive composition 51 form the via of the present embodiment.
【００５３】ここで、導体パターン２２の層間接続のメ
カニズムを簡単に説明する。ビアホール２４内に充填さ
れ乾燥された導電ペースト５０は、錫粒子と銀粒子とが
混合された状態にある。そして、このペースト５０が２
５０〜３５０℃に加熱されると、錫粒子の融点は２３２
℃であり、銀粒子の融点は９６１℃であるため、錫粒子
は融解し、銀粒子の外周を覆うように付着する。Here, the mechanism of the interlayer connection of the conductor pattern 22 will be briefly described. The conductive paste 50 filled in the via holes 24 and dried is in a state in which tin particles and silver particles are mixed. And this paste 50 is 2
When heated to 50 to 350 ° C, the melting point of tin particles is 232.
Since the melting point of the silver particles is 961 ° C., the tin particles melt and adhere to cover the outer circumference of the silver particles.
【００５４】この状態で加熱が継続すると、融解した錫
は、銀粒子の表面から拡散を始め、錫と銀との合金（融
点４８０℃）を形成する。このとき、導電ペースト５０
には１〜１０ＭＰａの圧力が加えられているため、錫と
銀との合金形成に伴い、ビアホール２４内には、焼結に
より一体化した合金からなる導電性組成物５１が形成さ
れる。When heating is continued in this state, the molten tin begins to diffuse from the surface of the silver particles and forms an alloy of tin and silver (melting point 480 ° C.). At this time, the conductive paste 50
Since a pressure of 1 to 10 MPa is applied to, the conductive composition 51 made of an alloy integrated by sintering is formed in the via hole 24 with the formation of the alloy of tin and silver.
【００５５】ビアホール２４内で導電性組成物５１が形
成されているときには、この導電性組成物５１は加圧さ
れているため、導体パターン２２のビアホール２４の底
部を構成している面に圧接される。これにより、導電性
組成物５１中の錫成分と、導体パターン２２を構成する
銅箔の銅成分とが相互に固相拡散し、導電性組成物５１
と導体パターン２２との界面に固相拡散層を形成して電
気的に接続する。When the conductive composition 51 is formed in the via hole 24, since the conductive composition 51 is pressurized, it is pressed against the surface of the conductor pattern 22 constituting the bottom portion of the via hole 24. It Thereby, the tin component in the conductive composition 51 and the copper component of the copper foil forming the conductor pattern 22 are solid-phase diffused with each other, and the conductive composition 51 is formed.
A solid phase diffusion layer is formed at the interface between the conductor pattern 22 and the conductor pattern 22 to electrically connect them.
【００５６】また、電気素子４１の電極４２は、銅やニ
ッケル等の金属部材の表面に錫めっき層等を形成したも
のであり、上述の導体パターン２２の層間接続とほぼ同
様のメカニズムにより、ビアホール２４内で形成された
導電性組成物５１と、導電性組成物５１と導体パターン
２２との界面および導電性組成物５１と電極４２との界
面に形成された固相拡散層とを介して導体パターン２２
と電気的に接続する。Further, the electrode 42 of the electric element 41 is formed by forming a tin plating layer or the like on the surface of a metal member such as copper or nickel, and by the mechanism similar to the above-mentioned interlayer connection of the conductor pattern 22, a via hole is formed. A conductive composition 51 formed in the conductive layer 24 and a solid phase diffusion layer formed at the interface between the conductive composition 51 and the conductor pattern 22 and at the interface between the conductive composition 51 and the electrode 42; Pattern 22
To be electrically connected to.
【００５７】真空加熱プレス機により加圧しつつ加熱さ
れているとき、樹脂フィルム２３およびシート部材８１
の弾性率は約５〜４０ＭＰａに低下している。従って、
凹部８２の周囲のシート部材８１および凹部８２の上方
の樹脂フィルム２３は凹部８２内に押し出されるように
変形しようとする。すなわち、空間部８３の周囲の樹脂
フィルム２３やシート部材８１は空間部８３方向に押し
出される。When the resin film 23 and the sheet member 81 are heated while being pressurized by the vacuum heating press machine.
Has decreased to about 5 to 40 MPa. Therefore,
The sheet member 81 around the recess 82 and the resin film 23 above the recess 82 tend to be deformed so as to be pushed into the recess 82. That is, the resin film 23 and the sheet member 81 around the space portion 83 are extruded toward the space portion 83.
【００５８】これにより、電気素子４１は、樹脂フィル
ム２３およびシート部材８１が変形しながら一体化した
絶縁基材３９により封止される。なお、加熱プレス時の
樹脂フィルム２３およびシート部材８１の弾性率は１〜
１０００ＭＰａであることが好ましい。弾性率が１００
０ＭＰａより大きいと樹脂フィルム２３間や樹脂フィル
ム２３とシート部材８１との間等が熱融着し難いととも
に、樹脂フィルム２３およびシート部材８１を変形させ
難い。また、弾性率が１ＭＰａより小さいと加圧により
樹脂フィルムが流れ易くプリント基板１００を形成し難
い。As a result, the electric element 41 is sealed by the insulating base material 39 in which the resin film 23 and the sheet member 81 are deformed and integrated. The elastic modulus of the resin film 23 and the sheet member 81 at the time of hot pressing is 1 to
It is preferably 1000 MPa. Elastic modulus is 100
When it is greater than 0 MPa, the resin film 23 and the resin film 23 and the sheet member 81 are less likely to be heat-sealed, and the resin film 23 and the sheet member 81 are not easily deformed. Further, when the elastic modulus is less than 1 MPa, the resin film easily flows under pressure, and it is difficult to form the printed board 100.
【００５９】また、前述したように、シート部材８１に
形成した凹部８２は、電気素子４１とシート部材８１と
のクリアランスが、電気素子４１の全周に渡って２０μ
ｍ以上でかつ凹部８２の深さ（本例では０．８５ｍｍ）
以下となる寸法とした。これは、クリアランスが２０μ
ｍ未満では凹部８２内へ電気素子４１を挿設し難く、ク
リアランスが凹部８２の深さより大きいと加熱プレスに
よりシート部材８１等が変形しても電気素子４１を完全
に封止することが難しいためである。Further, as described above, in the concave portion 82 formed in the sheet member 81, the clearance between the electric element 41 and the sheet member 81 is 20 μ over the entire circumference of the electric element 41.
m or more and the depth of the recess 82 (0.85 mm in this example)
The dimensions are as follows. This has a clearance of 20μ
If it is less than m, it is difficult to insert the electric element 41 into the recess 82, and if the clearance is larger than the depth of the recess 82, it is difficult to completely seal the electric element 41 even if the sheet member 81 or the like is deformed by the heating press. Is.
【００６０】また、前述したように、シート部材８１の
凹部８２の深さ（すなわち、片面導体パターンフィルム
２１、シート部材８１等の積層時の空間部８３の厚さ）
が電気素子４１の厚さに対し略同等以下となるように、
シート部材８１を成形した。Further, as described above, the depth of the concave portion 82 of the sheet member 81 (that is, the thickness of the space portion 83 when the single-sided conductor pattern film 21, the sheet member 81 and the like are laminated).
Is approximately equal to or less than the thickness of the electric element 41,
The sheet member 81 was molded.
【００６１】これは、シート部材８１の凹部８２の深さ
が電気素子４１の厚さより大きい場合、加熱プレスによ
り電気素子４１を封止内蔵したプリント基板１００の表
面において、電気素子４１を内蔵した部位の上下面は図
２（ａ）に示すように凹形状となる。この状態のプリン
ト基板１００が、例えば高温環境下等に置かれると、電
気素子４１の上下面方向（樹脂フィルム２３等の積層方
向）に位置する絶縁基材３９は平坦状に戻ろうとする。This is because when the depth of the recess 82 of the sheet member 81 is larger than the thickness of the electric element 41, the portion where the electric element 41 is built in is formed on the surface of the printed circuit board 100 in which the electric element 41 is sealed and built in by hot pressing. The upper and lower surfaces have a concave shape as shown in FIG. When the printed circuit board 100 in this state is placed, for example, in a high temperature environment, the insulating base material 39 located in the upper and lower surface directions of the electric element 41 (the laminating direction of the resin film 23 and the like) tends to return to a flat shape.
【００６２】これに伴い、電気素子４１上下方向の絶縁
基材３９との界面４１ａには剥離方向の応力が発生し、
電気素子４１の絶縁封止信頼性を低下させるという不都
合が発生し易い。Along with this, a peeling-direction stress is generated at the interface 41a between the electric element 41 and the insulating base material 39 in the vertical direction,
The inconvenience of lowering the reliability of insulation and sealing of the electric element 41 is likely to occur.
【００６３】空間部８３の厚さ（凹部８２の深さ）が電
気素子４１の厚さに対し同等以下であると、電気素子４
１を内蔵した部位の上下面は平坦状もしくは図２（ｂ）
に示すように凸形状となる。凸形状となった場合に、プ
リント基板１００が例えば高温環境下等に置かれ、絶縁
基材３９が平坦状に戻ろうとすると、電気素子４１上下
方向の絶縁基材３９との界面４１ａには、押圧が発生し
剥離方向の応力は発生し難い。When the thickness of the space portion 83 (depth of the recess 82) is equal to or less than the thickness of the electric element 41, the electric element 4
The upper and lower surfaces of the part containing 1 are flat or as shown in FIG.
It becomes a convex shape as shown in. When the printed board 100 is placed in, for example, a high temperature environment and the insulating base material 39 tries to return to a flat shape in the case of a convex shape, the interface 41a with the insulating base material 39 in the vertical direction of the electric element 41 is Pressure is generated and stress in the peeling direction is unlikely to occur.
【００６４】なお、空間部８３の厚さ（凹部８２の深
さ）は電気素子４１の厚さ以下であることが好ましい
が、剥離方向の応力が問題にならない程度に小さけれ
ば、空間部８３の厚さが電気素子４１の厚さより若干大
きくてもよい。また、空間部８３の厚さ（凹部８２の深
さ）が電気素子４１の厚さより極めて小さいと、プリン
ト基板１００の表面において凸形状部位が大きくなり、
この部位が電気素子の表面実装部位となったときに電気
素子を接続し難い等の不都合が発生する場合がある。The thickness of the space 83 (the depth of the recess 82) is preferably equal to or less than the thickness of the electric element 41. However, if the stress in the peeling direction is so small as not to be a problem, the space 83 may be formed. The thickness may be slightly larger than the thickness of the electric element 41. If the thickness of the space 83 (the depth of the recess 82) is much smaller than the thickness of the electric element 41, the convex portion on the surface of the printed circuit board 100 becomes large,
When this part becomes the surface mounting part of the electric element, it may be difficult to connect the electric element.
【００６５】なお、上述の製造工程において、図１
（ｅ）に示す工程が本実施形態における積層工程、配置
工程、挿設工程および放熱部材形成工程である。また、
図１（ｅ）に示す積層体を加熱プレスして図１（ｆ）に
示すプリント基板１００を形成する工程が本実施形態に
おける接着工程である。In the manufacturing process described above,
The step shown in (e) is a stacking step, an arranging step, an inserting step and a heat dissipation member forming step in this embodiment. Also,
The step of forming the printed circuit board 100 shown in FIG. 1 (f) by hot pressing the laminate shown in FIG. 1 (e) is the bonding step in this embodiment.
【００６６】上述の製造方法およびその製造方法により
得られる構成によれば、片面導体パターンフィルム２
１、シート部材８１およびヒートシンク４６の積層一体
化、導体パターン２２層間の層間接続および電気素子４
１の導体パターン２２への接続を、加圧しつつ加熱する
ことにより、同時に行なうことができる。従って、プリ
ント基板１００の製造工程を簡素化でき、加工工数を低
減することが可能である。According to the above-mentioned manufacturing method and the structure obtained by the manufacturing method, the single-sided conductor pattern film 2 is formed.
1, lamination of sheet member 81 and heat sink 46, interlayer connection between conductor patterns 22 and electric element 4
The connection of one conductor pattern 22 to the conductor pattern 22 can be performed simultaneously by heating while applying pressure. Therefore, the manufacturing process of the printed circuit board 100 can be simplified and the number of processing steps can be reduced.
【００６７】また、内蔵された電気素子４１が、各樹脂
フィルム２３およびシート部材８１相互が確実に接着さ
れた絶縁基材３９に対し位置決めされ、導体パターン２
２と確実に電気的接続されるとともに、絶縁基材３９中
に確実に封止されたプリント基板１００が得られる。Further, the built-in electric element 41 is positioned with respect to the insulating base material 39 to which the respective resin films 23 and the sheet members 81 are securely adhered, and the conductor pattern 2 is formed.
It is possible to obtain the printed circuit board 100 which is surely electrically connected to the No. 2 and is surely sealed in the insulating base material 39.
【００６８】また、大型の電気素子を内蔵する必要があ
る場合には、その電気素子の大きさに応じたサイズのシ
ート部材８１を成形し用いればよいので、樹脂フィルム
２３のみで絶縁基材３９を形成する場合よりも加工工数
を低減することが可能である。When it is necessary to incorporate a large-sized electric element, the sheet member 81 having a size corresponding to the size of the electric element may be molded and used. It is possible to reduce the processing man-hours as compared with the case of forming.
【００６９】また、プリント基板１００は下面にヒート
シンク４６を備える基板であるが、図１（ｇ）に示すよ
うに、プリント基板１００の上面に電気素子６１を表面
実装するとともに、電気素子４１を内蔵することによ
り、良好な放熱性を有しつつ高密度実装に対応すること
ができる。The printed board 100 is a board having a heat sink 46 on the lower surface. As shown in FIG. 1G, the electric element 61 is surface-mounted on the upper surface of the printed board 100 and the electric element 41 is built in. By doing so, it is possible to cope with high-density mounting while having good heat dissipation.
【００７０】（他の実施形態）上記一実施形態におい
て、プリント基板製造時に、図１（ｅ）に示すように片
面導体パターンフィルム２１、シート部材８１を積層し
たが、この積層パターンに限定されるものではない。両
面導体パターンフィルム、片面導体パターンフィルムお
よび導体パターンを形成していない樹脂フィルムとシー
ト部材とを適宜組み合わせ積層するものであってもよ
い。ただし、上記一実施形態のように片面導体パターン
フィルムとシート部材との積層であれば、製造工程を簡
素化することが可能である。(Other Embodiments) In the above embodiment, the single-sided conductor pattern film 21 and the sheet member 81 are laminated as shown in FIG. Not a thing. A double-sided conductor pattern film, a single-sided conductor pattern film, a resin film on which a conductor pattern is not formed, and a sheet member may be appropriately combined and laminated. However, if the single-sided conductor pattern film and the sheet member are laminated as in the above-described embodiment, the manufacturing process can be simplified.
【００７１】また、シート部材８１は、積層された片面
導体パターンフィルム２１の積層体の表面に配置した
が、例えば、図３に示すように、片面導体パターンフィ
ルム２１の間に積層配置するものであってもよい。The sheet member 81 is arranged on the surface of the laminated body of the single-sided conductor pattern films 21. For example, as shown in FIG. 3, the sheet member 81 may be laminated between the single-sided conductor pattern films 21. It may be.
【００７２】また、上記一実施形態において、シート部
材８１は、電気素子４１を挿設するための凹部８２を備
えていたが、電気素子４１を挿設する貫通孔を備えるも
のであってもよい。例えば、図４に示すように、貫通孔
９２を備えるシート部材８１ａを片面導体パターンフィ
ルム２１とともに積層してもよい。また、放熱部材であ
るヒートシンクがセラミック等の絶縁部材である場合に
は、例えば図５に示すように、片面導体パターンフィル
ム２１、貫通孔９２を備えるシート部材８１ａおよびセ
ラミック製のヒートシンク４６ａを積層するものであっ
てもよい。Further, in the above-described embodiment, the sheet member 81 has the recess 82 for inserting the electric element 41, but it may have a through hole for inserting the electric element 41. . For example, as shown in FIG. 4, a sheet member 81 a having a through hole 92 may be laminated together with the single-sided conductor pattern film 21. When the heat sink, which is a heat radiating member, is an insulating member such as ceramic, a single-sided conductor pattern film 21, a sheet member 81a having a through hole 92, and a ceramic heat sink 46a are laminated as shown in FIG. 5, for example. It may be one.
【００７３】また、上記一実施形態において、樹脂フィ
ルム２３としてポリエーテルエーテルケトン樹脂６５〜
３５重量％とポリエーテルイミド樹脂３５〜６５重量％
とからなる樹脂フィルムを、シート部材８１としてポリ
エーテルエーテルケトン樹脂６５〜３５重量％とポリエ
ーテルイミド樹脂３５〜６５重量％とからなる樹脂シー
トを用いたが、これに限らず、ポリエーテルエーテルケ
トン樹脂とポリエーテルイミド樹脂に非導電性フィラを
充填したフィルムであってもよいし、ポリエーテルエー
テルケトン（ＰＥＥＫ）もしくはポリエーテルイミド
（ＰＥＩ）を単独で使用することも可能である。Further, in the above embodiment, the polyether ether ketone resin 65 to 65 is used as the resin film 23.
35 wt% and polyetherimide resin 35-65 wt%
Although a resin sheet made of and a resin sheet made of 65 to 35% by weight of polyetheretherketone resin and 35 to 65% by weight of polyetherimide resin is used as the sheet member 81, the present invention is not limited to this. A film in which a resin and a polyetherimide resin are filled with a non-conductive filler may be used, or polyether ether ketone (PEEK) or polyether imide (PEI) may be used alone.
【００７４】さらに、熱可塑性ポリイミド、または所謂
液晶ポリマー等の熱可塑性樹脂を用いてもよい。加熱プ
レス時の加熱温度において弾性率が１〜１０００ＭＰａ
であり、後工程である半田付け工程等で必要な耐熱性を
有する樹脂フィルムであれば好適に用いることができ
る。Further, a thermoplastic resin such as a thermoplastic polyimide or a so-called liquid crystal polymer may be used. Elastic modulus is 1 to 1000 MPa at heating temperature during hot pressing
Therefore, any resin film having heat resistance necessary for a soldering process or the like which is a post process can be preferably used.
【００７５】また、樹脂フィルム２３の材料とシート部
材８１の材料とに、異なる熱可塑性樹脂を採用すること
も可能である。ただし、同一材料を採用した場合の方
が、接着性、材料リサイクル性を考慮したときに有利で
ある。It is also possible to use different thermoplastic resins for the material of the resin film 23 and the material of the sheet member 81. However, when the same material is used, it is more advantageous in consideration of adhesiveness and material recyclability.
【００７６】また、上記一実施形態において、貫通孔３
５内に挿設する電気素子４１の表面には何ら処理を行な
っていなかったが、樹脂フィルム２３およびシート部材
８１との密着力を向上させるための表面処理や接着剤の
コーティング等を行なうものであってもよい。In the above embodiment, the through hole 3
No treatment was applied to the surface of the electric element 41 inserted in the member 5. However, surface treatment or adhesive coating for improving the adhesion between the resin film 23 and the sheet member 81 is performed. It may be.
【００７７】また、上記一実施形態において、ヒートシ
ンク４６をプリント基板１００の片面の全面に設けるも
のであったが、片面の一部に設けるものであってもよい
し、両面に設けるものであってもよい。また、放熱性向
上等の要求がなければ、ヒートシンク４６を設けないプ
リント基板であってもよいことはもちろんである。Further, in the above embodiment, the heat sink 46 is provided on the entire surface of one side of the printed circuit board 100, but it may be provided on a part of one side or on both sides. Good. Further, it is needless to say that a printed circuit board without the heat sink 46 may be used if there is no demand for improvement of heat dissipation.
【００７８】なお、ヒートシンク４６を設ける場合に
は、ヒートシンク４６の絶縁基材３９への接着面に、接
着性や熱伝導性の向上を目的として、例えばポリエーテ
ルイミドシート、熱伝導性フィラーを含有した熱硬化性
樹脂シートもしくは熱伝導性フィラーを含有した熱可塑
性樹脂シート等の所謂ボンディングシートを形成したも
のであってもよい。When the heat sink 46 is provided, the adhesive surface of the heat sink 46 to the insulating substrate 39 contains, for example, a polyetherimide sheet or a heat conductive filler for the purpose of improving the adhesiveness and the thermal conductivity. A so-called bonding sheet such as a thermosetting resin sheet or a thermoplastic resin sheet containing a thermally conductive filler may be formed.
【００７９】また、上記一実施形態において、プリント
基板１００は３層基板であったが、層数が限定されるも
のではないことは言うまでもない。Further, in the above-described embodiment, the printed circuit board 100 is a three-layer board, but it goes without saying that the number of layers is not limited.
【図１】本発明における一実施形態のプリント基板の概
略の製造工程を示す工程別断面図である。FIG. 1 is a sectional view for each step showing a schematic manufacturing process of a printed circuit board according to an embodiment of the present invention.
【図２】プリント基板の表面が凹凸形状となった場合の
状態を示す説明図であり、（ａ）は本実施形態によらず
凹形状となった状態、（ｂ）は本実施形態により凸形状
となった状態を示す。2A and 2B are explanatory views showing a state where the surface of the printed circuit board has an uneven shape, where FIG. 2A is a concave shape regardless of the present embodiment, and FIG. 2B is a convex shape according to the present embodiment. The shape is shown.
【図３】本発明における他の実施形態のプリント基板の
概略の製造工程の一部を示す断面図である。FIG. 3 is a cross-sectional view showing a part of a schematic manufacturing process of a printed circuit board according to another embodiment of the present invention.
【図４】本発明における他の実施形態のプリント基板の
概略の製造工程の一部を示す断面図である。FIG. 4 is a cross-sectional view showing a part of a schematic manufacturing process of a printed circuit board according to another embodiment of the present invention.
【図５】本発明における他の実施形態のプリント基板の
概略の製造工程の一部を示す断面図である。FIG. 5 is a cross-sectional view showing a part of a schematic manufacturing process of a printed circuit board according to another embodiment of the present invention.
２１ 片面導体パターンフィルム ２２ 導体パターン ２３ 樹脂フィルム ２４ ビアホール（有底ビアホール、ビアの一部） ３９ 絶縁基材 ４１ 電気素子 ４１ａ 界面 ４２ 電極 ４６、４６ａ ヒートシンク（放熱部材） ５０ 導電ペースト（接続材料） ５１ 導電性組成物（接続材料、ビアの一部） ８１、８１ａ シート部材 ８２ 凹部 ８３ 空間部 ９２ 貫通孔 １００ プリント基板 21 Single-sided conductor pattern film 22 Conductor pattern 23 Resin film 24 Via holes (bottomed via holes, part of vias) 39 Insulating material 41 Electric element 41a Interface 42 electrodes 46, 46a Heat sink (heat dissipation member) 50 Conductive paste (connection material) 51 Conductive composition (connecting material, part of via) 81, 81a sheet member 82 recess 83 Space 92 Through hole 100 printed circuit board
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｈ０５Ｋ 1/02 Ｈ０５Ｋ 1/11 Ｎ 1/11 1/18 Ｒ 1/18 3/40 Ｋ 3/40 Ｈ０１Ｌ 23/12 Ｎ Ｆターム(参考） 5E317 AA24 BB12 BB14 CC17 CC25 CD32 GG16 5E336 AA04 BB03 CC31 GG03 5E338 AA03 AA16 BB03 BB19 BB25 EE02 EE32 5E346 AA60 CC10 CC32 CC39 DD12 FF18 FF45 GG15 HH17 HH32─────────────────────────────────────────────────── ─── Continued Front Page (51) Int.Cl. 7 Identification Code FI Theme Coat (Reference) H05K 1/02 H05K 1/11 N 1/11 1/18 R 1/18 3/40 K 3/40 H01L 23/12 NF term (reference) 5E317 AA24 BB12 BB14 CC17 CC25 CD32 GG16 5E336 AA04 BB03 CC31 GG03 5E338 AA03 AA16 BB03 BB19 BB25 EE02 EE32 5E346 AA60 CC10 CC32 CC39 DD12 FF18 FF45 GG15 HH17 H
Claims (11)
９）となる樹脂フィルム（２３）を積層する積層工程
と、 前記積層された樹脂フィルム（２３）の外側面、もしく
は前記積層された樹脂フィルム（２３）の間に、熱可塑
性樹脂からなり、前記樹脂フィルム（２３）とともに絶
縁基材となるシート部材（８１）を配置する配置工程
と、 前記シート部材（８１）に形成された凹部（８２）もし
くは貫通孔（９２）に電気素子（４１）を挿設する挿設
工程と、 前記積層工程、前記配置工程および前記挿設工程の後
に、積層された前記樹脂フィルム（２３）および前記シ
ート部材（８１）の積層体の両面から加圧しつつ加熱す
ることにより、各前記樹脂フィルム（２３）および前記
シート部材（８１）相互を接着する接着工程とを備え、 前記電気素子（４１）を、前記樹脂フィルム（２３）お
よび前記シート部材（８１）により形成された前記絶縁
基材（３９）内に封止することを特徴とするプリント基
板の製造方法。1. An insulating base material (3) made of a thermoplastic resin.
9) a laminating step of laminating a resin film (23), and a thermoplastic resin between the outer surface of the laminated resin film (23) or the laminated resin film (23), An arranging step of arranging a sheet member (81) serving as an insulating base material together with the resin film (23), and an electric element (41) in the recess (82) or through hole (92) formed in the sheet member (81). After the inserting step of inserting, and the laminating step, the arranging step and the inserting step, heating is performed while applying pressure from both sides of the laminated body of the resin film (23) and the sheet member (81) that are laminated. Accordingly, the resin film (23) and the sheet member (81) are adhered to each other, and the electric element (41) is connected to the resin film (23) and A method for manufacturing a printed circuit board, comprising encapsulating in the insulating base material (39) formed by the sheet member (81).
記凹部（８２）もしくは前記貫通孔（９２）の寸法は、
前記凹部（８２）もしくは前記貫通孔（９２）に挿設さ
れる前記電気素子（４１）の外形寸法と略同一であるこ
とを特徴とする請求項１に記載のプリント基板の製造方
法。2. The size of the recess (82) or the through hole (92) formed in the sheet member (81) is
The method of manufacturing a printed circuit board according to claim 1, wherein the external dimensions of the electric element (41) inserted into the recess (82) or the through hole (92) are substantially the same.
記凹部（８２）もしくは前記貫通孔（９２）の深さは、
前記凹部（８２）もしくは前記貫通孔（９２）内に挿設
される前記電気素子（４１）の厚さに対し略同等以下で
あること特徴とする請求項２に記載のプリント基板の製
造方法。3. The depth of the recess (82) or the through hole (92) formed in the sheet member (81) is
The method for manufacturing a printed circuit board according to claim 2, wherein the thickness of the electric element (41) inserted into the recess (82) or the through hole (92) is substantially equal to or less than the thickness of the electric element (41).
ィルム（２３）および前記シート部材（８１）の積層方
向に電極（４２）が形成され、 前記樹脂フィルム（２３）には、前記積層工程を行なう
前に、前記シート部材（８１）の前記凹部（８２）もし
くは前記貫通孔（９２）に挿設される前記電気素子（４
１）の前記電極（４２）の位置に対応して、接続材料
（５０）が充填されるとともに導体パターン（２２）を
底部とする有底ビアホール（２４）が形成され、 前記接着工程において加圧しつつ加熱することにより、
前記接続材料（５０）を介して、前記電気素子（４１）
の前記電極（４２）と前記導体パターン（２２）とを電
気的に接続することを特徴とする請求項１ないし請求項
３のいずれか１つに記載のプリント基板の製造方法。4. The electric element (41) is provided with an electrode (42) in a laminating direction of the resin film (23) and the sheet member (81), and the resin film (23) is provided with the laminating layer. Before performing the process, the electric element (4) inserted into the recess (82) or the through hole (92) of the sheet member (81).
Corresponding to the position of the electrode (42) in 1), a bottomed via hole (24) whose bottom is the conductor pattern (22) is formed while being filled with the connecting material (50), and pressure is applied in the bonding step. By heating while
The electric element (41) through the connection material (50)
The method for producing a printed circuit board according to claim 1, wherein the electrode (42) and the conductor pattern (22) are electrically connected.
ート部材（８１）は、同一の材料からなることを特徴と
する請求項１ないし請求項４のいずれか１つに記載のプ
リント基板の製造方法。5. The method for manufacturing a printed circuit board according to claim 1, wherein the resin film (23) and the sheet member (81) are made of the same material. .
ム（２３）および前記シート部材（８１）の弾性率が１
〜１０００ＭＰａとなる温度で加熱することを特徴とす
る請求項５に記載のプリント基板の製造方法。6. The elastic modulus of the resin film (23) and the sheet member (81) is 1 in the bonding step.
The method for manufacturing a printed circuit board according to claim 5, wherein the heating is performed at a temperature of about 1000 MPa.
よび前記シート部材（８１）の積層体において、最も外
側に位置する前記樹脂フィルム（２３）もしくは前記シ
ート部材（８１）の外側面に放熱部材（４６）を形成す
る放熱部材形成工程を備えることを特徴とする請求項１
ないし請求項６のいずれか１つに記載のプリント基板の
製造方法。7. A heat dissipation member is provided on an outer surface of the resin film (23) or the sheet member (81) located on the outermost side in a laminated body of the laminated resin film (23) and the sheet member (81). The heat dissipation member forming step of forming (46) is provided.
7. The method for manufacturing a printed circuit board according to claim 6.
工程および前記放熱部材形成工程後に、前記樹脂フィル
ム（２３）、前記シート部材（８１）および前記放熱部
材（４６）の積層体を両面から加圧しつつ加熱すること
により、各前記樹脂フィルム（２３）、前記シート部材
（８１）および前記放熱部材（４６）相互の接着を行な
うことを特徴とする請求項７に記載のプリント基板の製
造方法。8. The laminated body of the resin film (23), the sheet member (81) and the heat dissipation member (46) is placed on both sides after the lamination process, the placement process, the insertion process and the heat dissipation member formation process. The printed circuit board according to claim 7, wherein the resin film (23), the sheet member (81), and the heat dissipation member (46) are adhered to each other by heating while pressurizing from each other. Method.
３）と熱可塑性樹脂からなるシート部材（８１）とを積
層後加圧しつつ加熱して相互に接着した絶縁基材（３
９）と、 前記シート部材（８１）に凹部（８２）もしくは貫通孔
（９２）を設けることによって前記絶縁基材（３９）中
に形成された空間部（８３）に配置されるとともに、前
記樹脂フィルム（２３）および前記シート部材（８１）
の積層方向に形成された電極（４２）がビア（２４、５
１）を介して導体パターン（２２）と接続した電気素子
（４１）とを備え、 この電気素子（４１）は、加圧しつつ加熱されることに
より前記空間部（３６）方向に押し出された前記樹脂フ
ィルム（２３）および前記シート部材（８１）により封
止され、前記電気素子（４１）を前記絶縁基材（３９）
中に内蔵していることを特徴とするプリント基板。9. A resin film (2 comprising a thermoplastic resin
The insulating base material (3) in which the sheet member (81) made of a thermoplastic resin and the sheet member (81) are laminated and then heated under pressure while being bonded to each other.
9) and a recess (82) or a through hole (92) provided in the sheet member (81), and the resin is disposed in a space (83) formed in the insulating base material (39). Film (23) and the sheet member (81)
The electrodes (42) formed in the stacking direction of
1) An electric element (41) connected to the conductor pattern (22) via the electric element (41), the electric element (41) being extruded toward the space portion (36) by being heated while being pressurized. The electric element (41) is sealed with the resin film (23) and the sheet member (81), and the insulating base material (39) is provided.
Printed circuit board characterized by being built in.
シート部材（８１）は、同一の材料からなることを特徴
とする請求項９に記載のプリント基板。10. The printed circuit board according to claim 9, wherein the resin film (23) and the sheet member (81) are made of the same material.
材（４６）が接着されていることを特徴とする請求項９
または請求項１０に記載のプリント基板。11. The heat dissipation member (46) is adhered to the surface of the insulating base material (39).
Alternatively, the printed circuit board according to claim 10.
Priority Applications (12)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001204023A JP3882540B2 (en) | 2001-07-04 | 2001-07-04 | Printed circuit board manufacturing method and printed circuit board formed by the manufacturing method |
| KR10-2002-0032880A KR100488412B1 (en) | 2001-06-13 | 2002-06-12 | Printed wiring board with embedded electric device and method for manufacturing printed wiring board with embedded electric device |
| MXPA02005829A MXPA02005829A (en) | 2001-06-13 | 2002-06-12 | Method for manufacturing printed wiring board with embedded electric device. |
| US10/166,731 US6680441B2 (en) | 2001-06-13 | 2002-06-12 | Printed wiring board with embedded electric device and method for manufacturing printed wiring board with embedded electric device |
| SG200203488A SG102054A1 (en) | 2001-06-13 | 2002-06-13 | Printed wiring board with embedded electric device and method for manufacturing printed wiring board with embedded electric device |
| EP02013103A EP1267597B1 (en) | 2001-06-13 | 2002-06-13 | Printed wiring board with embedded electric device and method for manufacturing printed wiring board with embedded electric device |
| CN2008101490604A CN101370360B (en) | 2001-06-13 | 2002-06-13 | Printed wiring board with embedded electric device and method for manufacturing printed wiring board with embedded electric device |
| CN2008101490638A CN101370361B (en) | 2001-06-13 | 2002-06-13 | Method for manufacturing printed wiring board with embedded electric device |
| DE60224611T DE60224611T2 (en) | 2001-06-13 | 2002-06-13 | Printed circuit board with embedded electrical device and method for manufacturing a printed circuit board with embedded electrical device |
| CNB021230196A CN100475003C (en) | 2001-06-13 | 2002-06-13 | Printing circuit board embedding electronic device and manufacture method thereof |
| TW091112932A TW545100B (en) | 2001-06-13 | 2002-06-13 | Printed wiring board with embedded electric device and method for manufacturing printed wiring board with embedded electric device |
| US10/701,441 US7165321B2 (en) | 2001-06-13 | 2003-11-06 | Method for manufacturing printed wiring board with embedded electric device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001204023A JP3882540B2 (en) | 2001-07-04 | 2001-07-04 | Printed circuit board manufacturing method and printed circuit board formed by the manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003017859A true JP2003017859A (en) | 2003-01-17 |
| JP3882540B2 JP3882540B2 (en) | 2007-02-21 |
Family
ID=19040564
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001204023A Expired - Fee Related JP3882540B2 (en) | 2001-06-13 | 2001-07-04 | Printed circuit board manufacturing method and printed circuit board formed by the manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3882540B2 (en) |
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005051169A (en) * | 2003-07-31 | 2005-02-24 | Denso Corp | Multilayer substrate with connector |
| JP2006190901A (en) * | 2005-01-07 | 2006-07-20 | Denso Corp | Circuit board and its manufacturing method, and electronic circuit device |
| JP2006310544A (en) * | 2005-04-28 | 2006-11-09 | Ngk Spark Plug Co Ltd | Multilayer wiring board and its production process, multilayer wiring board structure |
| WO2007043639A1 (en) * | 2005-10-14 | 2007-04-19 | Fujikura Ltd. | Printed wiring board and method for manufacturing printed wiring board |
| JP2008141007A (en) * | 2006-12-01 | 2008-06-19 | Denso Corp | Method for manufacturing multilayer substrate |
| JP2008270443A (en) * | 2007-04-19 | 2008-11-06 | Fujikura Ltd | Multilayer wiring board and manufacturing method thereof |
| JP2010258019A (en) * | 2009-04-21 | 2010-11-11 | Murata Mfg Co Ltd | Resin multilayered module, and method of manufacturing resin multilayered module |
| DE112009001736T5 (en) | 2008-07-17 | 2012-01-26 | Murata Mfg. Co., Ltd. | Method for producing a component-embedded module |
| JP2012115128A (en) * | 2010-11-03 | 2012-06-14 | Denso Corp | Switching module |
| KR101448110B1 (en) | 2007-12-10 | 2014-10-08 | 삼성전자 주식회사 | Method for manufacturing printed circuit board embedded semiconductor device |
| JPWO2015194373A1 (en) * | 2014-06-18 | 2017-04-20 | 株式会社村田製作所 | Multi-layer board with built-in components |
| JPWO2015198870A1 (en) * | 2014-06-23 | 2017-04-20 | 株式会社村田製作所 | Component built-in substrate and method for manufacturing component built-in substrate |
| US9730322B2 (en) | 2013-10-15 | 2017-08-08 | Murata Manufacturing Co., Ltd. | Production method of component-embedded substrate, and component-embedded substrate |
| JPWO2017026208A1 (en) * | 2015-08-10 | 2017-12-14 | 株式会社村田製作所 | Resin multilayer substrate and manufacturing method thereof |
| WO2018030262A1 (en) * | 2016-08-09 | 2018-02-15 | 株式会社村田製作所 | Method for manufacturing module component |
| JP2020024977A (en) * | 2018-08-06 | 2020-02-13 | 信越ポリマー株式会社 | Electromagnetic wave shielding film, manufacturing method thereof, printed wiring board with electromagnetic wave shielding film, and manufacturing method thereof |
| US10959330B2 (en) | 2017-03-06 | 2021-03-23 | Murata Manufacturing Co., Ltd. | Metal-clad laminate, circuit board, and multilayer circuit board |
| JPWO2019240179A1 (en) * | 2018-06-14 | 2021-04-30 | 株式会社フジクラ | Built-in component board |
-
2001
- 2001-07-04 JP JP2001204023A patent/JP3882540B2/en not_active Expired - Fee Related
Cited By (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005051169A (en) * | 2003-07-31 | 2005-02-24 | Denso Corp | Multilayer substrate with connector |
| JP2006190901A (en) * | 2005-01-07 | 2006-07-20 | Denso Corp | Circuit board and its manufacturing method, and electronic circuit device |
| JP4718890B2 (en) * | 2005-04-28 | 2011-07-06 | 日本特殊陶業株式会社 | MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME, MULTILAYER WIRING BOARD STRUCTURE |
| JP2006310544A (en) * | 2005-04-28 | 2006-11-09 | Ngk Spark Plug Co Ltd | Multilayer wiring board and its production process, multilayer wiring board structure |
| JPWO2007043639A1 (en) * | 2005-10-14 | 2009-04-16 | 株式会社フジクラ | Printed wiring board and method for manufacturing printed wiring board |
| JP4592751B2 (en) * | 2005-10-14 | 2010-12-08 | 株式会社フジクラ | Method for manufacturing printed wiring board |
| US7849591B2 (en) | 2005-10-14 | 2010-12-14 | Fujikura Ltd. | Method of manufacturing a printed wiring board |
| WO2007043639A1 (en) * | 2005-10-14 | 2007-04-19 | Fujikura Ltd. | Printed wiring board and method for manufacturing printed wiring board |
| TWI415542B (en) * | 2005-10-14 | 2013-11-11 | Fujikura Ltd | A printed wiring board, and a printed wiring board |
| JP2008141007A (en) * | 2006-12-01 | 2008-06-19 | Denso Corp | Method for manufacturing multilayer substrate |
| JP2008270443A (en) * | 2007-04-19 | 2008-11-06 | Fujikura Ltd | Multilayer wiring board and manufacturing method thereof |
| KR101448110B1 (en) | 2007-12-10 | 2014-10-08 | 삼성전자 주식회사 | Method for manufacturing printed circuit board embedded semiconductor device |
| DE112009001736T5 (en) | 2008-07-17 | 2012-01-26 | Murata Mfg. Co., Ltd. | Method for producing a component-embedded module |
| JP2010258019A (en) * | 2009-04-21 | 2010-11-11 | Murata Mfg Co Ltd | Resin multilayered module, and method of manufacturing resin multilayered module |
| JP2012115128A (en) * | 2010-11-03 | 2012-06-14 | Denso Corp | Switching module |
| US8705257B2 (en) | 2010-11-03 | 2014-04-22 | Denso Corporation | Switching module including a snubber circuit connected in parallel to a series-connected unit of flowing restriction elements |
| US9730322B2 (en) | 2013-10-15 | 2017-08-08 | Murata Manufacturing Co., Ltd. | Production method of component-embedded substrate, and component-embedded substrate |
| JPWO2015194373A1 (en) * | 2014-06-18 | 2017-04-20 | 株式会社村田製作所 | Multi-layer board with built-in components |
| JPWO2015198870A1 (en) * | 2014-06-23 | 2017-04-20 | 株式会社村田製作所 | Component built-in substrate and method for manufacturing component built-in substrate |
| JPWO2017026208A1 (en) * | 2015-08-10 | 2017-12-14 | 株式会社村田製作所 | Resin multilayer substrate and manufacturing method thereof |
| WO2018030262A1 (en) * | 2016-08-09 | 2018-02-15 | 株式会社村田製作所 | Method for manufacturing module component |
| US10818518B2 (en) | 2016-08-09 | 2020-10-27 | Murata Manufacturing Co., Ltd. | Method for manufacturing module component |
| US10959330B2 (en) | 2017-03-06 | 2021-03-23 | Murata Manufacturing Co., Ltd. | Metal-clad laminate, circuit board, and multilayer circuit board |
| JPWO2019240179A1 (en) * | 2018-06-14 | 2021-04-30 | 株式会社フジクラ | Built-in component board |
| US11638351B2 (en) | 2018-06-14 | 2023-04-25 | Fujikura Ltd. | Component-embedded substrate |
| US11979986B2 (en) | 2018-06-14 | 2024-05-07 | Fujikura Ltd. | Component-embedded substrate |
| JP2020024977A (en) * | 2018-08-06 | 2020-02-13 | 信越ポリマー株式会社 | Electromagnetic wave shielding film, manufacturing method thereof, printed wiring board with electromagnetic wave shielding film, and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3882540B2 (en) | 2007-02-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100488412B1 (en) | Printed wiring board with embedded electric device and method for manufacturing printed wiring board with embedded electric device | |
| JP3867593B2 (en) | Printed circuit board manufacturing method and printed circuit board formed by the manufacturing method | |
| JP3840921B2 (en) | Printed circuit board and manufacturing method thereof | |
| JP3969192B2 (en) | Manufacturing method of multilayer wiring board | |
| JP3619395B2 (en) | Semiconductor device built-in wiring board and manufacturing method thereof | |
| JP4208631B2 (en) | Manufacturing method of semiconductor device | |
| JP3882540B2 (en) | Printed circuit board manufacturing method and printed circuit board formed by the manufacturing method | |
| JP2007324550A (en) | Multilayer substrate | |
| JP3849705B2 (en) | Wiring board and wiring board connection structure | |
| JPH1145955A (en) | Device built-in multilayered printed circuit board and its manufacture | |
| JP2002359470A (en) | Printed board and manufacturing method therefor | |
| JP5163806B2 (en) | Manufacturing method of component built-in module and component built-in module | |
| JP2003332749A (en) | Passive device built-in substrate, its fabrication method, and material for building passive device built-in substrate | |
| JP3733419B2 (en) | Electronic component built-in type multilayer substrate, method for manufacturing the same, and metal core substrate used therefor | |
| JP2010021368A (en) | Wiring board with built-in component and manufacturing method thereof | |
| JP3956087B2 (en) | Method for manufacturing printed circuit board | |
| JP5749235B2 (en) | Manufacturing method of circuit component built-in substrate | |
| JP2004153000A (en) | Method of manufacturing printed board, and printed board manufactured thereby | |
| JP3945316B2 (en) | Multilayer wiring board and manufacturing method thereof | |
| JP2006093439A (en) | Multilayer substrate and its production method | |
| JP4012022B2 (en) | Multilayer wiring substrate, base material for multilayer wiring substrate, and manufacturing method thereof | |
| JPH1070363A (en) | Method for manufacturing printed wiring board | |
| JP2004172533A (en) | Printed-board manufacturing method, and printed board formed by same method | |
| JP2002246745A (en) | Three-dimensional mounting package and its manufacturing method, and adhesive therefor | |
| JP2010021369A (en) | Wiring board with built-in component and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RD05 | Notification of revocation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7425 Effective date: 20040416 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20060119 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20060124 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060327 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20060919 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060927 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20061024 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20061106 |
|
| R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20101124 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20111124 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20111124 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121124 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20131124 Year of fee payment: 7 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |