JP2002540388A5 - - Google Patents

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Publication number
JP2002540388A5
JP2002540388A5 JP2000606954A JP2000606954A JP2002540388A5 JP 2002540388 A5 JP2002540388 A5 JP 2002540388A5 JP 2000606954 A JP2000606954 A JP 2000606954A JP 2000606954 A JP2000606954 A JP 2000606954A JP 2002540388 A5 JP2002540388 A5 JP 2002540388A5
Authority
JP
Japan
Prior art keywords
sample
measurement
wafer
camera
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000606954A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002540388A (ja
Filing date
Publication date
Priority claimed from US09/495,821 external-priority patent/US6690473B1/en
Application filed filed Critical
Priority claimed from PCT/US2000/007709 external-priority patent/WO2000057127A1/fr
Publication of JP2002540388A publication Critical patent/JP2002540388A/ja
Publication of JP2002540388A5 publication Critical patent/JP2002540388A5/ja
Pending legal-status Critical Current

Links

JP2000606954A 1999-03-22 2000-03-22 ウェーハ計測のための方法及び装置 Pending JP2002540388A (ja)

Applications Claiming Priority (11)

Application Number Priority Date Filing Date Title
US12546299P 1999-03-22 1999-03-22
US60/125,462 1999-03-22
US12891599P 1999-04-12 1999-04-12
US60/128,915 1999-04-12
US14319999P 1999-07-09 1999-07-09
US60/143,199 1999-07-09
US17285199P 1999-12-10 1999-12-10
US60/172,851 1999-12-10
US09/495,821 US6690473B1 (en) 1999-02-01 2000-02-01 Integrated surface metrology
US09/495,821 2000-02-01
PCT/US2000/007709 WO2000057127A1 (fr) 1999-03-22 2000-03-22 Procede et appareil de metrologie de plaquette

Publications (2)

Publication Number Publication Date
JP2002540388A JP2002540388A (ja) 2002-11-26
JP2002540388A5 true JP2002540388A5 (fr) 2007-05-10

Family

ID=27537723

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000606954A Pending JP2002540388A (ja) 1999-03-22 2000-03-22 ウェーハ計測のための方法及び装置

Country Status (5)

Country Link
EP (1) EP1163488A1 (fr)
JP (1) JP2002540388A (fr)
AU (1) AU4175800A (fr)
TW (1) TW493205B (fr)
WO (1) WO2000057127A1 (fr)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6744850B2 (en) 2001-01-11 2004-06-01 Therma-Wave, Inc. X-ray reflectance measurement system with adjustable resolution
US6507634B1 (en) 2001-09-19 2003-01-14 Therma-Wave, Inc. System and method for X-ray reflectometry measurement of low density films
US6738136B2 (en) 2001-11-09 2004-05-18 Therma-Wave, Inc. Accurate small-spot spectrometry instrument
WO2005064642A1 (fr) * 2003-12-25 2005-07-14 Ebara Corporation Appareil support de substrat, procede permettant de supporter un substrat, et appareil de traitement d'un substrat
DE102004033208B4 (de) * 2004-07-09 2010-04-01 Vistec Semiconductor Systems Gmbh Vorrichtung zur Inspektion eines mikroskopischen Bauteils mit einem Immersionsobjektiv
DE102004033195A1 (de) * 2004-07-09 2006-02-23 Leica Microsystems Semiconductor Gmbh Vorrichtung zur Inspektion eines mikroskopischen Bauteils
JP5417343B2 (ja) 2007-12-27 2014-02-12 ラム リサーチ コーポレーション 少なくとも１つの光源を使用してエンドエフェクタ・アラインメントを校正するためのシステムおよび方法
US8860955B2 (en) * 2007-12-27 2014-10-14 Lam Research Corporation Arrangements and methods for determining positions and offsets
WO2010013325A1 (fr) * 2008-07-30 2010-02-04 株式会社ニレコ Spectrophotomètre
US8547538B2 (en) * 2011-04-21 2013-10-01 Applied Materials, Inc. Construction of reference spectra with variations in environmental effects
US9831110B2 (en) 2015-07-30 2017-11-28 Lam Research Corporation Vision-based wafer notch position measurement
WO2017198764A1 (fr) * 2016-05-20 2017-11-23 Sentech Instruments Gmbh Dispositif et procédé pour mesurer des épaisseurs et des indices de réfraction de couches sur des surfaces rugueuses et lisses
US10770327B2 (en) * 2017-07-28 2020-09-08 Taiwan Semiconductor Manufacturing Co., Ltd. System and method for correcting non-ideal wafer topography
WO2023114535A1 (fr) * 2021-12-17 2023-06-22 Carnegie Mellon University Système, procédé et produit programme d'ordinateur pour la détection de vibration optique

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4402613A (en) * 1979-03-29 1983-09-06 Advanced Semiconductor Materials America Surface inspection system
JPS57161641A (en) * 1981-03-31 1982-10-05 Olympus Optical Co Ltd Inspecting device for defect of surface
US4659220A (en) * 1984-10-22 1987-04-21 International Business Machines Corporation Optical inspection system for semiconductor wafers
US5747813A (en) * 1992-06-16 1998-05-05 Kla-Tencop. Corporation Broadband microspectro-reflectometer
IL111229A (en) * 1994-10-10 1998-06-15 Nova Measuring Instr Ltd Autofocusing microscope
US5835225A (en) * 1994-11-30 1998-11-10 Micron Technology, Inc. Surface properties detection by reflectance metrology
US5825498A (en) * 1996-02-05 1998-10-20 Micron Technology, Inc. Ultraviolet light reflectance method for evaluating the surface characteristics of opaque materials
EP0865342B1 (fr) * 1996-06-15 2002-03-13 Unova U.K. Limited Ameliorations apportees aux meules
EP0961928A4 (fr) * 1997-02-21 2000-04-26 Sidney Braginsky Procede servant a detecter des defauts par balayage sur des tranches a semi-conducteurs
US6108091A (en) * 1997-05-28 2000-08-22 Lam Research Corporation Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing
US5900354A (en) * 1997-07-03 1999-05-04 Batchelder; John Samuel Method for optical inspection and lithography

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