JP2002536733A5 - - Google Patents
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- Publication number
- JP2002536733A5 JP2002536733A5 JP2000596598A JP2000596598A JP2002536733A5 JP 2002536733 A5 JP2002536733 A5 JP 2002536733A5 JP 2000596598 A JP2000596598 A JP 2000596598A JP 2000596598 A JP2000596598 A JP 2000596598A JP 2002536733 A5 JP2002536733 A5 JP 2002536733A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR99/00858 | 1999-01-27 | ||
| FR9900858A FR2788882A1 (fr) | 1999-01-27 | 1999-01-27 | Dispositif a circuits integres, module electronique pour carte a puce utilisant le dispositif et procede de fabrication dudit dispositif |
| PCT/FR2000/000098 WO2000045434A1 (fr) | 1999-01-27 | 2000-01-18 | Dispositif a circuits integres, module electronique pour carte a puce utilisant le dispositif et procede de fabrication dudit dispositif |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002536733A JP2002536733A (ja) | 2002-10-29 |
| JP2002536733A5 true JP2002536733A5 (enExample) | 2007-03-08 |
Family
ID=9541247
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000596598A Pending JP2002536733A (ja) | 1999-01-27 | 2000-01-18 | 集積回路デバイス、当該デバイスを用いたスマートカード用の電子ユニット及び当該デバイスの製造方法 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US7208822B1 (enExample) |
| EP (1) | EP1147557B1 (enExample) |
| JP (1) | JP2002536733A (enExample) |
| CN (1) | CN1207782C (enExample) |
| AT (1) | ATE376254T1 (enExample) |
| DE (1) | DE60036784T2 (enExample) |
| ES (1) | ES2293891T3 (enExample) |
| FR (1) | FR2788882A1 (enExample) |
| WO (1) | WO2000045434A1 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10111028A1 (de) * | 2001-03-07 | 2002-09-19 | Infineon Technologies Ag | Chipkartenmodul |
| US7449780B2 (en) * | 2003-03-31 | 2008-11-11 | Intel Corporation | Apparatus to minimize thermal impedance using copper on die backside |
| JP4058637B2 (ja) * | 2003-10-27 | 2008-03-12 | セイコーエプソン株式会社 | 半導体チップ、半導体装置、回路基板及び電子機器 |
| US20060270106A1 (en) * | 2005-05-31 | 2006-11-30 | Tz-Cheng Chiu | System and method for polymer encapsulated solder lid attach |
| USD707682S1 (en) * | 2012-12-05 | 2014-06-24 | Logomotion, S.R.O. | Memory card |
| TWI559495B (zh) * | 2013-07-24 | 2016-11-21 | 精材科技股份有限公司 | 晶片封裝體及其製造方法 |
| US9117721B1 (en) * | 2014-03-20 | 2015-08-25 | Excelitas Canada, Inc. | Reduced thickness and reduced footprint semiconductor packaging |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3051195C2 (de) * | 1980-08-05 | 1997-08-28 | Gao Ges Automation Org | Trägerelement zum Einbau in Ausweiskarten |
| DE3151408C1 (de) * | 1981-12-24 | 1983-06-01 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Ausweiskarte mit einem IC-Baustein |
| JPS6091489A (ja) * | 1983-10-24 | 1985-05-22 | Nippon Telegr & Teleph Corp <Ntt> | 静電対策ｉｃカ−ド |
| FR2584235B1 (fr) * | 1985-06-26 | 1988-04-22 | Bull Sa | Procede de montage d'un circuit integre sur un support, dispositif en resultant et son application a une carte a microcircuits electroniques |
| JPH022095A (ja) * | 1988-06-10 | 1990-01-08 | Ricoh Co Ltd | Ｉｃモジュールの製造方法及びｉｃモジュール用基材 |
| US5155068A (en) * | 1989-08-31 | 1992-10-13 | Sharp Kabushiki Kaisha | Method for manufacturing an IC module for an IC card whereby an IC device and surrounding encapsulant are thinned by material removal |
| US4975761A (en) * | 1989-09-05 | 1990-12-04 | Advanced Micro Devices, Inc. | High performance plastic encapsulated package for integrated circuit die |
| JPH04207061A (ja) * | 1990-11-30 | 1992-07-29 | Shinko Electric Ind Co Ltd | 半導体装置 |
| US5173764A (en) * | 1991-04-08 | 1992-12-22 | Motorola, Inc. | Semiconductor device having a particular lid means and encapsulant to reduce die stress |
| JPH04341896A (ja) * | 1991-05-20 | 1992-11-27 | Hitachi Ltd | 半導体装置及びメモリーカード |
| US5422435A (en) * | 1992-05-22 | 1995-06-06 | National Semiconductor Corporation | Stacked multi-chip modules and method of manufacturing |
| KR100209782B1 (ko) * | 1994-08-30 | 1999-07-15 | 가나이 쓰도무 | 반도체 장치 |
| US6002181A (en) * | 1994-11-08 | 1999-12-14 | Oki Electric Industry Co., Ltd. | Structure of resin molded type semiconductor device with embedded thermal dissipator |
| DE4443767A1 (de) * | 1994-12-08 | 1996-06-13 | Giesecke & Devrient Gmbh | Elektronisches Modul und Datenträger mit elektrischem Modul |
| JP3487524B2 (ja) * | 1994-12-20 | 2004-01-19 | 株式会社ルネサステクノロジ | 半導体装置及びその製造方法 |
| US5648684A (en) * | 1995-07-26 | 1997-07-15 | International Business Machines Corporation | Endcap chip with conductive, monolithic L-connect for multichip stack |
| FR2738077B1 (fr) * | 1995-08-23 | 1997-09-19 | Schlumberger Ind Sa | Micro-boitier electronique pour carte a memoire electronique et procede de realisation |
-
1999
- 1999-01-27 FR FR9900858A patent/FR2788882A1/fr active Pending
-
2000
- 2000-01-18 ES ES00900602T patent/ES2293891T3/es not_active Expired - Lifetime
- 2000-01-18 US US09/890,226 patent/US7208822B1/en not_active Expired - Fee Related
- 2000-01-18 CN CNB008036047A patent/CN1207782C/zh not_active Expired - Fee Related
- 2000-01-18 DE DE60036784T patent/DE60036784T2/de not_active Expired - Fee Related
- 2000-01-18 AT AT00900602T patent/ATE376254T1/de not_active IP Right Cessation
- 2000-01-18 EP EP00900602A patent/EP1147557B1/fr not_active Expired - Lifetime
- 2000-01-18 WO PCT/FR2000/000098 patent/WO2000045434A1/fr not_active Ceased
- 2000-01-18 JP JP2000596598A patent/JP2002536733A/ja active Pending