JP2002530206A - レーザアブレーションによる特徴部形状の再生産制御 - Google Patents
レーザアブレーションによる特徴部形状の再生産制御Info
- Publication number
- JP2002530206A JP2002530206A JP2000583668A JP2000583668A JP2002530206A JP 2002530206 A JP2002530206 A JP 2002530206A JP 2000583668 A JP2000583668 A JP 2000583668A JP 2000583668 A JP2000583668 A JP 2000583668A JP 2002530206 A JP2002530206 A JP 2002530206A
- Authority
- JP
- Japan
- Prior art keywords
- laser
- plate
- substrate
- feature
- mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000608 laser ablation Methods 0.000 title claims abstract description 13
- 239000000758 substrate Substances 0.000 claims abstract description 51
- 238000000034 method Methods 0.000 claims abstract description 33
- 238000002679 ablation Methods 0.000 claims abstract description 23
- 230000005855 radiation Effects 0.000 claims abstract description 21
- 238000012545 processing Methods 0.000 claims abstract description 18
- 230000010287 polarization Effects 0.000 claims description 34
- 230000008569 process Effects 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 13
- 230000000694 effects Effects 0.000 claims description 11
- 229920001721 polyimide Polymers 0.000 claims description 6
- 229920006254 polymer film Polymers 0.000 claims description 5
- 239000004642 Polyimide Substances 0.000 claims description 3
- 238000012935 Averaging Methods 0.000 claims description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 2
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 claims description 2
- 229910052801 chlorine Inorganic materials 0.000 claims description 2
- 239000000460 chlorine Substances 0.000 claims description 2
- 229910052731 fluorine Inorganic materials 0.000 claims description 2
- 239000011737 fluorine Substances 0.000 claims description 2
- 229910052743 krypton Inorganic materials 0.000 claims description 2
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052724 xenon Inorganic materials 0.000 claims description 2
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 claims description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims 1
- 239000007789 gas Substances 0.000 claims 1
- 229910052734 helium Inorganic materials 0.000 claims 1
- 239000001307 helium Substances 0.000 claims 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims 1
- 229910000041 hydrogen chloride Inorganic materials 0.000 claims 1
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 claims 1
- 229910052754 neon Inorganic materials 0.000 claims 1
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 229920000642 polymer Polymers 0.000 abstract description 6
- 230000001678 irradiating effect Effects 0.000 abstract description 4
- 238000009987 spinning Methods 0.000 abstract description 2
- 239000013598 vector Substances 0.000 description 20
- 238000003384 imaging method Methods 0.000 description 19
- 230000003287 optical effect Effects 0.000 description 14
- 230000005684 electric field Effects 0.000 description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 230000008859 change Effects 0.000 description 6
- 238000005286 illumination Methods 0.000 description 5
- 230000001276 controlling effect Effects 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 238000003754 machining Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000012937 correction Methods 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 230000004075 alteration Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 230000000875 corresponding effect Effects 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 229910021485 fumed silica Inorganic materials 0.000 description 2
- 229920000307 polymer substrate Polymers 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000002310 reflectometry Methods 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 102000003729 Neprilysin Human genes 0.000 description 1
- 108090000028 Neprilysin Proteins 0.000 description 1
- 229920001646 UPILEX Polymers 0.000 description 1
- 238000011298 ablation treatment Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 230000004438 eyesight Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000000265 homogenisation Methods 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 210000001747 pupil Anatomy 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000004304 visual acuity Effects 0.000 description 1
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Electromagnetism (AREA)
- Laser Beam Processing (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/198,160 US6172329B1 (en) | 1998-11-23 | 1998-11-23 | Ablated laser feature shape reproduction control |
| US09/198,160 | 1998-11-23 | ||
| PCT/US1999/007066 WO2000030801A1 (en) | 1998-11-23 | 1999-03-31 | Ablated laser feature shape reproduction control |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002530206A true JP2002530206A (ja) | 2002-09-17 |
| JP2002530206A5 JP2002530206A5 (enExample) | 2006-05-25 |
Family
ID=22732228
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000583668A Pending JP2002530206A (ja) | 1998-11-23 | 1999-03-31 | レーザアブレーションによる特徴部形状の再生産制御 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US6172329B1 (enExample) |
| EP (1) | EP1131184B1 (enExample) |
| JP (1) | JP2002530206A (enExample) |
| KR (1) | KR20010089494A (enExample) |
| CN (1) | CN1326393A (enExample) |
| AU (1) | AU3374199A (enExample) |
| CA (1) | CA2348277C (enExample) |
| DE (1) | DE69903973T2 (enExample) |
| WO (1) | WO2000030801A1 (enExample) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007118585A (ja) * | 2005-09-30 | 2007-05-17 | Brother Ind Ltd | ノズルプレートの製造方法及び液滴噴射装置の製造方法 |
| JP2009538231A (ja) * | 2006-05-25 | 2009-11-05 | エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド | 超短レーザパルスによるウェハスクライビング |
| KR20140112652A (ko) * | 2013-03-13 | 2014-09-24 | 삼성디스플레이 주식회사 | 피코초 레이저 가공 장치 |
| JP2015182129A (ja) * | 2014-03-26 | 2015-10-22 | 住友重機械工業株式会社 | レーザ加工装置及びレーザ加工方法 |
| WO2023214475A1 (ja) * | 2022-05-02 | 2023-11-09 | 三菱重工業株式会社 | レーザ加工装置 |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19905571C1 (de) * | 1999-02-11 | 2000-11-16 | Bosch Gmbh Robert | Verfahren zur Erzeugung definiert konischer Löcher mittels eines Laserstrahls |
| JP2001071168A (ja) * | 1999-06-30 | 2001-03-21 | Canon Inc | レーザ加工方法、該レーザ加工方法を用いたインクジェット記録ヘッドの製造方法、該製造方法で製造されたインクジェット記録ヘッド |
| US6433303B1 (en) * | 2000-03-31 | 2002-08-13 | Matsushita Electric Industrial Co., Ltd. | Method and apparatus using laser pulses to make an array of microcavity holes |
| JP4659300B2 (ja) * | 2000-09-13 | 2011-03-30 | 浜松ホトニクス株式会社 | レーザ加工方法及び半導体チップの製造方法 |
| US6621044B2 (en) * | 2001-01-18 | 2003-09-16 | Anvik Corporation | Dual-beam materials-processing system |
| US6627844B2 (en) * | 2001-11-30 | 2003-09-30 | Matsushita Electric Industrial Co., Ltd. | Method of laser milling |
| US6816316B2 (en) * | 2002-02-12 | 2004-11-09 | Visx, Incorporated | Smoothing laser beam integration using optical element motion |
| ES2285634T3 (es) | 2002-03-12 | 2007-11-16 | Hamamatsu Photonics K. K. | Metodo para dividir un siustrato. |
| EP2272618B1 (en) | 2002-03-12 | 2015-10-07 | Hamamatsu Photonics K.K. | Method of cutting object to be processed |
| TWI326626B (en) * | 2002-03-12 | 2010-07-01 | Hamamatsu Photonics Kk | Laser processing method |
| US20040076376A1 (en) * | 2002-10-17 | 2004-04-22 | Pate Michael A. | Optical fiber coupler and method of fabrication |
| TWI520269B (zh) * | 2002-12-03 | 2016-02-01 | 濱松赫德尼古斯股份有限公司 | Cutting method of semiconductor substrate |
| US7846152B2 (en) | 2004-03-24 | 2010-12-07 | Amo Manufacturing Usa, Llc. | Calibrating laser beam position and shape using an image capture device |
| FR2852250B1 (fr) * | 2003-03-11 | 2009-07-24 | Jean Luc Jouvin | Fourreau de protection pour canule, un ensemble d'injection comportant un tel fourreau et aiguille equipee d'un tel fourreau |
| EP1609559B1 (en) * | 2003-03-12 | 2007-08-08 | Hamamatsu Photonics K. K. | Laser beam machining method |
| US20040199199A1 (en) * | 2003-04-02 | 2004-10-07 | Scimed Life Systems, Inc. | Filter and method of making a filter |
| US7115211B2 (en) * | 2003-08-13 | 2006-10-03 | Tokyo Electron Limited | Endpoint detection using laser interferometry |
| US20050047892A1 (en) * | 2003-08-29 | 2005-03-03 | Bremner Ronald Dean | Laser cut apertures for thread forming fasteners |
| US7291805B2 (en) * | 2003-10-30 | 2007-11-06 | The Regents Of The University Of California | Target isolation system, high power laser and laser peening method and system using same |
| EP1528645B1 (en) * | 2003-10-30 | 2011-02-16 | Metal Improvement Company, LLC. | Relay telescope, laser amplifier, and laser peening method and system using same |
| US7110171B2 (en) * | 2003-10-30 | 2006-09-19 | Metal Improvement Company, Llc | Relay telescope including baffle, and high power laser amplifier utilizing the same |
| US20060011617A1 (en) * | 2004-07-13 | 2006-01-19 | Ricardo Covarrubias | Automated laser cutting of optical lenses |
| US7668364B2 (en) * | 2005-04-26 | 2010-02-23 | Hitachi Via Mechanics, Ltd. | Inspection method and apparatus for partially drilled microvias |
| US20070282312A1 (en) * | 2006-05-31 | 2007-12-06 | Sie Ag Surgical Instrument Engineering | Ophthalmologic apparatus |
| US20080013182A1 (en) * | 2006-07-17 | 2008-01-17 | Joerg Ferber | Two-stage laser-beam homogenizer |
| US7615722B2 (en) | 2006-07-17 | 2009-11-10 | Coherent, Inc. | Amorphous silicon crystallization using combined beams from optically pumped semiconductor lasers |
| JP5923132B2 (ja) * | 2014-04-30 | 2016-05-24 | 住友電気工業株式会社 | レーザ加工装置用の偏光状態変換素子 |
| WO2021168213A1 (en) * | 2020-02-19 | 2021-08-26 | Elemental Scientific Lasers, Llc | Variable beam size via homqgenizer movement |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4491383A (en) * | 1982-09-20 | 1985-01-01 | Centro Ricerche Fiat S.P.A. | Device for modifying and uniforming the distribution of the intensity of a power laser beam |
| DE3317022A1 (de) * | 1983-05-10 | 1984-11-15 | W.C. Heraeus Gmbh, 6450 Hanau | Materialbearbeitungsanlage |
| US4734558A (en) * | 1983-05-16 | 1988-03-29 | Nec Corporation | Laser machining apparatus with controllable mask |
| US4626652A (en) * | 1985-03-21 | 1986-12-02 | Honeywell Inc. | Method and means of removing claddings from optical fibers |
| US4733944A (en) | 1986-01-24 | 1988-03-29 | Xmr, Inc. | Optical beam integration system |
| US4923772A (en) | 1986-10-29 | 1990-05-08 | Kirch Steven J | High energy laser mask and method of making same |
| US4908493A (en) * | 1988-05-31 | 1990-03-13 | Midwest Research Institute | Method and apparatus for optimizing the efficiency and quality of laser material processing |
| US4940881A (en) | 1989-09-28 | 1990-07-10 | Tamarack Scientific Co., Inc. | Method and apparatus for effecting selective ablation of a coating from a substrate, and controlling the wall angle of coating edge portions |
| US5057664A (en) * | 1989-10-20 | 1991-10-15 | Electro Scientific Industries, Inc. | Method and apparatus for laser processing a target material to provide a uniformly smooth, continuous trim profile |
| US5091626A (en) * | 1990-02-02 | 1992-02-25 | Hadassah Medical Organization | Method for the ablative reshaping of material surfaces |
| JP2599513B2 (ja) | 1990-06-25 | 1997-04-09 | インターナショナル・ビジネス・マシーンズ・コーポレイション | アブレーション・マスク |
| JPH04270091A (ja) * | 1991-01-18 | 1992-09-25 | Nissan Motor Co Ltd | レーザ加工装置 |
| JPH05185254A (ja) * | 1991-11-20 | 1993-07-27 | Nikon Corp | レーザ加工装置 |
| DE4220705C2 (de) | 1992-06-24 | 2003-03-13 | Lambda Physik Ag | Vorrichtung zum Aufteilen eines Lichtstrahles in homogene Teilstrahlen |
| JPH06182574A (ja) * | 1992-12-22 | 1994-07-05 | Hoya Corp | レーザ加工機 |
| US5378137A (en) | 1993-05-10 | 1995-01-03 | Hewlett-Packard Company | Mask design for forming tapered inkjet nozzles |
| US5610733A (en) | 1994-02-28 | 1997-03-11 | Digital Optics Corporation | Beam-homogenizer |
| WO1997006462A1 (en) * | 1995-08-09 | 1997-02-20 | Minnesota Mining And Manufacturing Company | Rotating optical system for laser machining apparatus |
-
1998
- 1998-11-23 US US09/198,160 patent/US6172329B1/en not_active Expired - Fee Related
-
1999
- 1999-03-31 KR KR1020017006468A patent/KR20010089494A/ko not_active Withdrawn
- 1999-03-31 AU AU33741/99A patent/AU3374199A/en not_active Abandoned
- 1999-03-31 CA CA002348277A patent/CA2348277C/en not_active Expired - Fee Related
- 1999-03-31 EP EP99915156A patent/EP1131184B1/en not_active Expired - Lifetime
- 1999-03-31 DE DE69903973T patent/DE69903973T2/de not_active Expired - Fee Related
- 1999-03-31 CN CN99813493A patent/CN1326393A/zh active Pending
- 1999-03-31 WO PCT/US1999/007066 patent/WO2000030801A1/en not_active Ceased
- 1999-03-31 JP JP2000583668A patent/JP2002530206A/ja active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007118585A (ja) * | 2005-09-30 | 2007-05-17 | Brother Ind Ltd | ノズルプレートの製造方法及び液滴噴射装置の製造方法 |
| JP2009538231A (ja) * | 2006-05-25 | 2009-11-05 | エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド | 超短レーザパルスによるウェハスクライビング |
| US8624157B2 (en) | 2006-05-25 | 2014-01-07 | Electro Scientific Industries, Inc. | Ultrashort laser pulse wafer scribing |
| KR101385675B1 (ko) | 2006-05-25 | 2014-04-15 | 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 | 초단파 레이저 펄스 웨이퍼 스크라이빙 |
| US9221124B2 (en) | 2006-05-25 | 2015-12-29 | Electro Scientific Industries, Inc. | Ultrashort laser pulse wafer scribing |
| KR20140112652A (ko) * | 2013-03-13 | 2014-09-24 | 삼성디스플레이 주식회사 | 피코초 레이저 가공 장치 |
| KR102209964B1 (ko) | 2013-03-13 | 2021-02-02 | 삼성디스플레이 주식회사 | 피코초 레이저 가공 장치 |
| JP2015182129A (ja) * | 2014-03-26 | 2015-10-22 | 住友重機械工業株式会社 | レーザ加工装置及びレーザ加工方法 |
| WO2023214475A1 (ja) * | 2022-05-02 | 2023-11-09 | 三菱重工業株式会社 | レーザ加工装置 |
| JP2023165158A (ja) * | 2022-05-02 | 2023-11-15 | 三菱重工業株式会社 | レーザ加工装置 |
| JP7707125B2 (ja) | 2022-05-02 | 2025-07-14 | 三菱重工業株式会社 | レーザ加工装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1131184A1 (en) | 2001-09-12 |
| WO2000030801A1 (en) | 2000-06-02 |
| KR20010089494A (ko) | 2001-10-06 |
| US6172329B1 (en) | 2001-01-09 |
| DE69903973T2 (de) | 2003-07-17 |
| AU3374199A (en) | 2000-06-13 |
| EP1131184B1 (en) | 2002-11-13 |
| CA2348277C (en) | 2007-10-16 |
| CA2348277A1 (en) | 2000-06-02 |
| DE69903973D1 (de) | 2002-12-19 |
| CN1326393A (zh) | 2001-12-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2002530206A (ja) | レーザアブレーションによる特徴部形状の再生産制御 | |
| US8265109B2 (en) | Systems and methods for implementing an interaction between a laser shaped as line beam and a film deposited on a substrate | |
| JP2002530204A (ja) | レーザーアブレーションによる特徴部形成のためのマスク軌道 | |
| US6130009A (en) | Apparatus and process for nozzle production utilizing computer generated holograms | |
| JP2002530205A (ja) | レーザーアブレーションによる特徴部形成装置 | |
| US20030201578A1 (en) | Method of drilling holes with precision laser micromachining | |
| JPS61502507A (ja) | ディ−プ紫外線リソグラフィ− | |
| US20050205538A1 (en) | Method of controlling hole shape during ultrafast laser machining by manipulating beam polarization | |
| US7277188B2 (en) | Systems and methods for implementing an interaction between a laser shaped as a line beam and a film deposited on a substrate | |
| JP5613211B2 (ja) | ラインビームとして成形されたレーザと基板上に堆積された膜との間の相互作用を実現するためのシステム及び方法 | |
| CZ282088B6 (cs) | Způsob rytí kruhových šablon a zařízení k provádění tohoto způsobu | |
| JP2002178323A (ja) | セラミックグリーンシートの加工装置 | |
| JP3309046B2 (ja) | レーザ加工機 | |
| US20240173796A1 (en) | Laser processing apparatus, laser processing method, and electronic device manufacturing method | |
| US11796917B2 (en) | Width adjustment of EUV radiation beam | |
| EP0854374A2 (en) | Illumination apparatus with a high laser damage threshold and pattern transfer apparatus comprising the same | |
| Oesterlin et al. | Small structures with large excimer lasers | |
| Boyd | Experimental Considerations | |
| WO2006127891A2 (en) | Systems and methods interacting between a laser and film deposited |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060324 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20060324 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20080904 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20080909 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20090224 |