CA2348277C - Ablated laser feature shape reproduction control - Google Patents
Ablated laser feature shape reproduction control Download PDFInfo
- Publication number
- CA2348277C CA2348277C CA002348277A CA2348277A CA2348277C CA 2348277 C CA2348277 C CA 2348277C CA 002348277 A CA002348277 A CA 002348277A CA 2348277 A CA2348277 A CA 2348277A CA 2348277 C CA2348277 C CA 2348277C
- Authority
- CA
- Canada
- Prior art keywords
- laser
- substrate
- mask
- retardation plate
- feature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims abstract description 66
- 230000005855 radiation Effects 0.000 claims abstract description 28
- 238000000034 method Methods 0.000 claims abstract description 26
- 230000008569 process Effects 0.000 claims abstract description 22
- 238000009987 spinning Methods 0.000 claims abstract description 11
- 230000010287 polarization Effects 0.000 claims description 27
- 238000002679 ablation Methods 0.000 claims description 14
- 230000000694 effects Effects 0.000 claims description 14
- 229920001721 polyimide Polymers 0.000 claims description 6
- 239000004642 Polyimide Substances 0.000 claims description 3
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 2
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 claims description 2
- 229910052801 chlorine Inorganic materials 0.000 claims description 2
- 239000000460 chlorine Substances 0.000 claims description 2
- 229910052731 fluorine Inorganic materials 0.000 claims description 2
- 239000011737 fluorine Substances 0.000 claims description 2
- 239000007789 gas Substances 0.000 claims description 2
- 229910052743 krypton Inorganic materials 0.000 claims description 2
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052724 xenon Inorganic materials 0.000 claims description 2
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 claims description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims 1
- 229910052734 helium Inorganic materials 0.000 claims 1
- 239000001307 helium Substances 0.000 claims 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims 1
- 229910000041 hydrogen chloride Inorganic materials 0.000 claims 1
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 claims 1
- 229910052754 neon Inorganic materials 0.000 claims 1
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 claims 1
- 230000001678 irradiating effect Effects 0.000 abstract 1
- 238000003384 imaging method Methods 0.000 description 21
- 239000013598 vector Substances 0.000 description 17
- 230000005684 electric field Effects 0.000 description 10
- 238000005286 illumination Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 230000003287 optical effect Effects 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 229920000642 polymer Polymers 0.000 description 5
- 238000003070 Statistical process control Methods 0.000 description 4
- 238000010304 firing Methods 0.000 description 4
- 239000005350 fused silica glass Substances 0.000 description 4
- 238000000608 laser ablation Methods 0.000 description 4
- 238000003754 machining Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000576 coating method Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 230000004075 alteration Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229920006254 polymer film Polymers 0.000 description 2
- 229920000307 polymer substrate Polymers 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 238000002310 reflectometry Methods 0.000 description 2
- 229920001646 UPILEX Polymers 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
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- 230000003247 decreasing effect Effects 0.000 description 1
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- 238000006731 degradation reaction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000000265 homogenisation Methods 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000004276 ovality control Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 210000001747 pupil Anatomy 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000009897 systematic effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Electromagnetism (AREA)
- Laser Beam Processing (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/198,160 US6172329B1 (en) | 1998-11-23 | 1998-11-23 | Ablated laser feature shape reproduction control |
| US09/198,160 | 1998-11-23 | ||
| PCT/US1999/007066 WO2000030801A1 (en) | 1998-11-23 | 1999-03-31 | Ablated laser feature shape reproduction control |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2348277A1 CA2348277A1 (en) | 2000-06-02 |
| CA2348277C true CA2348277C (en) | 2007-10-16 |
Family
ID=22732228
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002348277A Expired - Fee Related CA2348277C (en) | 1998-11-23 | 1999-03-31 | Ablated laser feature shape reproduction control |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US6172329B1 (enExample) |
| EP (1) | EP1131184B1 (enExample) |
| JP (1) | JP2002530206A (enExample) |
| KR (1) | KR20010089494A (enExample) |
| CN (1) | CN1326393A (enExample) |
| AU (1) | AU3374199A (enExample) |
| CA (1) | CA2348277C (enExample) |
| DE (1) | DE69903973T2 (enExample) |
| WO (1) | WO2000030801A1 (enExample) |
Families Citing this family (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19905571C1 (de) * | 1999-02-11 | 2000-11-16 | Bosch Gmbh Robert | Verfahren zur Erzeugung definiert konischer Löcher mittels eines Laserstrahls |
| JP2001071168A (ja) * | 1999-06-30 | 2001-03-21 | Canon Inc | レーザ加工方法、該レーザ加工方法を用いたインクジェット記録ヘッドの製造方法、該製造方法で製造されたインクジェット記録ヘッド |
| US6433303B1 (en) * | 2000-03-31 | 2002-08-13 | Matsushita Electric Industrial Co., Ltd. | Method and apparatus using laser pulses to make an array of microcavity holes |
| JP4659300B2 (ja) * | 2000-09-13 | 2011-03-30 | 浜松ホトニクス株式会社 | レーザ加工方法及び半導体チップの製造方法 |
| US6621044B2 (en) * | 2001-01-18 | 2003-09-16 | Anvik Corporation | Dual-beam materials-processing system |
| US6627844B2 (en) * | 2001-11-30 | 2003-09-30 | Matsushita Electric Industrial Co., Ltd. | Method of laser milling |
| WO2003068052A2 (en) * | 2002-02-12 | 2003-08-21 | Visx, Inc. | Smoothing laser beam integration using optical element motion |
| DE60313900T2 (de) | 2002-03-12 | 2008-01-17 | Hamamatsu Photonics K.K., Hamamatsu | Methode zur Trennung von Substraten |
| TWI326626B (en) * | 2002-03-12 | 2010-07-01 | Hamamatsu Photonics Kk | Laser processing method |
| WO2003076119A1 (fr) | 2002-03-12 | 2003-09-18 | Hamamatsu Photonics K.K. | Procede de decoupe d'objet traite |
| US20040076376A1 (en) * | 2002-10-17 | 2004-04-22 | Pate Michael A. | Optical fiber coupler and method of fabrication |
| TWI520269B (zh) | 2002-12-03 | 2016-02-01 | 濱松赫德尼古斯股份有限公司 | Cutting method of semiconductor substrate |
| US7846152B2 (en) | 2004-03-24 | 2010-12-07 | Amo Manufacturing Usa, Llc. | Calibrating laser beam position and shape using an image capture device |
| FR2852250B1 (fr) * | 2003-03-11 | 2009-07-24 | Jean Luc Jouvin | Fourreau de protection pour canule, un ensemble d'injection comportant un tel fourreau et aiguille equipee d'un tel fourreau |
| EP1609559B1 (en) * | 2003-03-12 | 2007-08-08 | Hamamatsu Photonics K. K. | Laser beam machining method |
| US20040199199A1 (en) * | 2003-04-02 | 2004-10-07 | Scimed Life Systems, Inc. | Filter and method of making a filter |
| US7115211B2 (en) * | 2003-08-13 | 2006-10-03 | Tokyo Electron Limited | Endpoint detection using laser interferometry |
| US20050047892A1 (en) * | 2003-08-29 | 2005-03-03 | Bremner Ronald Dean | Laser cut apertures for thread forming fasteners |
| ATE498928T1 (de) * | 2003-10-30 | 2011-03-15 | Metal Improvement Company Llc | Relay teleskop, laserverstärker, und laserschockbestrahlungsverfahren und dessen vorrichtung |
| US7291805B2 (en) * | 2003-10-30 | 2007-11-06 | The Regents Of The University Of California | Target isolation system, high power laser and laser peening method and system using same |
| US7110171B2 (en) * | 2003-10-30 | 2006-09-19 | Metal Improvement Company, Llc | Relay telescope including baffle, and high power laser amplifier utilizing the same |
| US20060011617A1 (en) * | 2004-07-13 | 2006-01-19 | Ricardo Covarrubias | Automated laser cutting of optical lenses |
| US7668364B2 (en) * | 2005-04-26 | 2010-02-23 | Hitachi Via Mechanics, Ltd. | Inspection method and apparatus for partially drilled microvias |
| JP2007118585A (ja) * | 2005-09-30 | 2007-05-17 | Brother Ind Ltd | ノズルプレートの製造方法及び液滴噴射装置の製造方法 |
| US8624157B2 (en) * | 2006-05-25 | 2014-01-07 | Electro Scientific Industries, Inc. | Ultrashort laser pulse wafer scribing |
| US20070282312A1 (en) * | 2006-05-31 | 2007-12-06 | Sie Ag Surgical Instrument Engineering | Ophthalmologic apparatus |
| US7615722B2 (en) | 2006-07-17 | 2009-11-10 | Coherent, Inc. | Amorphous silicon crystallization using combined beams from optically pumped semiconductor lasers |
| US20080013182A1 (en) * | 2006-07-17 | 2008-01-17 | Joerg Ferber | Two-stage laser-beam homogenizer |
| KR102209964B1 (ko) * | 2013-03-13 | 2021-02-02 | 삼성디스플레이 주식회사 | 피코초 레이저 가공 장치 |
| JP6324151B2 (ja) * | 2014-03-26 | 2018-05-16 | 住友重機械工業株式会社 | レーザ加工装置及びレーザ加工方法 |
| JP5923132B2 (ja) * | 2014-04-30 | 2016-05-24 | 住友電気工業株式会社 | レーザ加工装置用の偏光状態変換素子 |
| JP7601422B2 (ja) * | 2020-02-19 | 2024-12-17 | エレメンタル・サイエンティフィック・レーザーズ・リミテッド・ライアビリティ・カンパニー | ホモジナイザの動きによる可変ビームサイズ |
| JP7707125B2 (ja) * | 2022-05-02 | 2025-07-14 | 三菱重工業株式会社 | レーザ加工装置 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4491383A (en) * | 1982-09-20 | 1985-01-01 | Centro Ricerche Fiat S.P.A. | Device for modifying and uniforming the distribution of the intensity of a power laser beam |
| DE3317022A1 (de) * | 1983-05-10 | 1984-11-15 | W.C. Heraeus Gmbh, 6450 Hanau | Materialbearbeitungsanlage |
| US4734558A (en) * | 1983-05-16 | 1988-03-29 | Nec Corporation | Laser machining apparatus with controllable mask |
| US4626652A (en) * | 1985-03-21 | 1986-12-02 | Honeywell Inc. | Method and means of removing claddings from optical fibers |
| US4733944A (en) | 1986-01-24 | 1988-03-29 | Xmr, Inc. | Optical beam integration system |
| US4923772A (en) | 1986-10-29 | 1990-05-08 | Kirch Steven J | High energy laser mask and method of making same |
| US4908493A (en) * | 1988-05-31 | 1990-03-13 | Midwest Research Institute | Method and apparatus for optimizing the efficiency and quality of laser material processing |
| US4940881A (en) | 1989-09-28 | 1990-07-10 | Tamarack Scientific Co., Inc. | Method and apparatus for effecting selective ablation of a coating from a substrate, and controlling the wall angle of coating edge portions |
| US5057664A (en) * | 1989-10-20 | 1991-10-15 | Electro Scientific Industries, Inc. | Method and apparatus for laser processing a target material to provide a uniformly smooth, continuous trim profile |
| US5091626A (en) * | 1990-02-02 | 1992-02-25 | Hadassah Medical Organization | Method for the ablative reshaping of material surfaces |
| JP2599513B2 (ja) | 1990-06-25 | 1997-04-09 | インターナショナル・ビジネス・マシーンズ・コーポレイション | アブレーション・マスク |
| JPH04270091A (ja) * | 1991-01-18 | 1992-09-25 | Nissan Motor Co Ltd | レーザ加工装置 |
| JPH05185254A (ja) * | 1991-11-20 | 1993-07-27 | Nikon Corp | レーザ加工装置 |
| DE4220705C2 (de) | 1992-06-24 | 2003-03-13 | Lambda Physik Ag | Vorrichtung zum Aufteilen eines Lichtstrahles in homogene Teilstrahlen |
| JPH06182574A (ja) * | 1992-12-22 | 1994-07-05 | Hoya Corp | レーザ加工機 |
| US5378137A (en) | 1993-05-10 | 1995-01-03 | Hewlett-Packard Company | Mask design for forming tapered inkjet nozzles |
| US5610733A (en) | 1994-02-28 | 1997-03-11 | Digital Optics Corporation | Beam-homogenizer |
| WO1997006462A1 (en) * | 1995-08-09 | 1997-02-20 | Minnesota Mining And Manufacturing Company | Rotating optical system for laser machining apparatus |
-
1998
- 1998-11-23 US US09/198,160 patent/US6172329B1/en not_active Expired - Fee Related
-
1999
- 1999-03-31 DE DE69903973T patent/DE69903973T2/de not_active Expired - Fee Related
- 1999-03-31 CA CA002348277A patent/CA2348277C/en not_active Expired - Fee Related
- 1999-03-31 CN CN99813493A patent/CN1326393A/zh active Pending
- 1999-03-31 JP JP2000583668A patent/JP2002530206A/ja active Pending
- 1999-03-31 WO PCT/US1999/007066 patent/WO2000030801A1/en not_active Ceased
- 1999-03-31 AU AU33741/99A patent/AU3374199A/en not_active Abandoned
- 1999-03-31 EP EP99915156A patent/EP1131184B1/en not_active Expired - Lifetime
- 1999-03-31 KR KR1020017006468A patent/KR20010089494A/ko not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| CA2348277A1 (en) | 2000-06-02 |
| US6172329B1 (en) | 2001-01-09 |
| JP2002530206A (ja) | 2002-09-17 |
| WO2000030801A1 (en) | 2000-06-02 |
| CN1326393A (zh) | 2001-12-12 |
| DE69903973D1 (de) | 2002-12-19 |
| DE69903973T2 (de) | 2003-07-17 |
| EP1131184A1 (en) | 2001-09-12 |
| EP1131184B1 (en) | 2002-11-13 |
| AU3374199A (en) | 2000-06-13 |
| KR20010089494A (ko) | 2001-10-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request | ||
| MKLA | Lapsed |