JP2002528907A - スマートカードのためのホットメルト接着剤構成成分層 - Google Patents

スマートカードのためのホットメルト接着剤構成成分層

Info

Publication number
JP2002528907A
JP2002528907A JP2000578777A JP2000578777A JP2002528907A JP 2002528907 A JP2002528907 A JP 2002528907A JP 2000578777 A JP2000578777 A JP 2000578777A JP 2000578777 A JP2000578777 A JP 2000578777A JP 2002528907 A JP2002528907 A JP 2002528907A
Authority
JP
Japan
Prior art keywords
hot melt
melt adhesive
card
layer
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000578777A
Other languages
English (en)
Japanese (ja)
Inventor
リアネ・モイテン
パウル・ランフト
ユルゲン・グリュッツナー
ウヴェ・コルプ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henkel AG and Co KGaA
Original Assignee
Henkel AG and Co KGaA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel AG and Co KGaA filed Critical Henkel AG and Co KGaA
Publication of JP2002528907A publication Critical patent/JP2002528907A/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/76—Measuring, controlling or regulating
    • B29C45/77—Measuring, controlling or regulating of velocity or pressure of moulding material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0723—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C2045/14852—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles incorporating articles with a data carrier, e.g. chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/0097—Glues or adhesives, e.g. hot melts or thermofusible adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
JP2000578777A 1998-10-22 1999-10-13 スマートカードのためのホットメルト接着剤構成成分層 Pending JP2002528907A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19848712A DE19848712A1 (de) 1998-10-22 1998-10-22 Komponentenschicht für Smart Cards aus Schmelzklebstoffen
DE19848712.6 1998-10-22
PCT/EP1999/007683 WO2000025264A1 (de) 1998-10-22 1999-10-13 Komponentenschicht für smart cards aus schmelzklebstoffen

Publications (1)

Publication Number Publication Date
JP2002528907A true JP2002528907A (ja) 2002-09-03

Family

ID=7885287

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000578777A Pending JP2002528907A (ja) 1998-10-22 1999-10-13 スマートカードのためのホットメルト接着剤構成成分層

Country Status (6)

Country Link
EP (1) EP1123535A1 (de)
JP (1) JP2002528907A (de)
KR (1) KR20010080890A (de)
CA (1) CA2347818A1 (de)
DE (1) DE19848712A1 (de)
WO (1) WO2000025264A1 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013505307A (ja) * 2009-09-18 2013-02-14 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン 加水分解安定性ポリアミド
JP2019531918A (ja) * 2016-07-27 2019-11-07 コンポーズキュア，リミティド ライアビリティ カンパニー 取引カードのためのオーバーモールド加工電子部品及びその製造方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10040762A1 (de) 2000-08-19 2002-03-07 Henkel Kgaa Formteile aus Dimerfettsäurefreie Polyamiden
JP2002259930A (ja) * 2001-03-02 2002-09-13 Hitachi Cable Ltd 非接触ｉｃカードの製造方法
JP4706117B2 (ja) * 2001-03-26 2011-06-22 凸版印刷株式会社 Ｉｃカードの製造方法
FI117331B (fi) * 2001-07-04 2006-09-15 Rafsec Oy Menetelmä ruiskuvaletun tuotteen valmistamiseksi
DE10135595C1 (de) * 2001-07-20 2003-02-13 Optimel Schmelzgustechnik Gmbh Verfahren zum kontinuierlichen Herstellen von dünnen, beidseitig mit Isoliermaterialien umhüllten Transpondern
EP1436777B1 (de) * 2001-10-18 2007-08-22 Trüb AG Verfahren zur herstellung eines datenträgers sowie nach diesem verfahren hergestellter datenträger
DE10205914A1 (de) * 2002-02-13 2003-08-21 Giesecke & Devrient Gmbh Verfahren zur Herstellung von Polyesterfolien mit Transponderantennenspule
US8010405B1 (en) 2002-07-26 2011-08-30 Visa Usa Inc. Multi-application smart card device software solution for smart cardholder reward selection and redemption
US8015060B2 (en) 2002-09-13 2011-09-06 Visa Usa, Inc. Method and system for managing limited use coupon and coupon prioritization
US7121456B2 (en) 2002-09-13 2006-10-17 Visa U.S.A. Inc. Method and system for managing token image replacement
US9852437B2 (en) 2002-09-13 2017-12-26 Visa U.S.A. Inc. Opt-in/opt-out in loyalty system
US8626577B2 (en) 2002-09-13 2014-01-07 Visa U.S.A Network centric loyalty system
US7827077B2 (en) 2003-05-02 2010-11-02 Visa U.S.A. Inc. Method and apparatus for management of electronic receipts on portable devices
US8554610B1 (en) 2003-08-29 2013-10-08 Visa U.S.A. Inc. Method and system for providing reward status
US7104446B2 (en) 2003-09-03 2006-09-12 Visa U.S.A., Inc. Method, system and portable consumer device using wildcard values
US7051923B2 (en) 2003-09-12 2006-05-30 Visa U.S.A., Inc. Method and system for providing interactive cardholder rewards image replacement
US8005763B2 (en) 2003-09-30 2011-08-23 Visa U.S.A. Inc. Method and system for providing a distributed adaptive rules based dynamic pricing system
US8407083B2 (en) 2003-09-30 2013-03-26 Visa U.S.A., Inc. Method and system for managing reward reversal after posting
US7653602B2 (en) 2003-11-06 2010-01-26 Visa U.S.A. Inc. Centralized electronic commerce card transactions
US7992781B2 (en) 2009-12-16 2011-08-09 Visa International Service Association Merchant alerts incorporating receipt data
US8429048B2 (en) 2009-12-28 2013-04-23 Visa International Service Association System and method for processing payment transaction receipts
US9659832B2 (en) 2011-07-22 2017-05-23 H.B. Fuller Company Reactive hot-melt adhesive for use on electronics
CN103965703A (zh) * 2014-05-23 2014-08-06 南通恒隆化工有限公司 一种水泥地板涂料
US9242436B1 (en) 2014-09-08 2016-01-26 Electronic Data Magnetics, Inc. Transaction cards and system
US11618191B2 (en) 2016-07-27 2023-04-04 Composecure, Llc DI metal transaction devices and processes for the manufacture thereof
US10977540B2 (en) 2016-07-27 2021-04-13 Composecure, Llc RFID device
US10762412B2 (en) 2018-01-30 2020-09-01 Composecure, Llc DI capacitive embedded metal card
CA3075405A1 (en) 2017-09-07 2019-03-14 Composecure, Llc Transaction card with embedded electronic components and process for manufacture
US11151437B2 (en) 2017-09-07 2021-10-19 Composecure, Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting
WO2019079007A1 (en) 2017-10-18 2019-04-25 Composecure, Llc TRANSACTION CARD OF METAL, CERAMIC OR CERAMIC COATED HAVING WINDOW OR WINDOW PATTERN AND OPTIONAL BACKLIGHT
FR3077025B1 (fr) * 2018-01-25 2021-01-22 Les Bouchages Delage Procede d’integration d’un composant rfid dans un dispositif
SG10201906867RA (en) 2019-07-25 2021-02-25 Pci Private Ltd Method for manufacturing electronic device
USD948613S1 (en) 2020-04-27 2022-04-12 Composecure, Llc Layer of a transaction card

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3087386B2 (ja) * 1991-10-17 2000-09-11 三菱化学株式会社 熱可塑性樹脂組成物および電子部品封止成形品
DE4446027A1 (de) * 1994-12-23 1996-07-04 Henkel Kgaa Formteile aus PU-Schmelzklebstoffen
DE19519499B4 (de) * 1995-05-27 2005-05-25 Tesa Ag Thermoplastische Klebstoffolie und deren Verwendung
WO1997048562A1 (fr) * 1996-06-17 1997-12-24 Mitsubishi Denki Kabushiki Kaisha Procede de production de carte de circuits imprimes fines, et construction de ces dernieres
DE19709985A1 (de) * 1997-03-11 1998-09-17 Pav Card Gmbh Chipkarte, Verbindungsanordnung und Verfahren zum Herstellen einer Chipkarte
JPH11134465A (ja) * 1997-10-31 1999-05-21 Konica Corp Ｉｃカード
WO1999029797A1 (fr) * 1997-12-09 1999-06-17 Toagosei Co., Ltd. Composition adhesive thermofusible et cartes a circuit integre stratifiees par la resine
JPH11175682A (ja) * 1997-12-12 1999-07-02 Hitachi Maxell Ltd Ｉｃカード及びその製造方法
JP3951409B2 (ja) * 1998-02-12 2007-08-01 日立化成工業株式会社 Ｉｃカードとその製造法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013505307A (ja) * 2009-09-18 2013-02-14 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン 加水分解安定性ポリアミド
KR101755735B1 (ko) 2009-09-18 2017-07-07 헨켈 아게 운트 코. 카게아아 가수분해적으로 안정적인 폴리아미드
JP2019531918A (ja) * 2016-07-27 2019-11-07 コンポーズキュア，リミティド ライアビリティ カンパニー 取引カードのためのオーバーモールド加工電子部品及びその製造方法

Also Published As

Publication number Publication date
WO2000025264A1 (de) 2000-05-04
KR20010080890A (ko) 2001-08-25
DE19848712A1 (de) 2000-04-27
EP1123535A1 (de) 2001-08-16
CA2347818A1 (en) 2000-05-04

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