JP2002504587A5 - - Google Patents

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Publication number
JP2002504587A5
JP2002504587A5 JP2000532483A JP2000532483A JP2002504587A5 JP 2002504587 A5 JP2002504587 A5 JP 2002504587A5 JP 2000532483 A JP2000532483 A JP 2000532483A JP 2000532483 A JP2000532483 A JP 2000532483A JP 2002504587 A5 JP2002504587 A5 JP 2002504587A5
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JP
Japan
Prior art keywords
group
monomers
monomer
basic
hot melt
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Granted
Application number
JP2000532483A
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English (en)
Japanese (ja)
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JP4440463B2 (ja
JP2002504587A (ja
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Priority claimed from US09/025,607 external-priority patent/US6720387B1/en
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Publication of JP2002504587A publication Critical patent/JP2002504587A/ja
Publication of JP2002504587A5 publication Critical patent/JP2002504587A5/ja
Application granted granted Critical
Publication of JP4440463B2 publication Critical patent/JP4440463B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2000532483A 1998-02-18 1998-06-29 ホットメルト接着剤組成物 Expired - Fee Related JP4440463B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/025,607 US6720387B1 (en) 1998-02-18 1998-02-18 Hot-melt adhesive compositions comprising acidic polymer and basic polymer blends
US09/025,607 1998-02-18
PCT/US1998/013135 WO1999042536A1 (en) 1998-02-18 1998-06-29 Hot-melt adhesive composition

Publications (3)

Publication Number Publication Date
JP2002504587A JP2002504587A (ja) 2002-02-12
JP2002504587A5 true JP2002504587A5 (https=) 2006-01-05
JP4440463B2 JP4440463B2 (ja) 2010-03-24

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ID=21827044

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000532483A Expired - Fee Related JP4440463B2 (ja) 1998-02-18 1998-06-29 ホットメルト接着剤組成物

Country Status (6)

Country Link
US (2) US6720387B1 (https=)
EP (1) EP1054932B1 (https=)
JP (1) JP4440463B2 (https=)
AU (1) AU8263298A (https=)
DE (1) DE69831356T2 (https=)
WO (1) WO1999042536A1 (https=)

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CN111171731B (zh) * 2018-11-09 2021-12-03 3M创新有限公司 双网络压敏胶组合物以及包含其的压敏胶制品
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