JP2002503033A5 - - Google Patents

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Publication number
JP2002503033A5
JP2002503033A5 JP2000530944A JP2000530944A JP2002503033A5 JP 2002503033 A5 JP2002503033 A5 JP 2002503033A5 JP 2000530944 A JP2000530944 A JP 2000530944A JP 2000530944 A JP2000530944 A JP 2000530944A JP 2002503033 A5 JP2002503033 A5 JP 2002503033A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000530944A
Other versions
JP2002503033A (ja
Filing date
Publication date
Priority claimed from DK199800101A external-priority patent/DK174111B1/da
Application filed filed Critical
Publication of JP2002503033A publication Critical patent/JP2002503033A/ja
Publication of JP2002503033A5 publication Critical patent/JP2002503033A5/ja
Pending legal-status Critical Current

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JP2000530944A 1998-01-26 1999-01-25 電気的接続要素および電気的接続要素を作る方法 Pending JP2002503033A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DK0101/98 1998-01-26
DK199800101A DK174111B1 (da) 1998-01-26 1998-01-26 Elektrisk forbindelseselement samt fremgangsmåde til fremstilling af et sådant
PCT/DK1999/000036 WO1999040627A1 (en) 1998-01-26 1999-01-25 An electrical connecting element and a method of making such an element

Publications (2)

Publication Number Publication Date
JP2002503033A JP2002503033A (ja) 2002-01-29
JP2002503033A5 true JP2002503033A5 (ja) 2006-03-09

Family

ID=8089750

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000530944A Pending JP2002503033A (ja) 1998-01-26 1999-01-25 電気的接続要素および電気的接続要素を作る方法

Country Status (6)

Country Link
US (1) US7212088B1 (ja)
EP (1) EP1051749A1 (ja)
JP (1) JP2002503033A (ja)
AU (1) AU2150299A (ja)
DK (1) DK174111B1 (ja)
WO (1) WO1999040627A1 (ja)

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FR2799887A1 (fr) * 1999-10-07 2001-04-20 Cit Alcatel Connexions de modules multi-puces hyperfrequence par transfert automatique sur bande
SE517455C2 (sv) * 1999-12-15 2002-06-11 Ericsson Telefon Ab L M Effekttransistormodul, effektförstärkare samt förfarande för framställning därav
SE517852C2 (sv) 1999-12-15 2002-07-23 Ericsson Telefon Ab L M Effekttransistormodul, effektförstärkare samt förfarande vid framställning därav
US6677832B1 (en) 2000-10-27 2004-01-13 Lucent Technologies Inc. Connector for differential-mode transmission line providing virtual ground
GB2378045A (en) * 2001-07-25 2003-01-29 Marconi Caswell Ltd Electrical connection with flexible coplanar transmission line
US8847696B2 (en) * 2002-03-18 2014-09-30 Qualcomm Incorporated Flexible interconnect cable having signal trace pairs and ground layer pairs disposed on opposite sides of a flexible dielectric
US7336139B2 (en) * 2002-03-18 2008-02-26 Applied Micro Circuits Corporation Flexible interconnect cable with grounded coplanar waveguide
US7888957B2 (en) * 2008-10-06 2011-02-15 Cascade Microtech, Inc. Probing apparatus with impedance optimized interface
JP2010135722A (ja) * 2008-11-05 2010-06-17 Toshiba Corp 半導体装置
US8410806B2 (en) 2008-11-21 2013-04-02 Cascade Microtech, Inc. Replaceable coupon for a probing apparatus
US9601530B2 (en) 2008-12-02 2017-03-21 Arizona Board Of Regents, A Body Corporated Of The State Of Arizona, Acting For And On Behalf Of Arizona State University Dual active layer semiconductor device and method of manufacturing the same
JP5583140B2 (ja) * 2008-12-02 2014-09-03 アリゾナ・ボード・オブ・リージェンツ，フォー・アンド・オン・ビハーフ・オブ・アリゾナ・ステート・ユニバーシティ フレキシブル基板アセンブリを準備する方法およびその方法により準備されたフレキシブル基板アセンブリ
US9721825B2 (en) 2008-12-02 2017-08-01 Arizona Board Of Regents, A Body Corporate Of The State Of Arizona, Acting For And On Behalf Of Arizona State University Method of providing a flexible semiconductor device and flexible semiconductor device thereof
US9991311B2 (en) 2008-12-02 2018-06-05 Arizona Board Of Regents On Behalf Of Arizona State University Dual active layer semiconductor device and method of manufacturing the same
JP5287390B2 (ja) * 2009-03-16 2013-09-11 ソニー株式会社 半導体装置、伝送システム、半導体装置の製造方法及び伝送システムの製造方法
TW201117262A (en) 2009-05-29 2011-05-16 Univ Arizona Method of providing a flexible semiconductor device at high temperatures and flexible semiconductor device thereof
WO2012021196A2 (en) 2010-05-21 2012-02-16 Arizona Board Of Regents, For And On Behalf Of Arizona State University Method for manufacturing electronic devices and electronic devices thereof
WO2012021197A2 (en) 2010-05-21 2012-02-16 Arizona Board Of Regents, For And On Behalf Of Arizona State University Method of manufacturing electronic devices on both sides of a carrier substrate and electronic devices thereof
US8290319B2 (en) * 2010-08-25 2012-10-16 Oracle America, Inc. Optical communication in a ramp-stack chip package
US8373280B2 (en) 2010-09-01 2013-02-12 Oracle America, Inc. Manufacturing fixture for a ramp-stack chip package using solder for coupling a ramp component
US8283766B2 (en) 2010-09-02 2012-10-09 Oracle America, Inc Ramp-stack chip package with static bends
US8772920B2 (en) 2011-07-13 2014-07-08 Oracle International Corporation Interconnection and assembly of three-dimensional chip packages
JP5861868B2 (ja) * 2011-11-04 2016-02-16 ソニー株式会社 電子回路および電子回路の製造方法
US9082632B2 (en) 2012-05-10 2015-07-14 Oracle International Corporation Ramp-stack chip package with variable chip spacing
US9590288B2 (en) 2013-04-09 2017-03-07 Taiyo Yuden Co., Ltd. Multilayer circuit substrate
JP5542231B1 (ja) * 2013-04-09 2014-07-09 太陽誘電株式会社 多層回路基板
US10381224B2 (en) 2014-01-23 2019-08-13 Arizona Board Of Regents On Behalf Of Arizona State University Method of providing an electronic device and electronic device thereof
WO2015156891A2 (en) 2014-01-23 2015-10-15 Arizona Board Of Regents, Acting For And On Behalf Of Arizona State University Method of providing a flexible semiconductor device and flexible semiconductor device thereof
WO2017034644A2 (en) 2015-06-09 2017-03-02 ARIZONA BOARD OF REGENTS a body corporate for THE STATE OF ARIZONA for and on behalf of ARIZONA STATE UNIVERSITY Method of providing an electronic device and electronic device thereof
KR102466741B1 (ko) 2014-05-13 2022-11-15 아리조나 보드 오브 리젠츠 온 비하프 오브 아리조나 스테이트 유니버시티 전자 디바이스를 제공하는 방법
US9741742B2 (en) 2014-12-22 2017-08-22 Arizona Board Of Regents, A Body Corporate Of The State Of Arizona, Acting For And On Behalf Of Arizona State University Deformable electronic device and methods of providing and using deformable electronic device
US10446582B2 (en) 2014-12-22 2019-10-15 Arizona Board Of Regents On Behalf Of Arizona State University Method of providing an imaging system and imaging system thereof
US20170085243A1 (en) * 2015-09-21 2017-03-23 Intel Corporation Impedance matching interconnect
US10784215B2 (en) * 2018-11-15 2020-09-22 Steradian Semiconductors Private Limited Millimeter wave integrated circuit and system with a low loss package transition

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US4600907A (en) 1985-03-07 1986-07-15 Tektronix, Inc. Coplanar microstrap waveguide interconnector and method of interconnection
US5256996A (en) * 1987-10-06 1993-10-26 The Board Of Trustees Of The Leland Stanford, Junior University Integrated coplanar strip nonlinear transmission line
US4806892A (en) * 1987-11-09 1989-02-21 Trw Inc. Inclined RF connecting strip
US4862120A (en) * 1988-02-29 1989-08-29 Canadian Patents And Development Limited/Societe Canadienne Des Brevets Et D'exploitation Limitee Wideband stripline to microstrip transition
US5182631A (en) * 1988-04-15 1993-01-26 Nippon Telegraph And Telephone Corporation Film carrier for RF IC
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US5065124A (en) 1990-09-04 1991-11-12 Watkins-Johnson Company DC-40 GHz module interface
JP2653583B2 (ja) 1991-09-17 1997-09-17 住友ベークライト株式会社 表面にポリアミック酸層を有するポリイミドフィルム及びこれを用いたフレキシブル印刷回路用基板
JPH06334410A (ja) 1993-05-24 1994-12-02 Japan Aviation Electron Ind Ltd フレキシブル配線基板
DE69421767T2 (de) * 1993-08-09 2000-05-31 Nippon Telegraph And Telephone Corp., Tokio/Tokyo Optoelektronische Hybridintegrationsplattform, optisches Untermodul, optoelektronische hybridintegrierte Schaltung, und Herstellungsverfahren der Plattform
US5753968A (en) * 1996-08-05 1998-05-19 Itt Industries, Inc. Low loss ridged microstrip line for monolithic microwave integrated circuit (MMIC) applications
US5825084A (en) * 1996-08-22 1998-10-20 Express Packaging Systems, Inc. Single-core two-side substrate with u-strip and co-planar signal traces, and power and ground planes through split-wrap-around (SWA) or split-via-connections (SVC) for packaging IC devices

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