JP2002359327A - Electronic circuit module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a small-sized electronic circuit module having a high performance and capable of maintaining electric characteristics of a surface acoustic wave element without influence of heating due to a power amplifying element. SOLUTION: The electronic circuit module comprises a recess 2a for mounting a power amplifying element formed on one main surface of a dielectric board 2; a recess 2b for mounting a surface acoustic wave element on a main surface or other main surface; the power amplifying element 4 and the surface acoustic wave element 8 mounted via conductor bumps 3a, 3b; a heat transfer cover 6 mounted in contact with the element 4 in the recess 2a; a cover 9 mounted in space from the element 8 in the recess 2b; and a conductor layer 2a1 extended from a bottom of the recess 2a connected at one end between the recess 2a and the recess 2b and formed at other end with a penetrating conductor 11 exposed with one main surface of the board 2, in such a manner that the cover 6 and the conductor 11 are mounted at a radiating conductor 15 on an upper surface of an external electric circuit board 7 via a brazing material 13 on the board 7.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to a portable information terminal,
Wireless LAN, WLL (Wireless Local)
The present invention relates to a small, high-performance, low-cost electronic circuit module integrally formed with a high-frequency power amplifying device, a high-frequency filter device, and a high-frequency demultiplexer device, which are used in electronic devices and electronic devices such as Loop.

[0002]

2. Description of the Related Art A high-frequency power amplifying device constituting a high-frequency power amplifying device in an electronic circuit module handles a large amount of high-frequency power in accordance with an increase in transmission capacity and an increase in transmission speed in a current mobile communication system. The heating value of the element itself is increasing. As a measure against the heat dissipation, there are a method of attaching a heat dissipation fin and a method of using a high thermal conductive ceramic such as aluminum nitride etc. on the dielectric substrate on which the high frequency power amplifier is mounted, to obtain good heat dissipation. Can be done. Further, Japanese Patent Application Laid-Open No. 2000-31331 proposes a technique for improving heat dissipation by arranging a high-frequency power amplifying element on the back surface of a wiring board and soldering it to an external electric circuit board.

A surface acoustic wave element used in a high-frequency filter device or the like provided in the vicinity of a high-frequency power amplifier in an electronic circuit module generally propagates a surface acoustic wave on a piezoelectric substrate such as lithium tantalate. However, since the electrical characteristics of the piezoelectric substrate itself are greatly affected by temperature changes, it should be placed in a module away from heating elements such as high-frequency power amplifiers. Is indispensable.
For this reason, an electronic circuit module in which a conventional high-frequency power amplifier and a high-frequency filter device are integrally formed has been used to reduce the size, weight, density, and cost of information terminals for mobile communication in recent years. However, there is a problem that it is not possible to sufficiently meet the demands for such services.

On the other hand, for example, Japanese Patent Laid-Open No. 7-58586
Japanese Patent Application Laid-Open No. H10-209,1992 discloses a compact, low-cost high-frequency circuit device in which an active circuit element, which is a high-frequency power amplification element, is mounted on a single piezoelectric substrate on which a passive circuit element, which is a surface acoustic wave element, is formed. It has been proposed to.

[0005]

However, in the high-frequency circuit device disclosed in Japanese Patent Application Laid-Open No. 7-58586, a large amount of high-frequency power is required in recent mobile communication systems with an increase in transmission capacity and an increase in transmission speed. If the active circuit element, which is a high-frequency power amplifier, is mounted on a single piezoelectric substrate on which a passive circuit element, which is a surface acoustic wave element, must be handled, the high-frequency power amplifier itself generates significant heat. However, deterioration of filter characteristics due to heat in a high-frequency filter formed on a piezoelectric substrate has become a problem, and there has been a problem that it cannot be used for a small information terminal device used in a mobile communication system that handles large high-frequency power. .

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems in the prior art, and has as its object the advantage that it is not affected by heat generated by a power amplifying element for high-power high-frequency use.
A portable information terminal, a wireless LAN, a WLL, etc., which can maintain electrical characteristics such as high-frequency filter characteristics of a surface acoustic wave element disposed in the vicinity thereof, and is small in size, high in performance and low in price. Another object of the present invention is to provide an electronic circuit module suitable for an electronic apparatus, an electronic device, and the like.

[0007]

According to the electronic circuit module of the present invention, a concave portion for mounting a power amplification element and a concave portion for mounting a surface acoustic wave element are provided on one main surface of a dielectric substrate formed by laminating a plurality of dielectric layers. Are formed, and a power amplification element and a surface acoustic wave element are mounted on a conductor layer formed on the bottom surface of each recess, and at least the power amplification element mounting recess is in contact with the power amplification element and has a heat conductive cover. The body is attached, and between the power amplifying element mounting recess and the surface acoustic wave element mounting recess, an extension of the conductor layer of the power amplifying element mounting recess extends from the dielectric substrate. A through conductor extending to the one main surface is formed, and the heat conductive lid and the through conductor are attached to a heat dissipation conductor on an upper surface of an external electric circuit board via a brazing material and mounted. It is characterized by

According to another electronic circuit module of the present invention, a power amplifier mounting recess is provided on one main surface of a dielectric substrate formed by laminating a plurality of dielectric layers, and a surface acoustic wave is provided on the other main surface. An element mounting recess is formed, and a power amplification element and a surface acoustic wave element are mounted on a conductor layer formed on the bottom surface of each recess, and at least the power amplification element mounting recess is in contact with the power amplification element. With the heat conductive lid attached, between the power amplifying element mounting recess and the surface acoustic wave element mounting recess, the power amplifying element mounting recess from the extending portion of the conductor layer. A through conductor extending to the one main surface of the dielectric substrate is formed, and the heat conductive lid and the through conductor are attached to a heat dissipation conductor on an upper surface of the external electric circuit board via a brazing material and mounted. Is characterized by being That.

According to the above configuration of the present invention, the heat generated from the power amplifying element is transferred to the heat dissipation conductor on the upper surface of the external electric circuit board via the heat conductive lid and the brazing material directly joined to the power amplifying element. It is possible to efficiently dissipate heat. Further, heat transfer from the power amplifying element to the surface acoustic wave element arranged in the vicinity thereof is blocked by the through conductor,
Heat transfer to the surface acoustic wave element can be extremely reduced. As a result, a small and high-performance electronic circuit module can be provided without deteriorating electrical characteristics such as high-frequency filter characteristics of the surface acoustic wave element.

In addition, according to this configuration, it is not necessary to separately provide a heat radiation member such as a heat radiation fin. Further, the power amplifying element is mounted in a concave portion formed on the mounting surface side of the dielectric substrate, and the surface acoustic wave element may be either the dielectric substrate, but the power amplifying element and the elastic surface By mounting the wave element, the number of steps can be reduced, and a low-cost electronic circuit module can be obtained.

In the above electronic circuit module, in order to further reduce the influence of heat generated from the power amplifying element on the surface acoustic wave element, the thermal conductivity of the dielectric layer is set to 20 W / m · K or less. In particular, the dielectric layer around the power amplifying element mounting recess is formed by a dielectric layer having a smaller thermal conductivity than the dielectric layer around the surface acoustic wave element mounting recess, The recess for mounting the power amplification element and the recess for mounting the surface acoustic wave element are separated by 0.3 mm or more, and the thermal conductivity of the through conductor is 100 W
/ M · K or more, a plurality of the through conductors are formed between the power amplifying element mounting recess and the surface acoustic wave element mounting recess, a bottom surface of the power amplifying element mounting recess. And the conductor layer on the bottom surface of the concave portion for mounting a surface acoustic wave element are formed on different dielectric layers.

With these improvements, a small, high-performance electronic circuit module can be provided without deteriorating electrical characteristics such as high-frequency filter characteristics and high-frequency demultiplexer characteristics of the surface acoustic wave element.

The concave portion for mounting the surface acoustic wave element is
It may be either sealed with a lid or filled with an insulating resin in the recess.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an electronic circuit module according to the present invention will be described in detail with reference to the drawings.

FIG. 1 is a sectional view showing an embodiment of an electronic circuit module according to the present invention. In this example, an electronic circuit module 1 is an external electric circuit board 7 such as a motherboard.
It is mounted on and implemented.

The dielectric substrate 2 of the electronic circuit module 1 is formed by laminating a plurality of dielectric layers. The dielectric layers include low-temperature fired ceramics such as alumina ceramics, mullite ceramics, glass ceramics, and the like. A mixed material of an organic resin material and a ceramic material can be used. In particular, Cu, Ag as a conductor
When forming by co-firing, low-temperature fired ceramics such as glass ceramics, and mixed materials of organic resin materials and ceramic materials can be used. In terms of excellent thermal stability, low-temperature fired ceramics such as glass ceramics can be used. Is most desirable.

The thermal conductivity of the dielectric layer constituting the dielectric substrate 2 can be controlled by the ceramic material to be used and the mixing ratio thereof, and is 20 W / m · K or less, particularly 10 W / m · K or less. / M · K or less, preferably 5 W / m · K or less, more preferably 3 W / m · K or less.

In the electronic circuit module shown in FIG. 1, a concave portion 2a for mounting a power amplifying element is provided on a bottom surface of a dielectric substrate 2.
The surface acoustic wave element mounting recess 2b is formed at a predetermined interval.

At the bottom of the power amplifier mounting recess 2a,
The conductor layer 2a1 is formed, and the power amplifying element 4 is electrically connected and mounted via the conductor bump 3a. Here, gold, solder, thermosetting Ag paste, or the like can be used for the conductor bumps 3a. For example, when gold is used, the electrodes of the power amplification element 4 and the electrode portions are electrically connected by ultrasonic thermocompression bonding. Connection can be achieved, and the connection resistance can be reduced and the conductor loss can be reduced as compared with solder or thermosetting Ag paste.

As the power amplifying element 4, for example, a pn junction gate type field effect transistor, a Schottky barrier gate type field effect transistor, a hetero junction type field effect transistor, a pn junction gate type hetero junction type field effect transistor And the like.
A so-called underfill 5 is injected between the conductive layer 2a1 and the conductor layer 2a1 for the purpose of protecting the connection portion and the element surface.
The underfill 5 can be made of an epoxy resin, a silicone resin, or the like that is cured by applying heat. Further, as the underfill 5, in the electronic circuit module 1 of the present invention, it is desirable to use one having a thermal conductivity of 20 W / m · K or less, and use an epoxy resin having a thermal conductivity of about 10 W / m · K or less. Is preferred. This makes it possible to suppress the transmission of heat generated by the power amplifying element 4 to the dielectric substrate 2 itself.

The heat conductive lid 6 is brought into contact with the opening of the power amplifying element mounting recess 2a directly or through a heat conductive compound such as grease for heat dissipation. Be attached. The heat conductive lid 6 is for efficiently transmitting the heat generated by the power amplifying element 4 to the external electric circuit board 7, and is specifically made of a metal such as copper or the like having a high thermal conductivity. Preferably, one is used.

The heat-conductive lid 6 is connected to the brazing material 13.
Is attached to the heat radiating conductor 15 on the upper surface of the external electric circuit board 7 via the. Thereby, the heat generated from the power amplifying element 4 passes through the heat conductive lid 6 and the brazing material 13,
Heat dissipation conductor 15 formed on the surface of external electric circuit board 7
To the surface acoustic wave element 8 in the module.

In order to obtain good brazing properties with the back electrode of the power amplifying element 4 and the heat dissipation conductor 15 and the grounding electrode (not shown) on the upper surface of the external electric circuit board 7, a heat conductive lid is provided. It is preferable that the surface of No. 6 be plated with Ni, Sn, solder or the like.

On the other hand, the surface acoustic wave element 8 is provided in the concave portion 2b for mounting the surface acoustic wave element on the bottom surface of the concave portion 2b for mounting the surface acoustic wave element via the conductive bump 3b.
It is mounted electrically connected to the electrode part consisting of b1. Gold, solder, thermosetting Ag paste, or the like can be used for the conductor bumps 3b as in the case of the conductor bumps 3a. For example, when gold is used, the electrodes of the surface acoustic wave element 8 are connected by ultrasonic thermocompression bonding. It becomes possible to electrically connect with the electrode part.

Examples of the surface acoustic wave element 8 include a resonator type filter, a resonator ladder type and a lattice type connection filter, a multi-IDT (Inter Digital Tra).
An nsducer type filter or the like is used. When the surface acoustic wave element 8 is, for example, a resonator filter, a 36 ° Y-cut X-propagating LiTaO ₃ crystal, a 64 ° Y-cut-X propagating LiNbO ₃ crystal, 45
An XB cut-Z propagating LiB ₄ O ₇ crystal or the like is preferably used because of its large electromechanical coupling coefficient and small group delay time temperature coefficient. The surface acoustic wave element 8 includes
In order to excite, propagate, and resonate a surface acoustic wave on the surface of the piezoelectric substrate, at least a pair of IDTs (Interfaces) of at least a pair of comb-shaped electrodes formed on the surface so as to mesh with each other.
Digital Transducer) electrodes (not shown) are provided. The IDT electrode is configured by connecting a plurality of pairs of comb-shaped electrodes in a series connection, a parallel connection, or the like, in order to obtain a desired filter characteristic. Such IDT
The electrodes can be formed in a desired shape and dimensions on the piezoelectric substrate by a thin film forming method such as an evaporation method, a sputtering method, or a CVD method.

In the module shown in FIG. 1, a lid 9 is attached to the opening of the concave portion 2b for mounting the surface acoustic wave element so as to be separated from the surface acoustic wave element 8. The lid 9 is provided with low-humidity air or the like in the inner space of the surface acoustic wave element mounting recess 2b, which is a vibration space, for the purpose of mechanical protection of the surface acoustic wave element 8 and suppression of deterioration of the IDT electrode due to oxidation. It is sealed and attached using an epoxy resin, a brazing material, or the like, and seals the concave portion 2b for mounting the surface acoustic wave element. Even if an inert gas such as a nitrogen gas or an argon gas or an inert gas having a lower thermal conductivity than air is sealed and sealed instead of air, the IDT electrode can be prevented from being deteriorated by oxidation.

The material used for the lid 9 is SU
Metals such as S, copper, and nickel silver, and resins such as glass epoxy resin can be used. Above all, heat generated by the power amplifying element 4 is transmitted to the external electric circuit board 7 via the heat conductive lid 6, so that the heat transmitted to the external electric circuit board 7 is again transmitted to the surface acoustic wave via the lid 9. It is preferable to use a material made of glass epoxy resin having a low thermal conductivity so as not to be transmitted to the element 8.

The lid 9 is attached to the surface acoustic wave element mounting recess 2b so as to be separated from the surface acoustic wave element 8, and a gap 10 is also provided between the lid 9 and the external electric circuit board 7. With the provision, the transmission of heat generated by the power amplification element 4 can be more reliably suppressed.

In the example of FIG. 1, the opening of the concave portion 2b for mounting the surface acoustic wave element is sealed with the lid 9, but the concave portion 2b is filled with a sealing resin such as a silicone resin or an epoxy resin. By doing so, sealing can be performed.

It is preferable that a gap of 0.3 mm or more is provided between the concave portion 2a for mounting the power amplifying element and the concave portion 2b for mounting the surface acoustic wave element, more preferably 0.5 m.
By providing an interval of m or more, it is possible to sufficiently reduce the transmission of heat generated by the power amplifying element 4 to the surface acoustic wave element 8 via the dielectric layer between the recesses 2a and 2b.

According to the present invention, the conductor layer 2a1 formed on the bottom surface of the power amplifying element mounting recess 2a extends in the horizontal direction, and the power amplifying element mounting recess 2a and the surface acoustic wave element mounting are formed. A through conductor 11 extending from the extending portion to the surface of the dielectric substrate on which the power amplification element mounting concave portion 2a is formed is formed between the extension portion and the concave portion 2b. And, like the heat conductive lid 6, the through conductor 11 is also provided with the heat dissipation conductor 1 on the upper surface of the external electric circuit board 7 via the brazing material 13.
5 is attached.

By forming such a through conductor 11, the heat transmitted to the conductor layer 2a1 on the bottom surface of the concave portion 2a and the heat transmitted to the dielectric layer between the concave portions 2a and 2b among the heat generated by the power amplifying element 4. Is absorbed by the through conductor 11,
The heat can be efficiently transmitted to the heat-radiating conductor 15 formed on the surface of the external electric circuit board 7 via the brazing material 13.

The above effect can be further enhanced by providing not only one through-conductor 11 but also two or more through-conductors 11 between the power amplifying element mounting recess 2a and the surface acoustic wave element mounting recess 2b. it can.

FIGS. 2 to 4 show specific examples. FIG.
FIG. 2 is a plan view when the electronic circuit module of FIG. 1 is cut along line AA ′. 3 and 4 are plan views showing still another example.

According to the example of FIG. 2, the penetrating conductor 11 is provided with the power amplifying element mounting recess 2a which is obliquely arranged in a plan view.
And two concave portions 2b are formed substantially in the middle of the surface acoustic wave element mounting concave portion 2b. FIG. 3 shows that a plurality of through conductors 11 are linearly arranged in a substantially intermediate portion between the concave portions 2a and 2b in which the through conductors 11 are arranged side by side so as to surround the concave portion 2a side. Further, FIG. 4 shows an example in which a plurality of through conductors 11 are arranged in a so-called zigzag pattern at a substantially intermediate portion between the concave portions 2a and the concave portions 2b arranged side by side.

The through conductor 11 is desirably formed of a metal having excellent heat conductivity in view of its function.
It is desirable that the conductive layer be formed of a conductor mainly composed of a metal mainly composed of at least one selected from the group consisting of Cu, CuO, Ag, Ag-Pd, Ag-Pt and Au. In particular, the through conductor 11 is at least five times the thermal conductivity of the dielectric substrate 2 in order to prevent the heat generated by the power amplifying element 4 from being transmitted to the dielectric substrate 2 and further to the surface acoustic wave element 8. It is desirable to increase it, and it is more preferable to use one having a thermal conductivity of 100 W / m · K or more. In addition, the through conductor 11 may contain an inorganic substance such as a metal oxide or glass in order to match firing shrinkage during firing firing with the dielectric substrate.

The high thermal conductive through conductor 11 is made of, for example, about 85% by mass of Ag powder and 3% of lead borosilicate glass.
The thermal conductivity can be set to about 150 W / m · K by setting the mixing ratio of SiO ₂ to 12% by mass.

The through conductor 11 has a diameter (short diameter) of 0.1 to
It is preferable that the distance between the side surfaces of the through conductor 11 is 0.2 to 1.0 m.
It may be arranged at intervals of m. Also, this through conductor 11
Does not necessarily have to be circular, but may be oval or slit.

Further, in the module of the present invention, as shown in FIG. 1, the concave portions 2a and 2b are formed at different depths, respectively, so that the bottom surface of the power amplifying element mounting concave portion 2a formed on the dielectric substrate 2 is formed. By forming the conductor layers 2a1 and 2b1 formed on the bottom surface of the concave portion 2b for mounting a surface acoustic wave element and the conductor layers 2a1 and 2b1 respectively on different dielectric layers, compared with the case where they are formed on the same dielectric layer. In addition, the amount of heat transferred from the power amplifying element 4 to the surface acoustic wave element 8 via the dielectric layer or the conductor layer can be reduced more effectively, and the electrical characteristics due to the thermal influence of the surface acoustic wave element 8 can be reduced. Degradation can be more reliably prevented.

In the electronic circuit module 1 of the present invention, in order to make the power amplifying element 4 and the surface acoustic wave element 8 function electrically, the internal conductor wiring 16, the surface conductor wiring 17, and the via hole conductor 18 are formed and Electronic components 12 such as resistors, capacitors, inductors, and semiconductor elements are mounted on the upper surface of the body substrate 2 to form a desired electronic circuit. Also, if necessary,
Inside the dielectric substrate 2, a high-frequency filter (not shown) using a conductor, a capacitor, an inductor, and the like is used.
By incorporating such components, the electronic circuit module 1 with higher performance and smaller size can be configured.

In order to protect the electronic components 12 and circuits mounted on the surface of the electronic circuit module 1, a metal shield case 14 is attached to prevent external mechanical stress, influence of atmosphere, and electromagnetic noise. It is also possible to block or suppress.

Further, in the electronic circuit module 1, the electrode pads 20 formed on the electronic circuit module 1 are connected to the external electric circuit board 7 for signal transmission with the brazing material 1.
3 is connected to a signal wiring layer 21 formed on the surface of the external electric circuit board 7.

FIG. 5 is a sectional view showing another example of the electronic circuit module of the present invention. In the example of FIG. 1, the concave portion 2b for mounting the surface acoustic wave element is formed on the same surface as the surface on which the concave portion 2a for mounting the power amplifying element is formed. 1 is formed on the surface opposite to the surface on which is formed, that is, on the front surface side, and is mounted on the conductor layer 2b1 formed in the concave portion 2b as in FIG. Further, in this example, the concave portion 2b is filled with an insulating organic resin 19 and sealed with a resin.

Also in this embodiment, a through conductor 11 is formed in a portion located between the concave portion 2b for mounting the surface acoustic wave element and the concave portion 2a for mounting the power amplification element, as in FIG. At this time, one end of the through conductor 11 is exposed on the lower surface of the module 1 and brazed to the heat dissipation conductor 15 via the brazing material 13 as in FIG.
It may be connected to the extension of the conductor layer 2a1 and may further extend on the upper surface side.

FIG. 6 is a schematic sectional view showing still another example of the electronic circuit module of the present invention. In the examples shown in FIGS. 1 and 5, the dielectric substrate 2 is formed of the same material.
is formed of a dielectric material having a lower thermal conductivity than other portions, the dielectric material around the concave portion 2a functions as a heat insulating material, and heat generated from the power amplifying element 4 diffuses to the surroundings. , Can be prevented from being transmitted.

FIG. 7 is a schematic sectional view showing still another example of the electronic circuit module of the present invention. In the example of FIG. 6, two kinds of dielectric materials having different thermal conductivities exist in the same dielectric layer. However, as shown in FIG. 5, a concave portion 2a for mounting the power amplifying element is formed on the lower surface side. In the case where the surface acoustic wave element mounting concave portion 2b is provided on the upper surface side, the lower surface of the module 1 may be entirely formed of a material having low thermal conductivity as shown in FIG.

The electronic circuit module of the present invention can be manufactured by a conventional and well-known method. Here, as a preferred example, a case where the dielectric substrate is made of a glass ceramic composition will be briefly described below.

First, in order to form each dielectric layer on the dielectric substrate 2, a ceramic green sheet made of a glass ceramic composition to be each dielectric layer is prepared. The ceramic green sheet serving as the dielectric layer is made of 30 to 90% by mass of a well-known glass such as borosilicate glass, zinc borosilicate glass, SiO ₂ —Al ₂ O ₃ —alkaline earth oxide.
A mixture of inorganic fillers such as alumina, quartz, mullite, AlN, and forsterite in a ratio of 10 to 70% by mass is mixed with an organic binder such as alkyl methacrylate, a plasticizer such as DBP (dibutyl phthalate) and toluene. An organic solvent is mixed and kneaded with a ball mill for 4 to 8 hours to prepare a slurry, and a tape is formed using the slurry by a doctor blade method or the like, and the tape is cut into a predetermined size to prepare a slurry.

Then, the through conductors 11, the internal conductor wirings 16 and the surface conductor wirings 1 are formed on predetermined ceramic green sheets.
7, a via hole conductor 18, a concave portion 2a for mounting a power amplification element, and a concave portion 2 for mounting a surface acoustic wave element.
b, in order to form a through hole for the through conductor 11, a concave portion or each of various portions is formed by a process such as forming with a micro drill or punching, and further performing exposure and development processing on a green sheet containing a photosensitive resin. Through holes having various shapes such as a circle, an ellipse, and a long hole can be formed.

The through-holes for the through conductors 11 and the via-hole conductors 18 are filled with a Cu or Ag-based conductor paste. At the same time, the inner-layer conductor wiring 16, the surface-layer conductor wiring 17, the conductor layers 2a1, 2
The pattern to be b1 is formed by printing using a Cu or Ag-based conductor paste by a screen printing method, a gravure printing method, or the like.

Here, the Cu or Ag-based conductive paste includes, for example, Cu powder, CuO powder, Ag powder, and A powder.
Ag-Pd powder and Ag-Pt powder, which are g alloys, can be used. If necessary, for example, a predetermined amount of borosilicate low melting point glass, SiO ₂ , Al ₂ O ₃ , MgO, CaO
Alkaline earth metal oxides such as, Bi ₂ O ₃ or the like metal oxide added and further an organic binder such as ethyl cellulose, such as 2,4-trimethyl-1,3-organic solvent such as pentanediol monoisobutyrate Are mixed and homogenously kneaded.

These metal powders and, if necessary, a predetermined amount of a low-melting borosilicate glass such as a zinc borosilicate glass or a lead borosilicate glass, Al ₂ O ₃ , Mg
An inorganic substance such as a metal oxide such as O, CaO, SiO ₂ or Bi ₂ O ₃ , an organic binder such as ethyl cellulose,
A mixture obtained by mixing and homogeneously kneading an organic solvent such as 4-trimethyl-1,3-pentanediol monoisobutyrate is used, and the thermal conductivity is determined by the ratio of the amount of the low-melting glass or metal oxide to the metal powder. Can be controlled.

The ceramic green sheets obtained as described above are positioned, for example, with the via-hole conductor 18 as a reference, laminated according to the lamination order, and thermocompression-bonded to form an unfired laminate.

Next, the unfired laminate is fired, for example, in an oxidizing atmosphere to be sintered and integrated. Specifically, 800-1000 ° C. in an oxygen atmosphere or an air atmosphere.
By sintering, a sintered substrate can be manufactured.

Thereafter, the surface acoustic wave element 8, the power amplifying element 4 and the like are mounted in the recesses 2a and 2b, and the heat conductive lid 6,
The lid 9 is brazed or filled with a sealing organic resin 19 for sealing.

When such a module is mounted on the external electric circuit board 7, the electrode pad for signal transmission of a normal module is soldered and at the same time the heat conductive lid 6 is mounted.
And the through conductor 11 is soldered to the heat dissipation conductor 15 formed on the surface of the external electric circuit board 7.

As shown in FIG. 6, when the periphery of the power amplifying element mounting concave portion 2a is formed of a dielectric material having heat insulation, a photosensitive resin is mixed with a normal dielectric substrate material and developed. After exposing to form a predetermined concave portion, the concave portion is filled with a heat-insulating dielectric material, and further, the concave portion 2a, 2b is formed by punching or the like to form an unfired laminated body. What is necessary is just to bake.

As shown in FIG. 7, when the upper surface and the lower surface of the dielectric substrate 2 in the module are formed of dielectric materials having different thermal conductivities, the green sheets are formed using the respective dielectric materials. After performing the respective processes, they may be laminated and integrated to produce an unfired laminate, and then fired.

[0059]

EXAMPLE As a dielectric material, borosilicate glass 70% by mass and alumina 30% by mass have a thermal conductivity of 2 W /
An electronic circuit module is manufactured as described above using a glass ceramic dielectric material of m · K, a through conductor using an Ag-based conductor material of 150 W / m · K, and copper as a heat conductive lid, This was mounted on an insulating substrate made of a glass woven fabric-epoxy resin composite material, using a Cu-Ag brazing material on the surface of a motherboard on which a heat-dissipating conductor made of copper and a signal wiring layer were formed (Sample No. 1). 6).

Then, the power of the power amplifying element (PA) is turned on.
0d with the / OFF ratio (duty ratio) set to 1/8
The input signal of B is input, conditions are set so that an output of 33.5 dBm is obtained, and the steady temperature in the concave portion for mounting the power amplifying element 4 and the concave portion for mounting the surface acoustic wave element 8 (represented by the concave portion 2b in Table 1) ) Was measured.

Using a heat conduction analysis simulation program, the temperatures of the respective constituent materials when the thermal conductivity was changed were calculated.

[0062]

[Table 1]

From the results shown in Table 1, according to the structure of the present invention,
It has been found that the provision of the heat conductive lid and the through conductor effectively dissipates the heat of the power amplification element and reduces the influence on the surface acoustic wave element.

Further, it can be seen that, in such a configuration, the effect is more excellent as the number of through conductors is larger and the thermal conductivity of the dielectric substrate is smaller. It was also found that similar results were obtained when the dielectric substrate was formed of two types of dielectric materials.

It should be noted that the above is only an example of the embodiment of the present invention, and the present invention is not limited to the embodiment. Various modifications and improvements may be made without departing from the gist of the present invention. No problem.

[0066]

As described above in detail, according to the present invention, heat generated by the power amplifying element can be efficiently dissipated to the heat dissipation conductor of the external electric circuit board. Since heat transfer to the arranged surface acoustic wave element can be extremely reduced, a small, high-performance device can be used without deteriorating electrical characteristics such as high-frequency filter characteristics and high-frequency demultiplexer characteristics of the surface acoustic wave element. An electronic circuit module can be provided. In addition, a heat-radiating member such as a heat-radiating fin is not separately required, and the electronic circuit module is suitable for low-cost electronic devices and electronic devices such as portable information terminals.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view showing an example of an embodiment of an electronic circuit module of the present invention.

FIG. 2 is a schematic plan view taken along line AA ′ of FIG. 1, showing an example of the arrangement of through conductors in the electronic circuit module of the present invention.

FIG. 3 is a schematic plan view showing another example of the arrangement of the through conductors in the electronic circuit module of the present invention.

FIG. 4 is a schematic plan view showing still another example of the arrangement of the through conductors in the electronic circuit module of the present invention.

FIG. 5 is a schematic sectional view showing another example of the embodiment of the electronic circuit module of the present invention.

FIG. 6 is a schematic sectional view showing still another example of the embodiment of the electronic circuit module of the present invention.

FIG. 7 is a schematic sectional view showing still another example of the embodiment of the electronic circuit module of the present invention.

[Explanation of symbols]

 1 ... Electronic circuit module 2 ... Dielectric substrate 2a ... Recess for mounting power amplification element 2b ... Recess 3a for mounting surface acoustic wave element , 3b ... conductor bump 4 ... power amplifying element 6 ... heat conductive lid 7 ... external electric circuit board 8 ... Surface acoustic wave element 9 ············································································· Heat dissipation conductor

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification code FI Theme coat ゛ (Reference) H05K 3/46 H05K 3/46 UF term (Reference) 5E346 AA13 AA43 CC18 CC32 CC39 DD07 DD34 DD45 EE24 FF18 GG04 GG05 GG06 GG08 GG09 GG25 HH17 HH33 5F036 AA01 BB21 BC06 BC33 BD01 5J097 AA29 AA33 BB15 GG03 GG04 JJ09 KK10 LL06

Claims (9)

[Claims] 1. A power amplifying element mounting recess and a surface acoustic wave element mounting recess are formed on one main surface of a dielectric substrate formed by laminating a plurality of dielectric layers, and the power amplifying element and the surface acoustic wave element are formed. Are mounted on a conductor layer formed on the bottom surface of each recess, and at least the power amplification element mounting recess has a heat conductive lid attached thereto in contact with the power amplification element, and the power amplification element Between the mounting concave portion and the surface acoustic wave device mounting concave portion, a through conductor extending from the extended portion of the conductor layer of the power amplifying device mounting concave portion to the one main surface of the dielectric substrate is formed. An electronic circuit module, wherein the heat conductive lid and the through conductor are attached to a heat dissipation conductor on an upper surface of an external electric circuit board via a brazing material and mounted. 2. A power amplifying device mounting concave portion is formed on one main surface of a dielectric substrate formed by laminating a plurality of dielectric layers, and a surface acoustic wave device mounting concave portion is formed on the other main surface. An element and a surface acoustic wave element are mounted on a conductor layer formed on the bottom surface of each recess, and a heat conductive lid is attached to at least the power amplification element mounting recess in contact with the power amplification element. Along with the power amplifying element mounting recess and the surface acoustic wave element mounting recess, from the extended portion of the conductor layer of the power amplifying element mounting recess to the one main surface of the dielectric substrate. Extending through conductors are formed,
An electronic circuit module, wherein the heat conductive lid and the through conductor are attached to a heat dissipation conductor on an upper surface of an external electric circuit board via a brazing material and mounted. 3. The thermal conductivity of the dielectric layer is 20 W / m · K.
3. The electronic circuit module according to claim 1, wherein: 4. The dielectric layer around the power amplifier mounting recess is formed of a dielectric layer having a lower thermal conductivity than the dielectric layer surrounding the surface acoustic wave device mounting recess. The electronic circuit module according to claim 1, wherein: 5. The electronic device according to claim 1, wherein the recess for mounting the power amplification element and the recess for mounting the surface acoustic wave element are separated by 0.3 mm or more. Circuit module. 6. The thermal conductivity of the through conductor is 100 W / m ·
The electronic circuit module according to claim 1, wherein the electronic circuit module is at least K. 7. The semiconductor device according to claim 1, wherein a plurality of the through conductors are formed between the concave portion for mounting the power amplification element and the concave portion for mounting the surface acoustic wave element. An electronic circuit module as described in the above. 8. A conductive layer on a bottom surface of the concave portion for mounting the power amplifying element and a conductive layer on a bottom surface of the concave portion for mounting the surface acoustic wave device are formed on different dielectric layers. An electronic circuit module according to any one of claims 1 to 7. 9. The surface acoustic wave element mounting concave portion is sealed with a lid, or the concave portion is filled with an insulating resin. An electronic circuit module as described in the above.