JP2002299775A - Electronic component device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component device which can reduce the size of the device, and enhance density and functions by increasing a mounted area of a base, and enhance the heat-dissipation performance of the device. SOLUTION: In an electronic component device 10, the electronic component element 5 to be accommodates in a cavity 7 are disposed in an insulation base 1, which has the electronic component element accommodating cavity 7 and a terminal electrode 42 on the bottom, and a surface wiring conductor 4 and a circuit structure part 6 connected thereto are mounted to a surface of the insulation base 1. On a bottom surface of the cavity 7, there is provided a thermal via hole 8, which has a die attach conductive film 41 to which the electronic component element 5 is mounted, and extends in the thickness direction of the base 1, in the periphery of an opening of the cavity 7, for radiating heat generated by operation of the electronic component element 5 to the bottom surface side of the base 1. One end part of the thermal via hole 8 is jointed to the die attach conductive film 41, and the other end is exposed in the bottom surface of the base 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of an electronic component mounting device used as an electronic circuit module of various electronic devices and electronic devices.

[0002]

2. Description of the Related Art In recent years, there has been an increasing demand for various electronic devices and electronic devices to be smaller, thinner, and more sophisticated, and accordingly, electronic devices used in electronic circuit modules of these devices and devices have been increased. There is also a strong demand for component devices to be smaller, thinner, have higher density, and have higher functions corresponding to high-speed signal processing.

In such an electronic component device, a base material for performing signal processing corresponding to a high-speed circuit operation is made of a glass-ceramic material obtained by adding an inorganic filler such as alumina to a glass frit and capable of being sintered at a low temperature. Used for In the case of a low-temperature fired substrate that can be fired at 850 to 1050 ° C., gold (Au) -based, silver (A)
g) It is possible to use a metal material having a low melting point and a small specific resistance such as a copper (Cu) type, and thereby an electronic component device which performs high-speed signal processing can be realized. Therefore, development for miniaturization, high density, and low cost is being promoted.

[0004] The amount of heat generated by the electronic component elements mounted on such an electronic component device is reduced by reducing the size of the electronic component device.
As shown in FIG. 5, the electronic component device 60 has a cavity 67 for accommodating an electronic component on the surface of the insulating base 61 on which a plurality of insulating layers are stacked, since the density has increased with the increase in density and the increase in power.
Then, the electronic component element 65 is accommodated in the cavity 67, and the heat generated by the operation of the electronic component element 65 has formed the via-hole conductor 68 formed immediately below the cavity 67. The via-hole conductor is formed by filling a through-hole with a thermally conductive metal material.
Since its main purpose is to conduct heat, it is called a thermal via hole. Such a thermal via hole 6
8, a large number of electronic component elements 6 are efficiently provided.
5 can be transmitted, thereby preventing thermal destruction of the electronic component element 65 and deterioration of reliability.

More specifically, one end of the thermal via hole 68 (one end on the inner side of the substrate is joined to the die attach conductor film 71 on which the electronic component element 65 is mounted, and the other end extends to the bottom surface of the insulating base 61. The other end of the thermal via hole 68 may be exposed as it is,
As shown, a dummy heat radiation end electrode 72 covering the thermal via hole 68 may be formed.

As a material for the thermal via hole 68, an Ag-based material is used because it is inexpensive and has excellent electrical and thermal conductivity. The conductive paste for the thermal via hole 68 is filled by forming a through hole in the green sheet with a press pin, placing the green sheet on a sheet of paper, and printing the conductive paste.

[0007]

However, an electronic circuit module incorporating this kind of electronic component device has been downsized.
Demands for higher density, lower cost, and higher functionality are increasing. For this reason, it is necessary to mount circuit components other than the electronic component element 65 mounted in the cavity 67 on the electronic component device 60.

However, the electronic component device shown in FIG. 5 has an opening of the cavity 67 on the surface side of the base 61. In other words, this opening area becomes a dead space for mounting circuit components, and there is a limit to the miniaturization and high functionality of the electronic component device 61.

Further, with the high integration of the electronic component element 65, for example, the semiconductor element itself, the amount of heat generated by the operation of the electronic component element 65 increases, and good heat radiation is required. ing. For example, due to the structure of the thermal via hole 68, in order to improve the heat dissipation, a metal material filled in the via hole is made of a material having high thermal conductivity, the density of the thermal via hole with respect to the base is increased, or the thermal via hole conductor A method of increasing the diameter is conceivable.

Further, the thermal conductivity of the via hole material is limited to the range of material selection since it is formed in common with the internal wiring conductor and the via hole conductor for circuit configuration formed inside the substrate 1 in the manufacturing process. Will be.

As for the density of the thermal via hole with respect to the substrate, it is necessary to consider the occurrence of cracks in the substrate 61 due to the stress generated in the formation of the thermal via hole. Empirically, the distance between the adjacent thermal via holes needs to be equal to or greater than the thickness of the green sheet serving as the insulating layer constituting the base 1 having the laminated structure. For example, when a green sheet having a thickness of 100 to 200 μm is used, the distance between adjacent via holes is set to 160 to 200 μm or more. For this reason,
There is a limit to the method of increasing the formation density of via holes.

Further, it is desirable that the opening shape of the thermal via hole has a large opening area. However, in order to suppress the cracks and the like generated in the above-described base 61, empirically, the diameter of the adjacent thermal via
It is necessary to secure a thickness corresponding to or less than the thickness of the green sheet serving as an insulating layer constituting the base 1. For example, when a green sheet having a thickness of 100 to 200 μm is used, the diameter of the thermal via hole is 160 to 200 μm or less.

When the opening diameter of the thermal via hole 68 is increased, a green sheet having a through hole serving as a thermal via hole is placed on a spreading sheet, and the metal material (metal paste) in the through hole is filled. When separating from the backing paper, the metal material filled in the through-hole is robbed by the backing paper, and the metal is removed from the through-hole, so that a thermal via hole cannot be formed substantially.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has as its object to increase the mounting efficiency of circuit components on a substrate, and to reduce the heat dissipation of electronic component elements. An object of the present invention is to provide an electronic component device that can be maintained and improved.

[0015]

Means for Solving the Problems An insulating base having a cavity on the bottom surface and a surface wiring conductor film on the surface, an electronic component element housed in the cavity, a surface mounted on the surface of the insulating base, In an electronic component device including a circuit component connected to a wiring conductor film, a radiating means for radiating heat generated by the operation of the electronic component element to a bottom surface side of the insulating base is provided around the cavity opening. It is an electronic component device characterized by the following.

Further, the heat radiating means is formed of a via hole conductor extending in the thickness direction of the base around the opening of the cavity. Further, the mounting bottom in the cavity has a die attach conductor film on which the electronic component element is mounted, one end of the via-hole conductor is joined to the die attach conductor film, and the other end is a base. Substantially exposed at the bottom.

Further, the via-hole conductor is configured so that a plurality of via-holes are continuously provided so as to linearly overlap each other.

[0018]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an electronic component device according to the present invention will be described in detail with reference to the drawings.

FIG. 1 is a cross-sectional view of an electronic component device mounting portion showing one embodiment of the electronic component device of the present invention. FIG.
FIG. 2 is a plan cross-sectional view of the upper part of the cavity of the electronic component device of FIG. 1. FIG. 3 is an enlarged plan view showing an embodiment of a via hole conductor (thermal via hole) of the present invention.

In these figures, 10 is an electronic component device, 1 is an insulating substrate (hereinafter simply referred to as a substrate) formed by laminating a plurality of insulator layers 1a to 1f, 2 is an internal wiring conductor, and 3 is a circuit forming device. Via hole conductor, 4 is a surface wiring conductor, 41 is a die attach conductor film, 42 is a terminal electrode, 43
Is an electrode pad, 5 is an electronic component element, 51 is wire bonding, 6 is a circuit component, 7 is a cavity, 8 is a thermal via hole, and 9 is a resin.

The base 1 of the electronic component device 10 is formed by laminating a plurality of insulating layers 1a to 1f from the bottom side, and an internal wiring conductor 2 is formed between the insulating layers 1a to 1f. . Also, via-hole conductors 3 and 8 are formed in the insulating layers 1a to 1f in the thickness direction of each layer. Specifically, there are via-hole conductors having two functions. Normally, the via holes constituting the predetermined circuit are the via hole conductors 3 for circuit formation, and mainly the electronic component elements 5.
The via-hole conductor for releasing the heat generated by the above operation to the outside is called a thermal via-hole (radiator) 8. still,
In the figure, the via hole conductors for circuit configuration are omitted in the insulating layers 1a and 1b, but this is only described for clarifying the structure of the thermal via hole 8, and actually, the insulating layers 1a to 1b are actually illustrated. The via hole conductor 3 for circuit configuration is also formed in 1b.

On the surface of the substrate 1 in such a laminated state, a predetermined surface wiring conductor 4 is formed. And
The circuit component 6 is mounted on the surface wiring conductor 4.

On the back surface of the base 1, a cavity 7 for housing the electronic component element 5 is formed. The cavity 7
For example, there is a step, and a die attach conductive film 41 on which the electronic component element 5 is mounted is provided on the mounting bottom surface of the cavity 7.
Are formed. Also, on the step surface of the cavity 7,
An electrode pad 43 is formed. In the step, the shape of the cavity outside the insulator layer 1a defines the shape of the cavity inside the insulator layer 1b.

The die attach conductor film 41 is formed so as to extend from the bottom surface of the cavity 7 to the periphery of the cavity 7 on the same plane as the bottom surface.

A terminal electrode 42 is formed on the back surface of the base 1 around the opening of the cavity 7. Examples of the terminal electrode 42 include a terminal electrode for actually inputting a signal or the like, a terminal electrode for supplying a power supply voltage, a terminal electrode for a ground potential, and the like.

In the present invention, as a function other than these, a dummy terminal electrode having a heat sink (radiation function) may be used. The dummy terminal electrode having only the heat dissipation function is formed so as to be joined to the other ends of the plurality of thermal via holes 8 as shown on the left side of the back surface of the base 1 in FIG. 1 (reference numeral 42a). Further, as shown on the right side of the back surface of the base 1 in FIG. 1, it can be shared with a terminal electrode which is at the ground potential (reference numeral 42b). The terminal electrode 42c is an input / output terminal electrode for a signal having no heat radiation function, a power supply voltage terminal electrode, a ground potential terminal electrode, or the like.

Insulator layer 1 constituting bottom surface of cavity 7
Between the layers b and 1c (the surface on the back side of the insulator layer 1c), the above-described die attach conductor film 41 is formed so as to spread and adhere. The electronic component element 5 is mounted on the die attach conductive film 41 exposed on the mounting bottom surface of the cavity 7.

An electrode pad 43 is formed between the insulator layers 1a and 1b forming the step of the cavity 7 (the surface on the back side of the insulator layer 1b). The electrode pad portion 43 is connected to the internal wiring conductor 2 inside the base 1 as the wiring 21 (considered as a part of the internal wiring conductor 2) between the insulator layers 1a and 1b.

It is important that the insulator layers 1a and 1a
The lead wiring 21 is routed between adjacent thermal via holes 8 between the layers b and b. That is, the insulating layer
Since the die attach conductor film 41 is formed in a relatively wide range between the layers 1b and 1c, the electrode pad portion 43
A via-hole conductor for circuit configuration cannot be formed just below (or around) the insulating layers 1b and 1c. Further, since the thermal via holes 8 are formed in the insulating layers 1a and 1b, the electrode pad portions 43 formed on the back main surface of the insulating layer 1b are flush with the back main surface of the insulating layer 1b. The lead wiring 21 is formed by sewing between the via hole 8 and the via hole conductor 3 in the area other than the die attach conductive film 41 forming area, and the wiring 21 is not wound around the surface side of the base 1 (the insulating layers 1c to 1f side). Not be.
Thereby, the electrode pad portion 43 and the routing wiring 21 are
It can be configured as a part of a predetermined circuit network without short-circuiting to the thermal via hole 8 or the die attach conductor film 41.

The electronic component element 5 mounted on the die attach conductor film 41 is electrically connected to the electrode pad 43 via a bonding wire 51. Also,
The cavity 7 is filled with a resin 9 to prevent the bonding wire 51 from falling down and protect the electronic component element 5 from moisture.

Here, the die attach conductive film 41 is a thermal via hole formed in the main surface on the back surface side of the insulator layer 1c and extending in a region other than the cavity 7 in the thickness direction of the insulator layers 1a and 1b. 8 and one end.

That is, the heat generated by the operation of the electronic component element 5 is transmitted through the die attach conductor film 41 and the plurality of thermal via holes 8 to the terminal electrode 42 having a heat radiation function.
a, 42b. Here, the terminal electrode 42b having a heat dissipation function also operates as a terminal electrode of the ground potential as described above. That is, the die attach conductor film 41 also has the ground potential. In the electronic component element 5, for example, a semiconductor element in which the die attach surface is set to the ground potential may be the above-described structure, but the one operated at the driving drive potential or the floating potential has a terminal electrode corresponding thereto. 42 functions as a dummy terminal electrode like the terminal electrode 42a.

The electronic component element 5 can be exemplified by a semiconductor element that emits heat by operation. In the figure, the electronic component element 5 is directly bonded to the die attach conductor film 41 in consideration of the heat radiation function, and the input and output of signals and the like use the bonding wires 51 between the electrode pad 43 and the electrodes. Although the heat radiating action of the heat by the operation of the electronic component element 51 is slightly reduced, the connection method may be a flip-chip type electronic component element using a bump or the like. In this case, the die attach conductor film 41 has a function of merely conducting heat.

The space between the electronic component element 5 and the heat conductive conductor film corresponding to the die attach conductive film 41 is filled with resin so that as much heat as possible can reach the thermal via hole.

The thermal via hole 8 is arranged so as to contribute to heat radiation most efficiently in consideration of the amount of heat generated by the mounted electronic component element 5 and the strength of the substrate formed by processing the base 1. For example, the entire thermal via hole 8 is arranged in a lattice shape or a staggered shape.

The thermal via hole 8 is made of a via-hole conductor having a circular opening cross-sectional shape so as to increase the area of the opening and prevent the above-mentioned metal loss from occurring.
A shape connected on a plurality of straight lines is desirable. In FIG. 2,
The thermal via holes 7 are arranged so as to surround the cavity 7 at predetermined intervals. Moreover, one thermal via hole 8 is shaped so that three cylindrical via holes alone overlap each other.

The heat conducted to the terminal electrodes 42 by the plurality of thermal via holes 8 is transmitted to the mother board on which the electronic component device 10 is mounted and radiated.

As shown in FIG. 3, the thermal via hole 8 is constituted by a plurality of (in FIG. 3, two cylindrical via holes 8a and 8b are continuously provided so as to linearly overlap each other. In FIG. 3, the overall length (distance in the overlapping direction) of the thermal via hole 8 is m, the radius of each of the via holes 8a and 8b is r, and each of the via holes 8a,
The center of 8b is indicated by C.

Such an electronic component device is formed as follows.

The insulating layers 1a to 1f are, for example, 850 to 10
Glass that can be fired at a relatively low temperature of around 50 ° C
Made of ceramic material. Specific ceramic materials include insulating ceramic materials such as cristobalite, quartz, corundum (β-alumina), mullite, cordierite, dielectric ceramic materials such as BaTiO ₃ , Pb ₄ Fe ₂ Nb ₂ O ₁₂ , TiO ₂ , and Ni -Zn ferrite, M
n-Zn ferrite (ceramic in a broad sense)
And other magnetic ceramic materials. The frit of the glass component is one that precipitates a crystal phase of cordierite, mullite, anorthite, Celsian, spinel, garnite, willemite, dolomite, petalite, or a substituted derivative thereof, or a crystal phase of a spinel structure by firing. For example, B ₂ O ₃ , SiO
₂ , glass frit containing Al ₂ O ₃ , ZnO, and alkaline earth oxide. The thickness of the insulating layers 1a to 1f is, for example, about 100 to 300 μm.

The internal wiring conductor 2, the via hole conductor 3, and the thermal via hole 8 are made of an Ag-based material (Ag alone, Ag-Pd,
It is made of a conductor film (conductor) mainly composed of Ag alloy such as Ag-Pt, and the thickness of the internal wiring conductor 2 is about 8 to 15 μm. The diameters of the via-hole conductor 3 and the thermal via-hole 8 can be set to arbitrary values, but are set to 80 to 350 μm in order to increase the diameter and reduce the resistance. In particular, via-hole conductor 3, thermal via-hole 8
Is composed of an Ag-based material, β-quartz, and a glass component substantially the same as the glass component constituting the insulating layers 1a to 1f.

The surface wiring conductor 4 and the terminal electrode 42 are made of Ag (Ag alone, Ag alloy such as Ag-Pd, Ag-Pt).
Mainly on the surface of the base 1, constitutes a predetermined circuit network, serves as connection pads for circuit components 6 joined via solder, and has a thick film resistance. It becomes a terminal electrode of a film or thick film capacitor element. Further, on the back surface of the base 1, terminal electrodes 42a to 42c connected to the via hole conductors 3 and 8 are formed.

The resin 9 is, for example, an epoxy resin or a silicon resin, and is applied to fill the cavity 7 after wire bonding of the electronic component 5 and is dried and cured to seal the electronic component 5. As a result, the electronic component element 5 can be protected from the external environment, and stable electrical characteristics and reliability such as waterproofing can be secured.

Since the mounting is performed with the cavity 7 forming surface facing down, it is necessary that the resin 7 does not protrude from the surface of the base 1.

First, for example, A for forming large green sheets, internal wiring conductors 2, via hole conductors 3, and thermal via holes 8 which become the insulating layers 1 a to 1 f of the laminate 1.
A g-based conductive paste and a glass paste for forming, for example, an Au-based and Ag-based conductive paste for forming the surface wiring conductor 4 are prepared.

The green sheet is used for a plurality of electronic component devices 1.
It has a plurality of substrate regions so that 0 can be extracted,
For example, a slurry is obtained by uniformly kneading a ceramic powder, a frit of a low-melting-point glass component, an organic binder, and an organic solvent into a tape by a doctor blade method to a predetermined thickness, and cutting into a predetermined size to form a sheet.

Next, a via-hole conductor 3, a through-hole serving as a thermal via-hole 8, and a through-hole serving as a cavity 7 are formed in each base region of the green sheet serving as the insulating layers 1a to 1f by punching.

Here, the through holes serving as the thermal via holes 8 are continuously provided so that the through holes serving as the plurality of via holes 8a and 8b linearly overlap each other. Specifically, after the first drilling of the pin forming the through hole is performed, the pin is shifted and the second drilling is performed.

Next, each green sheet having a through hole formed thereon is laid with a laying sheet made of Japanese paper, PET film, or the like, and the through holes serving as the via-hole conductor 3 and the thermal via hole 8 are provided with Ag-based materials. Print conductive paste
Fill. Further, on the green sheet to be the insulating layers 1b to 1e, a conductor film to be the internal wiring conductor 2 is formed by printing and drying an Ag-based conductive paste. At the time of this internal wiring conductor 2, a conductor film to be the die attach conductor film 41 is provided on the main surface on the back side of the insulating layer 1c.
On the main surface on the back side of 1b, a conductor film to be the electrode pad portion 43 and the lead-out wiring 21 is formed. On the green sheet on the front surface side of the insulating layer 1f, a conductive film as the surface wiring conductor 4 is formed, and on the green sheet on the back surface of the insulating layer 1a, a conductive film as the various terminal electrodes 42a to 42c is formed. It is formed by printing and drying a system conductive paste.

Next, such a green sheet is removed from the spreadsheet, and the lean sheets to be the insulating layers 1a to 1f are laminated and integrated in a lamination order to form a large laminated body.

Next, division grooves are formed in the large-sized laminate in an unfired state so as to partition each base region.

Next, the unfired large-sized laminate is simultaneously fired in an oxidizing atmosphere or an air atmosphere. The firing step includes a binder removal step and a sintering step.

In the binder removal process, a green sheet serving as the insulating layers 1a to 1f, a conductor film serving as the internal wiring conductor 2, a conductor serving as the die attach conductor film 41, a conductor film serving as the routing wiring 21, and an electrode pad portion 43 are formed. Conductor film, via hole conductor 3, conductor to be thermal via hole 8, surface wiring conductor 4
This is for burning off the organic components contained in the conductive film to be formed. In the sintering process, the glass component of the glass-ceramic green sheet is crystallized and simultaneously dispersed uniformly at the grain boundaries of the ceramic powder to give a constant strength to the laminate, and the above-described various conductor films and via-hole conductors 3 are provided. In addition, the metal powder and the Ag powder of the conductor which becomes the thermal via hole 8 are grain-grown to lower the resistance and are integrated with the insulating layers 1a to 1f.

Thus, a large-sized substrate having a plurality of bases 1 connected thereto is achieved.

Then, in the cavity 7 of each base region,
The electronic component element 5 is housed (die-attached), electrically connected to the electrode pad 43 by Al or Au wire bonding 51, and the electronic component element 5 is sealed with a resin 9.

After that, the thick film resistance element and various circuit components 6 are joined and mounted on the surface of the substrate 1 opposite to the surface on which the cavity 7 is formed by soldering or the like.

Lastly, a dividing process is performed along the dividing groove which divides each base 1. As a result, from a large substrate, FIG.
Are extracted.

Thus, the electronic component device 10 of the present invention
Electronic component element storage cavity 7 and terminal electrode 4 on the bottom
The electronic component element 5 accommodated in the cavity 7 is disposed on the insulating base 1 having the surface wiring conductor 2, and the surface wiring conductor 4 and the circuit component 6 connected thereto are provided on the surface of the insulating base 1.
It is equipped with.

That is, the cavity 7 does not exist on the surface of the base 1, and the circuit components 6 constituting the circuit can be arranged on the entire surface of the base 1. Thereby, the electronic component element 5 and the circuit component 6 mounted on the base 1 can be mounted at a high density, and the size of the electronic component device can be reduced.

This is because of the operation of the electronic component element 5,
This can be achieved because the means for releasing generated heat is formed in the peripheral region of the cavity and is thermally conducted to the back side of the base 1. Specifically, the thermal via hole 8 is connected to the die attach conductor film 41 on which the electronic component element 5 is mounted and extends to the back surface side of the base 1.
It is releasing heat. Moreover, the other end of the thermal via hole 8 is connected to the terminal electrode 42 formed on the bottom surface of the base 1.
a, 42b.

When this electronic component device is mounted on a printed board, the terminal electrodes 42a and 42b to be joined to the thermal via holes 8 are surface-mounted on the wiring on the printed board side. Heat can be dissipated over a large area of the printed board. Further, in the present invention, the routing wiring 21 is arranged so as to be sewn between the plurality of thermal via holes 8. Here, if the die attach conductor film 41 is set to the ground potential (the thermal via hole 8 connected to the same is also at the ground potential), the routing wiring 21 passes between the ground potentials. The stable operation of the component element 5 is generated.

In the present invention, in order to efficiently release the heat generated by the operation of the electronic component element 5 to the back side of the base 1, the bonding area with the die attach conductor film 41 is increased.
Further, the cross-sectional shape of the thermal via hole 8 is increased. At the same time, by controlling the shape of the thermal via hole 8,
The conductor serving as the thermal via hole 8 is prevented from dropping from the through hole of the green sheet.

That is, as shown in FIG. 3, the thermal via hole 8 is formed by continuously connecting two via holes 8a and 8b so as to linearly overlap each other. That is, as compared with the case where the via holes 8a and 8b are completely separated or overlapped, the formation density of the thermal via holes 8 per unit area is increased, and the conductive paste serving as the metal conductor of the thermal via holes 8 is coated on the green sheet. In order to maintain the distance around the opening, the distance around the opening is maximized.

This mechanism will be described with reference to FIG. Since the conductive paste is supported by the outer periphery in the thermal via hole 8, the thermal via hole 8
As the ratio of the outer periphery / area increases, the filling retention of the conductive paste becomes better. FIG. 3 shows the result of calculating the relationship between the length m of the thermal via hole 8 and the ratio of the outer periphery / area. Here, the point at which the outer peripheral distance of the thermal via hole 8 becomes maximum with respect to the area is the maximum at the point of m = 3r.
That is, when the outer periphery of one via hole 8a overlaps the center C of the other via hole 8b, the filling property of the conductive paste becomes the best, and the via hole 8
As a and 8b separate or overlap with each other, the filling property of the conductive paste decreases. As a result of various studies by the inventor, the range of the distance m in the overlapping direction of the thermal via hole 8 is 2.2r ≦ m ≦ 3.8r, preferably 2.5r ≦ m.
It is desirable to be in the range of ≦ 3.5r.

Here, if m becomes large and the via holes 8a and 8b are independently provided, the strength of the green sheet between the through holes when each through hole is formed becomes weak, and the distance between the through holes becomes small. The connection part is broken, and it becomes impossible to laminate.

The present invention is not limited to the above embodiments, and various changes and improvements can be made without departing from the scope of the present invention. For example, as shown in FIGS. 2 and 4, the thermal via hole 8 may be composed of three via holes 8a to 8c alone, or may be composed of more via holes.

Further, the thermal via holes may be continuously formed while increasing or decreasing the number of thermal via holes for each lamination. For example, the thermal via hole 8 formed in the insulating layer 1b may be formed by two single thermal via holes, and the thermal via hole 8 formed in the insulating layer 1a may be formed by three single thermal via holes. Further, the thermal via holes may be arranged so as to be shifted by one via hole between the insulating layers 1a and 1b. Further, thermal via holes may be combined by combining via holes having different diameters from each other.

The shape of the thermal via hole as the heat conducting member may be various shapes such as a quadrangle and an ellipse in addition to a circle. In addition, as a method of forming a through hole for a thermal via hole, other than a method of forming a hole with a press pin,
Holes may be made with a laser.

[0069]

As described above, according to the electronic component device of the present invention, the thermal via hole extending in the thickness direction of the base is provided around the cavity opening, and one end of the thermal via hole is joined to the die attach conductor film. And the other end is led out to the back of the base. For this reason, since circuit components can be mounted on the surface of the base in the cavity forming region, the electronic component device can be reduced in size, increased in density, and enhanced in function.

Further, the die attach conductor film can be extended around the cavity, and the thermal via hole can be freely provided as long as it does not come into contact with the internal wiring conductor, so that the heat dissipation can be improved.

Further, since the thermal via holes are formed in such a manner that a plurality of via holes alone are continuously arranged so as to linearly overlap each other, the formation density of the thermal via holes per unit area increases, and the thermal via holes are printed and filled. Sometimes the filling retention of the metal paste is improved.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an embodiment of an electronic component device of the present invention.

FIG. 2 is a rear view of the electronic component device of FIG. 1;

FIG. 3 is an enlarged plan view showing one embodiment of a thermal via hole of the present invention.

FIG. 4 is an enlarged plan view showing another embodiment of the thermal via hole of the present invention.

FIG. 5 is a cross-sectional view showing one embodiment of a conventional electronic component device.

[Explanation of symbols]

 10, 60 Electronic component device 1, 61 Base 1a to 1f Insulating layer 2 Internal wiring conductor 3 Via hole conductor 4 Surface wiring conductor 41, 71 Die attach conductor film 42, 72 Terminal electrode 43 Electrode pad part 5, 65 Electronic component element 51 Wire Bonding 6 Circuit component 7, 67 Cavity 8, 68 Thermal via hole 9, 69 Resin

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H05K 3/46 H01L 25/08 B 7/20 F term (Reference) 5E322 AA11 EA11 FA04 5E338 AA03 AA18 BB03 BB05 BB16 BB19 BB25 BB63 BB75 CC01 CC06 CC08 CD32 EE02 5E346 AA11 AA12 AA15 AA60 BB01 BB06 BB16 CC18 DD02 DD34 EE24 FF18 FF45 GG03 HH17 5F036 AA01 BA23 BC33 BD01 BD21

Claims (4)

[Claims] 1. An insulating base having a cavity on a bottom surface and a surface wiring conductor film on a surface, an electronic component element housed in the cavity, and a surface wiring conductor film mounted on a surface of the insulating base. An electronic component device comprising circuit components connected to each other, wherein a radiator for radiating heat generated by the operation of the electronic component element to a bottom side of the insulating base is provided around the cavity opening. Parts equipment. 2. The electronic component device according to claim 1, wherein said heat radiating means is formed of a via-hole conductor extending in a thickness direction of the base around the opening of said cavity. 3. The mounting bottom in the cavity has a die attach conductor film on which the electronic component element is mounted, and one end of the via hole conductor is joined to the die attach conductor film and the other end is provided. 3. The electronic component device according to claim 2, wherein the device is substantially exposed on the bottom surface of the base. 4. The electronic component device according to claim 2, wherein the via-hole conductor is configured such that a plurality of via-holes are continuously provided so as to linearly overlap each other.