JP2002343877A - Ｉｃ素子の製造方法 - Google Patents

Ｉｃ素子の製造方法

Info

Publication number
JP2002343877A
JP2002343877A JP2002020219A JP2002020219A JP2002343877A JP 2002343877 A JP2002343877 A JP 2002343877A JP 2002020219 A JP2002020219 A JP 2002020219A JP 2002020219 A JP2002020219 A JP 2002020219A JP 2002343877 A JP2002343877 A JP 2002343877A
Authority
JP
Japan
Prior art keywords
information carrier
layer
metal
coil
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002020219A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002343877A5 (ko
Inventor
Shin Shimizu
伸 清水
Tetsushi Kawamura
哲士 川村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Maxell Holdings Ltd
Original Assignee
Hitachi Maxell Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Maxell Ltd filed Critical Hitachi Maxell Ltd
Priority to JP2002020219A priority Critical patent/JP2002343877A/ja
Publication of JP2002343877A publication Critical patent/JP2002343877A/ja
Publication of JP2002343877A5 publication Critical patent/JP2002343877A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Details Of Aerials (AREA)
JP2002020219A 1999-02-24 2002-01-29 Ｉｃ素子の製造方法 Pending JP2002343877A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002020219A JP2002343877A (ja) 1999-02-24 2002-01-29 Ｉｃ素子の製造方法

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP4654599 1999-02-24
JP5975399 1999-03-08
JP11-59753 1999-03-08
JP11-46545 1999-03-08
JP2002020219A JP2002343877A (ja) 1999-02-24 2002-01-29 Ｉｃ素子の製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2000044765A Division JP4363735B2 (ja) 1999-02-24 2000-02-22 情報担体の製造方法

Publications (2)

Publication Number Publication Date
JP2002343877A true JP2002343877A (ja) 2002-11-29
JP2002343877A5 JP2002343877A5 (ko) 2005-07-21

Family

ID=27292644

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002020219A Pending JP2002343877A (ja) 1999-02-24 2002-01-29 Ｉｃ素子の製造方法

Country Status (1)

Country Link
JP (1) JP2002343877A (ko)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005117139A (ja) * 2003-10-03 2005-04-28 Mitsubishi Electric Corp マイクロ波モジュール、及びこれを用いたアレーアンテナ装置
US7161449B2 (en) 2003-09-05 2007-01-09 Ntt Docomo, Inc. Coplanar waveguide resonator
JP2008205732A (ja) * 2007-02-19 2008-09-04 Toppan Forms Co Ltd 非接触型データ受送信体
US7436032B2 (en) 2003-12-19 2008-10-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor integrated circuit comprising read only memory, semiconductor device comprising the semiconductor integrated circuit, and manufacturing method of the semiconductor integrated circuit
US7566010B2 (en) 2003-12-26 2009-07-28 Semiconductor Energy Laboratory Co., Ltd. Securities, chip mounting product, and manufacturing method thereof
US7566640B2 (en) 2003-12-15 2009-07-28 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing thin film integrated circuit device, noncontact thin film integrated circuit device and method for manufacturing the same, and idtag and coin including the noncontact thin film integrated circuit device

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7161449B2 (en) 2003-09-05 2007-01-09 Ntt Docomo, Inc. Coplanar waveguide resonator
JP2005117139A (ja) * 2003-10-03 2005-04-28 Mitsubishi Electric Corp マイクロ波モジュール、及びこれを用いたアレーアンテナ装置
US7566640B2 (en) 2003-12-15 2009-07-28 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing thin film integrated circuit device, noncontact thin film integrated circuit device and method for manufacturing the same, and idtag and coin including the noncontact thin film integrated circuit device
US8202238B2 (en) 2003-12-15 2012-06-19 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing thin film integrated circuit device, noncontact thin film integrated circuit device and method for manufacturing the same, and idtag and coin including the noncontact thin film integrated circuit device
US7436032B2 (en) 2003-12-19 2008-10-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor integrated circuit comprising read only memory, semiconductor device comprising the semiconductor integrated circuit, and manufacturing method of the semiconductor integrated circuit
US7842561B2 (en) 2003-12-19 2010-11-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor integrated circuit, semiconductor device, and manufacturing method of the semiconductor integrated circuit
US7566010B2 (en) 2003-12-26 2009-07-28 Semiconductor Energy Laboratory Co., Ltd. Securities, chip mounting product, and manufacturing method thereof
US7857229B2 (en) 2003-12-26 2010-12-28 Semiconductor Energy Laboratory Co., Ltd. Securities, chip mounting product, and manufacturing method thereof
US8083153B2 (en) 2003-12-26 2011-12-27 Semiconductor Energy Laboratory Co., Ltd. Securities, chip mounting product, and manufacturing method thereof
US8662402B2 (en) 2003-12-26 2014-03-04 Semiconductor Energy Laboratory Co., Ltd. Securities, chip mounting product, and manufacturing method thereof
JP2008205732A (ja) * 2007-02-19 2008-09-04 Toppan Forms Co Ltd 非接触型データ受送信体

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